-
Fabrication and evaluation of Wrap Around Neural-Pass to record and stimulate neural activity in the cervical spinal cord
Kazushi Tsuji, Atsuhiko Ninomiya, Naoki Iwanuma, Chenxi Qiu, Shutaro Oba, Hisashi Kino, Takafumi Fukushima, Norihiro Katayama, Kuniyasu Niizuma, Hidenori Endo, Tetsu Tanaka
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers 63 (12) 2024年12月2日
DOI：
10.35848/1347-4065/ad9a6f
ISSN：0021-4922
eISSN：1347-4065
-
Multi-Functional Self-Assembled Monolayer for Chip-to-Chip and Chip-to-Wafer Hybrid Bonding
査読有り
Murugesan Mariappan, Kiyoharu Mori, Akifumi Kurachi, Toru Imori, Toshiya Kojima, Wakako Nakano, Hiroyuki Hashimoto, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 45-50 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00016
-
Single-Grain Cu μ-Joint Formation Induced by Selective Under-Seed-Metallurgy for Hybrid Bonding
査読有り
Murugesan Mariappan, Kiyoharu Mori, Masahiro Sawa, Jinta Nampo, Hiroyuki Hashimoto, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 325-330 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00060
-
D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations
査読有り
Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada, Mariappan Murugesan, Hiryuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 60 420-426 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00074
-
Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly
査読有り
Atsushi Shinoda, Chang Liu, Akihiro Tominaga, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 849-854 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00136
-
Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive
査読有り
Hirokatsu Sakamoto, Tadashi Teranishi, Rumi Nagai, Ryo Itaya, Hideaki Tamate, Takafumi Fukushima, Akihiko Happoya
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 871-875 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00140
-
Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
査読有り
Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Mariappan Murugesan, Tetsu Tanaka, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 1 1335-1341 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00217
-
An Advanced Remote-Plasma Assisted Ozone-Ethylene Radical (OER) Process for Cu-SiO2 Hybrid Bonding Yield Enhancement
査読有り
Tatsunori Shino, Mariappan Murugesan, Kiyoharu Mori, Bungo Tanaka, Eitaro Toyama, Tetsuya Nishiguchi, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2042-2046 2024年5月28日
出版者・発行元：
IEEE
DOI：
10.1109/ectc51529.2024.00348
-
Simulation and Fabrication of Advanced 3D Corrugated Wires for in-Mold FHE Applications
査読有り
H. Zhang, T. Tanaka, T. Fukushima
2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation 2024年4月
-
Heterogeneous 3D Integration Technology with TSV-Die and Micro-LEDs for Smart Skin Display
査読有り
J. Shen, C. Liu, T. Tanaka, T. Fukushima
2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation 2024年4月
-
Chip-to-Wafer Mini-LED Bonding and Integration for FOWLP-Based Photobiomodulation Sheet Devices Using a Hydrogel Substrate
査読有り
X. Guo, T. Tanaka, T. Fukushima
2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation 2024年4月
-
Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics
査読有り
Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Japanese Journal of Applied Physics 63 (4) 04SP74-04SP74 2024年4月1日
出版者・発行元：
IOP Publishing
DOI：
10.35848/1347-4065/ad375f
ISSN：0021-4922
eISSN：1347-4065
-
FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach
査読有り
Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE CPMT Symposium Japan (ICSJ) 45-48 2023年11月15日
出版者・発行元：
IEEE
DOI：
10.1109/icsj59341.2023.10339614
-
FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display
査読有り
Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE CPMT Symposium Japan (ICSJ) 49-52 2023年11月15日
出版者・発行元：
IEEE
DOI：
10.1109/icsj59341.2023.10339585
-
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction
査読有り
Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS) 1-4 2023年10月19日
出版者・発行元：
IEEE
DOI：
10.1109/biocas58349.2023.10389082
-
Cu-SiO2 Surface Activation by Ozone-Ethylene-Radical Process for Chip-to-Chip and Chip-to-Wafer Hybrid Bonding
査読有り
Murugesan Mariappan, Tetsuya Nishiguchi, Kiyoharu Mori, Tatsunori Shino, Hiroyuki Hashimoto, Takafumi Fukushima
ADMETA Plus 2023 2023年10月
-
High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
査読有り
Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials 2023年9月8日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2023.g-5-02
-
An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System
査読有り
Yaogan Liang, Kohei Nakamura, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, ndTetsu Tanaka
Electronics (MDPI) 12 (2836) 1-17 2023年6月
-
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last
査読有り
Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
2023 IEEE International 3D Systems Integration Conference (3DIC) 499 1-4 2023年5月10日
出版者・発行元：
IEEE
DOI：
10.1109/3dic57175.2023.10154930
-
Cu Electrode Surface Features and Cu-SiO2 Hybrid Bonding
査読有り
M. Murugesan, M. Sawa, M. Koyanagi, T. Fukushima
IEEE 3D System Integration Conference 2023年5月
-
Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources
査読有り
Takafumi Fukushima, Tianyu Xiang, Harshit Ranjan, Niharika Tripathi, Chang Liu, Guangqi Ouyang, Randall Irwin, Subramanian S. Iyer
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 444-449 2023年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51909.2023.00080
-
Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains for µ-joints Beyond 100 K
査読有り
M. Murugesan, M. Sawa, E. Sone, T. Miyazaki, M. Koyanagi, T. Fukushima
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 69 1713-1718 2023年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51909.2023.00292
-
A Novel Die-to-Die Bridge Architecture Employing High-Performance Bridge with Polymer RDL and Fine Vias
査読有り
Yasuhiro Morikawa, Meiten Koh, Hiroyuki Hashimoto, Chuantong Chen, Wangyun Li, Ichiro Kono, Shinji Wakisaka, Ken Ukawa, Takafumi Fukushima, Katsuaki Suganuma, Yoichiro Kurita
73rd Electronic Components and Technology Conference (ECTC 2023) 34-39 2023年5月
-
Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging
査読有り
Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 25 596-600 2023年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51909.2023.00105
-
Physical Properties of Large Cu Grain and Application to Cu-SiO2 Hybrid Bonding
査読有り
R. Kobayashi, E. Sone, M. Sawa, M. Murugesan, T. Fukushima
2023 International Conference on Electronics Packaging (ICEP) 43-44 2023年4月19日
出版者・発行元：
IEEE
DOI：
10.23919/icep58572.2023.10129755
-
Overview and Progress of the Chiplet Integration Platform Consortium
査読有り
Meiten Koh, Yoichiro Kurita, Yasuhiro Morikawa, Ichiro Kono, Takafumi Fukushima, Katsuaki Suganuma
International Conference on Electronics Packaging (ICEP) FA3 (2) 2023年4月
-
チップレットの概念と 3D-IC のラピッドプロトタイピング
招待有り
査読有り
福島誉史
エレクトロニクス実装学会誌（特集／3D・チップレット集積化技術動向） 26 (4) 333-340 2023年4月
DOI：
10.5104/jiep.26.333
-
Gapless Chip-in-Carrier Integration and Injectable Ag/AgCl-Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor
招待有り
査読有り
Hiromichi Wakebe, Yuki Susumago, Takafumi Fukushima, Tetsu Tanaka
IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING 18 (3) 477-487 2023年3月
DOI：
10.1002/tee.23744
-
3D-IC/TSVの最新動向と自己組織化による三次元実装／ヘテロ集積
招待有り
福島誉史
化学工学会誌（小特集 / 次世代半導体の展望～原理と生産技術～ 87 (1) 33-36 2023年
-
Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration with μLED
査読有り
Yuki Susumago, Takafumi Fukushima
IEEE Electron Device Letters 2023年1月
-
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration
査読有り
Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
IEICE Electronics Express 19 (23) 20220363-20220363 2022年12月10日
出版者・発行元：
Institute of Electronics, Information and Communications Engineers (IEICE)
DOI：
10.1587/elex.19.20220363
eISSN：1349-2543
-
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip
査読有り
Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2022 IEEE Biomedical Circuits and Systems Conference (BioCAS) 519-523 2022年10月13日
出版者・発行元：
IEEE
DOI：
10.1109/biocas54905.2022.9948542
-
脂質二分子膜センサのための埋植チップ上SU;マイクロチャネル直接形成法の開発
招待有り
査読有り
分部寛道, 福島誉史, 田中徹
電気学会論文誌;センサ;マイクロマシン部門誌 141 (10) 327-335 2022年10月
-
Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display
Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月29日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.e-7-02
-
Development of Small-Area Pixel Circuit with Light-to-Pulse Width Converter for the High-Resolution Smart Skin Display
査読有り
Yuta - Aruga, Bang - Du, Yaogan - Liang, Kouhei - Nakamura, Shengwei - Wang, Bunta - Inoue, Hisashi - Kino, Takafumi - Fukushima, Koji - Kiyoyama, Tetsu - Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月28日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.d-6-02
-
Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration
査読有り
Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月28日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-4-02
-
Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip
査読有り
Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月27日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.d-1-03
-
Fabrication of UCNP (Upconversion Nanoparticle) Disk Device for Non-Invasive Optical Stimulation Therapy of Organ Diseases
査読有り
Shimon - Suzuki, Hisashi - Kino, Takafumi - Fukushima, Tetsu - Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月27日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.d-2-03
-
Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
査読有り
CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月27日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-1-01
-
Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis
査読有り
Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022年9月27日
出版者・発行元：
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-1-03
-
TSV形成の基礎と三次元実装の動向
招待有り
査読有り
福島誉史
エレクトロニクス実装学会誌（講座「三次元実装基礎講座」第1回） 25 (7) 700-708 2022年9月
DOI：
10.5104/jiep.25.700
-
Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics
査読有り
Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Journal of Vacuum Science & Technology B 40 (5) 052202-052202 2022年9月
出版者・発行元：
American Vacuum Society
DOI：
10.1116/6.0001836
ISSN：2166-2746
eISSN：2166-2754
-
Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2022 IEEE International Interconnect Technology Conference (IITC) 82-84 2022年6月27日
出版者・発行元：
IEEE
DOI：
10.1109/iitc52079.2022.9881288
-
Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs
査読有り
Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 49 1403-1408 2022年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51906.2022.00225
-
Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
査読有り
Toshiaki Shirasaka, Tadashi Okuda, Tomoaki Shibata, Satoshi Yoneda, Daisaku Matsukawa, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51906.2022.00059
-
Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment
査読有り
Murugesan Mariappan, Shizu Fukuzumi, Tomoaki Shibata, Hiroyuki Hashimoto, JiChel Bea, Mitsumasa Koyanagi, Takafumi Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51906.2022.00184
-
Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement
査読有り
M. Murugesan, K. Mori, M. Sawa, E. Sone, M. Koyanagi, T. Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022年5月
出版者・発行元：
IEEE
DOI：
10.1109/ectc51906.2022.00115
-
Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Applied Physics Express 15 (11) 111004-1-111004-5 2022年4月
DOI：
10.35848/1882-0786/ac9d24
-
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System
査読有り
Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2021 IEEE Biomedical Circuits and Systems Conference (BioCAS) 2021年10月7日
出版者・発行元：
IEEE
DOI：
10.1109/biocas49922.2021.9645034
-
Chip-to-Chip/Wafer Three-Dimensional Integration of 2.5 mm-sized Neuron and Memory Chips by Via-Last Approach
査読有り
M. Murugesan, H. Hashimoto, Jichel Bea, M. Koyanagi, T. Fukushima
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2021年10月5日
出版者・発行元：
IEEE
DOI：
10.1109/ltb-3d53950.2021.9598372
-
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing
査読有り
Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi
2021 IEEE International 3D Systems Integration Conference (3DIC) 2021年10月
DOI：
10.1109/3dic52383.2021.9687608
ISSN：2164-0157
-
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications
査読有り
M. Murugesan, E. Sone, A. Simomura, M. Motoyoshi, M. Sawa, K. Fukuda, M. Koyanagi, T. Fukushima
2021 IEEE International 3D Systems Integration Conference (3DIC) 2021年10月
出版者・発行元：
IEEE
DOI：
10.1109/3dic52383.2021.9687604
-
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing
査読有り
Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan
2021 IEEE International 3D Systems Integration Conference (3DIC) 2021年10月
出版者・発行元：
IEEE
DOI：
10.1109/3dic52383.2021.9687601
-
Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics
査読有り
Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2021 IEEE International Interconnect Technology Conference, IITC 2021 2021年7月6日
DOI：
10.1109/IITC51362.2021.9537540
-
Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2021 IEEE International Interconnect Technology Conference, IITC 2021 2021年7月6日
DOI：
10.1109/IITC51362.2021.9537336
-
Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
招待有り
査読有り
Takafumi Fukushima
2021 Symposium on VLSI Circuits 2021年6月13日
出版者・発行元：
IEEE
DOI：
10.23919/vlsicircuits52068.2021.9492335
-
High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path
査読有り
Applied Physics Express 14, (2021), 091003 14 (8) 091003 2021年
DOI：
10.35848/1882-0786/ac18b0
ISSN：1882-0778
eISSN：1882-0786
-
On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2
査読有り
Takafumi Fukushima, Mariappan Murugesan, Ji‐Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
Journal of Polymer Science 58 (16) 2248-2258 2020年8月15日
出版者・発行元：
Wiley
DOI：
10.1002/pol.20200094
ISSN：2642-4150
eISSN：2642-4169
-
Significant Die-Shift Reduction and mu LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics
査読有り
Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 10 (8) 1419-1422 2020年8月
DOI：
10.1109/TCPMT.2020.3009640
ISSN：2156-3950
eISSN：2156-3985
-
Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor
査読有り
Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka
Electronics and Communications in Japan 105 (2) 2020年6月
出版者・発行元：
Wiley
DOI：
10.1002/ecj.12343
ISSN：1942-9533
eISSN：1942-9541
-
Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics
査読有り
M. Murugesan, Y. Susumago, K. Sumitani, Y. Imai, S. Kimura, T. Fukushima
Japanese Journal of Applied Physics 60 (SB) SBBC02-SBBC02 2020年5月1日
出版者・発行元：
IOP Publishing
DOI：
10.35848/1347-4065/abdb81
ISSN：0021-4922
eISSN：1347-4065
-
High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications
査読有り
M. Murugesan, K. Mori, J.C. Bea, M. Koyanagi, T. Fukushima
Japanese Journal of Applied Physics 59 (SG) SGGC02-SGGC02 2020年4月1日
出版者・発行元：
IOP Publishing
DOI：
10.35848/1347-4065/ab75b8
ISSN：0021-4922
eISSN：1347-4065
-
Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) 2020年4月
出版者・発行元：
IEEE
DOI：
10.1109/edtm47692.2020.9118027
-
Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory
査読有り
Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
Japanese Journal of Applied Physics 59 (SG) 2020年4月
DOI：
10.35848/1347-4065/ab6867
ISSN：0021-4922
eISSN：1347-4065
-
Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
査読有り
Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 59 (SB) 2020年2月
DOI：
10.7567/1347-4065/ab4f3c
ISSN：0021-4922
eISSN：1347-4065
-
Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications
査読有り
Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 1448-1452 2020年
DOI：
10.1109/ECTC32862.2020.00229
ISSN：0569-5503
eISSN：2377-5726
-
7-mu m-thick NCF technology with low-height solder microbump bonding for 3D integration
査読有り
Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 1453-1458 2020年
DOI：
10.1109/ECTC32862.2020.00230
ISSN：0569-5503
eISSN：2377-5726
-
Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion
査読有り
Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 1199-1204 2020年
DOI：
10.1109/ECTC32862.2020.00192
ISSN：0569-5503
eISSN：2377-5726
-
Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electroplating in High Aspect Ratio (>10) TSVs for 3D-IC Packaging Applications
査読有り
Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 1736-1741 2020年
DOI：
10.1109/ECTC32862.2020.00271
ISSN：0569-5503
eISSN：2377-5726
-
Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly
Takafumi Fukushima
2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020) 2020年
-
RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
査読有り
Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 811-816 2020年
DOI：
10.1109/ECTC32862.2020.00132
ISSN：0569-5503
eISSN：2377-5726
-
Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE Journal of the Electron Devices Society 8 1266-1271 2020年
出版者・発行元：
Institute of Electrical and Electronics Engineers (IEEE)
DOI：
10.1109/jeds.2020.3025336
eISSN：2168-6734
-
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration
Murugesan Mariappan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC48104.2019.9058849
-
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI
Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC48104.2019.9058853
-
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration
Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takahumi Fukushima
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC48104.2019.9058773
-
PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System
査読有り
Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama
BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings 2019年10月
DOI：
10.1109/BIOCAS.2019.8919027
-
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation
査読有り
Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月
DOI：
10.1109/3DIC48104.2019.9058843
-
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing
査読有り
Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月
DOI：
10.1109/3DIC48104.2019.9058856
-
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs
査読有り
Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月
DOI：
10.1109/3DIC48104.2019.9058841
-
Development of 3D-IC Embedded Flexible Hybrid System
査読有り
Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月
DOI：
10.1109/3DIC48104.2019.9058880
-
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019年10月
DOI：
10.1109/3DIC48104.2019.9058838
-
Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging
Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori, Ai Nakamura, Yisang Lee, Makoto Motoyoshi, J. C. Bea, Shigeru Watariguchi, Mitsumasa Koyanagi
Proceedings - Electronic Components and Technology Conference 2019- 1047-1051 2019年5月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ECTC.2019.00164
ISSN：0569-5503
-
X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications—characterization technique-dependent reliability issues
査読有り
M. Murugesan, A. Takeuchi, T. Fukushima, M. Koyanagi
Japanese Journal of Applied Physics 58 (SB) SBBC05-SBBC05 2019年4月1日
出版者・発行元：
IOP Publishing
DOI：
10.7567/1347-4065/ab02e2
ISSN：0021-4922
eISSN：1347-4065
-
Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 222-224 2019年3月
DOI：
10.1109/EDTM.2019.8731161
-
High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs
Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1) 181-188 2019年1月
出版者・発行元：
Institute of Electrical and Electronics Engineers (IEEE)
DOI：
10.1109/tcpmt.2018.2871764
ISSN：2156-3950
eISSN：2156-3985
-
Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
査読有り
Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) 265-267 2019年
-
Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter
査読有り
Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE ELECTRON DEVICE LETTERS 40 (1) 95-98 2019年1月
DOI：
10.1109/LED.2018.2884452
ISSN：0741-3106
eISSN：1558-0563
-
Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter
査読有り
Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE Electron Device Letters 40 (1) 95-98 2019年1月
DOI：
10.1109/LED.2018.2884452
ISSN：0741-3106
-
Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC
査読有り
Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
IEEE Journal of the Electron Devices Society 7 1225-1231 2019年
DOI：
10.1109/JEDS.2019.2936180
eISSN：2168-6734
-
Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
査読有り
Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) 265-267 2019年
DOI：
10.23919/ICEP.2019.8733416
-
Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
査読有り
Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2019-May 264-269 2019年
DOI：
10.1109/ECTC.2019.00046
ISSN：0569-5503
eISSN：2377-5726
-
Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
査読有り
Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 17-17 2019年
DOI：
10.23919/LTB-3D.2019.8735115
-
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips
査読有り
Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka
2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings 2018年12月20日
DOI：
10.1109/BIOCAS.2018.8584776
-
Process Integration for FlexTrate TM
査読有り
Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer
2018 International Flexible Electronics Technology Conference, IFETC 2018 2018年12月19日
DOI：
10.1109/IFETC.2018.8584029
-
Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration
査読有り
Takafumi Fukushima, Arsalan Alam, Amir Hanna, Siva Chandra Jangam, Adeel Ahmad Bajwa, Subramanian S. Iyer
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8 (10) 1738-1746 2018年10月
DOI：
10.1109/TCPMT.2018.2871603
ISSN：2156-3950
eISSN：2156-3985
-
Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (<6 μm) and reliable flexible cu-based interconnects
Amir Hanna, Arsalan Alam, Takafumi Fukushima, Steven Moran, William Whitehead, Siva Chandra Jangam, Saptadeep Pal, Goutham Ezhilarasu, Randall Irwin, Adeel Bajwa, Subramanian Iyer
Proceedings - Electronic Components and Technology Conference 2018- 1505-1511 2018年8月7日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ECTC.2018.00229
ISSN：0569-5503
-
TSV liner dielectric technology with spin-on low-k polymer
査読有り
S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 346-349 2018年6月6日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.23919/ICEP.2018.8374320
-
Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system
査読有り
Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Japanese Journal of Applied Physics 57 (4) 2018年4月1日
出版者・発行元：
Japan Society of Applied Physics
DOI：
10.7567/JJAP.57.04FM11
ISSN：1347-4065 0021-4922
-
Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 57 (4) 2018年4月1日
出版者・発行元：
Japan Society of Applied Physics
DOI：
10.7567/JJAP.57.04FE07
ISSN：1347-4065 0021-4922
-
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current
Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings 2018- 1-4 2018年3月23日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/BIOCAS.2017.8325165
-
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip
Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings 2018- 1-4 2018年3月23日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/BIOCAS.2017.8325552
-
3D Interconnection by Directed Self-Assembly (DSA) with Metal/Block-Copolymer Nanocomposites
Takafumi Fukushima
Kick-off Symposium for World Leading Research Centers - Materials Science and Spintronics - (2017) 2018年2月
-
Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies
Takafumi Fukushima
2018 INTERNATIONAL CONFERENCE ON MANIPULATION, AUTOMATION AND ROBOTICS AT SMALL SCALES (MARSS) 2018年
-
Self-Assembly Technologies for FlexTrate (TM)
査読有り
Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) 1836-1841 2018年
DOI：
10.1109/ECTC.2018.00275
ISSN：0569-5503
eISSN：2377-5726
-
Study of Al-doped ZnO transparent stimulus electrode for fully implantable retinal prosthesis with three-dimensionally stacked retinal prosthesis chip
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Sensors and Materials 30 (2) 225-234 2018年
出版者・発行元：
M Y U Scientific Publishing Division
DOI：
10.18494/SAM.2018.1741
ISSN：0914-4935
-
Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs
査読有り
Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka
2018 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) 135-137 2018年
DOI：
10.1109/IITC.2018.8430390
ISSN：2380-632X
eISSN：2380-6338
-
Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration
査読有り
Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 64 (12) 5065-5072 2017年12月
DOI：
10.1109/TED.2017.2767598
ISSN：0018-9383
eISSN：1557-9646
-
Temporary Bonding and De-Bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si
査読有り
M. Murugesan, T. Fukushima, M. Koyanagi
Proceedings - Electronic Components and Technology Conference 1237-1242 2017年8月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ECTC.2017.253
ISSN：0569-5503
-
Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Proceedings - Electronic Components and Technology Conference 1523-1528 2017年8月1日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ECTC.2017.209
ISSN：0569-5503
-
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017年7月5日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC.2016.7970031
-
Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission
査読有り
Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka
IITC 2017 - 2017 IEEE International Interconnect Technology Conference 2017年7月5日
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/IITC-AMC.2017.7968936
-
3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration
査読有り
Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 64 (7) 2912-2918 2017年7月
DOI：
10.1109/TED.2017.2705562
ISSN：0018-9383
eISSN：1557-9646
-
FlexTrateTM Characterization
査読有り
T. Takafumi, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer
2017 FLEX 2017年6月
-
Directed Self-Assembly Patterning for 3D LSI
招待有り
Takafumi Fukushima, Mitsumasa Koyanagi
INC13 Workshop 2017年5月9日
-
Heterogeneous Integration with High-Performance and Scalable Substrates: Si-IF (Interconnect Fabric) and FlexTrateTM
査読有り
T. Fukushima, A. Bajwa, S. S. Iyer
Advancing Microelectronics Magazine 44 (2) 6-11 2017年5月
-
Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces
査読有り
Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 56 (4) 04CM04-1-04CM04-4 2017年4月1日
出版者・発行元：
Japan Society of Applied Physics
DOI：
10.7567/JJAP.56.04CM04
ISSN：1347-4065 0021-4922
-
Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber
査読有り
Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 56 (4) 04CM08-1-04CM08-4 2017年4月
DOI：
10.7567/JJAP.56.04CM08
ISSN：0021-4922
eISSN：1347-4065
-
Improving the barrier ability of Ti in Cu through-silicon vias through vacuum annealing
査読有り
Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Eiji Ikenaga, Hiroshi Nohira, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 56 (4) 2017年4月
DOI：
10.7567/JJAP.56.04CC08
ISSN：0021-4922
eISSN：1347-4065
-
半導体微細加工技術を用いた高機能シリコン神経プローブの開発
原島 卓也, 森川 拓実, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹
平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録 66-66 2017年2月6日
-
光ファイバ埋め込みシリコンオプト神経プローブの開発
森川 拓実, 原島 卓也, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹
平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録集 68-68 2017年2月6日
-
経爪型集積化光電式容積脈波計測システムの開発
査読有り
銭 正ヨウ, 竹澤 好樹, 下川 賢士, 伊藤 圭汰, 西野 悟, 清山 浩司, 田中 徹
生体医工学 55 (5) 464-464 2017年
出版者・発行元：
公益社団法人 日本生体医工学会
DOI：
10.11239/jsmbe.55Annual.464
-
Feasibility Study on Ultrafine-Pitch Cu-Cu Bonding Using Directed Self-Assembly (DSA)
査読有り
M. Murugesan, T. Fukushima, K. Mori, H. Hashimoto, Jichel Bea, M. Koyanagi
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 44-44 2017年
DOI：
10.23919/LTB-3D.2017.7947440
-
“FlexTrate®” - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
査読有り
Tak Fukushima, Arsalan Alam, Saptadeep Pal, Zhe Wan, Siva Jangam, Goutham Ezhilarasu, Adeel Bajwa, Subramanian Iyer
ECTC 2017, The 67th Electronic Components and Technology Conference 649-654 2017年
DOI：
10.1109/ECTC.2017.226
ISSN：0569-5503
-
Heterogeneous Integration at Fine Pitch (2-10 μm) Using Thermal Compression Bonding
査読有り
Adeel Ahmad Bajwa, SivaChandra Jangam, Saptadeep Pal, Niteesh Marathe, Tingyu Bai, Takafumi Fukushima, Mark Goorsky, Subramanian Iyer
ECTC 2017, The 67th Electronic Components and Technology Conference 1276-1284 2017年
DOI：
10.1109/ECTC.2017.240
ISSN：0569-5503
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A New Flexible Device Integration Technology Based on Fan-Out Wafer-Level Packaging
査読有り
T. Takafumi, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer
Printed Electronics USA in IDTechEx show 2016年11月16日
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FlexTrate™: High Interconnect Density Fan-Out Wafer Level Processing for Flexible Bio-compatible Electronics
招待有り
T. Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer
NBMC (Nano-Bio Manufactuuring Consortium) Workshop: Blood, Sweat and Tears III 2016年11月2日
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Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
査読有り
Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Micromachines 7 (10) 184-1-184-18 2016年10月
DOI：
10.3390/mi7100184
ISSN：2072-666X
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Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring
査読有り
Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
JSAP 2016 International Conference on Solid State Devices and Materials 409-410 2016年9月29日
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Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber
査読有り
Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka
JSAP 2016 International Conference on Solid State Devices and Materials 389-390 2016年9月28日
-
Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique
査読有り
Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
JSAP 2016 International Conference on Solid State Devices and Materials 467-468 2016年9月27日
-
半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に
招待有り
査読有り
福島誉史, 李康旭, 田中徹, 小柳光正
表面技術 小特集: シリコンウエハの表面処理 67 (8) 414-420 2016年8月1日
DOI：
10.4139/sfj.67.414
-
Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 6 (7) 1002-1008 2016年7月
DOI：
10.1109/TCPMT.2016.2575070
ISSN：2156-3950
eISSN：2156-3985
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Influence of Cu-TSVs, CuSnand PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips
査読有り
Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, Tetsu Tanaka
Proceedings of the ECTC 2016 50-55 2016年6月1日
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Capacitance characteristics of low-k low-cost CVD grown polyimide liner for high-density Cu through-Si-via in three-dimensional LSI
査読有り
Mariappan Murugesan, Fukushima Takafumi, Bea Ji-Chel, Hashimoto Hiroyuki, Koyanagi Mitsumasa
Jpn. J. Appl. Phys. 55 (4S) 04EC12-04EC12 2016年4月1日
出版者・発行元：
Institute of Physics
DOI：
10.7567/jjap.55.04ec12
ISSN：0021-4922
eISSN：1347-4065
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Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC
査読有り
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 2016年4月
DOI：
10.7567/JJAP.55.04EC07
ISSN：0021-4922
eISSN：1347-4065
-
Study of Vacuum-Assisted Spin Coating of Polymer Liner for High-Aspect-Ratio Through-Silicon-Via Applications
査読有り
Yangyang Yan, Yingtao Ding, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 6 (4) 501-509 2016年4月
DOI：
10.1109/TCPMT.2016.2514365
ISSN：2156-3950
eISSN：2156-3985
-
Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC
査読有り
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 04EC03-1-04EC03-4 2016年4月
DOI：
10.7567/JJAP.55.04EC03
ISSN：0021-4922
eISSN：1347-4065
-
Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC
査読有り
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Japanese Journal of Applied Physics 55 (4S) 04EC07-1-04EC07-4 2016年3月17日
DOI：
10.7567/JJAP.55.04EC07
-
Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration
査読有り
Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 25 (1) 91-100 2016年2月
DOI：
10.1109/JMEMS.2015.2480787
ISSN：1057-7157
eISSN：1941-0158
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New multichip-to-wafer 3D integration technology using Self-Assembly and Cu nano-pillar hybrid bonding
査読有り
M. Koyanagi, K. W. Lee, T. Fukushima, T. Tanaka
2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings 338-341 2016年
出版者・発行元：
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ICSICT.2016.7998914
-
Impact of Interconnections on Vertically Stacked 20 mu m-thick DRAM Chips
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, M. Koyanagi, S. Tanikawa, T. Tanaka
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 50-55 2016年
DOI：
10.1109/ECTC.2016.255
ISSN：0569-5503
-
Non-Conductive Film Underfill for 3D Integration of 20 mu m-Thick LSI Wafers with Fine Cu-TSVs
査読有り
M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka
2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 466-471 2016年
ISSN：1078-8743
-
Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, S. H. Lee, M. Motoyoshi, T. Tanaka, K. W. Lee, M. Koyanagi
2016 International Conference on Electronics Packaging (ICEP) 265-269 2016年
-
Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration
査読有り
Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 37 (1) 81-83 2016年1月
DOI：
10.1109/LED.2015.2502584
ISSN：0741-3106
eISSN：1558-0563
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DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価
谷川星野, 木野久志, 福島誉史, 田中徹
応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 11-130 2016年
-
応力センサ集積シリコン神経プローブの開発
原島卓也, 谷卓治, 鈴木雄策, 森川拓実, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 10-311-10-311 2016年
-
脳深部刺入可能なフレキシブルケーブル一体化シリコン神経プローブの開発
森川拓実, 谷卓治, 原島卓也, 鈴木雄策, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 2016年
-
Capillary Self-Assebly for 3D Heterogeneous System Integration and Packaging
招待有り
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
MRS ADVANCES 1 (34) 2355-2366 2016年
DOI：
10.1557/adv.2016.528
ISSN：2059-8521
-
Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip
査読有り
S. Tanikawa, H. Kino, T. Fukushima, K-W. Lee, M. Koyanagi, T. Tanaka
2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 6B-1-1-6B-1-6 2016年
DOI：
10.1109/IRPS.2016.7574561
ISSN：1541-7026
-
Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding
査読有り
T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 289-294 2016年
DOI：
10.1109/ECTC.2016.298
ISSN：0569-5503
-
Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra-fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration
査読有り
K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 350-355 2016年
DOI：
10.1109/ECTC.2016.10
ISSN：0569-5503
-
Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration
査読有り
Shinya Kikuta, Satohiko Hoshino, Yoshiki Yamanishi, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi
2016 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) 350-355 2016年
ISSN：2160-9020
-
Highly Sensitive Pressure Sensor with Silicon-On-Nothing (SON) MOSFET for Sensor Integrated Heterogeneous System
査読有り
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW) 186-187 2016年
DOI：
10.1109/SNW.2016.7578043
-
マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価
菅原陽平, 木野久志, 福島誉史, LEE K.-W., 小柳光正, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 12-340-12-340 2016年
-
網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価
下川賢士, 後藤大輝, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 11-408-11-408 2016年
-
光ファイバ埋め込みシリコンオプト神経プローブの刺入特性評価
森川拓実, 原島卓也, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 11-416-11-416 2016年
-
Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration
査読有り
T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 75 (9) 285-290 2016年
DOI：
10.1149/07509.0285ecst
ISSN：1938-5862
-
Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration
招待有り
T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 75 (9) 285-290 2016年
DOI：
10.1149/07509.0285ecst
ISSN：1938-5862
-
三次元集積用テンポラリー接着剤の特性とウエハエッジの影響
査読有り
福島誉史, 福島誉史, MURUGESAN Mariappan, BEA Jicheol, LEE Sanghoon, LEE Kang-Wook, 田中徹, 田中徹, 小柳光正
電子情報通信学会論文誌 C(Web) J99-C (11) 493-500 2016年
ISSN：1881-0217
-
New Concept of TSV Formation Methodology Using Directed Self-Assembly (DSA)
査読有り
Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2016年
DOI：
10.1109/3DIC.2016.7970022
ISSN：2164-0157
-
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications
査読有り
Kangwook. Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi
2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2016年
DOI：
10.1109/3DIC.2016.7970027
ISSN：2164-0157
-
Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology
査読有り
Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi
2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2016年
DOI：
10.1109/3DIC.2016.7970017
ISSN：2164-0157
-
電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発
原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹
平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム 60-60 2015年12月17日
-
柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-
鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹
平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム 60-60 2015年12月17日
-
Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array
査読有り
Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 790-791 2015年9月30日
-
Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications
査読有り
Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, Kang-Wook Lee
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 70-71 2015年9月29日
-
Capacitance Characteristics of Low-k Low-Cost CVD Grown Polyimide Liner for High-Density Cu-TSVs in 3D-LSI
査読有り
Murugesan Mariappan, Ji-Chel Bea, Takafumi Fukushima, Hiroyuki Hashimoto, Kang-Wook Lee, Mitsumasa Koyanagi
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 64-65 2015年9月29日
-
Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC
査読有り
Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 56-57 2015年9月27日
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高分子材料を用いた三次元集積技術
招待有り
福島誉史
第41回 よこはま高度実装技術コンソーシアム（YJC）実装技術セミナー 2015年6月11日
-
Die-to-Wafer Self-Assembly by Droplet Surface Tension for 3D LSI & Advanced System Integration
招待有り
Takafumi Fukushima
Proc. EMN Meeting on Droplets 2015年5月10日
-
Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration
査読有り
Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 54 (3) 030206-1-030206-6 2015年3月
DOI：
10.7567/JJAP.54.030206
ISSN：0021-4922
eISSN：1347-4065
-
Applications of three-dimensional LSI
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka
MRS BULLETIN 40 (3) 242-247 2015年3月
DOI：
10.1557/mrs.2015.33
ISSN：0883-7694
eISSN：1938-1425
-
Applications of three-dimensional LSI
招待有り
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka
MRS BULLETIN 40 (3) 242-247 2015年3月
DOI：
10.1557/mrs.2015.33
ISSN：0883-7694
eISSN：1938-1425
-
Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University
査読有り
K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015年
ISSN：2164-0157
-
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM
査読有り
Kang-Wook Lee, Ji-Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 2015年
ISSN：1541-7026
-
Yield Enhancement and Mitigating the Si-Chipping and Wafer Cracking in Ultra-Thin 20 mu m-Thick 8-and 12-Inch LSI Wafer
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi
2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 435-439 2015年
ISSN：1078-8743
-
高分子材料を用いた三次元集積技術 I:セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ
伊藤有香, 伊藤有香, 福島誉史, MURUGESAN Mariappan, 裴志哲, 李康旭, 田中徹, 田中徹, 小柳光正
エレクトロニクス実装学会講演大会講演論文集(CD-ROM) 29th 408-409 2015年
ISSN：1880-4616
-
高分子材料を用いた三次元集積技術 II:ビアラストTSV形成のための高耐熱テンポラリー無機接着層
橋口日出登, 福島誉史, 裴志哲, MURUGESAN Mariappan, 李康旭, 田中徹, 小柳光正
エレクトロニクス実装学会講演大会講演論文集(CD-ROM) 29th 410-412 2015年
ISSN：1880-4616
-
高分子材料を用いた三次元集積技術 III:気相堆積ポリイミドTSVライナーの形成と特性評価
福島誉史, MURUGESAN Mariappan, 裴志哲, 橋本宏之, 佐藤優, 李康旭, 小柳光正
エレクトロニクス実装学会講演大会講演論文集(CD-ROM) 29th 413-415 2015年
ISSN：1880-4616
-
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi
2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 260-263 2015年
-
Improved C-V, I-V Characteristics for Co-Polymerized Organic Liner in the Through-Silicon-Via for High Frequency Applications by Post Heat Treatment
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 73-77 2015年
DOI：
10.1109/ECTC.2015.7159574
ISSN：0569-5503
-
Development of Highly-Reliable Microbump Bonding Technology using Self-Assembly of NCF-Covered KGDs and Multi -Layer 3D Stacking Challenges
査読有り
Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 336-341 2015年
DOI：
10.1109/ECTC.2015.7159614
ISSN：0569-5503
-
Challenges of High-Robustness Self-Assembly with Cu/Sn-Ag Microbump Bonding for Die-to-Wafer 3D Integration
査読有り
Taku Suzuki, Kazushi Asami, Yasuhiro Kitamura, Takafumi Fukushima, Chisato Nagai, Jichoel Bea, Yutaka Sato, Mariappan Murugesan, Kang-wook Lee, Mitsumasa Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 342-347 2015年
DOI：
10.1109/ECTC.2015.7159615
ISSN：0569-5503
eISSN：2377-5726
-
Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV
査読有り
Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 822-827 2015年
DOI：
10.1109/ECTC.2015.7159687
ISSN：0569-5503
-
Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV liners for 3D RF Module
Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Jin Ho Lee
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 928-933 2015年
DOI：
10.1109/ECTC.2015.7159705
ISSN：0569-5503
-
Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration
査読有り
H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1458-1463 2015年
DOI：
10.1109/ECTC.2015.7159789
ISSN：0569-5503
-
Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors
査読有り
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 59-61 2015年
DOI：
10.1109/3DIC.2015.7334557
ISSN：2164-0157
-
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers
査読有り
K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, J. C. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 31-34 2015年
DOI：
10.1109/3DIC.2015.7334471
ISSN：2164-0157
-
Consideration of Micro bump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC
査読有り
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 260-263 2015年
DOI：
10.1109/3DIC.2015.7334596
ISSN：2164-0157
-
Transfer and Non-Transfer Stacking Technologies Based on Chip-to-Wafer Self-Asembly for High-Throughput and High-Precision Alignment and Microbump Bonding
査読有り
Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 134-137 2015年
DOI：
10.1109/3DIC.2015.7334578
ISSN：2164-0157
-
Vacuum-Assisted-Spin-Coating of Polyimide Liner for High-Aspect-Ratio TSVs Applications
査読有り
Yangyang Yan, Yingtao Ding, Qianwen Chen, Kangwook Lee, Takafumi Fukushima, Mitsu Koyanagi
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 84-88 2015年
DOI：
10.1109/3DIC.2015.7334568
ISSN：2164-0157
-
Mitigating Thermo Mechanical Stress in High Density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via _ mu-RS and mu-XRD Study
査読有り
M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 179-183 2015年
DOI：
10.1109/3DIC.2015.7334579
ISSN：2164-0157
-
回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究
木野久志, 橋口日出登, 谷川星野, 菅原陽平, 池ヶ谷俊介, 福島誉史, 福島誉史, 小柳光正, 田中徹, 田中徹
マイクロエレクトロニクスシンポジウム論文集 25th 355-358 2015年
ISSN：2434-396X
-
DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価
谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 12-124 2015年
-
3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価
菅原陽平, 木野久志, 福島誉史, LEE K.-W., 小柳光正, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 12-123-12-123 2015年
-
チップ集積・フレキシブルケーブル一体化シリコン神経プローブの開発(集積化脳神経プローブシステムの開発 1)
鈴木雄策, 谷卓治, 原島卓也, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 11-379 2015年
-
大脳皮質層別光刺激のための反射ミラー集積シリコン神経プローブの開発
原島卓也, 谷卓治, 鈴木雄策, 森川拓実, 木野久志, 福島誉史, 田中徹, 田中徹
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th p11-381-p11-381 2015年
-
気相堆積重合によるポリイミド薄膜の形成とシリコン貫通配線への応用
福島誉史, 福島誉史, MURUGESAN Mariappan, BEA Jichoel, LEE Kangwook, 小柳光正
高分子学会予稿集(CD-ROM) 64 (2) 2015年
-
三次元積層型LSI作製のための高耐熱テンポラリー接着剤技術
福島誉史, 福島誉史, MURUGESAN Mariappan, BEA Jichoel, LEE Kangwook, 小柳光正
高分子学会予稿集(CD-ROM) 64 (2) 2015年
-
シリコン貫通配線(TSV)と三次元集積化技術の研究開発動向
招待有り
福島誉史, LEE Kang-Wook, 田中徹, 小柳光正
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 32nd 28pm3-D-1-1-28pm3-D-1-6 2015年
-
三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価
谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹, 田中徹
応用物理学会東北支部学術講演会講演予稿集(Web) 70th 2015年
-
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
査読有り
K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi
2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 185-188 2015年
DOI：
10.1109/IEDM.2015.7409652
-
Mechanical Characteristics of Thin Die/Wafers in Three-Dimensional Large-Scale Integrated Systems
査読有り
Murugesan Mariappan, Takafumi Fukushima, Jichoel C. Bea, Kang-Wook Lee, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 27 (3) 341-346 2014年8月
DOI：
10.1109/TSM.2014.2316917
ISSN：0894-6507
eISSN：1558-2345
-
Self-Assembly Based 3D and Heterointegration
査読有り
Takafumi Fukushima, Jicheol Bea
Handbook of 3D Integration 3 325-334 2014年7月21日
出版者・発行元：
Wiley Blackwell
DOI：
10.1002/9783527670109.ch24
-
Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration
査読有り
Kang-Wook Lee, Ji-Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 14 (1) 451-462 2014年3月
DOI：
10.1109/TDMR.2013.2258022
ISSN：1530-4388
eISSN：1558-2574
-
Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM
査読有り
Kang-Wook Lee, Seiya Tanikawa, Mariappan Murugesan, Hideki Naganuma, Ji-Choel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 379-385 2014年2月
DOI：
10.1109/TED.2013.2295244
ISSN：0018-9383
eISSN：1557-9646
-
Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film
査読有り
Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 533-539 2014年2月
DOI：
10.1109/TED.2013.2294831
ISSN：0018-9383
eISSN：1557-9646
-
Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice
査読有り
Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 540-547 2014年2月
DOI：
10.1109/TED.2013.2295463
ISSN：0018-9383
eISSN：1557-9646
-
Impacts of Cu Contamination in 3D Integration Process on Memory Retention Characteristics in Thinned DRAM Chip
査読有り
Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichel Bea, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM 2014年
ISSN：1541-7026
-
Via-Last/Backside-Via 3D Integration Using a Visible-Light Laser Debonding Technique
査読有り
T. Fukushima, M. Mariappan, J. -C. Bea, H. Hashimoto, Y. Sato, M. Motoyoshi, K. -W. Lee, M. Koyanagi
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 13-13 2014年
-
Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV
査読有り
Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 35 (1) 114-116 2014年1月
DOI：
10.1109/LED.2013.2287879
ISSN：0741-3106
eISSN：1558-0563
-
Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, Y. Sato, H. Hashimoto, K. W. Lee, M. Koyanagi
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 374-377 2014年
-
Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology
査読有り
K-W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J-C Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 669-672 2014年
-
A Study on Positive Photosensitive Epoxy Resins Using Reaction Development Patterning (RDP)
査読有り
Wei Min Zhou, Takafumi Fukushima, Masao Tomoi, Toshiyuki Oyama
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY 27 (6) 713-717 2014年
DOI：
10.2494/photopolymer.27.713
ISSN：0914-9244
-
Wafer Thinning for High-Density Three Dimensional Integration _ 12-Inch Wafer-Level 3D-LSI Program at GINTI
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi
2014 25TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 57-61 2014年
DOI：
10.1109/ASMC.2014.6846977
ISSN：1078-8743
-
A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
査読有り
H. Hashiguchi, T. Fukushima, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) 74-77 2014年
DOI：
10.1109/ICEP.2014.6826664
-
A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies
査読有り
K-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 304-308 2014年
DOI：
10.1109/ECTC.2014.6897303
ISSN：0569-5503
-
Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
査読有り
Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 636-640 2014年
DOI：
10.1109/ECTC.2014.6897353
ISSN：0569-5503
eISSN：2377-5726
-
Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly
査読有り
H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 856-861 2014年
DOI：
10.1109/ECTC.2014.6897386
ISSN：0569-5503
-
Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
査読有り
Hisashi Kino, Hideto Hashiguchi, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1110-1115 2014年
DOI：
10.1109/ECTC.2014.6897428
ISSN：0569-5503
-
Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies
査読有り
Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1148-1153 2014年
DOI：
10.1109/ECTC.2014.6897434
ISSN：0569-5503
-
Via-last/backside-via 3D integration using a visible-light laser debonding technique
査読有り
T. Fukushima, M. Mariappan, J. C. Bea, H. Hashimoto, Y. Sato, M. Motoyoshi, K. W. Lee, M. Koyanagi
Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 13-70 2014年
出版者・発行元：
IEEE Computer Society
DOI：
10.1109/LTB-3D.2014.6886152
-
Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration
査読有り
H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 14-14 2014年
DOI：
10.1109/LTB-3D.2014.6886153
-
Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration
査読有り
Y. Ito, T. Fukushima, K. -W. Lee, K. Choki, T. Tanaka, M. Koyanagi
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 15-15 2014年
DOI：
10.1109/LTB-3D.2014.6886154
-
Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation
査読有り
Takafumi Fukushima, Murugesan Mariappan, Jichoel Bea, Kang-Wook Lee, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 720-721 2014年
-
Stress Distribution Pattern in Cross-Sectional 3D-LSI Examined by u-XRD
査読有り
M. Mariappan, J.C. Bea, T. Fukushima, K.W. Lee, M. Koyaangi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 724-725 2014年
-
Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
査読有り
Y. Sugawara, H. Hashiguchi, S. Tanikawa, H. Kino, K. Lee, T. Fukushima, M. Koyanagi, T. Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 726-727 2014年
-
Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration
査読有り
Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) O4 2014年
ISSN：2164-0157
-
Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV
査読有り
K. W. Lee, C. Nagai, A. Nakamura, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) O13 2014年
ISSN：2164-0157
-
Micro-XRD Investigation of Fine-Pitch Cu-TSV Induced Thermo-Mechanical Stress in High-Density 3D-LSI
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, T. Tanaka
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) O18 2014年
ISSN：2164-0157
-
Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems
査読有り
Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 60 (11) 3842-3848 2013年11月
DOI：
10.1109/TED.2013.2280273
ISSN：0018-9383
eISSN：1557-9646
-
Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration
査読有り
Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan, Hideki Naganuma, Haro Shimamoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 34 (8) 1038-1040 2013年8月
DOI：
10.1109/LED.2013.2265336
ISSN：0741-3106
eISSN：1558-0563
-
Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration
査読有り
Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Japanese Journal of Applied Physics 52 (4) 04CB11-1-04CB11-5 2013年4月
DOI：
10.7567/JJAP.52.04CB11
ISSN：0021-4922 1347-4065
-
Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration
査読有り
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 52 (4) 04CB09-1-04CB09-6 2013年4月
DOI：
10.7567/JJAP.52.04CB09
ISSN：0021-4922
eISSN：1347-4065
-
3D Hetero-Integration Technology with Backside TSV and Reliability Challenges
査読有り
Kang-Wook Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) 2013年
-
Challenges in 3D Integration
査読有り
Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka
SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3 53 (3) 237-244 2013年
DOI：
10.1149/05303.0237ecst
ISSN：1938-5862
eISSN：1938-6737
-
Revisiting the Silicon-Lattice in the High-Density 3D-LSIs - In the Perspective of Device Reliability
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 172-175 2013年
DOI：
10.1109/IEDM.2013.6724578
-
Characterization and Reliability of 3D LSI and SiP
査読有り
K-W. Lee, M. Murugesan, Jichel Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 176-179 2013年
DOI：
10.1109/IEDM.2013.6724579
-
3次元システムLSI開発のためのチップレベルTSVプロセス
査読有り
朴澤一幸, 古田太, 花岡裕子, 青木真由, 長田健一, 武田健一, LEE Kang Wook, 福島誉史, 小柳光正
電子情報通信学会論文誌 C J96-C (11) 335-343 2013年
ISSN：1345-2827
-
Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
査読有り
H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
Proceedings of International Conference on Electronics Packaging (ICEP) 502-505 2013年
-
3D Integration technologies using self-assembly and electrostatic temporary multichip bonding
査読有り
T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
Proceedings - Electronic Components and Technology Conference 58-63 2013年
DOI：
10.1109/ECTC.2013.6575550
ISSN：0569-5503
-
Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI
査読有り
H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka
Proceedings - Electronic Components and Technology Conference 360-365 2013年
DOI：
10.1109/ECTC.2013.6575596
ISSN：0569-5503
-
Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
査読有り
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 891-896 2013年
DOI：
10.1109/ECTC.2013.6575679
-
Young Modulus of Si in 3D-LSIs and Reliability
査読有り
M. Murugesan, J.C. Bea, T. Fukushima, K.W. Lee, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 38-39 2013年
-
Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
査読有り
H. Hashiguchi, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 40-41 2013年
-
Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D-IC
査読有り
H. Kino, T. Fukushima, K.-W. Lee, M. Koyanagi, T. Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 862-863 2013年
-
Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization
査読有り
T. Fukushima, M. Murugesan, J. Bea, K.W. Lee, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 866-867 2013年
-
Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
査読有り
Y. Ito, T. Fukushima, K.W. Lee, K. Choki, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 988-989 2013年
-
Mechanical Characteristics of Thin Dies/Wafers in Three-Dimensional Large-Scale Integrated systems
査読有り
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, T. Tanaka
2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 66-69 2013年
DOI：
10.1109/ASMC.2013.6552777
ISSN：1078-8743
-
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory
査読有り
K-W Lee, S. Tanikawa, M. Murugesan, H. Naganuma, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702336
ISSN：2164-0157
-
Highly Efficient TSV Repair Technology for Resilient 3-D Stacked Multicore Processor System
査読有り
H. Hashimoto, T. Fukushima, K. W. Lee, M. Koyanagi, T. Tanaka
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702338
ISSN：2164-0157
-
3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology
査読有り
T. Fukushima, J. Bea, M. Murugesan, H. -Y. Son, M. -S. Sun, K. -Y. Byun, N. -S. Kim, K. -W. Lee, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702360
ISSN：2164-0157
-
A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor
査読有り
K. Kiyoyama, Y. Sato, H. Hashimoto, K-W Lee, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702363
ISSN：2164-0157
-
Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV
査読有り
M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702364
ISSN：2164-0157
-
Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System
査読有り
T. Fukushima, J. Bea, M. Murugesan, K. -W. Lee, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013年
DOI：
10.1109/3DIC.2013.6702383
ISSN：2164-0157
-
Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation
査読有り
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 59 (11) 2956-2963 2012年11月
DOI：
10.1109/TED.2012.2212709
ISSN：0018-9383
eISSN：1557-9646
-
Instability-driven terahertz emission and injection locking behavior in an asymmetric dual-grating-gate HEMT with a vertical cavity structure
査読有り
T. Watanabe, T. Fukushima, Y. Kurita, A. Satou, T. Otsuji
ICMNE: Int. Conf. on Micro and Nanoelectronics, Moscow, Russia, Oct. 1-5, 2012. 1 (1) P1-43 2012年10月3日
-
Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis
査読有り
Kang-Wook Lee, Yoshinobu Watanabe, Chikashi Kigure, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22 (10) 2012年10月
DOI：
10.1088/0960-1317/22/10/105015
ISSN：0960-1317
eISSN：1361-6439
-
Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration
査読有り
Kangwook Lee, Takaharu Tani, Hideki Naganuma, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 33 (9) 1297-1299 2012年9月
DOI：
10.1109/LED.2012.2202631
ISSN：0741-3106
eISSN：1558-0563
-
High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate—an alternative method to wire bonding
査読有り
M Murugesan, T Fukushima, K Kiyoyama, J-C Bea, T Tanaka, M Koyanagi
JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22 (8) 2012年8月
DOI：
10.1088/0960-1317/22/8/085033
ISSN：0960-1317
eISSN：1361-6439
-
Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking
査読有り
M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi
JOURNAL OF ELECTRONIC MATERIALS 41 (4) 720-729 2012年4月
DOI：
10.1007/s11664-012-1949-1
ISSN：0361-5235
-
Impact of Data Transmission over 10 Gbps on High-Density and Low-Cost Optoelectronic Module with Polynorbornene Waveguides
査読有り
Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 51 (4) 04DG01-1-04DG01-4 2012年4月
DOI：
10.1143/JJAP.51.04DG01
ISSN：0021-4922
eISSN：1347-4065
-
Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI
査読有り
Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 33 (2) 221-223 2012年2月
DOI：
10.1109/LED.2011.2174608
ISSN：0741-3106
-
Heterogeneous 3D Integration Technology and New 3D LSIs
査読有り
Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka
2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 240-243 2012年
-
Chip-Based Hetero-Integration Technology for High-Performance 3D Stacked Image Sensor
査読有り
Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2012 2ND IEEE CPMT SYMPOSIUM JAPAN 2012年
ISSN：2373-5449
-
Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs
査読有り
M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 657-660 2012年
DOI：
10.1109/IEDM.2012.6479124
-
Characterization of Chip-level Hetero-Integration Technology for High-Speed, Highly Parallel 3D-Stacked Image Processing System
査読有り
K-W Lee, Y. Ohara, K. Kiyoyama, S. Konno, Y. Sato, S. Watanabe, A. Yabata, T. Kamada, J-C Bea, H. Hashimoto, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 785-788 2012年
DOI：
10.1109/IEDM.2012.6479156
-
New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
査読有り
T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 789-792 2012年
DOI：
10.1109/IEDM.2012.6479157
-
Impact of Cu Diffusion from Cu Through-Silicon Via (TSV) on Device Reliability in 3-D LSIs Evaluated by Transient Capacitance Measurement
査読有り
Kangwook Lee, Jichel Bea, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 2B.4.1-2B.4.6 2012年
DOI：
10.1109/IRPS.2012.6241777
-
Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs
査読有り
Kangwook Lee, Itakafumi Fukushima, Tetsu Tanaka, Imitsumasa Koyanagi
2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 5F.2.1-5F.2.4 2012年
DOI：
10.1109/IRPS.2012.6241860
-
Self-assembly-based 3D integration technologies
査読有り
T. Fukushima, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 151-152 2012年
DOI：
10.1109/LTB-3D.2012.6238075
-
Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
査読有り
T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 393-398 2012年
DOI：
10.1109/ECTC.2012.6248860
-
Locally Induced Stress in Stacked Ultrathin Si wafers: XPS and mu-Raman study
査読有り
M. Murugesan, H. Nohira, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 625-629 2012年
DOI：
10.1109/ECTC.2012.6248896
-
Optical interconnect technology for 3-D LSI and neural engineering applications
査読有り
T. Tanaka, A. Noriki, T. Kukushima, K-W Lee, M. Koyanagi
2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) 2012年
-
Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration
査読有り
Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Osada, Kenichi Takeda, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
Digest of Technical Papers - Symposium on VLSI Technology 175-176 2012年
DOI：
10.1109/VLSIT.2012.6242518
ISSN：0743-1562
-
10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
査読有り
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 46-47 2012年
-
Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
査読有り
Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 48-49 2012年
-
The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3D LSI by Using C–V and C–t Measurements
査読有り
Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 50-51 2012年
-
Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration
査読有り
H. Kino, J-C. Bea, M. Murugesan, K-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 52-53 2012年
-
Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisted Self-Assembly with Cu/Sn Microbump
査読有り
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1176-1177 2012年
-
Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
査読有り
Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1183-1184 2012年
-
Reliability Challenges in High-Density 3D-Integration
査読有り
M. Murugesan, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1185-1186 2012年
-
Cu Contamination Assessment and Control in 3-D Integration
査読有り
Mitsumasa Koyanagi, Kang Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka
The 222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012年
-
Long Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride
査読有り
Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
Materials Research Society (MRS) 2008 Spring Meeting, Symposium F: Materials Science and Technology for Nonvolatile Memories, F2.4 2012年
-
Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing
査読有り
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 1 (12) 1873-1884 2011年12月
DOI：
10.1109/TCPMT.2011.2160266
ISSN：2156-3950
eISSN：2156-3985
-
Advanced die-to-wafer 3D integration platform: Self-assembly technology
査読有り
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
3D Integration for VLSI Systems 153-174 2011年9月30日
出版者・発行元：
Pan Stanford Publishing Pte. Ltd.
DOI：
10.4032/9789814303828
-
Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement
査読有り
Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 32 (7) 940-942 2011年7月
DOI：
10.1109/LED.2011.2141109
ISSN：0741-3106
eISSN：1558-0563
-
MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric
査読有り
Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON NANOTECHNOLOGY 10 (3) 528-531 2011年5月
DOI：
10.1109/TNANO.2010.2050331
ISSN：1536-125X
-
Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
査読有り
Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 58 (3) 748-757 2011年3月
DOI：
10.1109/TED.2010.2099870
ISSN：0018-9383
eISSN：1557-9646
-
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
査読有り
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
MICROMACHINES 2 (1) 49-68 2011年3月
DOI：
10.3390/mi2010049
ISSN：2072-666X
-
Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement
査読有り
K-W Lee, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
SEMICONDUCTOR SCIENCE AND TECHNOLOGY 26 (2) 2011年2月
DOI：
10.1088/0268-1242/26/2/025007
ISSN：0268-1242
eISSN：1361-6641
-
Chip-level TSV integration for rapid prototyping of 3D system LSIs
査読有り
Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262952
-
Stacked SOI pixel detector using versatile fine pitch μ-bump technology
査読有り
Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262959
-
3D Integration Technology and Reliability Challenges
査読有り
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) 2011年
ISSN：2151-1225
-
Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement
査読有り
K-W. Lee, J-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 158 (8) H795-H799 2011年
DOI：
10.1149/1.3597317
ISSN：0013-4651
eISSN：1945-7111
-
Energy Band Engineering of Metal Nanodots for High Performance Nonvolatile Memory Application
査読有り
Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS 470 140-+ 2011年
DOI：
10.4028/www.scientific.net/KEM.470.140
ISSN：1013-9826
-
三次元集積化技術とヘテロインテグレーション
査読有り
小柳光正, 福島誉史, LEE Kangwook, 田中徹
電子情報通信学会論文誌 C J94-C (11) 355-364 2011年
ISSN：1345-2827
-
三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術
査読有り
大原悠希, 乗木暁博, LEE Kang-Wook, 福島誉史, 田中徹, 田中徹, 小柳光正
電子情報通信学会論文誌 C J94-C (11) 394-401 2011年
ISSN：1345-2827
-
シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価
査読有り
木野久志, MURUGESAN Mariappan, 小島俊哉, 福島誉史, 田中徹, 田中徹, 小柳光正
電子情報通信学会論文誌 C J94-C (11) 411-418 2011年
ISSN：1345-2827
-
Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement
査読有り
Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 32 (1) 66-68 2011年1月
DOI：
10.1109/LED.2010.2087004
ISSN：0741-3106
eISSN：1558-0563
-
High Density 3D LSI Technology using W/Cu Hybrid TSVs
査読有り
M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 139-142 2011年
DOI：
10.1109/IEDM.2011.6131503
-
Development of 5 µm Diameter Backside Cu TSV Technology for 3D LSI
査読有り
Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings of the International Conference on Electronics Packaging (ICEP) 237-240 2011年
-
Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration
査読有り
T. Fukushima, Y. Ohara, M. Murugesan, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi
2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2050-2055 2011年
DOI：
10.1109/ECTC.2011.5898799
ISSN：0569-5503
-
3D LSI Technology and Reliability Issues
査読有り
T. Tanaka, J. Bea, M. Murugesan, K. Lee, T. Fukushima, M. Koyanagi
Proceedings of the 2011 Symposium on VLSI Technology 184-185 2011年
-
Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer
査読有り
M. Murugesan, H. Nohira, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 50-51 2011年
-
Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor
査読有り
H. Hashimoto, T. Fukushima, K-W. Lee, T. Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 168-169 2011年
-
Development of Implantable Si Neural Probe with Stimulus and Recording Electrodes for Deep Brain Stimulation
査読有り
Yoshiho Yukita, Sanghoon Lee, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 408-409 2011年
-
Impacts of Microbump-Induced Local Bending Stress in 3D-LSI
査読有り
H. Kino, M. Murugesan, K.-W. Lee, J.-C. Bea, C. Miyazaki, H. Kobayashi, H. Shimamoto, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 785-786 2011年
-
Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs
査読有り
H. Hashiguchi, M. Murugesan, J.C. Bea, K.W. Lee, T. Fukushima, H. Kobayashi, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 795-796 2011年
-
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI
査読有り
Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Fanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 821-822 2011年
DOI：
10.1109/3DIC.2012.6262957
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A Block-Parallel SAR ADC for CMOS Image Sensor with 3-D Stacked Structure
査読有り
K. Kiyoyama, K-W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1055-1056 2011年
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Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis
査読有り
Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1097-1098 2011年
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Performance of Low-Loss and Low-Cost Optoelectronic Module with Polynorbornene Waveguide for 10-Gbps Data Transmission
査読有り
Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1125-1126 2011年
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Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration
査読有り
Yuki Ohara, Lee Kangwook, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262950
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Temporary bonding strength control for self-assembly-based 3D integration
査読有り
Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262954
-
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI
査読有り
Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Fanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262957
-
A very low area ADC for 3-D stacked CMOS image processing system
査読有り
K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262958
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High-bandwidth data transmission of new transceiver module through optical interconnection
査読有り
Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyangi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 1-36 2011年
DOI：
10.1109/3DIC.2012.6263010
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High density Cu-TSVs and reliability issues
査読有り
Murugesan Mariappan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262969
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W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress
査読有り
Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011年
DOI：
10.1109/3DIC.2012.6262970
-
High Reliable and Fine Size of 5-µm Diameter Backside Cu Through-Silicon Via(TSV)for High Reliability and High-End 3-D LSIs
査読有り
K.-W. Lee, J.-C. Bea, T. Fukushima, Y. Ohara, T. Tanaka, M. Koyanagi
Technical Digest of IEEE International 3D System Integration Conference (3DIC) 2011年
DOI：
10.1109/3DIC.2012.6262975
-
A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module
査読有り
Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 19 (6) 1284-1291 2010年12月
DOI：
10.1109/JMEMS.2010.2082497
ISSN：1057-7157
eISSN：1941-0158
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Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application
査読有り
Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 49 (6) 066503-1-066503-4 2010年6月
DOI：
10.1143/JJAP.49.066503
ISSN：0021-4922
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Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
査読有り
T. Fukushima, E. Iwata, T. Konno, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi
APPLIED PHYSICS LETTERS 96 (15) 154105-1-154105-3 2010年4月
DOI：
10.1063/1.3328098
ISSN：0003-6951
-
Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010 2010年
-
セルフアセンブリを基盤としたウェーハレベル三次元集積化技術
査読有り
福島誉史, LEE Kang-Wook, 田中徹, 田中徹, 小柳光正
電子情報通信学会技術研究報告 109 (408(SDM2009 171-181)) 323-326 2010年
ISSN：0913-5685
-
Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration
査読有り
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Technical Digest of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 433-437 2010年
-
Impact of Remnant Stress/Strain in 3D Stacked Retinal Chip by Wafer Thinning and Bonding
査読有り
Hisashi Kino, Tatsuro Hiraki, Mariappan Murugesan, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi, Testu Tanaka
Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region 123-124 2010年
-
Electrical and Mechanical Characteristics of Si Double-sided Neural Probe for In-vivo Recording
査読有り
Sanghoon Lee, Risato Kobayashi, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region 127-128 2010年
-
Highly Accurate Optical Stimulation of Neuron using Si Neural Probe with Optical Waveguide
査読有り
Risato Kobayashi, Sanghoon Lee, Soichiro Kanno, Yoshiho Yukita, Kangwook Lee, Takafumi Fukushima, Toru Ishizuka, Hajime Mushiake, Hiromu Yao, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 181-182 2010年
-
Development of Versatile Backside Via Technology for 3D System on Chip
査読有り
Y. Ohara, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 237-238 2010年
-
Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement
査読有り
J.-C. Bea, K.-W. Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1196-1197 2010年
-
Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI
査読有り
Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1198-1199 2010年
-
Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration
査読有り
Eiji Iwata, Yuki Ohara, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1202-1203 2010年
-
Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study
査読有り
M. Murugesan, Y. Ohara, J.C Bea, K.W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1204-1205 2010年
-
Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration
査読有り
T. Fukushima, E. Iwata, K. -W. Lee, T. Tanaka, M. Koyanagi
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1050-1055 2010年
DOI：
10.1109/ECTC.2010.5490830
ISSN：0569-5503
-
Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application
査読有り
Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings of the China Semiconductor Technology International Conference (CSTIC) 55-55 2010年
-
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding
査読有り
Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010年
DOI：
10.1109/3DIC.2010.5751432
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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI
査読有り
Akihiro Noriki, Kang-Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010年
DOI：
10.1109/3DIC.2010.5751435
-
エレクトロニクスの多様化を支える新デバイス技術-2020年を見据えて-4.極限集積化を目指すスーパチップ
査読有り
小柳光正, 福島誉史, LEE Kangwook, 田中徹
電子情報通信学会誌 93 (11) 918-922 2010年
ISSN：0913-5693
-
3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems
査読有り
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS 33 (12) 71-90 2010年
DOI：
10.1149/1.3501035
ISSN：1938-5862
eISSN：1938-6737
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Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias
査読有り
M. Murugesan, H. Kino, H. Nohira, J. C. Bea, A. Horibe, F. Yamada, C. Miyazaki, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST 30-34 2010年
DOI：
10.1109/IEDM.2010.5703279
-
三次元積層型集積回路のための自己組織化チップ位置合せ技術
査読有り
岩田永司, 福島誉史, 大原悠希, LEE Kang-Wook, 田中徹, 田中徹, 小柳光正
電子情報通信学会論文誌 C J93-C (11) 493-502 2010年
ISSN：1345-2827
-
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature
査読有り
T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010年
DOI：
10.1109/3DIC.2010.5751436
-
A block-parallel signal processing system for CMOS image sensor with three-dimensional structure
査読有り
K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010年
DOI：
10.1109/3DIC.2010.5751479
-
Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer
査読有り
T. Tanaka, T. Fukushima, K. -W. Lee, M. Murugesan, M. Koyanagi
2010 IEEE INTERNATIONAL SOI CONFERENCE 60-63 2010年
DOI：
10.1109/SOI.2010.5641471
ISSN：1078-621X
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セルフアセンブリ法を用いた新しいヘテロインテグレーション技術
招待有り
福島誉史, 田中徹, 小柳光正
応用物理学会分科会 シリコンテクノロジー 「VLSIシンポジウム特集(先端CMOSデバイス・プロセス技術)」 115 17-22 2009年8月3日
-
Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric
査読有り
Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 95 (3) 033118-033120 2009年7月
DOI：
10.1063/1.3189085
ISSN：0003-6951
-
Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric
査読有り
Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 95 (3) 033118-1-033118-3 2009年7月
DOI：
10.1063/1.3189085
ISSN：0003-6951
-
MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition
査読有り
Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi
SEMICONDUCTOR SCIENCE AND TECHNOLOGY 24 (4) 2009年4月
DOI：
10.1088/0268-1242/24/4/045022
ISSN：0268-1242
-
Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
査読有り
Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C113-1-C113-5 2009年4月
DOI：
10.1143/JJAP.48.04C113
ISSN：0021-4922
-
Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
査読有り
Kenji Makita, Kouji Kiyoyarna, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C077-1-C077-5 2009年4月
DOI：
10.1143/JJAP.48.04C077
ISSN：0021-4922
-
Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
査読有り
Woo-Cheol Jeong, Kouji Kiyoyama, Kang-Wook Lee, Akihiro Noriki, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C157-1-C157-5 2009年4月
DOI：
10.1143/JJAP.48.04C157
ISSN：0021-4922
eISSN：1347-4065
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Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
査読有り
Soichiro Kanno, Risato Kobayashi, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C189-1-C189-4 2009年4月
DOI：
10.1143/JJAP.48.04C189
ISSN：0021-4922
-
Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
査読有り
Risato Kobayashi, Soichiro Kanno, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C194-1-C194-5 2009年4月
DOI：
10.1143/JJAP.48.04C194
ISSN：0021-4922
-
Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application
査読有り
Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 94 (6) 063108-063110 2009年2月
DOI：
10.1063/1.3081042
ISSN：0003-6951
-
Super chip integration technology for three-dimensionally stacked retinal prosthesis chips
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Smart Systems Integration 2009, SSI 2009 299-306 2009年
出版者・発行元：
AKA Verlag
-
訂正：三次元積層型チップのためのSi貫通ビア（TSV）形成技術 [エレクトロニクス実装学会誌 12(2): 104-109 (2009)]
福島 誉史, 田中 徹, 小柳 光正
エレクトロニクス実装学会誌 12 (3) 262-262 2009年
出版者・発行元：
The Japan Institute of Electronics Packaging
DOI：
10.5104/jiep.12.262
ISSN：1343-9677
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Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method
査読有り
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 323-326 2009年
ISSN：2380-9248
-
Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding
査読有り
M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanag
Technical Digest - International Electron Devices Meeting, IEDM 14.5.4 2009年
DOI：
10.1109/IEDM.2009.5424348
ISSN：0163-1918
-
3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding
査読有り
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
Technical Digest - International Electron Devices Meeting, IEDM 14.2.4 2009年
DOI：
10.1109/IEDM.2009.5424351
ISSN：0163-1918
-
Three-Dimensional Integration Technology and Integrated Systems
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009 409-415 2009年
ISSN：2153-6961
-
Fabrication of Multichannel Neural Microelectrodes with Microfluidic Channels Based on Wafer Bonding Technology
査読有り
R. Kobayashi, S. Kann, T. Fukushima, T. Tanaka, M. Koyanagi
13TH INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING, VOLS 1-3 23 (1-3) 2258-+ 2009年
ISSN：1680-0737
-
Development of A Silicon Neural Probe for An Intelligent Silicon Neural Probe System
Risato Kobayashi, Lee Sanghoon, Soichiro Kanno, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
Nano-Biomedical Engineering 2009 297-308 2009年
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Electrical characterization of MOS memory devices with self-assembled tungsten nano-dots dispersed in silicon nitride
査読有り
Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
ECS Transactions 18 (1) 33-37 2009年
DOI：
10.1149/1.3096423
ISSN：1938-5862 1938-6737
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Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride
査読有り
Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
Proceedings of the International Semiconductor Technology Conference/China Semiconductor Technology International Conference (ISTC/CSTIC) 85-89 2009年
-
Super Hetero-Integration Technology for LSI /MEMS Integration
査読有り
M. Koyanagi, K.-W. Lee, T. Fukushima, T. Tanaka
Proceedings of the International Conference on Electronics Packaging (ICEP) 589-595 2009年
-
Development of Double-sided Si Neural Probe with Microfluidic Channels Using Wafer Direct Bonding Technique
査読有り
R. Kobayashi, S. Kanno, S. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka
2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING 96-+ 2009年
DOI：
10.1109/NER.2009.5109243
ISSN：1948-3546
-
A Simple Device Allowing Silicon Microelectrode Insertion for Chronic Neural Recording in Primates
査読有り
Kazuhiro Sakamoto, Yoshia Matsuzaka, Tamotsu Suenaga, Hiroshi Watanabe, Risato Kobayashi, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka, Mitsumasa Koyanagi, Hajime Mushiake
2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING 104-+ 2009年
DOI：
10.1109/NER.2009.5109245
ISSN：1948-3546
-
Cu Lateral Interconnects Formed Between 100-mu m-Thick Self-Assembled Chips on Flexible Substrates
査読有り
M. Murugesan, J. -C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. -C. Jeong, H. Kino, A. Noriki, K. -W. Lee, T. Tanaka, M. Koyanagi
2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 1496-1501 2009年
DOI：
10.1109/ECTC.2009.5074210
-
Development of EEB (Electroplated Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps
査読有り
Y. Ohara, A. Noriki, E. Iwata, T. Hiraki, K.-W. Lee, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 86-87 2009年
-
High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module
査読有り
A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K.-W. Lee, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 88-89 2009年
-
Evaluation of Thin LSI Wafers by Capacitance-Time (C-t) Measurement for the Process Characterization of Three-Dimensional (3D) Integration
査読有り
J.-C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of International Conference on Solid State Devices and Materials (SSDM) 370-371 2009年
-
In vivo Neural Signal Recording using Double-sided Si Neural Probe
査読有り
S. Lee, R. Kobayashi, S. Kanno, K. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 691-692 2009年
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Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module
査読有り
K-W Lee, S. Kanno, Y. Ohara, K. Kiyoyama, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 6-+ 2009年
ISSN：2164-0157
-
A Parallel ADC for High-Speed CMOS Image Processing System with 3D Structure
査読有り
K. Kiyoyama, Y. Ohara, K-W Lee, Y. Yang, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 101-+ 2009年
ISSN：2164-0157
-
Micro-Raman Spectroscopy Analysis and Capacitance-Time (C-t) Measurement of Thinned Silicon Substrates for 3D Integration
査読有り
J. -C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. -W Lee, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 189-193 2009年
ISSN：2164-0157
-
10 µm Fine Pitch Cu/Sn Micro-Bumps for 3-D Super-Chip Stack
査読有り
Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang-Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Technical Digest of the IEEE International 3D System Integration Conference 2009 (3DIC) 389-+ 2009年
ISSN：2164-0157
-
Development of a New Self-Assembled Die Bonder to Three-Dimensionally Stack Known Good Dies in Batch
査読有り
Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 434-437 2009年
ISSN：2164-0157
-
Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
査読有り
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION 1112 121-130 2009年
ISSN：0272-9172
-
Ultra Low Power Vertical MOS Devices for Fully Implantable Rtinal Prosthesis
査読有り
H. Kino, T. Hiraki, J-C. Bea, T. Fukushima, M. Koyanagi, T. Tanaka
3rd East Asian Pacific Student Workshop on Nano-Biomedical Engineering 112-113 2009年
-
Impact of Remnant Stress/Strain and Metal Contamination in 3D-LSIs with Through-Si Vias Fabricated by Wafer Thinning and Bonding
査読有り
M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 335-+ 2009年
DOI：
10.1109/IEDM.2009.5424348
ISSN：2380-9248
-
3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon (SOS)
査読有り
K-W Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W-C Jeong, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 495-498 2009年
DOI：
10.1109/IEDM.2009.5424305
-
3D System Integration Technology and 3D Systems
査読有り
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Conference Proceedings Advanced Metallization Conference 2008 (AMC 2008) 479-485 2009年1月
-
High-Density Through Silicon Vias for 3-D LSIs
招待有り
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE IEEE 97 (1) 49-59 2009年1月
DOI：
10.1109/JPROC.2008.2007463
ISSN：0018-9219
eISSN：1558-2256
-
Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
招待有り
査読有り
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION 1112 121-130 2009年
ISSN：0272-9172
-
三次元実装材料 三次元積層型チップのためのSi貫通ビア(TSV)形成技術
招待有り
査読有り
福島誉史, 田中徹, 田中徹, 小柳光正
エレクトロニクス実装学会誌 12 (2) 104-109 2009年
出版者・発行元：
DOI：
10.5104/jiep.12.104
ISSN：1343-9677
-
Cu filling characteristics in through-Si via holes by electroless plating with addition of inhibitors
査読有り
F. Inoue, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. Wang, S. Shingubara
ECS Transactions 16 (22) 27-32 2009年
DOI：
10.1149/1.3115647
ISSN：1938-5862 1938-6737
-
Perfect Conformal Deposition of Electroless Cu for High Aspect Ratio Through-Si Vias
査読有り
F. Inoue, Y. Harada, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. Wang, S. Shingubara
ELECTROCHEMICAL AND SOLID STATE LETTERS 12 (10) H381-H384 2009年
DOI：
10.1149/1.3193535
ISSN：1099-0062
-
Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy
査読有り
M. Murugesan, J. C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
JOURNAL OF APPLIED PHYSICS 104 (7) 074316-1-074316-5 2008年10月
DOI：
10.1063/1.2973665
ISSN：0021-8979
-
Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride
査読有り
Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 93 (11) 113115-113117 2008年9月
DOI：
10.1063/1.2986409
ISSN：0003-6951
eISSN：1077-3118
-
Chip Self-Assembly Technique for 3D LSI Fabrication
T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi
Technical Digest of the International 3D System Integration Conference (3D-SIC) 2008 207-216 2008年5月12日
-
Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate
査読有り
Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2936-2940 2008年4月
DOI：
10.1143/JJAP.47.29361
ISSN：0021-4922
eISSN：1347-4065
-
Tungsten through-silicon via technology for three-dimensional LSIs
査読有り
Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2801-2806 2008年4月
DOI：
10.1143/JJAP.47.2801
ISSN：0021-4922
-
New reconfigurable memory architecture for parallel image-processing LSI with three-dimensional structure
査読有り
Shigeo Kodama, Daijirou Amano, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2774-2778 2008年4月
DOI：
10.1143/JJAP.47.2774
ISSN：0021-4922
-
Power supply system using electromagnetic induction for three-dimensionally stacked retinal prosthesis chip
査読有り
Ken Komiya, Risato Kobayashi, Takafumi Kobayashi, Keigo Sato, Takafumi Fukushima, Hiroshi Tomita, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 3244-3247 2008年4月
DOI：
10.1143/JJAP.47.3244
ISSN：0021-4922
-
Electrical Characterization of Metal–Oxide–Semiconductor Memory Devices with High-Density Self-Assembled Tungsten Nanodots
査読有り
Yan-Li PEI, Takafumi FUKUSHIMA, Tetsu TANAKA, Mitsumasa KOYANAGI
Japanese Journal of Applied Physics 47 (4) 2680-2683 2008年4月
DOI：
10.1143/JJAP.47.2680
ISSN：0021-4922
-
A New Nano-System with Three-Dimensional Structure for Real Time Parallel Image Processing
Mitsumasa Koyanagi, Takafumi Fukushima
Proceeding of the 5th International Conference on Mechanical Science based on Nanotechnology 117-118 2008年3月6日
-
3D system integration technology and 3D systems
招待有り
Takafumi FUKUSHIMA Tetsu TANAKA, Mitsumasa KOYANAGI
Abstract Book: European Workshop Materials for Advanced Metallization (MAM) 2008 37-38 2008年3月2日
-
自己組織化ウェーハ張り合せによる三次元集積化技術
招待有り
福島誉史, 田中徹, 小柳光正
応用物理学会分科会 シリコンテクノロジー 「多層配線」特集号 (99) 34-37 2008年2月8日
-
3-D integration technology for realizing super chip
Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi
2008 Proceedings - 25th International VLSI Multilevel Interconnection Conference, VMIC 2008 197-202 2008年
-
Deep trench etching for through-silicon vias in three-dimensional integration technology
Jun Liang, Hirokazu Kikuchi, Takayuki Konno, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings - Electrochemical Society PV 2008-1 674-678 2008年
-
Three-Dimensional Super-Chip Integration Technology Using Self-Assembly Technique
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2008 IEEE SILICON NANOELECTRONICS WORKSHOP 23-24 2008年
-
Three-dimensional integration technology using self-assembly technique and super-chip integration
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE 10-12 2008年
ISSN：2380-632X
eISSN：2380-6338
-
New Three-Dimensional Integration Technology Using Reconfigured Wafers
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4 1180-1183 2008年
-
A Closed-loop Power Control Function for Bio-implantable devices
査読有り
Kouji Kiyoyama, Yoshito Tanaka, Mashahiro Onoda, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE 321-+ 2008年
-
受光素子と刺激電流生成回路を有する完全埋込型人工網膜チップ
査読有り
田中徹, 福島誉史, 小柳光正
映像情報メディア学会技術報告 32 (19(IST2008 8-18/CE2008 21-31)) 1015-+ 2008年
DOI：
10.1109/IEDM.2007.4419127
ISSN：1342-6893
-
Multichip self-assembly technique on flexible polymeric substrate
査読有り
T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS 1532-1537 2008年
DOI：
10.1109/ECTC.2008.4550179
ISSN：0569-5503
-
A Novel SPRAM (SPin-transfer torque RAM)-based Reconfigurable Logic Block for 3D-Stacked reconfigurable Spin Processor
査読有り
M. Sekikawa, K. Kiyoyama, H. Hasegawa, K. Miura, T. Fukushima, S. Ikeda, T. Tanaka, H. Ohno, M. Koyanagi
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST 935-+ 2008年
DOI：
10.1109/IEDM.2008.4796645
-
New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method
査読有り
T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, A. Norki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST 499-502 2008年
DOI：
10.1109/IEDM.2008.4796735
-
Evaluation of platinum-black stimulus electrode array for electrical stimulation of retinal cells in retinal prosthesis system
査読有り
Taiichiro Watanabe, Risato Kobayashi, Ken Komiya, Takafumi Fukushima, Hiroshi Tomita, Eriko Sugano, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2785-2791 2007年4月
DOI：
10.1143/JJAP.46.2785
ISSN：0021-4922
-
Novel optical/electrical printed circuit board with polynorbornene optical waveguide
査読有り
Makoto Fujiwara, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2395-2400 2007年4月
DOI：
10.1143/JJAP.46.23951
ISSN：0021-4922
-
Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap
査読有り
Takeaki Sugimura, Takeshi Sakaguchi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2226-2230 2007年4月
DOI：
10.1143/JJAP.46.2226
ISSN：0021-4922
-
New magnetic nanodot memory with FePt nanodots
査読有り
Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Mikihiko Oogane, Takafumi Fukushima, Tetsu Tanaka, Shozo Kono, Seiji Samukawa, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2167-2171 2007年4月
DOI：
10.1143/JJAP.46.2167
ISSN：0021-4922
-
Fully implantable retinal prosthesis chip with photodetector and stimulus current generator
T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Watanabe, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi
Technical Digest - International Electron Devices Meeting, IEDM 1015-1018 2007年
DOI：
10.1109/IEDM.2007.4419127
ISSN：0163-1918
-
New three-dimensional integration technology to achieve a super chip
査読有り
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings 318-321 2007年
DOI：
10.1109/ICSICT.2006.306217
-
High performance polynorbornene optical waveguide for Opto-Electric interconnections
査読有り
M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi
6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007 193-+ 2007年
-
Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method
査読有り
C. K. Yin, H. Choi, J. C. Bea, M. Murugesan, J. H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi
2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings 4 401-404 2007年
-
Self-assembly process for chip-to-wafer three-dimensional integration
査読有り
T. Fulcushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS 836-+ 2007年
DOI：
10.1109/ECTC.2007.373895
ISSN：0569-5503
-
New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique
査読有り
Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 985-988 2007年
DOI：
10.1109/IEDM.2007.4419119
ISSN：2380-9248
-
Analysis of GOI-MOSFET with high-k gate dielectric and metal gate fabricated by Ge condensation technique
査読有り
Mungi Park, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi
SURFACE AND INTERFACE ANALYSIS 38 (12-13) 1720-1724 2006年12月
DOI：
10.1002/sia.2434
ISSN：0142-2421
-
Three-dimensional integration technology based on wafer bonding with vertical buried interconnections
招待有り
査読有り
Mitsumasa Koyanagi, Tomonori Nakamura, Yuusuke Yamada, Hirokazu Kikuchi, Takafumi Fukushima, Tetsu Tanaka, Hiroyuki Kurino
IEEE TRANSACTIONS ON ELECTRON DEVICES 53 (11) 2799-2808 2006年11月
DOI：
10.1109/TED.2006.884079
ISSN：0018-9383
eISSN：1557-9646
-
Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
査読有り
Risato Kobayashi, Taiichiro Watanabe, Ken Komiya, Takafumi Fukushima, Kazuhiro Sakamoto, Hiroyuki Kurino, Tetsu Tanaka, Norihiro Katayama, Hajime Mushiake, Mitsumasa Koyanagi
International Conference on Solid State Devices and Materials 898-899 2006年9月12日
-
Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method
査読有り
C. K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi, J. C. Bea, H. Choi, M. Nishijima, M. Miyao
APPLIED PHYSICS LETTERS 89 (6) 063109-1-063109-3 2006年8月
DOI：
10.1063/1.2335588
ISSN：0003-6951
-
Multichip shared memory module with optical interconnection for parallel-processor system
査読有り
Hirofumi Kuribara, Hiroyuki Hashimoto, Takafumi Fukushima, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3504-3509 2006年4月
DOI：
10.1143/JJAP.45.3504
ISSN：0021-4922
-
Low-power and high-sensitivity magnetoresistive random access memory sensing scheme with body-biased preamplifier
査読有り
Takeaki Sugimura, Jun Deguchi, Hoon Choi, Takeshi Sakaguchi, Hyuckjae Oh, Takafumi Fukushima, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3321-3325 2006年4月
DOI：
10.1143/JJAP.45.3321
ISSN：0021-4922
-
Quantitative derivation and evaluation of wire length distribution in three-dimensional integrated circuits using simulated quenching
査読有り
Jun Deguchi, Takeaki Sugimura, Yoshihiro Nakatani, Takafumi Fukushima, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3260-3265 2006年4月
DOI：
10.1143/JJAP.45.3260
ISSN：0021-4922
-
Fabrication and evaluation of magnetic tunnel junction with MgO tunneling barrier
査読有り
Takeshi Sakaguchi Hoon Choi, Ahn Sung-Jin, Takeaki Sugimura, Mungi Park, Milcihiko Oogane, Hyuckjae Oh, Jun Hayakawa, Shoji Ikeda, Young Min Lee, Takafumi Fukushima, Terunobu Miyazaki, Hideo Ohno, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3228-3232 2006年4月
DOI：
10.1143/JJAP.45.3228
ISSN：0021-4922
-
New magnetic flash memory with FePt magnetic floating gate
査読有り
CK Yin, JC Bea, YG Hong, T Fukushima, M Miyao, K Natori, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3217-3221 2006年4月
DOI：
10.1143/JJAP.45.3217
ISSN：0021-4922
-
Characteristics of silicon-on-low k insulator metal oxide semiconductor field effect transistor with metal back gate
査読有り
Y Yamada, H Oh, T Sakaguchi, T Fukushima, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3040-3044 2006年4月
DOI：
10.1143/JJAP.45.30401
ISSN：0021-4922
-
Deep-trench etching for chip-to-chip three-dimensional integration technology
査読有り
H Kikuchi, Y Yamada, H Kuima, T Fukushima, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3024-3029 2006年4月
DOI：
10.1143/JJAP.45.3024
ISSN：0021-4922
-
Nickel germanide formation on condensed Ge layer for Ge-on-insulator device application
査読有り
H Choi, M Park, T Fukushima, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 2984-2986 2006年4月
DOI：
10.1143/JJAP.45.2984
ISSN：0021-4922
-
Effects of ion implantation damage on elevated source/drain formation for ultrathin body silicon on insulator metal oxide semiconductor field-effect transistor
査読有り
H Oh, T Sakaguchi, T Fukushima, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 2965-2969 2006年4月
DOI：
10.1143/JJAP.45.2965
ISSN：0021-4922
-
New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration
査読有り
T Fukushima, Y Yamada, H Kikuchi, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 45 (4B) 3030-3035 2006年4月
DOI：
10.1143/JJAP.45.3030
ISSN：0021-4922
-
Fabrication of magnetic tunnel junction with FePt nanodots for magnetic nanodot memory
Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Semiconductor Technology, ISTC2007 - Proceedings of the 6th International Conference on Semiconductor Technology 418-422 2006年
-
Semiconductor-on-Low-K Substrate Technology
Tetsu Tanaka, Yusuke Yamada, Mungi Park, Takafumi Fukushima, Mitsumasa Koyanagi
Proceedings - Electrochemical Society PV 2006-03 297-301 2006年
-
New non-volatile memory with magnetic nano-dots
Mitsumasa Koyanagi, J. C. Bea, C. K. Yin, Takafumi Fukushima, Tetsu Tanaka
ECS Transactions 2 (1) 209-215 2006年
ISSN：1938-5862 1938-6737
-
Research and development of transistor structure in nano-scale region
査読有り
M. Koyanagi, Y. Yamada, M. Park, T. Fukushima, T. Tanaka
2006 INTERNATIONAL WORKSHOP ON NANO CMOS, PROCEEDINGS 34-37 2006年
-
Development of new three-dimensional integration technology for retinal prosthesis
査読有り
Yusuke Yamada, Jun Deguchi, Taiichiro Watanabe, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 613-+ 2006年
DOI：
10.1142/9781860948800_0067
-
Neuromorphic analog circuits for three-dimensionally stacked vision chip
査読有り
Jun Liang, Yoshihiro Nakagawa, Jun Deguchi, Jeoung-Chill Shim, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 455-+ 2006年
DOI：
10.1142/9781860948800_0049
-
Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips
査読有り
Hircrazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 385-+ 2006年
-
Novel retinal prosthesis system with three dimensionally stacked LSI chip
査読有り
T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi
ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE 327-+ 2006年
DOI：
10.1109/ESSDER.2006.307704
ISSN：1930-8876
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Evaluation of electrical stimulus current applied to retinal cells for retinal prosthesis
査読有り
Taiichiro Watanabe, Keita Motonami, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 45 (4B) 585-+ 2006年
DOI：
10.1142/9781860948800_0065
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ロボットビジョンシステムのための積層型並列リコンフィギャラブル画像処理プロセッサの設計
査読有り
杉村武昭, 小西雄太, 出口淳, 石原聡之, 福島誉史, 近野敦, 内山勝, 小柳光正
電子情報通信学会論文誌 D J89-D (6) 1141-1152 2006年
ISSN：1880-4535
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New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
査読有り
T. Fukushima, Y. Yamada, H. Kikuchi, M.Koyanagi
Proceeding of SOLID STATE DEVICES AND MATERIALS (SSDM) 2005 64-65 2005年9月
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Nickel Germanide Formation on Condensed Ge Layer For Ge-on-Insulator Device Application
査読有り
Hoon CHOI, Mungi PARK, Takafumi FUKUSHIMA, Mitsumasa KOYANAGI
International Conference on Solid State Device and Materials (SSDM) 572-573 2005年9月
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Characteristics of Silicon-on-Low-K Insulator (SOLK) MOSFET with Metal Back-Gate
査読有り
Y. Yamada, Hyuckjae Oh, T. Sakaguchi, T. Fukushima, M. Koyanagi
International Conference on Solid State Device and Materials (SSDM) 66-67 2005年9月
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Multi-Chip Shared-Memory Module with Optical Interconnection for Parallel Processor System
査読有り
Hirofumi Kuribara, Hiroyuki Hashimoto, Takafumi Fukushima, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 2005 334-335 2005年9月
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Magnetic and Microstructural Properties of FePt L10 Nanoparticle Films Fabricated by Self-Assembled Nano-Dot Deposition(SAND) Method
査読有り
J. C. Bea, C.-K. Yin, M. Nishijima,T. Fukushima, T. Sadoh, M. Miyao, M. Koyanagi
International Conference on Solid State Device and Materials (SSDM) 436-437 2005年9月
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Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
査読有り
Taiichiro Watanabe, Keita Motonami, Kazuhiro Sakamoto, Jun Deguchi, Risato Kobayashi, Ken Komiya, Keiji Okumura, Takafumi Fukushima, Hiroyuki Kurino, Hajime Mushiake, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 2005 462-463 2005年9月
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Influences of Ion Implantation Damages on Elevated Source/Drain Formation for Ultra-Thin Body SOI MOSFET
査読有り
Hyuckjae Oh, Takeshi Sakaguchi, Jicheol Bea, Takafumi Fukusima, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 520-521 2005年9月
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Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration
査読有り
Hirokazu Kikuchi, Yusuke Yamada, Hitoshi Kijima, Takafumi Fukushima
International Conference on Solid State Device and Materials (SSDM) 562-563 2005年9月
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Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method
査読有り
Mungi Park, Hoon Choi, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 588-589 2005年9月
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Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
査読有り
Takeshi Sakaguchi, Hoon Choi, Takeaki Sugimura, Mikihiko Oogane, Hyuckjae Oh, Jun Hayakawa, Shoji Ikeda, Young Min Lee, Takafumi Fukushima, Terunobu Miyazaki, Hideo Ohno, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 642-643 2005年9月
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Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI
査読有り
Jun Deguchi, Yoshihiro Nakatani, Takeaki Sugimura, Takafumi Fukushima, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 2005 660-661 2005年9月
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Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier
査読有り
Takeaki Sugimura, Jun Deguchi, Hoon Choi, Takeshi Sakaguchi, Hyuchjae Oh, Takafumi Fukushima, Mitsumasa Koyanagi
International Conference on Solid State Device and Materials (SSDM) 2005 928-929 2005年9月
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三次元積層型リコンフィギャラブル画像処理プロセッサを用いたロボットビジョンシステム
杉村武昭, 出口淳, 小西雄太, 中谷好博, 福島誉史, 近野敦, 栗野浩之, 内山勝, 小柳光正
電子情報通信学会技術研究報告 105 (43(RECONF2005 15-29)) 79-84 2005年
ISSN：0913-5685
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New three-dimensional integration technology using self-assembly technique
査読有り
T Fukushima, Y Yamada, H Kikuchi, M Koyanagi
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST 359-362 2005年
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Deep Si Hole Etching Technique for Super Chip Integration
査読有り
T. Fukushima, H. Kurino, H. Kikuchi, H. Kijima, Y. Yamada, J. Shim, M. Koyanagi
Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC) 364-366 2004年9月
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Bump Formation Technique for Multi-Chip Module with Optical Interconnections
査読有り
T. Fukushima, H. Kurino, R. Nitobe, H. Kuribara, Y. Yamada, J. Shim, M. Koyanagi
Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC) 442-444 2004年9月
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Ultimate Functional Multi-Electrode System (UFMES) Formed by Multi-Chip Bonding Technology
査読有り
T. Watanabe, K. Motonami, K. Sakamoto, J. Deguchi, T. Fukushima, J. Shim, H. Mushiake, H. Kurino, M. Koyanagi
Proceeding of 2004 International Conference on Solid State Device and Materials (SSDM) 2004年9月
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Ultrathin-SOI PMOSFET with Elevated S/D and buried back gate
H. Oh, T. Fukushima, T. Sakaguchi, J. Shim, C. Yin, M. Park, H. Kurino, M. Koyanagi
Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC) 51-56 2004年9月
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Three-dimensionally stacked analog retinal prosthesis chip
査読有り
J Deguchi, T Watanabe, T Nakamura, Y Nakagawa, T Fukushima, S Jeoung-Chill, H Kurino, T Abe, M Tamai, M Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 43 (4B) 1685-1689 2004年4月
DOI：
10.1143/JJAP.43.1685
ISSN：0021-4922
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並列リコンフィギュラブル画像処理プロセッサを用いたロボットビジョンシステム
杉村武昭, 出口淳, 小西雄太, 中谷好博, 福島誉史, 近野敦, 栗野浩之, 内山勝, 小柳光正
電子情報通信学会技術研究報告 104 (521(ICD2004 183-192)) 49-54 2004年
ISSN：0913-5685
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Heat-resistant photoresists based on new imaging technique: reaction development patterning
査読有り
T Fukushima, Y Kawakami, A Kitamura, T Oyama, M Tomoi
JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS 3 (1) 159-167 2004年1月
DOI：
10.1117/1.1633273
ISSN：1537-1646
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Photosensitive fluorinated polyimides with constant based on reaction development a low dielectric patterning
査読有り
T Miyagawa, T Fukushima, T Oyama, T Iijima, M Tomoi
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY 41 (6) 861-871 2003年3月
DOI：
10.1002/pola.10638
ISSN：0887-624X
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Ultrafast active transmission lines with low-k polyimide integrated with ultrafast photoconductive switches
査読有り
S Yagi, T Itatani, H Kawanami, S Gorwadkar, T Uemura, T Fukushima, H Itatani, M Tomoi, M Tacano
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS 42 (2B) L154-L156 2003年2月
DOI：
10.1143/JJAP.42.L154
ISSN：0021-4922
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Heat-resistant photoresists based on new imaging technique: reaction development patterning (RDP)
査読有り
T Fukushima, T Oyama, M Tomoi
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XX, PTS 1 AND 2 5039 960-967 2003年
DOI：
10.1117/12.483709
ISSN：0277-786X
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Ionic-bonded negative photosensitive polyimides having pendant aminoalkyl (meth)acrylamide groups
査読有り
T Fukushima, T Oyama, M Tomoi
REACTIVE & FUNCTIONAL POLYMERS 56 (1) 59-73 2003年
DOI：
10.1016/S1381-5148(03)00033-6
ISSN：1381-5148
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反応現像画像形成法を基盤とした感光性エンジニアリングプラスチックの開発
招待有り
査読有り
福島誉史, 大山俊幸, 友井正男
日本化学会講演予稿集 83rd (2) 585-588 2003年
ISSN：0285-7626
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New Concept of Heat-Resistant Photoresists: Reaction Development Patterning (RDP)
査読有り
T. Fukushima, T. Oyama, M. Tomoi
IUPAC World Polymer Congress 2002, 39th International Symposium on Macromolecules 2002年7月
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Positive Photosensitive Polyimides Based on Novel Imaging Principle: Reaction Development Patterning (RDP)
T. Fukushima, T. Oyama, M. Tomoi
Proceedings of STEPI6: 6th European Technical Symposium on Polyimides and High Performance Functional Polymer 2002年5月
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Photosensitive polyarylates based on reaction development patterning
査読有り
T Oyama, A Kitamura, T Fukushima, T Iijima, M Tomoi
MACROMOLECULAR RAPID COMMUNICATIONS 23 (2) 104-108 2002年1月
ISSN：1022-1336
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Photosensitive polyetherimide (Ultem) based on reaction development patterning (RDP)
査読有り
T Fukushima, Y Kawakami, T Oyama, M Tomoi
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY 15 (2) 191-196 2002年
DOI：
10.2494/photopolymer.15.191
ISSN：0914-9244
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Ultrafast photoconductive swiches integrated with electrical waveguides of low-k polyimide
招待有り
査読有り
S Yagi, T Itatani, H Kawanami, S Gorwadkar, T Uemura, T Fukushima, H Itatani, M Tomoi, M Tacano
APPLICATIONS OF PHOTONIC TECHNOLOGY 5 4833 623-632 2002年
DOI：
10.1117/12.474331
ISSN：0277-786X
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Durable and refreshable polymeric N-halamine biocides containing 3-(4′-vinylbenzyl)-5,5-dimethylhydantoin
査読有り
Takafumi Fukushima, Toshiyuki Oyama, Takao Iijima, Masao Tomoi, Hiroshi Itatani
Journal of Polymer Science, Part A: Polymer Chemistry 39 (19) 3348-3355 2001年10月1日
DOI：
10.1002/pola.1317
ISSN：0887-624X
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Photosensitive polycarbonates based on reaction development patterning (RDP)
査読有り
T Oyama, Y Kawakami, T Fukushima, T Iijima, M Tomoi
POLYMER BULLETIN 47 (2) 175-181 2001年10月
DOI：
10.1007/s002890170009
ISSN：0170-0839
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New concept of positive photosensitive polyimide: Reaction development patterning (RDP)
査読有り
T Fukushima, T Oyama, T Iijima, M Tomoi, H Itatani
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY 39 (19) 3451-3463 2001年10月
DOI：
10.1002/pola.1327
ISSN：0887-624X
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Synthesis and positive-imaging photosensitivity of soluble polyimides having pendant carboxyl groups
査読有り
T Fukushima, K Hosokawa, T Oyama, T Iijima, M Tomoi, H Itatani
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY 39 (6) 934-946 2001年3月
DOI：
10.1002/1099-0518(20010315)39:6<934::AID-POLA1068>3.0.CO;2-T
ISSN：0887-624X
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Positive photosensitive polyimide synthesized by block-copolymerization for KrF lithography
査読有り
T Itatani, S Gorwadkar, T Fukushima, M Komuro, H Itatani, M Tomoi, T Sakamoto, S Matsumoto
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2 3999 552-558 2000年
ISSN：0277-786X
-
Applications of newly developed positive photosensitive block co-polyimides to CSPs
査読有り
S Matsumoto, XZ Jin, T Fukushima, M Miyamura, H Itatani
PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE 367-372 2000年
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Sub-micron Patterning of Positive Photo-sensitive Polyimide Synthesized by Block Copolymerization
査読有り
T. Itatani, S. Gorwadkar, T. Fukushima, Y. Yamamoto, M. Maezawa, M. Komuro, T. Sakamoto, M. Tomoi, H. Itatani
Proceedings of International Conference on Solid State Device and Materials (SSDM), 1999年9月
