Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive Peer-reviewed

Hirokatsu Sakamoto, Tadashi Teranishi, Rumi Nagai, Ryo Itaya, Hideaki Tamate, Takafumi Fukushima, Akihiko Happoya

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)　871-875　2024/05/28

DOI： 10.1109/ectc51529.2024.00140 　

Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM Peer-reviewed

Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Mariappan Murugesan, Tetsu Tanaka, Takafumi Fukushima

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)　1　1335-1341　2024/05/28

DOI： 10.1109/ectc51529.2024.00217 　

An Advanced Remote-Plasma Assisted Ozone-Ethylene Radical (OER) Process for Cu-SiO₂ Hybrid Bonding Yield Enhancement Peer-reviewed

Tatsunori Shino, Mariappan Murugesan, Kiyoharu Mori, Bungo Tanaka, Eitaro Toyama, Tetsuya Nishiguchi, Takafumi Fukushima

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)　2042-2046　2024/05/28

DOI： 10.1109/ectc51529.2024.00348 　

Simulation and Fabrication of Advanced 3D Corrugated Wires for in-Mold FHE Applications Peer-reviewed

H. Zhang, T. Tanaka, T. Fukushima

2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation　2024/04

Heterogeneous 3D Integration Technology with TSV-Die and Micro-LEDs for Smart Skin Display Peer-reviewed

J. Shen, C. Liu, T. Tanaka, T. Fukushima

2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation　2024/04

Chip-to-Wafer Mini-LED Bonding and Integration for FOWLP-Based Photobiomodulation Sheet Devices Using a Hydrogel Substrate Peer-reviewed

X. Guo, T. Tanaka, T. Fukushima

2024 Japan-Taiwan Workshop on Electronic Interconnection IV poster presentation　2024/04

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics Peer-reviewed

Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Japanese Journal of Applied Physics　63　(4)　04SP74-04SP74　2024/04/01

DOI： 10.35848/1347-4065/ad375f 　

ISSN： 0021-4922

eISSN： 1347-4065

FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach Peer-reviewed

Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　45-48　2023/11/15

DOI： 10.1109/icsj59341.2023.10339614 　

FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display Peer-reviewed

Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　49-52　2023/11/15

DOI： 10.1109/icsj59341.2023.10339585 　

Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction Peer-reviewed

Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)　1-4　2023/10/19

DOI： 10.1109/biocas58349.2023.10389082 　

Cu-SiO2 Surface Activation by Ozone-Ethylene-Radical Process for Chip-to-Chip and Chip-to-Wafer Hybrid Bonding Peer-reviewed

Murugesan Mariappan, Tetsuya Nishiguchi, Kiyoharu Mori, Tatsunori Shino, Hiroyuki Hashimoto, Takafumi Fukushima

ADMETA Plus 2023　2023/10

High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging Peer-reviewed

Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials　2023/09/08

DOI： 10.7567/ssdm.2023.g-5-02 　

An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System Peer-reviewed

Yaogan Liang, Kohei Nakamura, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, ndTetsu Tanaka

Electronics (MDPI)　12　(2836)　1-17　2023/06

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last Peer-reviewed

Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2023 IEEE International 3D Systems Integration Conference (3DIC)　499　1-4　2023/05/10

DOI： 10.1109/3dic57175.2023.10154930 　

Cu Electrode Surface Features and Cu-SiO2 Hybrid Bonding Peer-reviewed

M. Murugesan, M. Sawa, M. Koyanagi, T. Fukushima

IEEE 3D System Integration Conference　2023/05

Advanced Packaging Methods Used for Energy Storage from Intermittent Renewable Sources Peer-reviewed

Takafumi Fukushima, Tianyu Xiang, Harshit Ranjan, Niharika Tripathi, Chang Liu, Guangqi Ouyang, Randall Irwin, Subramanian S. Iyer

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　444-449　2023/05

DOI： 10.1109/ectc51909.2023.00080 　

Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains for µ-joints Beyond 100 K Peer-reviewed

M. Murugesan, M. Sawa, E. Sone, T. Miyazaki, M. Koyanagi, T. Fukushima

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　69　1713-1718　2023/05

DOI： 10.1109/ectc51909.2023.00292 　

A Novel Die-to-Die Bridge Architecture Employing High-Performance Bridge with Polymer RDL and Fine Vias Peer-reviewed

Yasuhiro Morikawa, Meiten Koh, Hiroyuki Hashimoto, Chuantong Chen, Wangyun Li, Ichiro Kono, Shinji Wakisaka, Ken Ukawa, Takafumi Fukushima, Katsuaki Suganuma, Yoichiro Kurita

73rd Electronic Components and Technology Conference (ECTC 2023)　34-39　2023/05

Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging Peer-reviewed

Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　25　596-600　2023/05

DOI： 10.1109/ectc51909.2023.00105 　

Physical Properties of Large Cu Grain and Application to Cu-SiO2 Hybrid Bonding Peer-reviewed

R. Kobayashi, E. Sone, M. Sawa, M. Murugesan, T. Fukushima

2023 International Conference on Electronics Packaging (ICEP)　43-44　2023/04/19

DOI： 10.23919/icep58572.2023.10129755 　

Overview and Progress of the Chiplet Integration Platform Consortium Peer-reviewed

Meiten Koh, Yoichiro Kurita, Yasuhiro Morikawa, Ichiro Kono, Takafumi Fukushima, Katsuaki Suganuma

International Conference on Electronics Packaging (ICEP)　FA3　(2)　2023/04

チップレットの概念と 3D-IC のラピッドプロトタイピング Invited Peer-reviewed

福島誉史

エレクトロニクス実装学会誌（特集／3D・チップレット集積化技術動向）　26　(4)　333-340　2023/04

DOI： 10.5104/jiep.26.333 　

Gapless Chip-in-Carrier Integration and Injectable Ag/AgCl-Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor Invited Peer-reviewed

Hiromichi Wakebe, Yuki Susumago, Takafumi Fukushima, Tetsu Tanaka

IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING　18　(3)　477-487　2023/03

DOI： 10.1002/tee.23744 　

Recent Trend of 3D-IC/TSV and Self-Assembly for 3D Packaging and Heterogeneous Integration Invited

87　(1)　33-36　2023

Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration with μLED Peer-reviewed

Yuki Susumago, Takafumi Fukushima

IEEE Electron Device Letters　2023/01

3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration Peer-reviewed

Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

IEICE Electronics Express　19　(23)　20220363-20220363　2022/12/10

DOI： 10.1587/elex.19.20220363 　

eISSN： 1349-2543

Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip Peer-reviewed

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)　519-523　2022/10/13

DOI： 10.1109/biocas54905.2022.9948542 　

Direct Fabrication of SU-8 Microchannel across an Embedded Chip for Potentiometric Bilayer Lipid Membrane Sensor IEEJ Transactions on Sensors and Micromachines Invited Peer-reviewed

Hiromichi Wakebe, Takafumi FUKUSHIMA, Tetsu Tanaka

IEEJ Transactions on Sensors;Micromachines)　141　(10)　327-335　2022/10

Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/29

DOI： 10.7567/ssdm.2022.e-7-02 　

Development of Small-Area Pixel Circuit with Light-to-Pulse Width Converter for the High-Resolution Smart Skin Display Peer-reviewed

Yuta - Aruga, Bang - Du, Yaogan - Liang, Kouhei - Nakamura, Shengwei - Wang, Bunta - Inoue, Hisashi - Kino, Takafumi - Fukushima, Koji - Kiyoyama, Tetsu - Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/28

DOI： 10.7567/ssdm.2022.d-6-02 　

Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration Peer-reviewed

Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/28

DOI： 10.7567/ssdm.2022.k-4-02 　

Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip Peer-reviewed

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.d-1-03 　

Fabrication of UCNP (Upconversion Nanoparticle) Disk Device for Non-Invasive Optical Stimulation Therapy of Organ Diseases Peer-reviewed

Shimon - Suzuki, Hisashi - Kino, Takafumi - Fukushima, Tetsu - Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.d-2-03 　

Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging Peer-reviewed

CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.k-1-01 　

Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis Peer-reviewed

Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.k-1-03 　

TSV形成の基礎と三次元実装の動向 Invited Peer-reviewed

福島誉史

エレクトロニクス実装学会誌（講座「三次元実装基礎講座」第1回）　25　(7)　700-708　2022/09

DOI： 10.5104/jiep.25.700 　

Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics Peer-reviewed

Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Journal of Vacuum Science & Technology B　40　(5)　052202-052202　2022/09

DOI： 10.1116/6.0001836 　

ISSN： 2166-2746

eISSN： 2166-2754

Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2022 IEEE International Interconnect Technology Conference (IITC)　82-84　2022/06/27

DOI： 10.1109/iitc52079.2022.9881288 　

Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs Peer-reviewed

Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　49　1403-1408　2022/05

DOI： 10.1109/ectc51906.2022.00225 　

Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems Peer-reviewed

Toshiaki Shirasaka, Tadashi Okuda, Tomoaki Shibata, Satoshi Yoneda, Daisaku Matsukawa, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　2022/05

DOI： 10.1109/ectc51906.2022.00059 　

Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment Peer-reviewed

Murugesan Mariappan, Shizu Fukuzumi, Tomoaki Shibata, Hiroyuki Hashimoto, JiChel Bea, Mitsumasa Koyanagi, Takafumi Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　2022/05

DOI： 10.1109/ectc51906.2022.00184 　

Cu-SiO₂ Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement Peer-reviewed

M. Murugesan, K. Mori, M. Sawa, E. Sone, M. Koyanagi, T. Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　2022/05

DOI： 10.1109/ectc51906.2022.00115 　

Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　15　(11)　111004-1-111004-5　2022/04

DOI： 10.35848/1882-0786/ac9d24 　

Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System Peer-reviewed

Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2021 IEEE Biomedical Circuits and Systems Conference (BioCAS)　2021/10/07

DOI： 10.1109/biocas49922.2021.9645034 　

Chip-to-Chip/Wafer Three-Dimensional Integration of 2.5 mm-sized Neuron and Memory Chips by Via-Last Approach Peer-reviewed

M. Murugesan, H. Hashimoto, Jichel Bea, M. Koyanagi, T. Fukushima

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)　2021/10/05

DOI： 10.1109/ltb-3d53950.2021.9598372 　

Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing Peer-reviewed

Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi

2021 IEEE International 3D Systems Integration Conference (3DIC)　2021/10

DOI： 10.1109/3dic52383.2021.9687608 　

ISSN： 2164-0157

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications Peer-reviewed

M. Murugesan, E. Sone, A. Simomura, M. Motoyoshi, M. Sawa, K. Fukuda, M. Koyanagi, T. Fukushima

2021 IEEE International 3D Systems Integration Conference (3DIC)　2021/10

DOI： 10.1109/3dic52383.2021.9687604 　

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing Peer-reviewed

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan

2021 IEEE International 3D Systems Integration Conference (3DIC)　2021/10

DOI： 10.1109/3dic52383.2021.9687601 　

Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics Peer-reviewed

Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021/07/06

DOI： 10.1109/IITC51362.2021.9537540 　

Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021/07/06

DOI： 10.1109/IITC51362.2021.9537336 　

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE Invited Peer-reviewed

Takafumi Fukushima

2021 Symposium on VLSI Circuits　2021/06/13

DOI： 10.23919/vlsicircuits52068.2021.9492335 　

High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　14　(8)　091003　2021

DOI： 10.35848/1882-0786/ac18b0 　

ISSN： 1882-0778

eISSN： 1882-0786

On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2 Peer-reviewed

Takafumi Fukushima, Mariappan Murugesan, Ji‐Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

Journal of Polymer Science　58　(16)　2248-2258　2020/08/15

DOI： 10.1002/pol.20200094 　

ISSN： 2642-4150

eISSN： 2642-4169

Significant Die-Shift Reduction and mu LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics Peer-reviewed

Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　10　(8)　1419-1422　2020/08

DOI： 10.1109/TCPMT.2020.3009640 　

ISSN： 2156-3950

eISSN： 2156-3985

Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor Peer-reviewed

Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka

Electronics and Communications in Japan　105　(2)　2020/06

DOI： 10.1002/ecj.12343 　

ISSN： 1942-9533

eISSN： 1942-9541

Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics Peer-reviewed

M. Murugesan, Y. Susumago, K. Sumitani, Y. Imai, S. Kimura, T. Fukushima

Japanese Journal of Applied Physics　60　(SB)　SBBC02-SBBC02　2020/05/01

DOI： 10.35848/1347-4065/abdb81 　

ISSN： 0021-4922

eISSN： 1347-4065

High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications Peer-reviewed

M. Murugesan, K. Mori, J.C. Bea, M. Koyanagi, T. Fukushima

Japanese Journal of Applied Physics　59　(SG)　SGGC02-SGGC02　2020/04/01

DOI： 10.35848/1347-4065/ab75b8 　

ISSN： 0021-4922

eISSN： 1347-4065

Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)　2020/04

DOI： 10.1109/edtm47692.2020.9118027 　

Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory Peer-reviewed

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

Japanese Journal of Applied Physics　59　(SG)　2020/04

DOI： 10.35848/1347-4065/ab6867 　

ISSN： 0021-4922

eISSN： 1347-4065

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration Peer-reviewed

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　59　(SB)　2020/02

DOI： 10.7567/1347-4065/ab4f3c 　

ISSN： 0021-4922

eISSN： 1347-4065

Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications Peer-reviewed

Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)　1448-1452　2020

DOI： 10.1109/ECTC32862.2020.00229 　

ISSN： 0569-5503

eISSN： 2377-5726

7-mu m-thick NCF technology with low-height solder microbump bonding for 3D integration Peer-reviewed

Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)　1453-1458　2020

DOI： 10.1109/ECTC32862.2020.00230 　

ISSN： 0569-5503

eISSN： 2377-5726

Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion Peer-reviewed

Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)　1199-1204　2020

DOI： 10.1109/ECTC32862.2020.00192 　

ISSN： 0569-5503

eISSN： 2377-5726

Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electroplating in High Aspect Ratio (>10) TSVs for 3D-IC Packaging Applications Peer-reviewed

Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)　1736-1741　2020

DOI： 10.1109/ECTC32862.2020.00271 　

ISSN： 0569-5503

eISSN： 2377-5726

Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

Takafumi Fukushima

2020 IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2020)　2020

RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel Peer-reviewed

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)　811-816　2020

DOI： 10.1109/ECTC32862.2020.00132 　

ISSN： 0569-5503

eISSN： 2377-5726

Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　8　1266-1271　2020

DOI： 10.1109/jeds.2020.3025336 　

eISSN： 2168-6734

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

Murugesan Mariappan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10/01

DOI： 10.1109/3DIC48104.2019.9058849 　

Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI

Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10/01

DOI： 10.1109/3DIC48104.2019.9058853 　

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration

Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takahumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10/01

DOI： 10.1109/3DIC48104.2019.9058773 　

PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System Peer-reviewed

Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama

BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings　2019/10

DOI： 10.1109/BIOCAS.2019.8919027 　

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation Peer-reviewed

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058843 　

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing Peer-reviewed

Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058856 　

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs Peer-reviewed

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058841 　

Development of 3D-IC Embedded Flexible Hybrid System Peer-reviewed

Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058880 　

Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058838 　

Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio &gt;10 for future 3D-LSI/IC packaging

Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori, Ai Nakamura, Yisang Lee, Makoto Motoyoshi, J. C. Bea, Shigeru Watariguchi, Mitsumasa Koyanagi

Proceedings - Electronic Components and Technology Conference　2019-　1047-1051　2019/05/01

DOI： 10.1109/ECTC.2019.00164 　

ISSN： 0569-5503

X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications—characterization technique-dependent reliability issues Peer-reviewed

M. Murugesan, A. Takeuchi, T. Fukushima, M. Koyanagi

Japanese Journal of Applied Physics　58　(SB)　SBBC05-SBBC05　2019/04/01

DOI： 10.7567/1347-4065/ab02e2 　

ISSN： 0021-4922

eISSN： 1347-4065

Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019　222-224　2019/03

DOI： 10.1109/EDTM.2019.8731161 　

High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs

Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE Transactions on Components, Packaging and Manufacturing Technology　9　(1)　181-188　2019/01

DOI： 10.1109/tcpmt.2018.2871764 　

ISSN： 2156-3950

eISSN： 2156-3985

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application Peer-reviewed

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)　265-267　2019

Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter Peer-reviewed

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE ELECTRON DEVICE LETTERS　40　(1)　95-98　2019/01

DOI： 10.1109/LED.2018.2884452 　

ISSN： 0741-3106

eISSN： 1558-0563

Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter Peer-reviewed

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Electron Device Letters　40　(1)　95-98　2019/01

DOI： 10.1109/LED.2018.2884452 　

ISSN： 0741-3106

Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC Peer-reviewed

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　7　1225-1231　2019

DOI： 10.1109/JEDS.2019.2936180 　

eISSN： 2168-6734

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application Peer-reviewed

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)　265-267　2019

DOI： 10.23919/ICEP.2019.8733416 　

Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application Peer-reviewed

Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　2019-May　264-269　2019

DOI： 10.1109/ECTC.2019.00046 　

ISSN： 0569-5503

eISSN： 2377-5726

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration Peer-reviewed

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　17-17　2019

DOI： 10.23919/LTB-3D.2019.8735115 　

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips Peer-reviewed

Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka

2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings　2018/12/20

DOI： 10.1109/BIOCAS.2018.8584776 　

Process Integration for FlexTrate ^TM Peer-reviewed

Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 International Flexible Electronics Technology Conference, IFETC 2018　2018/12/19

DOI： 10.1109/IFETC.2018.8584029 　

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration Peer-reviewed

Takafumi Fukushima, Arsalan Alam, Amir Hanna, Siva Chandra Jangam, Adeel Ahmad Bajwa, Subramanian S. Iyer

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　8　(10)　1738-1746　2018/10

DOI： 10.1109/TCPMT.2018.2871603 　

ISSN： 2156-3950

eISSN： 2156-3985

Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (&lt;6 μm) and reliable flexible cu-based interconnects

Amir Hanna, Arsalan Alam, Takafumi Fukushima, Steven Moran, William Whitehead, Siva Chandra Jangam, Saptadeep Pal, Goutham Ezhilarasu, Randall Irwin, Adeel Bajwa, Subramanian Iyer

Proceedings - Electronic Components and Technology Conference　2018-　1505-1511　2018/08/07

DOI： 10.1109/ECTC.2018.00229 　

ISSN： 0569-5503

TSV liner dielectric technology with spin-on low-k polymer Peer-reviewed

S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　346-349　2018/06/06

DOI： 10.23919/ICEP.2018.8374320 　

Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system Peer-reviewed

Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018/04/01

DOI： 10.7567/JJAP.57.04FM11 　

ISSN： 1347-4065 0021-4922

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018/04/01

DOI： 10.7567/JJAP.57.04FE07 　

ISSN： 1347-4065 0021-4922

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current

Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018/03/23

DOI： 10.1109/BIOCAS.2017.8325165 　

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip

Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018/03/23

DOI： 10.1109/BIOCAS.2017.8325552 　

3D Interconnection by Directed Self-Assembly (DSA) with Metal/Block-Copolymer Nanocomposites

Takafumi Fukushima

Kick-off Symposium for World Leading Research Centers - Materials Science and Spintronics - (2017)　2018/02

Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies

Takafumi Fukushima

2018 INTERNATIONAL CONFERENCE ON MANIPULATION, AUTOMATION AND ROBOTICS AT SMALL SCALES (MARSS)　2018

Self-Assembly Technologies for FlexTrate (TM) Peer-reviewed

Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)　1836-1841　2018

DOI： 10.1109/ECTC.2018.00275 　

ISSN： 0569-5503

eISSN： 2377-5726

Study of Al-doped ZnO transparent stimulus electrode for fully implantable retinal prosthesis with three-dimensionally stacked retinal prosthesis chip Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Sensors and Materials　30　(2)　225-234　2018

DOI： 10.18494/SAM.2018.1741 　

ISSN： 0914-4935

Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs Peer-reviewed

Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka

2018 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)　135-137　2018

DOI： 10.1109/IITC.2018.8430390 　

ISSN： 2380-632X

eISSN： 2380-6338

Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration Peer-reviewed

Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(12)　5065-5072　2017/12

DOI： 10.1109/TED.2017.2767598 　

ISSN： 0018-9383

eISSN： 1557-9646

Temporary Bonding and De-Bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si Peer-reviewed

M. Murugesan, T. Fukushima, M. Koyanagi

Proceedings - Electronic Components and Technology Conference　1237-1242　2017/08/01

DOI： 10.1109/ECTC.2017.253 　

ISSN： 0569-5503

Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　1523-1528　2017/08/01

DOI： 10.1109/ECTC.2017.209 　

ISSN： 0569-5503

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017/07/05

DOI： 10.1109/3DIC.2016.7970031 　

Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission Peer-reviewed

Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka

IITC 2017 - 2017 IEEE International Interconnect Technology Conference　2017/07/05

DOI： 10.1109/IITC-AMC.2017.7968936 　

3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration Peer-reviewed

Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(7)　2912-2918　2017/07

DOI： 10.1109/TED.2017.2705562 　

ISSN： 0018-9383

eISSN： 1557-9646

FlexTrateTM Characterization Peer-reviewed

T. Takafumi, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer

2017 FLEX　2017/06

Directed Self-Assembly Patterning for 3D LSI Invited

Takafumi Fukushima, Mitsumasa Koyanagi

INC13 Workshop　2017/05/09

Heterogeneous Integration with High-Performance and Scalable Substrates: Si-IF (Interconnect Fabric) and FlexTrateTM Peer-reviewed

T. Fukushima, A. Bajwa, S. S. Iyer

Advancing Microelectronics Magazine　44　(2)　6-11　2017/05

Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces Peer-reviewed

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　56　(4)　04CM04-1-04CM04-4　2017/04/01

DOI： 10.7567/JJAP.56.04CM04 　

ISSN： 1347-4065 0021-4922

Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber Peer-reviewed

Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　56　(4)　04CM08-1-04CM08-4　2017/04

DOI： 10.7567/JJAP.56.04CM08 　

ISSN： 0021-4922

eISSN： 1347-4065

Improving the barrier ability of Ti in Cu through-silicon vias through vacuum annealing Peer-reviewed

Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Eiji Ikenaga, Hiroshi Nohira, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　56　(4)　2017/04

DOI： 10.7567/JJAP.56.04CC08 　

ISSN： 0021-4922

eISSN： 1347-4065

半導体微細加工技術を用いた高機能シリコン神経プローブの開発

原島 卓也, 森川 拓実, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹

平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録　66-66　2017/02/06

光ファイバ埋め込みシリコンオプト神経プローブの開発

森川 拓実, 原島 卓也, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹

平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録集　68-68　2017/02/06

Development of Integrated Photoplethysmography Sensor System for Trans-Nail Pulse-Rate Monitoring Peer-reviewed

Qian Zhengyang, Takezawa Yoshiki, Shimokawa Kenji, Ito Keita, Nishino Satoru, Kiyoyama Koji, Tanaka Tetsu

Transactions of Japanese Society for Medical and Biological Engineering　55　(5)　464-464　2017

DOI： 10.11239/jsmbe.55Annual.464 　

Feasibility Study on Ultrafine-Pitch Cu-Cu Bonding Using Directed Self-Assembly (DSA) Peer-reviewed

M. Murugesan, T. Fukushima, K. Mori, H. Hashimoto, Jichel Bea, M. Koyanagi

2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　44-44　2017

DOI： 10.23919/LTB-3D.2017.7947440 　

"FlexTrate (TM)" - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates using FOWLP Peer-reviewed

Takafumi Fukushima, Arsalan Alam, Zhe Wan, Siva C. Jangam, Saptadeep Pal, Goutham Ezhilarasu, Adeel Bajwa, Subramanian S. Iyer

2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)　649-654　2017

DOI： 10.1109/ECTC.2017.226 　

ISSN： 0569-5503

Heterogeneous Integration at Fine Pitch (<= 10 mu m) using Thermal Compression Bonding Peer-reviewed

Adeel A. Bajwa, SivaChandra Jangam, Saptadeep Pal, Niteesh Marathe, Tingyu Bai, Takafumi Fukushima, Mark Goorsky, Subramanian S. Iyer

2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017)　1276-1284　2017

DOI： 10.1109/ECTC.2017.240 　

ISSN： 0569-5503

A New Flexible Device Integration Technology Based on Fan-Out Wafer-Level Packaging Peer-reviewed

T. Takafumi, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer

Printed Electronics USA in IDTechEx show　2016/11/16

FlexTrate™: High Interconnect Density Fan-Out Wafer Level Processing for Flexible Bio-compatible Electronics Invited

T. Fukushima, A. Alam, S. Pal, Z. Wan, S. C. Jangam, G. Ezhilarasu, A. Bajwa, S. S. Iyer

NBMC (Nano-Bio Manufactuuring Consortium) Workshop: Blood, Sweat and Tears III　2016/11/02

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Peer-reviewed

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines　7　(10)　184-1-184-18　2016/10

DOI： 10.3390/mi7100184 　

ISSN： 2072-666X

Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring Peer-reviewed

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

JSAP 2016 International Conference on Solid State Devices and Materials　409-410　2016/09/29

Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber Peer-reviewed

Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka

JSAP 2016 International Conference on Solid State Devices and Materials　389-390　2016/09/28

Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique Peer-reviewed

Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

JSAP 2016 International Conference on Solid State Devices and Materials　467-468　2016/09/27

3D Interconnect echnologies Based on TSV and Fine-Pitch Electrode Invited Peer-reviewed

福島誉史, 李康旭, 田中徹, 小柳光正

Journal of the Surface Finishing Society of Japan　67　(8)　414-420　2016/08/01

DOI： 10.4139/sfj.67.414 　

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　6　(7)　1002-1008　2016/07

DOI： 10.1109/TCPMT.2016.2575070 　

ISSN： 2156-3950

eISSN： 2156-3985

Influence of Cu-TSVs, CuSnand PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips Peer-reviewed

Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, Tetsu Tanaka

Proceedings of the ECTC 2016　50-55　2016/06/01

Capacitance characteristics of low-klow-cost CVD grown polyimide liner for high-density Cu through-Si-via in three-dimensional LSI Peer-reviewed

Murugesan Mariappan, Takafumi Fukushima, Ji-Chel Bea, Hiroyuki Hashimoto, Mitsumasa Koyanagi

Japanese Journal of Applied Physics　55　(4S)　04EC12-04EC12　2016/04/01

DOI： 10.7567/jjap.55.04ec12 　

ISSN： 0021-4922

eISSN： 1347-4065

Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　2016/04

DOI： 10.7567/JJAP.55.04EC07 　

ISSN： 0021-4922

eISSN： 1347-4065

Study of Vacuum-Assisted Spin Coating of Polymer Liner for High-Aspect-Ratio Through-Silicon-Via Applications Peer-reviewed

Yangyang Yan, Yingtao Ding, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　6　(4)　501-509　2016/04

DOI： 10.1109/TCPMT.2016.2514365 　

ISSN： 2156-3950

eISSN： 2156-3985

Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　04EC03-1-04EC03-4　2016/04

DOI： 10.7567/JJAP.55.04EC03 　

ISSN： 0021-4922

eISSN： 1347-4065

Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　55　(4S)　04EC07-1-04EC07-4　2016/03/17

DOI： 10.7567/JJAP.55.04EC07 　

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　25　(1)　91-100　2016/02

DOI： 10.1109/JMEMS.2015.2480787 　

ISSN： 1057-7157

eISSN： 1941-0158

New multichip-to-wafer 3D integration technology using Self-Assembly and Cu nano-pillar hybrid bonding Peer-reviewed

M. Koyanagi, K. W. Lee, T. Fukushima, T. Tanaka

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings　338-341　2016

DOI： 10.1109/ICSICT.2016.7998914 　

Impact of Interconnections on Vertically Stacked 20 mu m-thick DRAM Chips Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, M. Koyanagi, S. Tanikawa, T. Tanaka

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　50-55　2016

DOI： 10.1109/ECTC.2016.255 　

ISSN： 0569-5503

Non-Conductive Film Underfill for 3D Integration of 20 mu m-Thick LSI Wafers with Fine Cu-TSVs Peer-reviewed

M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka

2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　466-471　2016

ISSN： 1078-8743

Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, S. H. Lee, M. Motoyoshi, T. Tanaka, K. W. Lee, M. Koyanagi

2016 International Conference on Electronics Packaging (ICEP)　265-269　2016

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration Peer-reviewed

Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　37　(1)　81-83　2016/01

DOI： 10.1109/LED.2015.2502584 　

ISSN： 0741-3106

eISSN： 1558-0563

Evaluation of Local Bending Stress Effects on 3DIC with Retention Time Measurement of DRAM Cell Array

谷川 星野, 木野久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会 講演予稿集　63rd　11-130　2016

Development of Si Neural Probe with Piezoresistive Strain Sensor

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

63回応用物理学会春季学術講演会予稿集　63rd　10-311-10-311　2016

Development of Flexible Si Neural Probe for Deep Brain Insertion and In-vivo Recording

森川 拓実, 谷 卓治, 原島 卓也, 鈴木 雄策, 木野 久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会予稿集　63rd　2016

Capillary Self-Assebly for 3D Heterogeneous System Integration and Packaging Invited

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MRS ADVANCES　1　(34)　2355-2366　2016

DOI： 10.1557/adv.2016.528 　

ISSN： 2059-8521

Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip Peer-reviewed

S. Tanikawa, H. Kino, T. Fukushima, K-W. Lee, M. Koyanagi, T. Tanaka

2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　6B-1-1-6B-1-6　2016

DOI： 10.1109/IRPS.2016.7574561 　

ISSN： 1541-7026

Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　289-294　2016

DOI： 10.1109/ECTC.2016.298 　

ISSN： 0569-5503

Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra-fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration Peer-reviewed

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　350-355　2016

DOI： 10.1109/ECTC.2016.10 　

ISSN： 0569-5503

Accuracy Enhancement of Sub-mm Chip Self-Alignment Using Liquid Surface Tension for Hybrid Integration Peer-reviewed

Shinya Kikuta, Satohiko Hoshino, Yoshiki Yamanishi, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi

2016 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)　350-355　2016

ISSN： 2160-9020

Highly Sensitive Pressure Sensor with Silicon-On-Nothing (SON) MOSFET for Sensor Integrated Heterogeneous System Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW)　186-187　2016

DOI： 10.1109/SNW.2016.7578043 　

Evaluation of Depth-dependent Interface States at TSV-liner SiO2 Using Multi-well Structured TSV

菅原陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹

2016年第77回応用物理学会秋季学術講演会講演予稿集　77th　12-340-12-340　2016

Fundamental characteristics of AZO transparent stimulus electrode for fully-implantable subretinal prosthesis

Kenji Shimokawa, Taiki Goto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016年第77回応用物理学会秋季学術講演会講演予稿集　77th　11-408-11-408　2016

Evaluation of Insertion Characteristics of Si Opto-Neural Probe with Embedded Optical fiber

森川拓実, 原島卓也, 木野 久志, 福島 誉史, 田中 徹

2016年第77回応用物理学会秋季学術講演会講演予稿集　77th　11-416-11-416　2016

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration Peer-reviewed

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14　75　(9)　285-290　2016

DOI： 10.1149/07509.0285ecst 　

ISSN： 1938-5862

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration Invited

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14　75　(9)　285-290　2016

DOI： 10.1149/07509.0285ecst 　

ISSN： 1938-5862

Characterization of Temporary Adhesives for 3D Integration and Their Impact on Thinned Wafer Edges Peer-reviewed

福島 誉史, マリアッパン ムルゲサン, 裵 志哲, 李 相勲, 李 康旭, 田中 徹, 小柳 光正

電子情報通信学会誌C　J99-C　(11)　493-500　2016

ISSN： 1881-0217

New Concept of TSV Formation Methodology Using Directed Self-Assembly (DSA) Peer-reviewed

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2016

DOI： 10.1109/3DIC.2016.7970022 　

ISSN： 2164-0157

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications Peer-reviewed

Kangwook. Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2016

DOI： 10.1109/3DIC.2016.7970027 　

ISSN： 2164-0157

Improving the Integrity of Ti Barrier Layer in Cu-TSVs Through Self-Formed TiSix for Via-Last TSV Technology Peer-reviewed

Murugesan Mariappan, JiChel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2016

DOI： 10.1109/3DIC.2016.7970017 　

ISSN： 2164-0157

電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム　60-60　2015/12/17

柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-

鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム　60-60　2015/12/17

Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array Peer-reviewed

Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　790-791　2015/09/30

Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications Peer-reviewed

Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, Kang-Wook Lee

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　70-71　2015/09/29

Capacitance Characteristics of Low-k Low-Cost CVD Grown Polyimide Liner for High-Density Cu-TSVs in 3D-LSI Peer-reviewed

Murugesan Mariappan, Ji-Chel Bea, Takafumi Fukushima, Hiroyuki Hashimoto, Kang-Wook Lee, Mitsumasa Koyanagi

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　64-65　2015/09/29

Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC Peer-reviewed

Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　56-57　2015/09/27

高分子材料を用いた三次元集積技術 Invited

福島誉史

第41回 よこはま高度実装技術コンソーシアム（YJC）実装技術セミナー　2015/06/11

Die-to-Wafer Self-Assembly by Droplet Surface Tension for 3D LSI & Advanced System Integration Invited

Takafumi Fukushima

Proc. EMN Meeting on Droplets　2015/05/10

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　54　(3)　030206-1-030206-6　2015/03

DOI： 10.7567/JJAP.54.030206 　

ISSN： 0021-4922

eISSN： 1347-4065

Applications of three-dimensional LSI Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

MRS BULLETIN　40　(3)　242-247　2015/03

DOI： 10.1557/mrs.2015.33 　

ISSN： 0883-7694

eISSN： 1938-1425

Applications of three-dimensional LSI Invited Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

MRS BULLETIN　40　(3)　242-247　2015/03

DOI： 10.1557/mrs.2015.33 　

ISSN： 0883-7694

eISSN： 1938-1425

Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University Peer-reviewed

K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　2015

ISSN： 2164-0157

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM Peer-reviewed

Kang-Wook Lee, Ji-Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2015

ISSN： 1541-7026

Yield Enhancement and Mitigating the Si-Chipping and Wafer Cracking in Ultra-Thin 20 mu m-Thick 8-and 12-Inch LSI Wafer Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi

2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　435-439　2015

ISSN： 1078-8743

高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ

伊藤有香, 福島誉史, Murugesan Mariappan, 裵 志哲, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　408-409　2015

ISSN： 1880-4616

高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層

橋口日出登, 福島誉史, 裵 志哲, Murugesan Mariappan, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　410-412　2015

ISSN： 1880-4616

高分子材料を用いた三次元集積技術III：気相堆積ポリイミドTSVライナーの形成と特性評価

福島誉史, Murugesan Mariappan, 裵 志哲, 橋本宏之, 佐藤 優, 李 康旭, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　413-415　2015

ISSN： 1880-4616

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　260-263　2015

Improved C-V, I-V Characteristics for Co-Polymerized Organic Liner in the Through-Silicon-Via for High Frequency Applications by Post Heat Treatment Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　73-77　2015

DOI： 10.1109/ECTC.2015.7159574 　

ISSN： 0569-5503

Development of Highly-Reliable Microbump Bonding Technology using Self-Assembly of NCF-Covered KGDs and Multi -Layer 3D Stacking Challenges Peer-reviewed

Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　336-341　2015

DOI： 10.1109/ECTC.2015.7159614 　

ISSN： 0569-5503

Challenges of High-Robustness Self-Assembly with Cu/Sn-Ag Microbump Bonding for Die-to-Wafer 3D Integration Peer-reviewed

Taku Suzuki, Kazushi Asami, Yasuhiro Kitamura, Takafumi Fukushima, Chisato Nagai, Jichoel Bea, Yutaka Sato, Mariappan Murugesan, Kang-wook Lee, Mitsumasa Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　342-347　2015

DOI： 10.1109/ECTC.2015.7159615 　

ISSN： 0569-5503

eISSN： 2377-5726

Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV Peer-reviewed

Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　822-827　2015

DOI： 10.1109/ECTC.2015.7159687 　

ISSN： 0569-5503

Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV liners for 3D RF Module

Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Jin Ho Lee

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　928-933　2015

DOI： 10.1109/ECTC.2015.7159705 　

ISSN： 0569-5503

Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration Peer-reviewed

H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1458-1463　2015

DOI： 10.1109/ECTC.2015.7159789 　

ISSN： 0569-5503

Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　59-61　2015

DOI： 10.1109/3DIC.2015.7334557 　

ISSN： 2164-0157

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers Peer-reviewed

K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, J. C. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　31-34　2015

DOI： 10.1109/3DIC.2015.7334471 　

ISSN： 2164-0157

Consideration of Micro bump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　260-263　2015

DOI： 10.1109/3DIC.2015.7334596 　

ISSN： 2164-0157

Transfer and Non-Transfer Stacking Technologies Based on Chip-to-Wafer Self-Asembly for High-Throughput and High-Precision Alignment and Microbump Bonding Peer-reviewed

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　134-137　2015

DOI： 10.1109/3DIC.2015.7334578 　

ISSN： 2164-0157

Vacuum-Assisted-Spin-Coating of Polyimide Liner for High-Aspect-Ratio TSVs Applications Peer-reviewed

Yangyang Yan, Yingtao Ding, Qianwen Chen, Kangwook Lee, Takafumi Fukushima, Mitsu Koyanagi

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　84-88　2015

DOI： 10.1109/3DIC.2015.7334568 　

ISSN： 2164-0157

Mitigating Thermo Mechanical Stress in High Density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via _ mu-RS and mu-XRD Study Peer-reviewed

M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　179-183　2015

DOI： 10.1109/3DIC.2015.7334579 　

ISSN： 2164-0157

Study of local stress induced by circuit operation heating in 3D IC

木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹

第25回マイクロエレクトロニクスシンポジウム論文集　25th　355-358　2015

ISSN： 2434-396X

DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価

谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹

2015年第76回応用物理学会秋季学術講演会講演予稿集　76th　12-124　2015

3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価

菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹

第76回応用物理学会秋季学術講演会講演予稿集　76th　12-123-12-123　2015

チップ集積・フレキシブルケーブル一体化シリコン神経プローブの開発(集積化脳神経プローブシステムの開発1)

鈴木雄策, 谷卓治, 原島卓也, 木野久志, 福島誉史, 田中徹

2015年第76回応用物理学会秋季学術講演会講演予稿集　76th　11-379　2015

Development of Si Opto-Neural Probe having Multiple Optical Waveguides with Reflection Mirror for Cerebrum Cortex Stimulation

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

第76回応用物理学会秋季学術講演会予稿集　76th　p11-381-p11-381　2015

Polyimide Thin Film Formation by Vapor Deposition Polymerization for TSV Dielectric Liner

福島誉史, マリアッパン ムルゲサン, 裵志哲, 李康旭, 小柳光正

Polymer Preprints, Japan　64　(2)　2015

High-heat-resistant temporary adhesive technologies for three-dimensionally stacked LSI

福島誉史, マリアッパン ムルゲサン, 裵志哲, 李康旭, 小柳光正

Polymer Preprints, Japan　64　(2)　2015

シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向 Invited

福島 誉史, 李 康旭, 田中 徹, 小柳 光正

第32回「センサ・マイクロマシンと応用システム」シンポジウム予稿集　32nd　28pm3-D-1-1-28pm3-D-1-6　2015

三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価

谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹

公益社団法人 応用物理学会東北支部 第70回学術講演会プログラム　70th　2015

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration Peer-reviewed

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　185-188　2015

DOI： 10.1109/IEDM.2015.7409652 　

Mechanical Characteristics of Thin Die/Wafers in Three-Dimensional Large-Scale Integrated Systems Peer-reviewed

Murugesan Mariappan, Takafumi Fukushima, Jichoel C. Bea, Kang-Wook Lee, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING　27　(3)　341-346　2014/08

DOI： 10.1109/TSM.2014.2316917 　

ISSN： 0894-6507

eISSN： 1558-2345

Self-Assembly Based 3D and Heterointegration Peer-reviewed

Takafumi Fukushima, Jicheol Bea

Handbook of 3D Integration　3　325-334　2014/07/21

DOI： 10.1002/9783527670109.ch24 　

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration Peer-reviewed

Kang-Wook Lee, Ji-Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY　14　(1)　451-462　2014/03

DOI： 10.1109/TDMR.2013.2258022 　

ISSN： 1530-4388

eISSN： 1558-2574

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM Peer-reviewed

Kang-Wook Lee, Seiya Tanikawa, Mariappan Murugesan, Hideki Naganuma, Ji-Choel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　379-385　2014/02

DOI： 10.1109/TED.2013.2295244 　

ISSN： 0018-9383

eISSN： 1557-9646

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film Peer-reviewed

Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　533-539　2014/02

DOI： 10.1109/TED.2013.2294831 　

ISSN： 0018-9383

eISSN： 1557-9646

Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice Peer-reviewed

Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　540-547　2014/02

DOI： 10.1109/TED.2013.2295463 　

ISSN： 0018-9383

eISSN： 1557-9646

Impacts of Cu Contamination in 3D Integration Process on Memory Retention Characteristics in Thinned DRAM Chip Peer-reviewed

Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichel Bea, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM　2014

ISSN： 1541-7026

Via-Last/Backside-Via 3D Integration Using a Visible-Light Laser Debonding Technique Peer-reviewed

T. Fukushima, M. Mariappan, J. -C. Bea, H. Hashimoto, Y. Sato, M. Motoyoshi, K. -W. Lee, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　13-13　2014

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV Peer-reviewed

Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　35　(1)　114-116　2014/01

DOI： 10.1109/LED.2013.2287879 　

ISSN： 0741-3106

eISSN： 1558-0563

Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, Y. Sato, H. Hashimoto, K. W. Lee, M. Koyanagi

2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　374-377　2014

Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology Peer-reviewed

K-W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J-C Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　669-672　2014

A Study on Positive Photosensitive Epoxy Resins Using Reaction Development Patterning (RDP) Peer-reviewed

Wei Min Zhou, Takafumi Fukushima, Masao Tomoi, Toshiyuki Oyama

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY　27　(6)　713-717　2014

DOI： 10.2494/photopolymer.27.713 　

ISSN： 0914-9244

Wafer Thinning for High-Density Three Dimensional Integration _ 12-Inch Wafer-Level 3D-LSI Program at GINTI Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, Y. Sato, K. W. Lee, M. Koyanagi

2014 25TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　57-61　2014

DOI： 10.1109/ASMC.2014.6846977 　

ISSN： 1078-8743

A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs Peer-reviewed

H. Hashiguchi, T. Fukushima, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)　74-77　2014

DOI： 10.1109/ICEP.2014.6826664 　

A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies Peer-reviewed

K-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　304-308　2014

DOI： 10.1109/ECTC.2014.6897303 　

ISSN： 0569-5503

Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits Peer-reviewed

Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　636-640　2014

DOI： 10.1109/ECTC.2014.6897353 　

ISSN： 0569-5503

eISSN： 2377-5726

Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly Peer-reviewed

H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　856-861　2014

DOI： 10.1109/ECTC.2014.6897386 　

ISSN： 0569-5503

Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1110-1115　2014

DOI： 10.1109/ECTC.2014.6897428 　

ISSN： 0569-5503

Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies Peer-reviewed

Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1148-1153　2014

DOI： 10.1109/ECTC.2014.6897434 　

ISSN： 0569-5503

Via-last/backside-via 3D integration using a visible-light laser debonding technique Peer-reviewed

T. Fukushima, M. Mariappan, J. C. Bea, H. Hashimoto, Y. Sato, M. Motoyoshi, K. W. Lee, M. Koyanagi

Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014　13-70　2014

DOI： 10.1109/LTB-3D.2014.6886152 　

Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration Peer-reviewed

H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　14-14　2014

DOI： 10.1109/LTB-3D.2014.6886153 　

Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration Peer-reviewed

Y. Ito, T. Fukushima, K. -W. Lee, K. Choki, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　15-15　2014

DOI： 10.1109/LTB-3D.2014.6886154 　

Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation Peer-reviewed

Takafumi Fukushima, Murugesan Mariappan, Jichoel Bea, Kang-Wook Lee, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　720-721　2014

Stress Distribution Pattern in Cross-Sectional 3D-LSI Examined by u-XRD Peer-reviewed

M. Mariappan, J.C. Bea, T. Fukushima, K.W. Lee, M. Koyaangi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　724-725　2014

Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC Peer-reviewed

Y. Sugawara, H. Hashiguchi, S. Tanikawa, H. Kino, K. Lee, T. Fukushima, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　726-727　2014

Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration Peer-reviewed

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　O4　2014

ISSN： 2164-0157

Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV Peer-reviewed

K. W. Lee, C. Nagai, A. Nakamura, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　O13　2014

ISSN： 2164-0157

Micro-XRD Investigation of Fine-Pitch Cu-TSV Induced Thermo-Mechanical Stress in High-Density 3D-LSI Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, T. Tanaka

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　O18　2014

ISSN： 2164-0157

Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems Peer-reviewed

Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　60　(11)　3842-3848　2013/11

DOI： 10.1109/TED.2013.2280273 　

ISSN： 0018-9383

eISSN： 1557-9646

Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration Peer-reviewed

Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan, Hideki Naganuma, Haro Shimamoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　34　(8)　1038-1040　2013/08

DOI： 10.1109/LED.2013.2265336 　

ISSN： 0741-3106

eISSN： 1558-0563

Investigation of local bending stress effect on complementary metal-oxide-semiconductor characteristics in thinned si chip for chip-to-wafer three-dimensional integration Peer-reviewed

Hisashi Kino, Ji Choel Bea, Mariappan Murugesan, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CB11-1-04CB11-5　2013/04

DOI： 10.7567/JJAP.52.04CB11 　

ISSN： 0021-4922 1347-4065

Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　04CB09-1-04CB09-6　2013/04

DOI： 10.7567/JJAP.52.04CB09 　

ISSN： 0021-4922

eISSN： 1347-4065

3D Hetero-Integration Technology with Backside TSV and Reliability Challenges Peer-reviewed

Kang-Wook Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S)　2013

Challenges in 3D Integration Peer-reviewed

Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka

SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3　53　(3)　237-244　2013

DOI： 10.1149/05303.0237ecst 　

ISSN： 1938-5862

eISSN： 1938-6737

Revisiting the Silicon-Lattice in the High-Density 3D-LSIs - In the Perspective of Device Reliability Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　172-175　2013

DOI： 10.1109/IEDM.2013.6724578 　

Characterization and Reliability of 3D LSI and SiP Peer-reviewed

K-W. Lee, M. Murugesan, Jichel Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　176-179　2013

DOI： 10.1109/IEDM.2013.6724579 　

3次元システムLSI開発のためのチップレベルTSVプロセス Peer-reviewed

朴澤 一幸, 古田 太, 花岡 裕子, 青木 真由, 長田 健一, 武田 健一, 李 康旭, 福島 誉史, 小柳 光正

電子情報通信学会誌C　J96-C　(11)　335-343　2013

ISSN： 1345-2827

Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding Peer-reviewed

H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi

Proceedings of International Conference on Electronics Packaging (ICEP)　502-505　2013

3D Integration technologies using self-assembly and electrostatic temporary multichip bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings - Electronic Components and Technology Conference　58-63　2013

DOI： 10.1109/ECTC.2013.6575550 　

ISSN： 0569-5503

Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI Peer-reviewed

H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka

Proceedings - Electronic Components and Technology Conference　360-365　2013

DOI： 10.1109/ECTC.2013.6575596 　

ISSN： 0569-5503

Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　891-896　2013

DOI： 10.1109/ECTC.2013.6575679 　

Young Modulus of Si in 3D-LSIs and Reliability Peer-reviewed

M. Murugesan, J.C. Bea, T. Fukushima, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　38-39　2013

Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration Peer-reviewed

H. Hashiguchi, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　40-41　2013

Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D-IC Peer-reviewed

H. Kino, T. Fukushima, K.-W. Lee, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　862-863　2013

Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization Peer-reviewed

T. Fukushima, M. Murugesan, J. Bea, K.W. Lee, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　866-867　2013

Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration Peer-reviewed

Y. Ito, T. Fukushima, K.W. Lee, K. Choki, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　988-989　2013

Mechanical Characteristics of Thin Dies/Wafers in Three-Dimensional Large-Scale Integrated systems Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, T. Tanaka

2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　66-69　2013

DOI： 10.1109/ASMC.2013.6552777 　

ISSN： 1078-8743

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory Peer-reviewed

K-W Lee, S. Tanikawa, M. Murugesan, H. Naganuma, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702336 　

ISSN： 2164-0157

Highly Efficient TSV Repair Technology for Resilient 3-D Stacked Multicore Processor System Peer-reviewed

H. Hashimoto, T. Fukushima, K. W. Lee, M. Koyanagi, T. Tanaka

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702338 　

ISSN： 2164-0157

3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology Peer-reviewed

T. Fukushima, J. Bea, M. Murugesan, H. -Y. Son, M. -S. Sun, K. -Y. Byun, N. -S. Kim, K. -W. Lee, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702360 　

ISSN： 2164-0157

A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor Peer-reviewed

K. Kiyoyama, Y. Sato, H. Hashimoto, K-W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702363 　

ISSN： 2164-0157

Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV Peer-reviewed

M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702364 　

ISSN： 2164-0157

Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System Peer-reviewed

T. Fukushima, J. Bea, M. Murugesan, K. -W. Lee, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702383 　

ISSN： 2164-0157

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　59　(11)　2956-2963　2012/11

DOI： 10.1109/TED.2012.2212709 　

ISSN： 0018-9383

eISSN： 1557-9646

Instability-driven terahertz emission and injection locking behavior in an asymmetric dual-grating-gate HEMT with a vertical cavity structure Peer-reviewed

T. Watanabe, T. Fukushima, Y. Kurita, A. Satou, T. Otsuji

ICMNE: Int. Conf. on Micro and Nanoelectronics, Moscow, Russia, Oct. 1-5, 2012.　1　(1)　P1-43　2012/10/03

Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis Peer-reviewed

Kang-Wook Lee, Yoshinobu Watanabe, Chikashi Kigure, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JOURNAL OF MICROMECHANICS AND MICROENGINEERING　22　(10)　2012/10

DOI： 10.1088/0960-1317/22/10/105015 　

ISSN： 0960-1317

eISSN： 1361-6439

Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration Peer-reviewed

Kangwook Lee, Takaharu Tani, Hideki Naganuma, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(9)　1297-1299　2012/09

DOI： 10.1109/LED.2012.2202631 　

ISSN： 0741-3106

eISSN： 1558-0563

High-step-coverage Cu-lateral interconnections over 100 mu m thick chips on a polymer substrate-an alternative method to wire bonding Peer-reviewed

M. Murugesan, T. Fukushima, K. Kiyoyama, J. C. Bea, T. Tanaka, M. Koyanagi

JOURNAL OF MICROMECHANICS AND MICROENGINEERING　22　(8)　2012/08

DOI： 10.1088/0960-1317/22/8/085033 　

ISSN： 0960-1317

eISSN： 1361-6439

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking Peer-reviewed

M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF ELECTRONIC MATERIALS　41　(4)　720-729　2012/04

DOI： 10.1007/s11664-012-1949-1 　

ISSN： 0361-5235

Impact of Data Transmission over 10 Gbps on High-Density and Low-Cost Optoelectronic Module with Polynorbornene Waveguides Peer-reviewed

Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　51　(4)　04DG01-1-04DG01-4　2012/04

DOI： 10.1143/JJAP.51.04DG01 　

ISSN： 0021-4922

eISSN： 1347-4065

Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI Peer-reviewed

Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(2)　221-223　2012/02

DOI： 10.1109/LED.2011.2174608 　

ISSN： 0741-3106

Heterogeneous 3D Integration Technology and New 3D LSIs Peer-reviewed

Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka

2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012)　240-243　2012

Chip-Based Hetero-Integration Technology for High-Performance 3D Stacked Image Sensor Peer-reviewed

Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　2012

ISSN： 2373-5449

Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs Peer-reviewed

M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　657-660　2012

DOI： 10.1109/IEDM.2012.6479124 　

Characterization of Chip-level Hetero-Integration Technology for High-Speed, Highly Parallel 3D-Stacked Image Processing System Peer-reviewed

K-W Lee, Y. Ohara, K. Kiyoyama, S. Konno, Y. Sato, S. Watanabe, A. Yabata, T. Kamada, J-C Bea, H. Hashimoto, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　785-788　2012

DOI： 10.1109/IEDM.2012.6479156 　

New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　789-792　2012

DOI： 10.1109/IEDM.2012.6479157 　

Impact of Cu Diffusion from Cu Through-Silicon Via (TSV) on Device Reliability in 3-D LSIs Evaluated by Transient Capacitance Measurement Peer-reviewed

Kangwook Lee, Jichel Bea, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2B.4.1-2B.4.6　2012

DOI： 10.1109/IRPS.2012.6241777 　

Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs Peer-reviewed

Kangwook Lee, Itakafumi Fukushima, Tetsu Tanaka, Imitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　5F.2.1-5F.2.4　2012

DOI： 10.1109/IRPS.2012.6241860 　

Self-assembly-based 3D integration technologies Peer-reviewed

T. Fukushima, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012　151-152　2012

DOI： 10.1109/LTB-3D.2012.6238075 　

Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration Peer-reviewed

T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　393-398　2012

DOI： 10.1109/ECTC.2012.6248860 　

Locally Induced Stress in Stacked Ultrathin Si wafers: XPS and mu-Raman study Peer-reviewed

M. Murugesan, H. Nohira, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　625-629　2012

DOI： 10.1109/ECTC.2012.6248896 　

Optical interconnect technology for 3-D LSI and neural engineering applications Peer-reviewed

T. Tanaka, A. Noriki, T. Kukushima, K-W Lee, M. Koyanagi

2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)　2012

Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration Peer-reviewed

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Osada, Kenichi Takeda, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Digest of Technical Papers - Symposium on VLSI Technology　175-176　2012

DOI： 10.1109/VLSIT.2012.6242518 　

ISSN： 0743-1562

10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications Peer-reviewed

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　46-47　2012

Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps Peer-reviewed

Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　48-49　2012

The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3D LSI by Using C–V and C–t Measurements Peer-reviewed

Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2012

Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration Peer-reviewed

H. Kino, J-C. Bea, M. Murugesan, K-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　52-53　2012

Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisted Self-Assembly with Cu/Sn Microbump Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1176-1177　2012

Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration Peer-reviewed

Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1183-1184　2012

Reliability Challenges in High-Density 3D-Integration Peer-reviewed

M. Murugesan, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1185-1186　2012

Cu Contamination Assessment and Control in 3-D Integration Peer-reviewed

Mitsumasa Koyanagi, Kang Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka

The 222nd ECS Meeting: PRiME (Pacific Rim Meeting)　2012

Long Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride Peer-reviewed

Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi

Materials Research Society (MRS) 2008 Spring Meeting, Symposium F: Materials Science and Technology for Nonvolatile Memories, F2.4　2012

Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　1　(12)　1873-1884　2011/12

DOI： 10.1109/TCPMT.2011.2160266 　

ISSN： 2156-3950

eISSN： 2156-3985

Advanced die-to-wafer 3D integration platform: Self-assembly technology Peer-reviewed

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

3D Integration for VLSI Systems　153-174　2011/09/30

DOI： 10.4032/9789814303828 　

Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement Peer-reviewed

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(7)　940-942　2011/07

DOI： 10.1109/LED.2011.2141109 　

ISSN： 0741-3106

eISSN： 1558-0563

MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric Peer-reviewed

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON NANOTECHNOLOGY　10　(3)　528-531　2011/05

DOI： 10.1109/TNANO.2010.2050331 　

ISSN： 1536-125X

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems Peer-reviewed

Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　58　(3)　748-757　2011/03

DOI： 10.1109/TED.2010.2099870 　

ISSN： 0018-9383

eISSN： 1557-9646

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration Peer-reviewed

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MICROMACHINES　2　(1)　49-68　2011/03

DOI： 10.3390/mi2010049 　

ISSN： 2072-666X

Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement Peer-reviewed

K-W Lee, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　26　(2)　2011/02

DOI： 10.1088/0268-1242/26/2/025007 　

ISSN： 0268-1242

eISSN： 1361-6641

Chip-level TSV integration for rapid prototyping of 3D system LSIs Peer-reviewed

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262952 　

Stacked SOI pixel detector using versatile fine pitch μ-bump technology Peer-reviewed

Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262959 　

3D Integration Technology and Reliability Challenges Peer-reviewed

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS)　2011

ISSN： 2151-1225

Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement Peer-reviewed

K-W. Lee, J-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF THE ELECTROCHEMICAL SOCIETY　158　(8)　H795-H799　2011

DOI： 10.1149/1.3597317 　

ISSN： 0013-4651

eISSN： 1945-7111

Energy Band Engineering of Metal Nanodots for High Performance Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS　470　140-+　2011

DOI： 10.4028/www.scientific.net/KEM.470.140 　

ISSN： 1013-9826

三次元集積化技術とヘテロインテグレーション Peer-reviewed

小柳 光正, 福島 誉史, 李 康旭, 田中 徹

電子情報通信学会誌C　J94-C　(11)　355-364　2011

ISSN： 1345-2827

三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術 Peer-reviewed

大原 悠希, 乗木 暁博, 李 康旭, 福島 誉史, 田中 徹, 小柳 光正

電子情報通信学会誌C　J94-C　(11)　394-401　2011

ISSN： 1345-2827

シリコンバンプ上に積層した薄化チップの曲げ応力とデバイスの特性評価 Peer-reviewed

木野 久志, Mariappan Murugesan, 小島 俊哉, 福島 誉史, 小柳 光正, 田中 徹

電子情報通信学会誌C　J94-C　(11)　411-418　2011

ISSN： 1345-2827

Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement Peer-reviewed

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(1)　66-68　2011/01

DOI： 10.1109/LED.2010.2087004 　

ISSN： 0741-3106

eISSN： 1558-0563

High Density 3D LSI Technology using W/Cu Hybrid TSVs Peer-reviewed

M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　139-142　2011

DOI： 10.1109/IEDM.2011.6131503 　

Development of 5 µm Diameter Backside Cu TSV Technology for 3D LSI Peer-reviewed

Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the International Conference on Electronics Packaging (ICEP)　237-240　2011

Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration Peer-reviewed

T. Fukushima, Y. Ohara, M. Murugesan, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　2050-2055　2011

DOI： 10.1109/ECTC.2011.5898799 　

ISSN： 0569-5503

3D LSI Technology and Reliability Issues Peer-reviewed

T. Tanaka, J. Bea, M. Murugesan, K. Lee, T. Fukushima, M. Koyanagi

Proceedings of the 2011 Symposium on VLSI Technology　184-185　2011

Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer Peer-reviewed

M. Murugesan, H. Nohira, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2011

Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor Peer-reviewed

H. Hashimoto, T. Fukushima, K-W. Lee, T. Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　168-169　2011

Development of Implantable Si Neural Probe with Stimulus and Recording Electrodes for Deep Brain Stimulation Peer-reviewed

Yoshiho Yukita, Sanghoon Lee, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　408-409　2011

Impacts of Microbump-Induced Local Bending Stress in 3D-LSI Peer-reviewed

H. Kino, M. Murugesan, K.-W. Lee, J.-C. Bea, C. Miyazaki, H. Kobayashi, H. Shimamoto, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　785-786　2011

Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs Peer-reviewed

H. Hashiguchi, M. Murugesan, J.C. Bea, K.W. Lee, T. Fukushima, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　795-796　2011

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Fanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　821-822　2011

DOI： 10.1109/3DIC.2012.6262957 　

A Block-Parallel SAR ADC for CMOS Image Sensor with 3-D Stacked Structure Peer-reviewed

K. Kiyoyama, K-W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1055-1056　2011

Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis Peer-reviewed

Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1097-1098　2011

Performance of Low-Loss and Low-Cost Optoelectronic Module with Polynorbornene Waveguide for 10-Gbps Data Transmission Peer-reviewed

Yuka Ito, Shinsuke Terada, Shinya Arai, Makoto Fujiwara, Tetsuya Mori, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1125-1126　2011

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration Peer-reviewed

Yuki Ohara, Lee Kangwook, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262950 　

Temporary bonding strength control for self-assembly-based 3D integration Peer-reviewed

Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262954 　

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Fanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262957 　

A very low area ADC for 3-D stacked CMOS image processing system Peer-reviewed

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262958 　

High-bandwidth data transmission of new transceiver module through optical interconnection Peer-reviewed

Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyangi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　1-36　2011

DOI： 10.1109/3DIC.2012.6263010 　

High density Cu-TSVs and reliability issues Peer-reviewed

Murugesan Mariappan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262969 　

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress Peer-reviewed

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262970 　

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs Peer-reviewed

K. W. Lee, J. C. Bea, T. Fukushima, Y. Ohara, T. Tanaka, M. Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262975 　

A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module Peer-reviewed

Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　19　(6)　1284-1291　2010/12

DOI： 10.1109/JMEMS.2010.2082497 　

ISSN： 1057-7157

eISSN： 1941-0158

Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　49　(6)　066503-1-066503-4　2010/06

DOI： 10.1143/JJAP.49.066503 　

ISSN： 0021-4922

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits Peer-reviewed

T. Fukushima, E. Iwata, T. Konno, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

APPLIED PHYSICS LETTERS　96　(15)　154105-1-154105-3　2010/04

DOI： 10.1063/1.3328098 　

ISSN： 0003-6951

Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010　2010

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method Peer-reviewed

福島誉史, LEE Kang-Wook, 田中徹, 田中徹, 小柳光正

電子情報通信学会技術研究報告　109　(408(SDM2009 171-181))　323-326　2010

ISSN： 0913-5685

Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration Peer-reviewed

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)　433-437　2010

Impact of Remnant Stress/Strain in 3D Stacked Retinal Chip by Wafer Thinning and Bonding Peer-reviewed

Hisashi Kino, Tatsuro Hiraki, Mariappan Murugesan, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi, Testu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　123-124　2010

Electrical and Mechanical Characteristics of Si Double-sided Neural Probe for In-vivo Recording Peer-reviewed

Sanghoon Lee, Risato Kobayashi, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　127-128　2010

Highly Accurate Optical Stimulation of Neuron using Si Neural Probe with Optical Waveguide Peer-reviewed

Risato Kobayashi, Sanghoon Lee, Soichiro Kanno, Yoshiho Yukita, Kangwook Lee, Takafumi Fukushima, Toru Ishizuka, Hajime Mushiake, Hiromu Yao, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　181-182　2010

Development of Versatile Backside Via Technology for 3D System on Chip Peer-reviewed

Y. Ohara, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　237-238　2010

Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement Peer-reviewed

J.-C. Bea, K.-W. Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1196-1197　2010

Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1198-1199　2010

Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration Peer-reviewed

Eiji Iwata, Yuki Ohara, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1202-1203　2010

Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study Peer-reviewed

M. Murugesan, Y. Ohara, J.C Bea, K.W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1204-1205　2010

Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration Peer-reviewed

T. Fukushima, E. Iwata, K. -W. Lee, T. Tanaka, M. Koyanagi

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1050-1055　2010

DOI： 10.1109/ECTC.2010.5490830 　

ISSN： 0569-5503

Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the China Semiconductor Technology International Conference (CSTIC)　55-55　2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding Peer-reviewed

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751432 　

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751435 　

極限集積化を目指すスーパーチップ Peer-reviewed

小柳光正, 福島誉史, 李 康旭, 田中 徹

電子情報通信学会誌　93　(11)　918-922　2010

ISSN： 0913-5693

3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems Peer-reviewed

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS　33　(12)　71-90　2010

DOI： 10.1149/1.3501035 　

ISSN： 1938-5862

eISSN： 1938-6737

Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias Peer-reviewed

M. Murugesan, H. Kino, H. Nohira, J. C. Bea, A. Horibe, F. Yamada, C. Miyazaki, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST　30-34　2010

DOI： 10.1109/IEDM.2010.5703279 　

三次元積層型集積回路のための自己組織化チップ位置合わせ技術 Peer-reviewed

岩田 永司, 福島 誉史, 大原 悠希, 李 康旭, 田中 徹, 小柳 光正

電子情報通信学会誌C　J93-C　(11)　493-502　2010

ISSN： 1345-2827

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature Peer-reviewed

T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751436 　

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure Peer-reviewed

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751479 　

Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer Peer-reviewed

T. Tanaka, T. Fukushima, K. -W. Lee, M. Murugesan, M. Koyanagi

2010 IEEE INTERNATIONAL SOI CONFERENCE　60-63　2010

DOI： 10.1109/SOI.2010.5641471 　

ISSN： 1078-621X

セルフアセンブリ法を用いた新しいヘテロインテグレーション技術 Invited

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「VLSIシンポジウム特集(先端CMOSデバイス・プロセス技術)」　115　17-22　2009/08/03

Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric Peer-reviewed

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　95　(3)　033118-033120　2009/07

DOI： 10.1063/1.3189085 　

ISSN： 0003-6951

Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric Peer-reviewed

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　95　(3)　033118-1-033118-3　2009/07

DOI： 10.1063/1.3189085 　

ISSN： 0003-6951

MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition Peer-reviewed

Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　24　(4)　2009/04

DOI： 10.1088/0268-1242/24/4/045022 　

ISSN： 0268-1242

Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection Peer-reviewed

Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C113-1-C113-5　2009/04

DOI： 10.1143/JJAP.48.04C113 　

ISSN： 0021-4922

Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System Peer-reviewed

Kenji Makita, Kouji Kiyoyarna, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C077-1-C077-5　2009/04

DOI： 10.1143/JJAP.48.04C077 　

ISSN： 0021-4922

Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films Peer-reviewed

Woo-Cheol Jeong, Kouji Kiyoyama, Kang-Wook Lee, Akihiro Noriki, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C157-1-C157-5　2009/04

DOI： 10.1143/JJAP.48.04C157 　

ISSN： 0021-4922

eISSN： 1347-4065

Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding Peer-reviewed

Soichiro Kanno, Risato Kobayashi, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C189-1-C189-4　2009/04

DOI： 10.1143/JJAP.48.04C189 　

ISSN： 0021-4922

Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System Peer-reviewed

Risato Kobayashi, Soichiro Kanno, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C194-1-C194-5　2009/04

DOI： 10.1143/JJAP.48.04C194 　

ISSN： 0021-4922

Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application Peer-reviewed

Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　94　(6)　063108-063110　2009/02

DOI： 10.1063/1.3081042 　

ISSN： 0003-6951

Super chip integration technology for three-dimensionally stacked retinal prosthesis chips

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Smart Systems Integration 2009, SSI 2009　299-306　2009

Erratum: TSV (Through-Si-Via) Formation Technologies for Three-Dimensionally Stacked Chips [Journal of Japan Institute of Electronics Packaging 12(2): 104-109 (2009)]

Fukushima Takafumi, Tanaka Tetsu, Koyanagi Mitsumasa

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits　12　(3)　262-262　2009

DOI： 10.5104/jiep.12.262 　

ISSN： 1343-9677

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　323-326　2009

ISSN： 2380-9248

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding Peer-reviewed

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanag

Technical Digest - International Electron Devices Meeting, IEDM　14.5.4　2009

DOI： 10.1109/IEDM.2009.5424348 　

ISSN： 0163-1918

3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　14.2.4　2009

DOI： 10.1109/IEDM.2009.5424351 　

ISSN： 0163-1918

Three-Dimensional Integration Technology and Integrated Systems Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009　409-415　2009

ISSN： 2153-6961

Fabrication of Multichannel Neural Microelectrodes with Microfluidic Channels Based on Wafer Bonding Technology Peer-reviewed

R. Kobayashi, S. Kann, T. Fukushima, T. Tanaka, M. Koyanagi

13TH INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING, VOLS 1-3　23　(1-3)　2258-+　2009

ISSN： 1680-0737

Development of A Silicon Neural Probe for An Intelligent Silicon Neural Probe System

Risato Kobayashi, Lee Sanghoon, Soichiro Kanno, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

Nano-Biomedical Engineering 2009　297-308　2009

Electrical characterization of MOS memory devices with self-assembled tungsten nano-dots dispersed in silicon nitride Peer-reviewed

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

ECS Transactions　18　(1)　33-37　2009

DOI： 10.1149/1.3096423 　

ISSN： 1938-5862 1938-6737

Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride Peer-reviewed

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of the International Semiconductor Technology Conference/China Semiconductor Technology International Conference (ISTC/CSTIC)　85-89　2009

Super Hetero-Integration Technology for LSI /MEMS Integration Peer-reviewed

M. Koyanagi, K.-W. Lee, T. Fukushima, T. Tanaka

Proceedings of the International Conference on Electronics Packaging (ICEP)　589-595　2009

Development of Double-sided Si Neural Probe with Microfluidic Channels Using Wafer Direct Bonding Technique Peer-reviewed

R. Kobayashi, S. Kanno, S. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　96-+　2009

DOI： 10.1109/NER.2009.5109243 　

ISSN： 1948-3546

A Simple Device Allowing Silicon Microelectrode Insertion for Chronic Neural Recording in Primates Peer-reviewed

Kazuhiro Sakamoto, Yoshia Matsuzaka, Tamotsu Suenaga, Hiroshi Watanabe, Risato Kobayashi, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka, Mitsumasa Koyanagi, Hajime Mushiake

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　104-+　2009

DOI： 10.1109/NER.2009.5109245 　

ISSN： 1948-3546

Cu Lateral Interconnects Formed Between 100-mu m-Thick Self-Assembled Chips on Flexible Substrates Peer-reviewed

M. Murugesan, J. -C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. -C. Jeong, H. Kino, A. Noriki, K. -W. Lee, T. Tanaka, M. Koyanagi

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4　1496-1501　2009

DOI： 10.1109/ECTC.2009.5074210 　

Development of EEB (Electroplated Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps Peer-reviewed

Y. Ohara, A. Noriki, E. Iwata, T. Hiraki, K.-W. Lee, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　86-87　2009

High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module Peer-reviewed

A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K.-W. Lee, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　88-89　2009

Evaluation of Thin LSI Wafers by Capacitance-Time (C-t) Measurement for the Process Characterization of Three-Dimensional (3D) Integration Peer-reviewed

J.-C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of International Conference on Solid State Devices and Materials (SSDM)　370-371　2009

In vivo Neural Signal Recording using Double-sided Si Neural Probe Peer-reviewed

S. Lee, R. Kobayashi, S. Kanno, K. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　691-692　2009

Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module Peer-reviewed

K-W Lee, S. Kanno, Y. Ohara, K. Kiyoyama, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　6-+　2009

ISSN： 2164-0157

A Parallel ADC for High-Speed CMOS Image Processing System with 3D Structure Peer-reviewed

K. Kiyoyama, Y. Ohara, K-W Lee, Y. Yang, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　101-+　2009

ISSN： 2164-0157

Micro-Raman Spectroscopy Analysis and Capacitance-Time (C-t) Measurement of Thinned Silicon Substrates for 3D Integration Peer-reviewed

J. -C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. -W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　189-193　2009

ISSN： 2164-0157

10 mu m Fine Pitch Cu/Sn Micro-Bumps for 3-D Super-Chip Stack Peer-reviewed

Yuki Ohara, Akihiro Noriki, Katsuyuki Sukuma, Kang-Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　389-+　2009

ISSN： 2164-0157

Development of a New Self-Assembled Die Bonder to Three-Dimensionally Stack Known Good Dies in Batch Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　434-437　2009

ISSN： 2164-0157

Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking Peer-reviewed

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION　1112　121-130　2009

ISSN： 0272-9172

Ultra Low Power Vertical MOS Devices for Fully Implantable Rtinal Prosthesis Peer-reviewed

H. Kino, T. Hiraki, J-C. Bea, T. Fukushima, M. Koyanagi, T. Tanaka

3rd East Asian Pacific Student Workshop on Nano-Biomedical Engineering　112-113　2009

Impact of Remnant Stress/Strain and Metal Contamination in 3D-LSIs with Through-Si Vias Fabricated by Wafer Thinning and Bonding Peer-reviewed

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　335-+　2009

DOI： 10.1109/IEDM.2009.5424348 　

ISSN： 2380-9248

3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon (SOS) Peer-reviewed

K-W Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W-C Jeong, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　495-498　2009

DOI： 10.1109/IEDM.2009.5424305 　

3D System Integration Technology and 3D Systems Peer-reviewed

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Conference Proceedings Advanced Metallization Conference 2008 (AMC 2008)　479-485　2009/01

High-Density Through Silicon Vias for 3-D LSIs Invited Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE　97　(1)　49-59　2009/01

DOI： 10.1109/JPROC.2008.2007463 　

ISSN： 0018-9219

eISSN： 1558-2256

Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking Invited Peer-reviewed

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION　1112　121-130　2009

ISSN： 0272-9172

TSV (Through-Si-Via) formation technologies for three-dimensionally stacked chips Invited Peer-reviewed

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Journal of Japan Institute of Electronics Packaging　12　(2)　104-109　2009

DOI： 10.5104/jiep.12.104 　

ISSN： 1343-9677

Cu filling characteristics in through-Si via holes by electroless plating with addition of inhibitors Peer-reviewed

F. Inoue, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. Wang, S. Shingubara

ECS Transactions　16　(22)　27-32　2009

DOI： 10.1149/1.3115647 　

ISSN： 1938-5862 1938-6737

Perfect Conformal Deposition of Electroless Cu for High Aspect Ratio Through-Si Vias Peer-reviewed

F. Inoue, Y. Harada, M. Koyanagi, T. Fukushima, K. Yamamoto, S. Tanaka, Z. Wang, S. Shingubara

ELECTROCHEMICAL AND SOLID STATE LETTERS　12　(10)　H381-H384　2009

DOI： 10.1149/1.3193535 　

ISSN： 1099-0062

Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy Peer-reviewed

M. Murugesan, J. C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi

JOURNAL OF APPLIED PHYSICS　104　(7)　074316-1-074316-5　2008/10

DOI： 10.1063/1.2973665 　

ISSN： 0021-8979

Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride Peer-reviewed

Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　93　(11)　113115-113117　2008/09

DOI： 10.1063/1.2986409 　

ISSN： 0003-6951

eISSN： 1077-3118

Chip Self-Assembly Technique for 3D LSI Fabrication

T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi

Technical Digest of the International 3D System Integration Conference (3D-SIC) 2008　207-216　2008/05/12

Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate Peer-reviewed

Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2936-2940　2008/04

DOI： 10.1143/JJAP.47.29361 　

ISSN： 0021-4922

eISSN： 1347-4065

Tungsten through-silicon via technology for three-dimensional LSIs Peer-reviewed

Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2801-2806　2008/04

DOI： 10.1143/JJAP.47.2801 　

ISSN： 0021-4922

New reconfigurable memory architecture for parallel image-processing LSI with three-dimensional structure Peer-reviewed

Shigeo Kodama, Daijirou Amano, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2774-2778　2008/04

DOI： 10.1143/JJAP.47.2774 　

ISSN： 0021-4922

Power supply system using electromagnetic induction for three-dimensionally stacked retinal prosthesis chip Peer-reviewed

Ken Komiya, Risato Kobayashi, Takafumi Kobayashi, Keigo Sato, Takafumi Fukushima, Hiroshi Tomita, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　3244-3247　2008/04

DOI： 10.1143/JJAP.47.3244 　

ISSN： 0021-4922

Electrical characterization of metal-oxide-semiconductor memory devices with high-density self-assembled tungsten nanodots Peer-reviewed

Yan-Li Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2680-2683　2008/04

DOI： 10.1143/JJAP.47.2680 　

ISSN： 0021-4922

A New Nano-System with Three-Dimensional Structure for Real Time Parallel Image Processing

Mitsumasa Koyanagi, Takafumi Fukushima

Proceeding of the 5th International Conference on Mechanical Science based on Nanotechnology　117-118　2008/03/06

3D system integration technology and 3D systems Invited

Takafumi FUKUSHIMA Tetsu TANAKA, Mitsumasa KOYANAGI

Abstract Book: European Workshop Materials for Advanced Metallization (MAM) 2008　37-38　2008/03/02

自己組織化ウェーハ張り合せによる三次元集積化技術 Invited

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「多層配線」特集号　(99)　34-37　2008/02/08

3-D integration technology for realizing super chip

Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi

2008 Proceedings - 25th International VLSI Multilevel Interconnection Conference, VMIC 2008　197-202　2008

Deep trench etching for through-silicon vias in three-dimensional integration technology

Jun Liang, Hirokazu Kikuchi, Takayuki Konno, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2008-1　674-678　2008

Three-Dimensional Super-Chip Integration Technology Using Self-Assembly Technique Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 IEEE SILICON NANOELECTRONICS WORKSHOP　23-24　2008

Three-dimensional integration technology using self-assembly technique and super-chip integration Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE　10-12　2008

ISSN： 2380-632X

eISSN： 2380-6338

New Three-Dimensional Integration Technology Using Reconfigured Wafers Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4　1180-1183　2008

A Closed-loop Power Control Function for Bio-implantable devices Peer-reviewed

Kouji Kiyoyama, Yoshito Tanaka, Mashahiro Onoda, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE　321-+　2008

Fabrication of fully implantable retinal prosthesis module with photodetector and stimulus current generator Peer-reviewed

田中徹, 福島誉史, 小柳光正

映像情報メディア学会技術報告　32　(19(IST2008 8-18/CE2008 21-31))　1015-+　2008

DOI： 10.1109/IEDM.2007.4419127 　

ISSN： 1342-6893

Multichip self-assembly technique on flexible polymeric substrate Peer-reviewed

T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS　1532-1537　2008

DOI： 10.1109/ECTC.2008.4550179 　

ISSN： 0569-5503

A Novel SPRAM (SPin-transfer torque RAM)-based Reconfigurable Logic Block for 3D-Stacked reconfigurable Spin Processor Peer-reviewed

M. Sekikawa, K. Kiyoyama, H. Hasegawa, K. Miura, T. Fukushima, S. Ikeda, T. Tanaka, H. Ohno, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　935-+　2008

DOI： 10.1109/IEDM.2008.4796645 　

New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method Peer-reviewed

T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, A. Norki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　499-502　2008

DOI： 10.1109/IEDM.2008.4796735 　

Evaluation of platinum-black stimulus electrode array for electrical stimulation of retinal cells in retinal prosthesis system Peer-reviewed

Taiichiro Watanabe, Risato Kobayashi, Ken Komiya, Takafumi Fukushima, Hiroshi Tomita, Eriko Sugano, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2785-2791　2007/04

DOI： 10.1143/JJAP.46.2785 　

ISSN： 0021-4922

Novel optical/electrical printed circuit board with polynorbornene optical waveguide Peer-reviewed

Makoto Fujiwara, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2395-2400　2007/04

DOI： 10.1143/JJAP.46.23951 　

ISSN： 0021-4922

Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap Peer-reviewed

Takeaki Sugimura, Takeshi Sakaguchi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2226-2230　2007/04

DOI： 10.1143/JJAP.46.2226 　

ISSN： 0021-4922

New magnetic nanodot memory with FePt nanodots Peer-reviewed

Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Mikihiko Oogane, Takafumi Fukushima, Tetsu Tanaka, Shozo Kono, Seiji Samukawa, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2167-2171　2007/04

DOI： 10.1143/JJAP.46.2167 　

ISSN： 0021-4922

Fully implantable retinal prosthesis chip with photodetector and stimulus current generator

T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Watanabe, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　1015-1018　2007

DOI： 10.1109/IEDM.2007.4419127 　

ISSN： 0163-1918

New three-dimensional integration technology to achieve a super chip Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings　318-321　2007

DOI： 10.1109/ICSICT.2006.306217 　

High performance polynorbornene optical waveguide for Opto-Electric interconnections Peer-reviewed

M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007　193-+　2007

Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method Peer-reviewed

C. K. Yin, H. Choi, J. C. Bea, M. Murugesan, J. H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi

2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings　4　401-404　2007

Self-assembly process for chip-to-wafer three-dimensional integration Peer-reviewed

T. Fulcushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS　836-+　2007

DOI： 10.1109/ECTC.2007.373895 　

ISSN： 0569-5503

New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique Peer-reviewed

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2　985-988　2007

DOI： 10.1109/IEDM.2007.4419119 　

ISSN： 2380-9248

Analysis of GOI-MOSFET with high-k gate dielectric and metal gate fabricated by Ge condensation technique Peer-reviewed

Mungi Park, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi

SURFACE AND INTERFACE ANALYSIS　38　(12-13)　1720-1724　2006/12

DOI： 10.1002/sia.2434 　

ISSN： 0142-2421

Three-dimensional integration technology based on wafer bonding with vertical buried interconnections Invited Peer-reviewed

Mitsumasa Koyanagi, Tomonori Nakamura, Yuusuke Yamada, Hirokazu Kikuchi, Takafumi Fukushima, Tetsu Tanaka, Hiroyuki Kurino

IEEE TRANSACTIONS ON ELECTRON DEVICES　53　(11)　2799-2808　2006/11

DOI： 10.1109/TED.2006.884079 　

ISSN： 0018-9383

eISSN： 1557-9646

Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem Peer-reviewed

Risato Kobayashi, Taiichiro Watanabe, Ken Komiya, Takafumi Fukushima, Kazuhiro Sakamoto, Hiroyuki Kurino, Tetsu Tanaka, Norihiro Katayama, Hajime Mushiake, Mitsumasa Koyanagi

International Conference on Solid State Devices and Materials　898-899　2006/09/12

Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method Peer-reviewed

C. K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi, J. C. Bea, H. Choi, M. Nishijima, M. Miyao

APPLIED PHYSICS LETTERS　89　(6)　063109-1-063109-3　2006/08

DOI： 10.1063/1.2335588 　

ISSN： 0003-6951

Multichip shared memory module with optical interconnection for parallel-processor system Peer-reviewed

Hirofumi Kuribara, Hiroyuki Hashimoto, Takafumi Fukushima, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3504-3509　2006/04

DOI： 10.1143/JJAP.45.3504 　

ISSN： 0021-4922

Low-power and high-sensitivity magnetoresistive random access memory sensing scheme with body-biased preamplifier Peer-reviewed

Takeaki Sugimura, Jun Deguchi, Hoon Choi, Takeshi Sakaguchi, Hyuckjae Oh, Takafumi Fukushima, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3321-3325　2006/04

DOI： 10.1143/JJAP.45.3321 　

ISSN： 0021-4922

Quantitative derivation and evaluation of wire length distribution in three-dimensional integrated circuits using simulated quenching Peer-reviewed

Jun Deguchi, Takeaki Sugimura, Yoshihiro Nakatani, Takafumi Fukushima, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3260-3265　2006/04

DOI： 10.1143/JJAP.45.3260 　

ISSN： 0021-4922

Fabrication and evaluation of magnetic tunnel junction with MgO tunneling barrier Peer-reviewed

Takeshi Sakaguchi Hoon Choi, Ahn Sung-Jin, Takeaki Sugimura, Mungi Park, Milcihiko Oogane, Hyuckjae Oh, Jun Hayakawa, Shoji Ikeda, Young Min Lee, Takafumi Fukushima, Terunobu Miyazaki, Hideo Ohno, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3228-3232　2006/04

DOI： 10.1143/JJAP.45.3228 　

ISSN： 0021-4922

New magnetic flash memory with FePt magnetic floating gate Peer-reviewed

CK Yin, JC Bea, YG Hong, T Fukushima, M Miyao, K Natori, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3217-3221　2006/04

DOI： 10.1143/JJAP.45.3217 　

ISSN： 0021-4922

Characteristics of silicon-on-low k insulator metal oxide semiconductor field effect transistor with metal back gate Peer-reviewed

Y Yamada, H Oh, T Sakaguchi, T Fukushima, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3040-3044　2006/04

DOI： 10.1143/JJAP.45.30401 　

ISSN： 0021-4922

Deep-trench etching for chip-to-chip three-dimensional integration technology Peer-reviewed

H Kikuchi, Y Yamada, H Kuima, T Fukushima, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3024-3029　2006/04

DOI： 10.1143/JJAP.45.3024 　

ISSN： 0021-4922

Nickel germanide formation on condensed Ge layer for Ge-on-insulator device application Peer-reviewed

H Choi, M Park, T Fukushima, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　2984-2986　2006/04

DOI： 10.1143/JJAP.45.2984 　

ISSN： 0021-4922

Effects of ion implantation damage on elevated source/drain formation for ultrathin body silicon on insulator metal oxide semiconductor field-effect transistor Peer-reviewed

H Oh, T Sakaguchi, T Fukushima, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　2965-2969　2006/04

DOI： 10.1143/JJAP.45.2965 　

ISSN： 0021-4922

New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration Peer-reviewed

T Fukushima, Y Yamada, H Kikuchi, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　45　(4B)　3030-3035　2006/04

DOI： 10.1143/JJAP.45.3030 　

ISSN： 0021-4922

Fabrication of magnetic tunnel junction with FePt nanodots for magnetic nanodot memory

Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Semiconductor Technology, ISTC2007 - Proceedings of the 6th International Conference on Semiconductor Technology　418-422　2006

Semiconductor-on-Low-K Substrate Technology

Tetsu Tanaka, Yusuke Yamada, Mungi Park, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2006-03　297-301　2006

New non-volatile memory with magnetic nano-dots

Mitsumasa Koyanagi, J. C. Bea, C. K. Yin, Takafumi Fukushima, Tetsu Tanaka

ECS Transactions　2　(1)　209-215　2006

ISSN： 1938-5862 1938-6737

Research and development of transistor structure in nano-scale region Peer-reviewed

M. Koyanagi, Y. Yamada, M. Park, T. Fukushima, T. Tanaka

2006 INTERNATIONAL WORKSHOP ON NANO CMOS, PROCEEDINGS　34-37　2006

Development of new three-dimensional integration technology for retinal prosthesis Peer-reviewed

Yusuke Yamada, Jun Deguchi, Taiichiro Watanabe, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　613-+　2006

DOI： 10.1142/9781860948800_0067 　

Neuromorphic analog circuits for three-dimensionally stacked vision chip Peer-reviewed

Jun Liang, Yoshihiro Nakagawa, Jun Deguchi, Jeoung-Chill Shim, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　455-+　2006

DOI： 10.1142/9781860948800_0049 　

Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips Peer-reviewed

Hircrazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　385-+　2006

Novel retinal prosthesis system with three dimensionally stacked LSI chip Peer-reviewed

T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE　327-+　2006

DOI： 10.1109/ESSDER.2006.307704 　

ISSN： 1930-8876

Evaluation of electrical stimulus current applied to retinal cells for retinal prosthesis Peer-reviewed

Taiichiro Watanabe, Keita Motonami, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　45　(4B)　585-+　2006

DOI： 10.1142/9781860948800_0065 　

Design of Parallel Reconfigurable Image Processor with Three-Dimensional Structure Peer-reviewed

杉村武昭, 小西雄太, 出口淳, 石原聡之, 福島誉史, 近野敦, 内山勝, 小柳光正

電子情報通信学会論文誌 D　J89-D　(6)　1141-1152　2006

ISSN： 1880-4535

New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration Peer-reviewed

T. Fukushima, Y. Yamada, H. Kikuchi, M.Koyanagi

Proceeding of SOLID STATE DEVICES AND MATERIALS (SSDM)　2005　64-65　2005/09

Nickel Germanide Formation on Condensed Ge Layer For Ge-on-Insulator Device Application Peer-reviewed

Hoon CHOI, Mungi PARK, Takafumi FUKUSHIMA, Mitsumasa KOYANAGI

International Conference on Solid State Device and Materials (SSDM)　572-573　2005/09

Characteristics of Silicon-on-Low-K Insulator (SOLK) MOSFET with Metal Back-Gate Peer-reviewed

Y. Yamada, Hyuckjae Oh, T. Sakaguchi, T. Fukushima, M. Koyanagi

International Conference on Solid State Device and Materials (SSDM)　66-67　2005/09

Multi-Chip Shared-Memory Module with Optical Interconnection for Parallel Processor System Peer-reviewed

Hirofumi Kuribara, Hiroyuki Hashimoto, Takafumi Fukushima, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　2005　334-335　2005/09

Magnetic and Microstructural Properties of FePt L10 Nanoparticle Films Fabricated by Self-Assembled Nano-Dot Deposition(SAND) Method Peer-reviewed

J. C. Bea, C.-K. Yin, M. Nishijima,T. Fukushima, T. Sadoh, M. Miyao, M. Koyanagi

International Conference on Solid State Device and Materials (SSDM)　436-437　2005/09

Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique Peer-reviewed

Taiichiro Watanabe, Keita Motonami, Kazuhiro Sakamoto, Jun Deguchi, Risato Kobayashi, Ken Komiya, Keiji Okumura, Takafumi Fukushima, Hiroyuki Kurino, Hajime Mushiake, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　2005　462-463　2005/09

Influences of Ion Implantation Damages on Elevated Source/Drain Formation for Ultra-Thin Body SOI MOSFET Peer-reviewed

Hyuckjae Oh, Takeshi Sakaguchi, Jicheol Bea, Takafumi Fukusima, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　520-521　2005/09

Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration Peer-reviewed

Hirokazu Kikuchi, Yusuke Yamada, Hitoshi Kijima, Takafumi Fukushima

International Conference on Solid State Device and Materials (SSDM)　562-563　2005/09

Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method Peer-reviewed

Mungi Park, Hoon Choi, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　588-589　2005/09

Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier Peer-reviewed

Takeshi Sakaguchi, Hoon Choi, Takeaki Sugimura, Mikihiko Oogane, Hyuckjae Oh, Jun Hayakawa, Shoji Ikeda, Young Min Lee, Takafumi Fukushima, Terunobu Miyazaki, Hideo Ohno, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　642-643　2005/09

Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI Peer-reviewed

Jun Deguchi, Yoshihiro Nakatani, Takeaki Sugimura, Takafumi Fukushima, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　2005　660-661　2005/09

Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier Peer-reviewed

Takeaki Sugimura, Jun Deguchi, Hoon Choi, Takeshi Sakaguchi, Hyuchjae Oh, Takafumi Fukushima, Mitsumasa Koyanagi

International Conference on Solid State Device and Materials (SSDM)　2005　928-929　2005/09

Robot Vision System with Three-Dimensionally Integrated Reconfigurable Image Processor Chip

杉村武昭, 出口淳, 小西雄太, 中谷好博, 福島誉史, 近野敦, 栗野浩之, 内山勝, 小柳光正

電子情報通信学会技術研究報告　105　(43(RECONF2005 15-29))　79-84　2005

ISSN： 0913-5685

New three-dimensional integration technology using self-assembly technique Peer-reviewed

T Fukushima, Y Yamada, H Kikuchi, M Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST　359-362　2005

Deep Si Hole Etching Technique for Super Chip Integration Peer-reviewed

T. Fukushima, H. Kurino, H. Kikuchi, H. Kijima, Y. Yamada, J. Shim, M. Koyanagi

Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC)　364-366　2004/09

Bump Formation Technique for Multi-Chip Module with Optical Interconnections Peer-reviewed

T. Fukushima, H. Kurino, R. Nitobe, H. Kuribara, Y. Yamada, J. Shim, M. Koyanagi

Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC)　442-444　2004/09

Ultimate Functional Multi-Electrode System (UFMES) Formed by Multi-Chip Bonding Technology Peer-reviewed

T. Watanabe, K. Motonami, K. Sakamoto, J. Deguchi, T. Fukushima, J. Shim, H. Mushiake, H. Kurino, M. Koyanagi

Proceeding of 2004 International Conference on Solid State Device and Materials (SSDM)　2004/09

Ultrathin-SOI PMOSFET with Elevated S/D and buried back gate

H. Oh, T. Fukushima, T. Sakaguchi, J. Shim, C. Yin, M. Park, H. Kurino, M. Koyanagi

Proceeding of The Electrochemical Society International Semiconductor Technology Conference (ISTC)　51-56　2004/09

Three-dimensionally stacked analog retinal prosthesis chip Peer-reviewed

J Deguchi, T Watanabe, T Nakamura, Y Nakagawa, T Fukushima, S Jeoung-Chill, H Kurino, T Abe, M Tamai, M Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS　43　(4B)　1685-1689　2004/04

DOI： 10.1143/JJAP.43.1685 　

ISSN： 0021-4922

Robot Vision System with Parallel Reconfigurable Image Processor

杉村武昭, 出口淳, 小西雄太, 中谷好博, 福島誉史, 近野敦, 栗野浩之, 内山勝, 小柳光正

電子情報通信学会技術研究報告　104　(521(ICD2004 183-192))　49-54　2004

ISSN： 0913-5685

Heat-resistant photoresists based on new imaging technique: reaction development patterning Peer-reviewed

T Fukushima, Y Kawakami, A Kitamura, T Oyama, M Tomoi

JOURNAL OF MICROLITHOGRAPHY MICROFABRICATION AND MICROSYSTEMS　3　(1)　159-167　2004/01

DOI： 10.1117/1.1633273 　

ISSN： 1537-1646

Photosensitive fluorinated polyimides with constant based on reaction development a low dielectric patterning Peer-reviewed

T Miyagawa, T Fukushima, T Oyama, T Iijima, M Tomoi

JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY　41　(6)　861-871　2003/03

DOI： 10.1002/pola.10638 　

ISSN： 0887-624X

Ultrafast active transmission lines with low-k polyimide integrated with ultrafast photoconductive switches Peer-reviewed

S Yagi, T Itatani, H Kawanami, S Gorwadkar, T Uemura, T Fukushima, H Itatani, M Tomoi, M Tacano

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS　42　(2B)　L154-L156　2003/02

DOI： 10.1143/JJAP.42.L154 　

ISSN： 0021-4922

Heat-resistant photoresists based on new imaging technique: reaction development patterning (RDP) Peer-reviewed

T Fukushima, T Oyama, M Tomoi

ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XX, PTS 1 AND 2　5039　960-967　2003

DOI： 10.1117/12.483709 　

ISSN： 0277-786X

Ionic-bonded negative photosensitive polyimides having pendant aminoalkyl (meth)acrylamide groups Peer-reviewed

T Fukushima, T Oyama, M Tomoi

REACTIVE & FUNCTIONAL POLYMERS　56　(1)　59-73　2003

DOI： 10.1016/S1381-5148(03)00033-6 　

ISSN： 1381-5148

Photosensitive engineering plastics based on reaction development patterning (RDP) Invited Peer-reviewed

福島誉史, 大山俊幸, 友井正男

日本化学会講演予稿集　83rd　(2)　585-588　2003

ISSN： 0285-7626

New Concept of Heat-Resistant Photoresists: Reaction Development Patterning (RDP) Peer-reviewed

T. Fukushima, T. Oyama, M. Tomoi

IUPAC World Polymer Congress 2002, 39th International Symposium on Macromolecules　2002/07

Positive Photosensitive Polyimides Based on Novel Imaging Principle: Reaction Development Patterning (RDP)

T. Fukushima, T. Oyama, M. Tomoi

Proceedings of STEPI6: 6th European Technical Symposium on Polyimides and High Performance Functional Polymer　2002/05

Photosensitive polyarylates based on reaction development patterning Peer-reviewed

T Oyama, A Kitamura, T Fukushima, T Iijima, M Tomoi

MACROMOLECULAR RAPID COMMUNICATIONS　23　(2)　104-108　2002/01

ISSN： 1022-1336

Photosensitive polyetherimide (Ultem) based on reaction development patterning (RDP) Peer-reviewed

T Fukushima, Y Kawakami, T Oyama, M Tomoi

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY　15　(2)　191-196　2002

DOI： 10.2494/photopolymer.15.191 　

ISSN： 0914-9244

Ultrafast photoconductive swiches integrated with electrical waveguides of low-k polyimide Invited Peer-reviewed

S Yagi, T Itatani, H Kawanami, S Gorwadkar, T Uemura, T Fukushima, H Itatani, M Tomoi, M Tacano

APPLICATIONS OF PHOTONIC TECHNOLOGY 5　4833　623-632　2002

DOI： 10.1117/12.474331 　

ISSN： 0277-786X

Durable and refreshable polymeric N-halamine biocides containing 3-(4′-vinylbenzyl)-5,5-dimethylhydantoin Peer-reviewed

Takafumi Fukushima, Toshiyuki Oyama, Takao Iijima, Masao Tomoi, Hiroshi Itatani

Journal of Polymer Science, Part A: Polymer Chemistry　39　(19)　3348-3355　2001/10/01

DOI： 10.1002/pola.1317 　

ISSN： 0887-624X

Photosensitive polycarbonates based on reaction development patterning (RDP) Peer-reviewed

T Oyama, Y Kawakami, T Fukushima, T Iijima, M Tomoi

POLYMER BULLETIN　47　(2)　175-181　2001/10

DOI： 10.1007/s002890170009 　

ISSN： 0170-0839

New concept of positive photosensitive polyimide: Reaction development patterning (RDP) Peer-reviewed

T Fukushima, T Oyama, T Iijima, M Tomoi, H Itatani

JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY　39　(19)　3451-3463　2001/10

DOI： 10.1002/pola.1327 　

ISSN： 0887-624X

Synthesis and positive-imaging photosensitivity of soluble polyimides having pendant carboxyl groups Peer-reviewed

T Fukushima, K Hosokawa, T Oyama, T Iijima, M Tomoi, H Itatani

JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY　39　(6)　934-946　2001/03

DOI： 10.1002/1099-0518(20010315)39:6<934::AID-POLA1068>3.0.CO;2-T 　

ISSN： 0887-624X

Positive photosensitive polyimide synthesized by block-copolymerization for KrF lithography Peer-reviewed

T Itatani, S Gorwadkar, T Fukushima, M Komuro, H Itatani, M Tomoi, T Sakamoto, S Matsumoto

ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2　3999　552-558　2000

ISSN： 0277-786X

Applications of newly developed positive photosensitive block co-polyimides to CSPs Peer-reviewed

S Matsumoto, XZ Jin, T Fukushima, M Miyamura, H Itatani

PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE　367-372　2000

Sub-micron Patterning of Positive Photo-sensitive Polyimide Synthesized by Block Copolymerization Peer-reviewed

T. Itatani, S. Gorwadkar, T. Fukushima, Y. Yamamoto, M. Maezawa, M. Komuro, T. Sakamoto, M. Tomoi, H. Itatani

Proceedings of International Conference on Solid State Device and Materials (SSDM),　1999/09