FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach

Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　45-48　2023年11月15日

DOI： 10.1109/icsj59341.2023.10339614 　

FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display

Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　49-52　2023年11月15日

DOI： 10.1109/icsj59341.2023.10339585 　

Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction

Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)　1-4　2023年10月19日

DOI： 10.1109/biocas58349.2023.10389082 　

High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials　2023年9月8日

DOI： 10.7567/ssdm.2023.g-5-02 　

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last

Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2023 IEEE International 3D Systems Integration Conference (3DIC)　499　1-4　2023年5月10日

DOI： 10.1109/3dic57175.2023.10154930 　

Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　25　596-600　2023年5月

DOI： 10.1109/ectc51909.2023.00105 　

Gapless Chip-in-Carrier Integration and Injectable Ag/AgCl-Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor 招待有り 査読有り

Hiromichi Wakebe, Yuki Susumago, Takafumi Fukushima, Tetsu Tanaka

IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING　18　(3)　477-487　2023年3月

DOI： 10.1002/tee.23744 　

3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration

Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

IEICE Electronics Express　19　(23)　20220363-20220363　2022年12月10日

DOI： 10.1587/elex.19.20220363 　

eISSN：1349-2543

Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)　519-523　2022年10月13日

DOI： 10.1109/biocas54905.2022.9948542 　

Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022年9月29日

DOI： 10.7567/ssdm.2022.e-7-02 　

Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration

Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022年9月28日

DOI： 10.7567/ssdm.2022.k-4-02 　

Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022年9月27日

DOI： 10.7567/ssdm.2022.d-1-03 　

Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022年9月27日

DOI： 10.7567/ssdm.2022.k-1-01 　

Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis

Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022年9月27日

DOI： 10.7567/ssdm.2022.k-1-03 　

Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics

Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Journal of Vacuum Science & Technology B　40　(5)　052202-052202　2022年9月

DOI： 10.1116/6.0001836 　

ISSN：2166-2746

eISSN：2166-2754

Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2022 IEEE International Interconnect Technology Conference (IITC)　2022年6月27日

DOI： 10.1109/iitc52079.2022.9881288 　

Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor

Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka

Electronics and Communications in Japan　105　(2)　2022年6月

DOI： 10.1002/ecj.12343 　

ISSN：1942-9533

eISSN：1942-9541

Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs

Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　2022年5月

DOI： 10.1109/ectc51906.2022.00225 　

Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　15　(11)　111004-1-111004-5　2022年4月

DOI： 10.35848/1882-0786/ac9d24 　

Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System

Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2021 IEEE Biomedical Circuits and Systems Conference (BioCAS)　2021年10月7日

DOI： 10.1109/biocas49922.2021.9645034 　

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan

2021 IEEE International 3D Systems Integration Conference (3DIC)　2021年10月

DOI： 10.1109/3dic52383.2021.9687601 　

High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　14　(9)　2021年9月

DOI： 10.35848/1882-0786/ac18b0 　

ISSN：1882-0778

eISSN：1882-0786

Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021年7月6日

DOI： 10.1109/IITC51362.2021.9537540 　

Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021年7月6日

DOI： 10.1109/IITC51362.2021.9537336 　

Direct fabrication of SU-8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor

Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka

IEEJ Transactions on Sensors and Micromachines　141　(10)　327-335　2021年

DOI： 10.1541/IEEJSMAS.141.327 　

ISSN：1347-5525 1341-8939

Multimodal Functional Analysis Platform: 1. Ultrathin Fluorescence Endoscope Imaging System Enables Flexible Functional Brain Imaging

Makoto Osanai, Hideki Miwa, Atsushi Tamura, Satomi Kikuta, Yoshio Iguchi, Yuchio Yanagawa, Kazuto Kobayashi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake

Advances in Experimental Medicine and Biology　471-479　2021年

DOI： 10.1007/978-981-15-8763-4_31 　

ISSN：0065-2598

eISSN：2214-8019

Multimodal Functional Analysis Platform: 2. Development of Si Opto-Electro Multifunctional Neural Probe with Multiple Optical Waveguides and Embedded Optical Fiber for Optogenetics. 国際誌

Tetsu Tanaka, Norihiro Katayama, Kazuhiro Sakamoto, Makoto Osanai, Hajime Mushiake

Advances in experimental medicine and biology　1293　481-491　2021年

DOI： 10.1007/978-981-15-8763-4_32 　

Multimodal Functional Analysis Platform: 3. Spherical Treadmill System for Small Animals. 国際誌

Norihiro Katayama, Mitsuyuki Nakao, Tetsu Tanaka, Makoto Osanai, Hajime Mushiake

Advances in experimental medicine and biology　1293　493-500　2021年

DOI： 10.1007/978-981-15-8763-4_33 　

Multimodal Functional Analysis Platform: 4. Optogenetics-Induced Oscillatory Activation to Explore Neural Circuits. 国際誌

Hajime Mushiake, Tomokazu Ohshiro, Shin-Ichiro Osawa, Ryosuke Hosaka, Norihiro Katayama, Tetsu Tanaka, Hiromu Yawo, Makoto Osanai

Advances in experimental medicine and biology　1293　501-509　2021年

DOI： 10.1007/978-981-15-8763-4_34 　

On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO<inf>2</inf>

Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

Journal of Polymer Science　58　(16)　2248-2258　2020年8月15日

DOI： 10.1002/pol.20200094 　

ISSN：2642-4150

eISSN：2642-4169

Significant Die-Shift Reduction and μlED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka

IEEE Transactions on Components, Packaging and Manufacturing Technology　10　(8)　1419-1422　2020年8月

DOI： 10.1109/TCPMT.2020.3009640 　

ISSN：2156-3950

eISSN：2156-3985

Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　2020-June　1199-1204　2020年6月

DOI： 10.1109/ECTC32862.2020.00192 　

ISSN：0569-5503

RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Proceedings - Electronic Components and Technology Conference　2020-June　811-816　2020年6月

DOI： 10.1109/ECTC32862.2020.00132 　

ISSN：0569-5503

7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　2020-June　1453-1458　2020年6月

DOI： 10.1109/ECTC32862.2020.00230 　

ISSN：0569-5503

Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)　2020年4月

DOI： 10.1109/edtm47692.2020.9118027 　

Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory 査読有り

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

Japanese Journal of Applied Physics　59　(SG)　2020年4月

DOI： 10.35848/1347-4065/ab6867 　

ISSN：0021-4922

eISSN：1347-4065

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration 査読有り

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　59　(SB)　2020年2月1日

DOI： 10.7567/1347-4065/ab4f3c 　

ISSN：0021-4922

eISSN：1347-4065

Generation of STDP with non-volatile tunnel-FET memory for large-scale and low-power spiking neural networks

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　8　1266-1271　2020年

DOI： 10.1109/JEDS.2020.3025336 　

eISSN：2168-6734

PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System 査読有り

Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama

BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings　2019年10月

DOI： 10.1109/BIOCAS.2019.8919027 　

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation 査読有り

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019年10月

DOI： 10.1109/3DIC48104.2019.9058843 　

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing 査読有り

Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019年10月

DOI： 10.1109/3DIC48104.2019.9058856 　

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs 査読有り

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019年10月

DOI： 10.1109/3DIC48104.2019.9058841 　

Development of 3D-IC Embedded Flexible Hybrid System 査読有り

Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019年10月

DOI： 10.1109/3DIC48104.2019.9058880 　

Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019年10月

DOI： 10.1109/3DIC48104.2019.9058838 　

Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application 査読有り

Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Proceedings - Electronic Components and Technology Conference　2019-May　264-269　2019年5月

DOI： 10.1109/ECTC.2019.00046 　

ISSN：0569-5503

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration 査読有り

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019　17　2019年5月

DOI： 10.23919/LTB-3D.2019.8735115 　

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application 査読有り

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 International Conference on Electronics Packaging, ICEP 2019　265-267　2019年4月

DOI： 10.23919/ICEP.2019.8733416 　

Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate 査読有り

Young Taek Oh, Jae Min Sim, Nguyen Van Toan, Hisashi Kino, Takahito Ono, Tetsu Tanaka, Yun Heub Song

IEEE Transactions on Electron Devices　66　(4)　1741-1746　2019年4月

DOI： 10.1109/TED.2019.2900155 　

ISSN：0018-9383

Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019　222-224　2019年3月

DOI： 10.1109/EDTM.2019.8731161 　

High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs

Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE Transactions on Components, Packaging and Manufacturing Technology　9　(1)　181-188　2019年1月

DOI： 10.1109/tcpmt.2018.2871764 　

ISSN：2156-3950

eISSN：2156-3985

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application 査読有り

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)　265-267　2019年

Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter 査読有り

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE ELECTRON DEVICE LETTERS　40　(1)　95-98　2019年1月

DOI： 10.1109/LED.2018.2884452 　

ISSN：0741-3106

eISSN：1558-0563

Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter 査読有り

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Electron Device Letters　40　(1)　95-98　2019年1月

DOI： 10.1109/LED.2018.2884452 　

ISSN：0741-3106

The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS 査読有り

Young Taek Oh, Jae Min Sim, Hisashi Kino, Deok Kee Kim, Tetsu Tanaka, Yun Heub Song

IEEE Journal of the Electron Devices Society　7　382-387　2019年

DOI： 10.1109/JEDS.2019.2901298 　

eISSN：2168-6734

Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC 査読有り

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　7　1225-1231　2019年

DOI： 10.1109/JEDS.2019.2936180 　

eISSN：2168-6734

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips 査読有り

Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka

2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings　2018年12月20日

DOI： 10.1109/BIOCAS.2018.8584776 　

Process Integration for FlexTrate ^TM 査読有り

Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 International Flexible Electronics Technology Conference, IFETC 2018　2018年12月19日

DOI： 10.1109/IFETC.2018.8584029 　

The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures 査読有り

Young Taek Oh, Il Pyo Roh, Hisashi Kino, Tetsu Tanaka, Yun Heub Song

IEEE Transactions on Electron Devices　65　(10)　4313-4319　2018年10月

DOI： 10.1109/TED.2018.2865007 　

ISSN：0018-9383

Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs 査読有り

Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka

2018 IEEE International Interconnect Technology Conference, IITC 2018　135-137　2018年8月8日

DOI： 10.1109/IITC.2018.8430390 　

TSV liner dielectric technology with spin-on low-k polymer 査読有り

S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　346-349　2018年6月6日

DOI： 10.23919/ICEP.2018.8374320 　

Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system 査読有り

Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018年4月1日

DOI： 10.7567/JJAP.57.04FM11 　

ISSN：1347-4065 0021-4922

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018年4月1日

DOI： 10.7567/JJAP.57.04FE07 　

ISSN：1347-4065 0021-4922

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current

Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018年3月23日

DOI： 10.1109/BIOCAS.2017.8325165 　

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip

Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018年3月23日

DOI： 10.1109/BIOCAS.2017.8325552 　

マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発 査読有り

菅原 陽平, 木野 久志, 福島 誉史, 田中 徹

電子情報通信学会論文誌 C(Web)　J101-C　(2)　58-65　2018年2月1日

ISSN：1881-0217

Self-Assembly Technologies for FlexTrate (TM)

Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)　1836-1841　2018年

DOI： 10.1109/ECTC.2018.00275 　

ISSN：0569-5503

eISSN：2377-5726

Study of Al-doped ZnO transparent stimulus electrode for fully implantable retinal prosthesis with three-dimensionally stacked retinal prosthesis chip 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Sensors and Materials　30　(2)　225-234　2018年

DOI： 10.18494/SAM.2018.1741 　

ISSN：0914-4935

Development of Biosignal Recording Board System with Agile Control of Circuit Characteristics for Various Biosignals 査読有り

Keita Ito, Takaharu Tani, Takuma Iwagami, Satoru Nishino, Koji Kiyoyama, Tetsu Tanaka

ELECTRONICS AND COMMUNICATIONS IN JAPAN　101　(1)　47-54　2018年1月

DOI： 10.1002/ecj.12021 　

ISSN：1942-9533

eISSN：1942-9541

Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration 査読有り

Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(12)　5065-5072　2017年12月

DOI： 10.1109/TED.2017.2767598 　

ISSN：0018-9383

eISSN：1557-9646

Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　1523-1528　2017年8月1日

DOI： 10.1109/ECTC.2017.209 　

ISSN：0569-5503

New concept of TSV formation methodology using Directed Self-Assembly (DSA) 査読有り

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017年7月5日

DOI： 10.1109/3DIC.2016.7970022 　

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications 査読有り

Kangwook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017年7月5日

DOI： 10.1109/3DIC.2016.7970027 　

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017年7月5日

DOI： 10.1109/3DIC.2016.7970031 　

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology 査読有り

Murugesan Mariappan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017年7月5日

DOI： 10.1109/3DIC.2016.7970017 　

Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission 査読有り

Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka

IITC 2017 - 2017 IEEE International Interconnect Technology Conference　2017年7月5日

DOI： 10.1109/IITC-AMC.2017.7968936 　

3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration 査読有り

Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(7)　2912-2918　2017年7月

DOI： 10.1109/TED.2017.2705562 　

ISSN：0018-9383

eISSN：1557-9646

3D-IC technology and reliability challenges 査読有り

Tetsu Tanaka

17th International Workshop on Junction Technology, IWJT 2017　51-53　2017年6月30日

DOI： 10.23919/IWJT.2017.7966513 　

Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces 査読有り

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　56　(4)　04CM04-1-04CM04-4　2017年4月1日

DOI： 10.7567/JJAP.56.04CM04 　

ISSN：1347-4065 0021-4922

Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties 査読有り

Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　56　(4)　04CM05-1-04CM05-5　2017年4月1日

DOI： 10.7567/JJAP.56.04CM05 　

ISSN：1347-4065 0021-4922

Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber 査読有り

Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　56　(4)　04CM08-1-04CM08-4　2017年4月

DOI： 10.7567/JJAP.56.04CM08 　

ISSN：0021-4922

eISSN：1347-4065

経爪型集積化光電式容積脈波計測システムの開発 査読有り

銭 正ヨウ, 竹澤 好樹, 下川 賢士, 伊藤 圭汰, 西野 悟, 清山 浩司, 田中 徹

生体医工学　55　(5)　464-464　2017年

DOI： 10.11239/jsmbe.55Annual.464 　

様々な生体信号を瞬時に選択記録可能なアジャイル生体信号記録用ボードシステムの開発 査読有り

伊藤圭汰, 谷卓治, 岩上卓磨, 西野悟, 清山浩司, 田中徹

電気学会論文誌C　137　(2)　348-353　2017年

DOI： 10.1541/ieejeiss.137.348 　

ISSN：1348-8155 0385-4221

三次元集積用テンポラリー接着剤の特性とウエハエッジの影響 査読有り

福島 誉史, マリアッパン ムルゲサン, 裵 志哲, 李 相勲, 李 康旭, 田中 徹, 小柳 光正

電子情報通信学会誌C　J99-C　(11)　493-500　2016年11月1日

ISSN：1881-0217

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration 査読有り

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines　7　(10)　184-1-184-18　2016年10月

DOI： 10.3390/mi7100184 　

ISSN：2072-666X

網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価

下川 賢士, 後藤 大輝, 木野 久志, 福島 誉史, 田中 徹

2016年第77回応用物理学会秋季学術講演会講演予稿集　77th　11-408-11-408　2016年9月16日

Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique 査読有り

Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　467-468　2016年9月

Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber 査読有り

Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　389-390　2016年9月

Analysis of Charge Injection Characteristics of Stimulus Electrode with Wide-Range Analog Front-end for Body-Implanted Devices 査読有り

Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　393-394　2016年9月

Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring 査読有り

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　409-410　2016年9月

半導体ウエハへの三次元配線加工：TSVと狭ピッチ電極を中心に 招待有り 査読有り

福島誉史, 李康旭, 田中徹, 小柳光正

表面技術 小特集: シリコンウエハの表面処理　67　(8)　414-420　2016年8月1日

DOI： 10.4139/sfj.67.414 　

ISSN：0915-1869

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　6　(7)　1002-1008　2016年7月

DOI： 10.1109/TCPMT.2016.2575070 　

ISSN：2156-3950

eISSN：2156-3985

Influence of Cu-TSVs, CuSnand PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips 査読有り

Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, Tetsu Tanaka

2016 Proceedings 66th Electronic Components and Technology Conference　50-55　2016年6月

Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC 査読有り

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　2016年4月

DOI： 10.7567/JJAP.55.04EC07 　

ISSN：0021-4922

eISSN：1347-4065

Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC 査読有り

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　04EC03-1-04EC03-4　2016年4月

DOI： 10.7567/JJAP.55.04EC03 　

ISSN：0021-4922

eISSN：1347-4065

Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system 査読有り

Takuma Iwagami, Takaharu Tani, Keita Ito, Satoru Nishino, Takuya Harashima, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　55　(4)　04EM12-1-04EM12-5　2016年4月

DOI： 10.7567/JJAP.55.04EM12 　

ISSN：0021-4922

eISSN：1347-4065

DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価

谷川 星野, 木野久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会 講演予稿集　63rd　11-130　2016年3月20日

応力センサ集積シリコン神経プローブの開発

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

63回応用物理学会春季学術講演会予稿集　63rd　10-311-10-311　2016年3月20日

脳深部刺入可能なフレキシブルケーブル一体化シリコン神経プローブの開発

森川 拓実, 谷 卓治, 原島 卓也, 鈴木 雄策, 木野 久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会予稿集　63rd　2016年3月20日

Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC 査読有り

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　55　(4S)　04EC07-1-04EC07-4　2016年3月17日

DOI： 10.7567/JJAP.55.04EC07 　

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration 査読有り

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　25　(1)　91-100　2016年2月

DOI： 10.1109/JMEMS.2015.2480787 　

ISSN：1057-7157

eISSN：1941-0158

New multichip-to-wafer 3D integration technology using Self-Assembly and Cu nano-pillar hybrid bonding 査読有り

M. Koyanagi, K. W. Lee, T. Fukushima, T. Tanaka

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings　338-341　2016年

DOI： 10.1109/ICSICT.2016.7998914 　

Impact of Interconnections on Vertically Stacked 20 mu m-thick DRAM Chips 査読有り

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, M. Koyanagi, S. Tanikawa, T. Tanaka

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　50-55　2016年

DOI： 10.1109/ECTC.2016.255 　

ISSN：0569-5503

Non-Conductive Film Underfill for 3D Integration of 20 mu m-Thick LSI Wafers with Fine Cu-TSVs 査読有り

M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka

2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　466-471　2016年

ISSN：1078-8743

Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding 査読有り

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, S. H. Lee, M. Motoyoshi, T. Tanaka, K. W. Lee, M. Koyanagi

2016 International Conference on Electronics Packaging (ICEP)　265-269　2016年

Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging 招待有り

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MRS Advances　1　(34)　2355-2366　2016年

DOI： 10.1557/adv.2016.528 　

ISSN：2059-8521

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration 査読有り

Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　37　(1)　81-83　2016年1月

DOI： 10.1109/LED.2015.2502584 　

ISSN：0741-3106

eISSN：1558-0563

Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip 査読有り

S. Tanikawa, H. Kino, T. Fukushima, K-W. Lee, M. Koyanagi, T. Tanaka

2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　6B-1-1-6B-1-6　2016年

DOI： 10.1109/IRPS.2016.7574561 　

ISSN：1541-7026

Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding 査読有り

T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　289-294　2016年

DOI： 10.1109/ECTC.2016.298 　

ISSN：0569-5503

Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra-fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration 査読有り

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　350-355　2016年

DOI： 10.1109/ECTC.2016.10 　

ISSN：0569-5503

Highly Sensitive Pressure Sensor with Silicon-On-Nothing (SON) MOSFET for Sensor Integrated Heterogeneous System 査読有り

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW)　186-187　2016年

DOI： 10.1109/SNW.2016.7578043 　

Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current 査読有り

Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, Tetsu Tanaka

PROCEEDINGS OF 2016 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS)　304-307　2016年

DOI： 10.1109/BioCAS.2016.7833792 　

ISSN：2163-4025

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration 査読有り

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14　75　(9)　285-290　2016年

DOI： 10.1149/07509.0285ecst 　

ISSN：1938-5862

電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム　60-60　2015年12月17日

柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-

鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム　60-60　2015年12月17日

三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価

谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹

公益社団法人 応用物理学会東北支部 第70回学術講演会プログラム　70th　2015年12月3日

シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向 招待有り

福島 誉史, 李 康旭, 田中 徹, 小柳 光正

第32回「センサ・マイクロマシンと応用システム」シンポジウム予稿集　32nd　28pm3-D-1-1-28pm3-D-1-6　2015年10月28日

Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC 査読有り

Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　56-57　2015年9月27日

大脳皮質層別光刺激のための反射ミラー集積シリコン神経プローブの開発

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

第76回応用物理学会秋季学術講演会予稿集　76th　p11-381-p11-381　2015年9月15日

DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価

谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹

2015年第76回応用物理学会秋季学術講演会講演予稿集　76th　12-124　2015年9月14日

3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価

菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹

第76回応用物理学会秋季学術講演会講演予稿集　76th　12-123-12-123　2015年9月14日

回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究

木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹

第25回マイクロエレクトロニクスシンポジウム論文集　25th　355-358　2015年9月3日

ISSN：2434-396X

Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications 査読有り

Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, Kang-Wook Lee

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　70-71　2015年9月

Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array 査読有り

Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　790-791　2015年9月

Area-Efficient and Wide-Range Impedance Analysis Circuit for Multichannel High Quality Brain Signal Recording System 査読有り

Takuma Iwagami, Takaharu Tani, Keita ito, Satoru Nishino, Takuya Harashima, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　822-823　2015年9月

高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ

伊藤有香, 福島誉史, Murugesan Mariappan, 裵 志哲, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　408-409　2015年3月17日

ISSN：1880-4616

高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層

橋口日出登, 福島誉史, 裵 志哲, Murugesan Mariappan, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　410-412　2015年3月17日

ISSN：1880-4616

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration 査読有り

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　54　(3)　030206-1-030206-6　2015年3月

DOI： 10.7567/JJAP.54.030206 　

ISSN：0021-4922

eISSN：1347-4065

Applications of three-dimensional LSI 招待有り 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

MRS BULLETIN　40　(3)　242-247　2015年3月

DOI： 10.1557/mrs.2015.33 　

ISSN：0883-7694

eISSN：1938-1425

Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner 査読有り

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

ECS Transactions　64　(40)　63-75　2015年

DOI： 10.1149/06440.0063ecst 　

ISSN：1938-6737 1938-5862

Development of glyoxylic acid based electroless copper deposition on ruthenium 査読有り

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

ECS Transactions　64　(40)　41-55　2015年

DOI： 10.1149/06440.0041ecst 　

ISSN：1938-6737 1938-5862

Role of bath composition in electroless Cu seeding on Co liner for through-Si vias 査読有り

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka

ECS Journal of Solid State Science and Technology　4　(1)　N3108-N3112　2015年

DOI： 10.1149/2.0131501jss 　

ISSN：2162-8777 2162-8769

Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University 査読有り

K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　2015年

ISSN：2164-0157

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM 査読有り

Kang-Wook Lee, Ji-Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2015年

ISSN：1541-7026

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　260-263　2015年

Consideration of Micro bump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC 査読有り

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　260-263　2015年

DOI： 10.1109/3DIC.2015.7334596 　

ISSN：2164-0157

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration 査読有り

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　185-188　2015年

DOI： 10.1109/IEDM.2015.7409652 　

Development of Highly-Reliable Microbump Bonding Technology using Self-Assembly of NCF-Covered KGDs and Multi -Layer 3D Stacking Challenges 査読有り

Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　336-341　2015年

DOI： 10.1109/ECTC.2015.7159614 　

ISSN：0569-5503

Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV 査読有り

Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　822-827　2015年

DOI： 10.1109/ECTC.2015.7159687 　

ISSN：0569-5503

Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration 査読有り

H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1458-1463　2015年

DOI： 10.1109/ECTC.2015.7159789 　

ISSN：0569-5503

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers 査読有り

K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, J. C. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　31-34　2015年

DOI： 10.1109/3DIC.2015.7334471 　

ISSN：2164-0157

Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors 査読有り

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　59-61　2015年

DOI： 10.1109/3DIC.2015.7334557 　

ISSN：2164-0157

Transfer and Non-Transfer Stacking Technologies Based on Chip-to-Wafer Self-Asembly for High-Throughput and High-Precision Alignment and Microbump Bonding 査読有り

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　134-137　2015年

DOI： 10.1109/3DIC.2015.7334578 　

ISSN：2164-0157

Mitigating Thermo Mechanical Stress in High Density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via _ mu-RS and mu-XRD Study 査読有り

M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　179-183　2015年

DOI： 10.1109/3DIC.2015.7334579 　

ISSN：2164-0157

Lower invasive in vivo brain insertion of the Si neural probe with triangular shank and sharpened tip 査読有り

Takuya Harashima, Takaharu Tani, Hisashi Kino, Norihiro Katayama, Tetsu Tanaka

Extended Abstracts of the 2014 International Conference on Solid State Device and Materials　606-607　2014年9月

Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC 査読有り

Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2014 International Conference on Solid State Device and Materials　726-727　2014年9月

Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording 査読有り

Takaharu Tani, Hideki Naganuma, Takuya Harashima, Takuma Iwagami, Hisashi Kino, Koji Kiyoyama, Minna Kellomäki, Jari Hyttinen, Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　377-O-378　2014年8月17日

DOI： 10.11239/jsmbe.52.O-377 　

ISSN：1347-443X 1881-4379

Development of chip-surface stimulus electrode array for fully-implantable subretinal prosthesis chip 査読有り

Yuichiro Sasaki, Takuji Suzuki, Takuma Iwagami, Takaharu Tani, Hideki Naganuma, Hisashi Kino, Jari Hyttinen, Minna Kellomaki, Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　253-O-254　2014年8月17日

DOI： 10.11239/jsmbe.52.O-253 　

ISSN：1347-443X 1881-4379

Development of Si opto-neural probe with multiple optical stimulation function 査読有り

Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　75　2014年8月17日

DOI： 10.11239/jsmbe.52.OS-75 　

ISSN：1347-443X 1881-4379

Evaluation of sink and source patterns in the prefrontal cortex of a monkey 査読有り

Kazuhiro Sakamoto, Norihiko Kawaguchi, Kohei Yagi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake

Transactions of Japanese Society for Medical and Biological Engineering　52　73-OS-74　2014年8月17日

DOI： 10.11239/jsmbe.52.OS-73 　

ISSN：1347-443X 1881-4379

Via Reveal and Backside Processing 査読有り

Mitsumasa Koyanagi, Tetsu Tanaka

Handbook of 3D Integration　3　227-240　2014年7月21日

DOI： 10.1002/9783527670109.ch17 　

Envelope tracking CMOS power amplifier with high-speed CMOS envelope amplifier for mobile handsets 査読有り

Eiji Yoshida, Yasufumi Sakai, Kazuaki Oishi, Hiroshi Yamazaki, Toshihiko Mori, Shinji Yamaura, Kazuo Suto, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　53　(4)　04EE19-1-04EE19-4　2014年4月

DOI： 10.7567/JJAP.53.04EE19 　

ISSN：0021-4922

eISSN：1347-4065

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration 査読有り

Kang-Wook Lee, Ji-Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY　14　(1)　451-462　2014年3月

DOI： 10.1109/TDMR.2013.2258022 　

ISSN：1530-4388

eISSN：1558-2574

Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice 査読有り

Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　540-547　2014年2月

DOI： 10.1109/TED.2013.2295463 　

ISSN：0018-9383

eISSN：1557-9646

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film 査読有り

Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　533-539　2014年2月

DOI： 10.1109/TED.2013.2294831 　

ISSN：0018-9383

eISSN：1557-9646

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM 査読有り

Kang-Wook Lee, Seiya Tanikawa, Mariappan Murugesan, Hideki Naganuma, Ji-Choel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　379-385　2014年2月

DOI： 10.1109/TED.2013.2295244 　

ISSN：0018-9383

eISSN：1557-9646

A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs 査読有り

H. Hashiguchi, T. Fukushima, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)　74-77　2014年

Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration 査読有り

H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　14-14　2014年

A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies 査読有り

K-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　304-308　2014年

ISSN：0569-5503

Micro-XRD Investigation of Fine-Pitch Cu-TSV Induced Thermo-Mechanical Stress in High-Density 3D-LSI 査読有り

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, T. Tanaka

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014年

ISSN：2164-0157

Impacts of Cu Contamination in 3D Integration Process on Memory Retention Characteristics in Thinned DRAM Chip 査読有り

Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichel Bea, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM　2014年

ISSN：1541-7026

Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration 査読有り

Y. Ito, T. Fukushima, K. -W. Lee, K. Choki, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　15-15　2014年

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV 査読有り

Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　35　(1)　114-116　2014年1月

DOI： 10.1109/LED.2013.2287879 　

ISSN：0741-3106

eISSN：1558-0563

Electroless Cu Seed on Ru and Co Liners in High Aspect Ratio TSV 査読有り

F. Inoue, H. Philipsen, M. H. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf, T. Tanaka

2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)　207-209　2014年

DOI： 10.1109/IITC.2014.6831871 　

Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits 査読有り

Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　636-640　2014年

DOI： 10.1109/ECTC.2014.6897353 　

ISSN：0569-5503

eISSN：2377-5726

Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly 査読有り

H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　856-861　2014年

DOI： 10.1109/ECTC.2014.6897386 　

ISSN：0569-5503

Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive 査読有り

Hisashi Kino, Hideto Hashiguchi, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1110-1115　2014年

DOI： 10.1109/ECTC.2014.6897428 　

ISSN：0569-5503

Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies 査読有り

Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1148-1153　2014年

DOI： 10.1109/ECTC.2014.6897434 　

ISSN：0569-5503

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent 査読有り

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka

JOURNAL OF THE ELECTROCHEMICAL SOCIETY　161　(14)　D768-D774　2014年

DOI： 10.1149/2.0361414jes 　

ISSN：0013-4651

eISSN：1945-7111

Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration 査読有り

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014年

DOI： 10.1109/3DIC.2014.7152145 　

ISSN：2164-0157

Cu Seeding Using Electroless Deposition on Ru Liner for High Aspect Ratio Through-Si Vias 査読有り

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014年

DOI： 10.1109/3DIC.2014.7152147 　

ISSN：2164-0157

Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV 査読有り

K. W. Lee, C. Nagai, A. Nakamura, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014年

DOI： 10.1109/3DIC.2014.7152153 　

ISSN：2164-0157

Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology 査読有り

K-W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J-C Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　669-672　2014年

DOI： 10.1109/IEDM.2014.7047128 　

Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration 査読有り

Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan, Hideki Naganuma, Haro Shimamoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　34　(8)　1038-1040　2013年8月

DOI： 10.1109/LED.2013.2265336 　

ISSN：0741-3106

eISSN：1558-0563

Development and In Vivo Evaluation of Conductive Polymer (PEDOT) Stimulus Electrodes for Fully Implantable Retinal Prosthesis 査読有り

Chikashi kigure, Hideki Naganuma, Yuichiro Sasaki, Hiroshi Kino, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CL03-1-04CL03-5　2013年4月22日

DOI： 10.7567/JJAP.52.04CL03 　

Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration 査読有り

Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CB11-1-04CB11-6　2013年4月22日

DOI： 10.7567/JJAP.52.04CB1 　

Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis 査読有り

Chikashi Kigure, Hideki Naganuma, Yuichiro Sasaki, Hisashi Kino, Hiroshi Tomita, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　2013年4月

DOI： 10.7567/JJAP.52.04CL03 　

ISSN：0021-4922

eISSN：1347-4065

Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration 査読有り

Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CB11-1-04CB11-5　2013年4月

DOI： 10.7567/JJAP.52.04CB11 　

ISSN：0021-4922 1347-4065

Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration 査読有り

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　04CB09-1-04CB09-6　2013年4月

DOI： 10.7567/JJAP.52.04CB09 　

ISSN：0021-4922

eISSN：1347-4065

Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain 査読有り

Sanghoon Lee, Soichiro Kanno, Hisashi Kino, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　04CL04-1-04CL04-6　2013年4月

DOI： 10.7567/JJAP.52.04CL04 　

ISSN：0021-4922

eISSN：1347-4065

Development of 3D-stacked reconfigurable spin logic chip using via-last backside-via 3D integration technology 査読有り

T. Tanaka, H. Kino, K. Kiyoyama, H. Ohno, M. Koyanagi

Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013　2013年

DOI： 10.1109/IITC.2013.6615594 　

3D Hetero-Integration Technology with Backside TSV and Reliability Challenges 査読有り

Kang-Wook Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S)　2013年

Challenges in 3D Integration 査読有り

Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka

SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3　53　(3)　237-244　2013年

DOI： 10.1149/05303.0237ecst 　

ISSN：1938-5862

eISSN：1938-6737

Characterization and Reliability of 3D LSI and SiP 査読有り

K-W. Lee, M. Murugesan, Jichel Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　176-179　2013年

DOI： 10.1109/IEDM.2013.6724579 　

Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding 査読有り

H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi

Proceedings of International Conference on Electronics Packaging (ICEP)　502-505　2013年

3D Integration technologies using self-assembly and electrostatic temporary multichip bonding 査読有り

T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings - Electronic Components and Technology Conference　58-63　2013年

DOI： 10.1109/ECTC.2013.6575550 　

ISSN：0569-5503

Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI 査読有り

H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka

Proceedings - Electronic Components and Technology Conference　360-365　2013年

DOI： 10.1109/ECTC.2013.6575596 　

ISSN：0569-5503

Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration 査読有り

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　891-896　2013年

DOI： 10.1109/ECTC.2013.6575679 　

Young Modulus of Si in 3D-LSIs and Reliability 査読有り

M. Murugesan, J.C. Bea, T. Fukushima, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　38-39　2013年

Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration 査読有り

H. Hashiguchi, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　40-41　2013年

Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D-IC 査読有り

H. Kino, T. Fukushima, K.-W. Lee, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　862-863　2013年

Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration 査読有り

Y. Ito, T. Fukushima, K.W. Lee, K. Choki, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　988-989　2013年

Mechanical Characteristics of Thin Dies/Wafers in Three-Dimensional Large-Scale Integrated systems 査読有り

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, T. Tanaka

2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　66-69　2013年

DOI： 10.1109/ASMC.2013.6552777 　

ISSN：1078-8743

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory 査読有り

K-W Lee, S. Tanikawa, M. Murugesan, H. Naganuma, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013年

DOI： 10.1109/3DIC.2013.6702336 　

ISSN：2164-0157

Highly Efficient TSV Repair Technology for Resilient 3-D Stacked Multicore Processor System 査読有り

H. Hashimoto, T. Fukushima, K. W. Lee, M. Koyanagi, T. Tanaka

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013年

DOI： 10.1109/3DIC.2013.6702338 　

ISSN：2164-0157

A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor 査読有り

K. Kiyoyama, Y. Sato, H. Hashimoto, K-W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013年

DOI： 10.1109/3DIC.2013.6702363 　

ISSN：2164-0157

Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV 査読有り

M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013年

DOI： 10.1109/3DIC.2013.6702364 　

ISSN：2164-0157

Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics 査読有り

S. Kanno, S. Lee, T. Harashima, T. Kuki, H. Kino, H. Mushiake, H. Yao, T. Tanaka

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS　253-256　2013年

DOI： 10.1109/EMBC.2013.6609485 　

ISSN：1557-170X

Die-level 3-D integration technology for rapid prototyping of high-performance multifunctionality hetero-integrated systems 査読有り

Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE Transactions on Electron Devices　60　(11)　3842-3848　2013年

DOI： 10.1109/TED.2013.2280273 　

ISSN：0018-9383

Revisiting the Silicon-Lattice in the High-Density 3D-LSIs - In the Perspective of Device Reliability 査読有り

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　172-175　2013年

DOI： 10.1109/IEDM.2013.6724578 　

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation 査読有り

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　59　(11)　2956-2963　2012年11月

DOI： 10.1109/TED.2012.2212709 　

ISSN：0018-9383

eISSN：1557-9646

Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis 査読有り

Kang-Wook Lee, Yoshinobu Watanabe, Chikashi Kigure, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JOURNAL OF MICROMECHANICS AND MICROENGINEERING　22　(10)　105015-1-105015-11　2012年10月

DOI： 10.1088/0960-1317/22/10/105015 　

ISSN：0960-1317

eISSN：1361-6439

Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration 査読有り

Kangwook Lee, Takaharu Tani, Hideki Naganuma, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(9)　1297-1299　2012年9月

DOI： 10.1109/LED.2012.2202631 　

ISSN：0741-3106

eISSN：1558-0563

High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate—an alternative method to wire bonding 査読有り

M Murugesan, T Fukushima, K Kiyoyama, J C Bea, T Tanaka, M Koyanagi

JOURNAL of Micromechanics and Microengineering　22　(8)　085033-1-085033-9　2012年8月

DOI： 10.1088/0960-1317/22/8/085033 　

ISSN：0960-1317

eISSN：1361-6439

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking 査読有り

M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF ELECTRONIC MATERIALS　41　(4)　720-729　2012年4月

DOI： 10.1007/s11664-012-1949-1 　

ISSN：0361-5235

Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI 査読有り

Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(2)　221-223　2012年2月

DOI： 10.1109/LED.2011.2174608 　

ISSN：0741-3106

A 37 × 37 pixels artificial retina chip with edge enhancement function for 3-D stacked fully implantable retinal prosthesis 査読有り

H. Naganuma, K. Kiyoyama, T. Tanaka

2012 IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Electronics and Systems for Better Life and Better Environment, BioCAS 2012 - Conference Publications　212-215　2012年

DOI： 10.1109/BioCAS.2012.6418459 　

The road to recovery from the great east Japan earthquake in micro/nano machining research and education center, Tohoku university 査読有り

Toshiya Kojima, Tetsu Tanaka

Journal of the Vacuum Society of Japan　55　(9)　413-416　2012年

DOI： 10.3131/jvsj2.55.413 　

ISSN：1882-2398 1882-4749

Ultrafast parallel reconfiguration of 3D-stacked reconfigurable spin logic chip with on-chip SPRAM (SPin-transfer torque RAM) 査読有り

T. Tanaka, H. Kino, R. Nakazawa, K. Kiyoyama, H. Ohno, M. Koyanagi

Digest of Technical Papers - Symposium on VLSI Technology　169-170　2012年

DOI： 10.1109/VLSIT.2012.6242515 　

ISSN：0743-1562

Study for CMOS device characteristics affected by Ultra Thin Wafer Thinning 査読有り

Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Shigeaki Saito, Koske Kitaichi, Shoji Yasunaga, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　2012年

ISSN：2373-5449

Heterogeneous 3D Integration Technology and New 3D LSIs 査読有り

Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka

2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012)　240-243　2012年

Chip-Based Hetero-Integration Technology for High-Performance 3D Stacked Image Sensor 査読有り

Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　2012年

ISSN：2373-5449

Impact of Cu Diffusion from Cu Through-Silicon Via (TSV) on Device Reliability in 3-D LSIs Evaluated by Transient Capacitance Measurement 査読有り

Kangwook Lee, Jichel Bea, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2B.4.1-2B.4.6　2012年

DOI： 10.1109/IRPS.2012.6241777 　

Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs 査読有り

Kangwook Lee, Itakafumi Fukushima, Tetsu Tanaka, Imitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　5F.2.1-5F.2.4　2012年

DOI： 10.1109/IRPS.2012.6241860 　

Self-assembly-based 3D integration technologies 査読有り

T. Fukushima, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012　151-152　2012年

DOI： 10.1109/LTB-3D.2012.6238075 　

Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration 査読有り

T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　393-398　2012年

DOI： 10.1109/ECTC.2012.6248860 　

Locally Induced Stress in Stacked Ultrathin Si wafers: XPS and mu-Raman study 査読有り

M. Murugesan, H. Nohira, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　625-629　2012年

DOI： 10.1109/ECTC.2012.6248896 　

Optical interconnect technology for 3-D LSI and neural engineering applications 査読有り

T. Tanaka, A. Noriki, T. Kukushima, K-W Lee, M. Koyanagi

2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)　2012年

10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications 査読有り

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　46-47　2012年

Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps 査読有り

Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　48-49　2012年

The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3D LSI by Using C–V and C–t Measurements 査読有り

Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2012年

Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisted Self-Assembly with Cu/Sn Microbump 査読有り

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1176-1177　2012年

Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration 査読有り

Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1183-1184　2012年

Reliability Challenges in High-Density 3D-Integration 査読有り

M. Murugesan, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1185-1186　2012年

Cu Contamination Assessment and Control in 3-D Integration 査読有り

Mitsumasa Koyanagi, Kang Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka

The 222nd ECS Meeting: PRiME (Pacific Rim Meeting)　2012年

Long Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride 査読有り

Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi

Materials Research Society (MRS) 2008 Spring Meeting, Symposium F: Materials Science and Technology for Nonvolatile Memories, F2.4　2012年

New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding 査読有り

T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　789-792　2012年

DOI： 10.1109/IEDM.2012.6479157 　

Characterization of Chip-level Hetero-Integration Technology for High-Speed, Highly Parallel 3D-Stacked Image Processing System 査読有り

K-W Lee, Y. Ohara, K. Kiyoyama, S. Konno, Y. Sato, S. Watanabe, A. Yabata, T. Kamada, J-C Bea, H. Hashimoto, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　785-788　2012年

DOI： 10.1109/IEDM.2012.6479156 　

Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs 査読有り

M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　657-660　2012年

DOI： 10.1109/IEDM.2012.6479124 　

Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing 査読有り

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　1　(12)　1873-1884　2011年12月

DOI： 10.1109/TCPMT.2011.2160266 　

ISSN：2156-3950

eISSN：2156-3985

三次元集積化技術とヘテロインテグレーション 招待有り 査読有り

小柳光正, 福島誉史, 李康旭, 田中徹

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　355-364　2011年11月

ISSN：1345-2827

三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術 査読有り

大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　394-401　2011年11月

ISSN：1345-2827

シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価 査読有り

木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　411-418　2011年11月

ISSN：1345-2827

Effects of Annealing Temperature in a Metal Alloy Nano-dot Memory 査読有り

Jung Min Lee, Gae Hun Lee, Yun Heub Song, Ji Cheol Bea, Tetsu Tanaka

JOURNAL OF THE KOREAN PHYSICAL SOCIETY　59　(4)　2782-2785　2011年10月

DOI： 10.3938/jkps.59.2782 　

ISSN：0374-4884

Advanced die-to-wafer 3D integration platform: Self-assembly technology 査読有り

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

3D Integration for VLSI Systems　153-174　2011年9月30日

DOI： 10.4032/9789814303828 　

Multilevel Charge Storage in a Multiple Alloy Nanodot Memory 査読有り

Gae-Hun Lee, Jung-Min Lee, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　50　(9)　2011年9月

DOI： 10.1143/JJAP.50.095001 　

ISSN：0021-4922

eISSN：1347-4065

Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement 査読有り

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(7)　940-942　2011年7月

DOI： 10.1109/LED.2011.2141109 　

ISSN：0741-3106

eISSN：1558-0563

MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric 査読有り

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON NANOTECHNOLOGY　10　(3)　528-531　2011年5月

DOI： 10.1109/TNANO.2010.2050331 　

ISSN：1536-125X

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration 査読有り

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MICROMACHINES　2　(1)　49-68　2011年3月

DOI： 10.3390/mi2010049 　

ISSN：2072-666X

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems 査読有り

Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　58　(3)　748-757　2011年3月

DOI： 10.1109/TED.2010.2099870 　

ISSN：0018-9383

eISSN：1557-9646

Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement 査読有り

K-W Lee, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　26　(2)　2011年2月

DOI： 10.1088/0268-1242/26/2/025007 　

ISSN：0268-1242

eISSN：1361-6641

Development of Si neural probe with optical waveguide for highly accurate optical stimulation of neuron 査読有り

R. Kobayashi, S. Kanno, S. Sakai, S. Lee, M. Koyanagi, H. Yao, T. Tanaka

2011 5th International IEEE/EMBS Conference on Neural Engineering, NER 2011　294-297　2011年

DOI： 10.1109/NER.2011.5910545 　

Comparison of electrode materials for the use of retinal prosthesis 査読有り

Onnela Niina, Takeshita Hirotaka, Kaiho Yoshiuki, Kojima Toshiya, Kobayashi Risato, Tanaka Tetsu, Hyttinen Jari

Bio-Medical Materials and Engineering　21　(2)　83-97　2011年

DOI： 10.3233/BME-2011-0658 　

ISSN：0959-2989

3D Integration Technology and Reliability Challenges 査読有り

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS)　2011年

ISSN：2151-1225

Energy Band Engineering of Metal Nanodots for High Performance Nonvolatile Memory Application 査読有り

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS　470　140-+　2011年

DOI： 10.4028/www.scientific.net/KEM.470.140 　

ISSN：1013-9826

Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration 査読有り

T. Fukushima, Y. Ohara, M. Murugesan, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　2050-2055　2011年

ISSN：0569-5503

Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement 査読有り

K-W. Lee, J-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF THE ELECTROCHEMICAL SOCIETY　158　(8)　H795-H799　2011年

DOI： 10.1149/1.3597317 　

ISSN：0013-4651

eISSN：1945-7111

High Density 3D LSI Technology using W/Cu Hybrid TSVs 査読有り

M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　2011年

Development of 5 µm Diameter Backside Cu TSV Technology for 3D LSI 査読有り

Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the International Conference on Electronics Packaging (ICEP)　237-240　2011年

3D LSI Technology and Reliability Issues 査読有り

T. Tanaka, J. Bea, M. Murugesan, K. Lee, T. Fukushima, M. Koyanagi

Proceedings of the 2011 Symposium on VLSI Technology　184-185　2011年

Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer 査読有り

M. Murugesan, H. Nohira, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2011年

Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor 査読有り

H. Hashimoto, T. Fukushima, K-W. Lee, T. Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　168-169　2011年

Development of Implantable Si Neural Probe with Stimulus and Recording Electrodes for Deep Brain Stimulation 査読有り

Yoshiho Yukita, Sanghoon Lee, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　408-409　2011年

Impacts of Microbump-Induced Local Bending Stress in 3D-LSI 査読有り

H. Kino, M. Murugesan, K.-W. Lee, J.-C. Bea, C. Miyazaki, H. Kobayashi, H. Shimamoto, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　785-786　2011年

Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs 査読有り

H. Hashiguchi, M. Murugesan, J.C. Bea, K.W. Lee, T. Fukushima, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　795-796　2011年

A Block-Parallel SAR ADC for CMOS Image Sensor with 3-D Stacked Structure 査読有り

K. Kiyoyama, K-W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1055-1056　2011年

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration 査読有り

Yuki Ohara, Lee Kangwook, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262950 　

Temporary bonding strength control for self-assembly-based 3D integration 査読有り

Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262954 　

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI 査読有り

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262957 　

A very low area ADC for 3-D stacked CMOS image processing system 査読有り

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262958 　

High density Cu-TSVs and reliability issues 査読有り

Murugesan Mariappan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262969 　

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress 査読有り

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011年

DOI： 10.1109/3DIC.2012.6262970 　

High Reliable and Fine Size of 5-µm Diameter Backside Cu Through-Silicon Via(TSV)for High Reliability and High-End 3-D LSIs 査読有り

K.-W. Lee, J.-C. Bea, T. Fukushima, Y. Ohara, T. Tanaka, M. Koyanagi

Technical Digest of IEEE International 3D System Integration Conference (3DIC)　2011年

DOI： 10.1109/3DIC.2012.6262975 　

Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement 査読有り

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(1)　66-68　2011年1月

DOI： 10.1109/LED.2010.2087004 　

ISSN：0741-3106

eISSN：1558-0563

A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module 査読有り

Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　19　(6)　1284-1291　2010年12月

DOI： 10.1109/JMEMS.2010.2082497 　

ISSN：1057-7157

eISSN：1941-0158

Leakage Current Characteristics of the Multiple Metal Alloy Nanodot Memory 査読有り

Gae Hun Lee, Jung Min Lee, Hyung Jun Yang, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka

JOURNAL OF THE KOREAN PHYSICAL SOCIETY　57　(5)　1248-1252　2010年11月

DOI： 10.3938/jkps.57.1248 　

ISSN：0374-4884

三次元積層型集積回路のための自己組織化チップ位置合わせ技術 査読有り

岩田永司, 福島誉史, 大原悠希, 李康旭, 田中徹, 小柳光正

電子情報通信学会論文誌C　J93-C　(11)　493-502　2010年11月1日

ISSN：1345-2827

極限集積化を目指すスーパーチップ 査読有り

小柳光正, 福島誉史, 李康旭, 田中徹

電子情報通信学会誌　93　(11)　918-922　2010年11月1日

ISSN：0913-5693

Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application 査読有り

Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　49　(6)　066503-1-066503-4　2010年6月

DOI： 10.1143/JJAP.49.066503 　

ISSN：0021-4922

３次元積層型集積回路に向けた自己組織化チップ実装技術

福島誉史, 李康旭, 田中徹, 小柳光正

電子材料　49　(6)　17--24　2010年6月

ISSN：0387-0774

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits 査読有り

T. Fukushima, E. Iwata, T. Konno, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

APPLIED PHYSICS LETTERS　96　(15)　154105-1-154105-3　2010年4月

DOI： 10.1063/1.3328098 　

ISSN：0003-6951

Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010　2010年

Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability 査読有り

Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　49　(7)　2010年

DOI： 10.1143/JJAP.49.074201 　

ISSN：0021-4922

Development of Retinal Prosthesis Module for Fully Implantable Retinal Prosthesis 査読有り

Kangwook Lee, Tetsu Tanaka

6TH WORLD CONGRESS OF BIOMECHANICS (WCB 2010), PTS 1-3　31　1625-+　2010年

ISSN：1680-0737

Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration 査読有り

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)　433-437　2010年

Impact of Remnant Stress/Strain in 3D Stacked Retinal Chip by Wafer Thinning and Bonding 査読有り

Hisashi Kino, Tatsuro Hiraki, Mariappan Murugesan, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　123-124　2010年

Electrical and Mechanical Characteristics of Si Double-sided Neural Probe for In-vivo Recording 査読有り

Sanghoon Lee, Risato Kobayashi, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　127-128　2010年

Highly Accurate Optical Stimulation of Neuron using Si Neural Probe with Optical Waveguide 査読有り

Risato Kobayashi, Sanghoon Lee, Soichiro Kanno, Yoshiho Yukita, Kangwook Lee, Takafumi Fukushima, Toru Ishizuka, Hajime Mushiake, Hiromu Yao, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　181-182　2010年

Development of Versatile Backside Via Technology for 3D System on Chip 査読有り

Y. Ohara, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　237-238　2010年

Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement 査読有り

J.-C. Bea, K.-W. Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1196-1197　2010年

Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI 査読有り

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1198-1199　2010年

Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration 査読有り

Eiji Iwata, Yuki Ohara, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1202-1203　2010年

Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study 査読有り

M. Murugesan, Y. Ohara, J.C Bea, K.W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1204-1205　2010年

Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application 査読有り

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the China Semiconductor Technology International Conference (CSTIC)　55-55　2010年

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding 査読有り

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010年

DOI： 10.1109/3DIC.2010.5751432 　

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature 査読有り

T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010年

DOI： 10.1109/3DIC.2010.5751436 　

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure 査読有り

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010年

DOI： 10.1109/3DIC.2010.5751479 　

Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer 査読有り

T. Tanaka, T. Fukushima, K. -W. Lee, M. Murugesan, M. Koyanagi

2010 IEEE INTERNATIONAL SOI CONFERENCE　60-63　2010年

DOI： 10.1109/SOI.2010.5641471 　

ISSN：1078-621X

Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration 査読有り

T. Fukushima, E. Iwata, K. -W. Lee, T. Tanaka, M. Koyanagi

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1050-1055　2010年

DOI： 10.1109/ECTC.2010.5490830 　

ISSN：0569-5503

3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems 査読有り

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS　33　(12)　71-90　2010年

DOI： 10.1149/1.3501035 　

ISSN：1938-5862

Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias 査読有り

M. Murugesan, H. Kino, H. Nohira, J. C. Bea, A. Horibe, F. Yamada, C. Miyazaki, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST　30-34　2010年

DOI： 10.1109/IEDM.2010.5703279 　

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method 査読有り

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE IEDM Technical Digest　109　(408(SDM2009 171-181))　349-352　2009年12月

ISSN：0913-5685

A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density 査読有り

Yun Heub Song, Ji Chel Bea, Kang Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(10)　2009年10月

DOI： 10.1143/JJAP.48.106505 　

ISSN：0021-4922

Cannula-aided penetration: A simple method to insert structurally weak electrodes into brain through the dura mater 査読有り

Yoshiya Matsuzaka, Kazuhiro Sakamoto, Tetsu Tanaka, Yoshihito Furusawa, Hajime Mushiake

NEUROSCIENCE RESEARCH　65　(1)　126-129　2009年9月

DOI： 10.1016/j.neures.2009.05.009 　

ISSN：0168-0102

セルフアセンブリ法を用いた新しいヘテロインテグレーション技術 招待有り

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「VLSIシンポジウム特集(先端CMOSデバイス・プロセス技術)」　115　17-22　2009年8月3日

Cell characteristics of a multiple alloy nano-dots memory structure 査読有り

Ji Chel Bea, Yun Heub Song, Kang-Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　24　(8)　2009年8月

DOI： 10.1088/0268-1242/24/8/085013 　

ISSN：0268-1242

Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric 査読有り

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　95　(3)　033118-1-033118-3　2009年7月

DOI： 10.1063/1.3189085 　

ISSN：0003-6951

三次元積層型チップのためのSi貫通ビア(TSV)形成技術 査読有り

福島誉史, 田中徹, 小柳光正

エレクトロニクス実装学会誌　12　(2)　104-109　2009年5月1日

DOI： 10.5104/jiep.12.104 　

ISSN：1343-9677

Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection 査読有り

Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C113-1-C113-5　2009年4月

DOI： 10.1143/JJAP.48.04C113 　

ISSN：0021-4922

Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System 査読有り

Kenji Makita, Kouji Kiyoyarna, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C077-1-C077-5　2009年4月

DOI： 10.1143/JJAP.48.04C077 　

ISSN：0021-4922

Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films 査読有り

Woo-Cheol Jeong, Kouji Kiyoyama, Kang-Wook Lee, Akihiro Noriki, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C157-1-C157-4　2009年4月

DOI： 10.1143/JJAP.48.04C157 　

ISSN：0021-4922

eISSN：1347-4065

Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding 査読有り

Soichiro Kanno, Risato Kobayashi, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C189-1-C189-4　2009年4月

DOI： 10.1143/JJAP.48.04C189 　

ISSN：0021-4922

Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System 査読有り

Risato Kobayashi, Soichiro Kanno, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C194-1-C194-5　2009年4月

DOI： 10.1143/JJAP.48.04C194 　

ISSN：0021-4922

MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition 査読有り

Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　24　(4)　045022-045025　2009年4月

DOI： 10.1088/0268-1242/24/4/045022 　

ISSN：0268-1242

Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application 査読有り

Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　94　(6)　063108-063110　2009年2月

DOI： 10.1063/1.3081042 　

ISSN：0003-6951

Super chip integration technology for three-dimensionally stacked retinal prosthesis chips

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Smart Systems Integration 2009, SSI 2009　299-306　2009年

W0201(4) 医用マイクロ・ナノシステムの開発 : 人工視覚と多機能集積化神経プローブ([W0201]医工学テクノロジーの最先端,ワークショップ)

田中 徹

年次大会講演資料集　2009　243-244　2009年

DOI： 10.1299/jsmemecjsm.2009.9.0_243 　

訂正：三次元積層型チップのためのSi貫通ビア（TSV）形成技術 [エレクトロニクス実装学会誌 12(2): 104-109 (2009)]

福島 誉史, 田中 徹, 小柳 光正

エレクトロニクス実装学会誌　12　(3)　262-262　2009年

DOI： 10.5104/jiep.12.262 　

ISSN：1343-9677

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding 査読有り

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanag

Technical Digest - International Electron Devices Meeting, IEDM　14.5.4　2009年

DOI： 10.1109/IEDM.2009.5424348 　

ISSN：0163-1918

3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding 査読有り

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　14.2.4　2009年

DOI： 10.1109/IEDM.2009.5424351 　

ISSN：0163-1918

3D integration technology for 3D stacked retinal chip 査読有り

Y. Kaiho, Y. Ohara, H. Takeshita, K. Kiyoyama, K. W. Lee, T. Tanaka, M. Koyanagi

2009 IEEE International Conference on 3D System Integration, 3DIC 2009　2009年

DOI： 10.1109/3DIC.2009.5306564 　

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method 査読有り

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　323-326　2009年

ISSN：2380-9248

Three-Dimensional Integration Technology and Integrated Systems 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009　409-415　2009年

ISSN：2153-6961

3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon (SOS) 査読有り

K-W Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W-C Jeong, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　495-498　2009年

Development of Double-sided Si Neural Probe with Microfluidic Channels Using Wafer Direct Bonding Technique 査読有り

R. Kobayashi, S. Kanno, S. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　96-+　2009年

ISSN：1948-3546

Fabrication of Multichannel Neural Microelectrodes with Microfluidic Channels Based on Wafer Bonding Technology 査読有り

R. Kobayashi, S. Kann, T. Fukushima, T. Tanaka, M. Koyanagi

13TH INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING, VOLS 1-3　23　(1-3)　2258-+　2009年

ISSN：1680-0737

Development of A Silicon Neural Probe for An Intelligent Silicon Neural Probe System

Risato Kobayashi, Lee Sanghoon, Soichiro Kanno, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

Nano-Biomedical Engineering 2009　297-308　2009年

Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride 査読有り

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of the International Semiconductor Technology Conference/China Semiconductor Technology International Conference (ISTC/CSTIC)　85-89　2009年

Super Hetero-Integration Technology for LSI /MEMS Integration 査読有り

M. Koyanagi, K.-W. Lee, T. Fukushima, T. Tanaka

Proceedings of the International Conference on Electronics Packaging (ICEP)　589-595　2009年

Cu Lateral Interconnects Formed Between 100-mu m-Thick Self-Assembled Chips on Flexible Substrates 査読有り

M. Murugesan, J. -C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. -C. Jeong, H. Kino, A. Noriki, K. -W. Lee, T. Tanaka, M. Koyanagi

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4　1496-1501　2009年

DOI： 10.1109/ECTC.2009.5074210 　

Development of EEB (Electroplated Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps 査読有り

Y. Ohara, A. Noriki, E. Iwata, T. Hiraki, K.-W. Lee, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　86-87　2009年

High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module 査読有り

A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K.-W. Lee, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　88-89　2009年

Evaluation of Thin LSI Wafers by Capacitance-Time (C-t) Measurement for the Process Characterization of Three-Dimensional (3D) Integration 査読有り

J.-C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of International Conference on Solid State Devices and Materials (SSDM)　370-371　2009年

In vivo Neural Signal Recording using Double-sided Si Neural Probe 査読有り

S. Lee, R. Kobayashi, S. Kanno, K. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　691-692　2009年

Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module 査読有り

K-W Lee, S. Kanno, Y. Ohara, K. Kiyoyama, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　6-+　2009年

ISSN：2164-0157

A Parallel ADC for High-Speed CMOS Image Processing System with 3D Structure 査読有り

K. Kiyoyama, Y. Ohara, K-W Lee, Y. Yang, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　101-+　2009年

ISSN：2164-0157

Micro-Raman Spectroscopy Analysis and Capacitance-Time (C-t) Measurement of Thinned Silicon Substrates for 3D Integration 査読有り

J. -C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. -W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　189-193　2009年

ISSN：2164-0157

10 µm Fine Pitch Cu/Sn Micro-Bumps for 3-D Super-Chip Stack 査読有り

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang-Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest of the IEEE International 3D System Integration Conference 2009 (3DIC)　389-+　2009年

ISSN：2164-0157

Development of a New Self-Assembled Die Bonder to Three-Dimensionally Stack Known Good Dies in Batch 査読有り

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　434-437　2009年

ISSN：2164-0157

Ultra Low Power Vertical MOS Devices for Fully Implantable Rtinal Prosthesis 査読有り

H. Kino, T. Hiraki, J-C. Bea, T. Fukushima, M. Koyanagi, T. Tanaka

3rd East Asian Pacific Student Workshop on Nano-Biomedical Engineering　112-113　2009年

Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking 招待有り 査読有り

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION　1112　121-130　2009年

ISSN：0272-9172

A Simple Device Allowing Silicon Microelectrode Insertion for Chronic Neural Recording in Primates 査読有り

Kazuhiro Sakamoto, Yoshia Matsuzaka, Tamotsu Suenaga, Hiroshi Watanabe, Risato Kobayashi, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka, Mitsumasa Koyanagi, Hajime Mushiake

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　104-+　2009年

DOI： 10.1109/NER.2009.5109245 　

ISSN：1948-3546

Electrical characterization of MOS memory devices with self-assembled tungsten nano-dots dispersed in silicon nitride 査読有り

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

ECS Transactions　18　(1)　33-37　2009年

DOI： 10.1149/1.3096423 　

ISSN：1938-5862 1938-6737

3D System Integration Technology and 3D Systems

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Conference Proceedings Advanced Metallization Conference 2008 (AMC 2008)　479-485　2009年

High-Density Through Silicon Vias for 3-D LSIs 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE　97　(1)　49-59　2009年1月

DOI： 10.1109/JPROC.2008.2007463 　

ISSN：0018-9219

eISSN：1558-2256

3D heterogeneous opto-electronic integration technology for system-on-silicon (SOS) 査読有り

K. W. Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W. C. Jeong, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　22.2.4-534　2009年

DOI： 10.1109/IEDM.2009.5424305 　

ISSN：0163-1918

Impact of Remnant Stress/Strain and Metal Contamination in 3D-LSIs with Through-Si Vias Fabricated by Wafer Thinning and Bonding 査読有り

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　335-+　2009年

ISSN：2380-9248

東北大学内連携プロジェクトによる多機能集積化半導体電極の開発と神経活動の多元的解読 査読有り

坂本一寛, 虫明元, 田中徹, 片山統裕, 小柳光正

BIO INDUSTRY　25　(12)　96-101　2008年12月

ISSN：0910-6545

LSI用光インターコネクションの技術動向と新展開 査読有り

田中徹

第17回フォトニックデバイス・応用技術報告書　25-42　2008年11月

Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy 査読有り

M. Murugesan, J. C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi

JOURNAL OF APPLIED PHYSICS　104　(7)　074316-1-074316-5　2008年10月

DOI： 10.1063/1.2973665 　

ISSN：0021-8979

Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride 査読有り

Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　93　(11)　2008年9月

DOI： 10.1063/1.2986409 　

ISSN：0003-6951

eISSN：1077-3118

Three-Dimensional Integration Technology Using Adhesive Injection Method and W/poly-Si TSV 査読有り

M.Koyanagi, T.Fukushima, T.Tanaka

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　31-44　2008年5月

Chip Self-Assembly Technique for 3D LSI Fabrication 査読有り

K.Kiyoyama, S.Kodama, D.Amano, T.Sugimura, F.Fukushima, T.Tanaka, M.Koyanagi

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　205-216　2008年5月

Study of Retinal Prosthesis with Three-Dimensionally Stacked LSI 査読有り

K.Sato, T.Fukushima, H.Tomiya, H.Kurino, T.Tanaka, M.Koyanagi

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　229-239　2008年5月

Tungsten through-silicon via technology for three-dimensional LSIs 査読有り

Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2801-2806　2008年4月

DOI： 10.1143/JJAP.47.2801 　

ISSN：0021-4922

Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate 査読有り

Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2936-2940　2008年4月

DOI： 10.1143/JJAP.47.29361 　

ISSN：0021-4922

eISSN：1347-4065

Electrical characterization of metal-oxide-semiconductor memory devices with high-density self-assembled tungsten nanodots 査読有り

Yan-Li Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2680-2683　2008年4月

DOI： 10.1143/JJAP.47.2680 　

ISSN：0021-4922

Power supply system using electromagnetic induction for three-dimensionally stacked retinal prosthesis chip 査読有り

Ken Komiya, Risato Kobayashi, Takafumi Kobayashi, Keigo Sato, Takafumi Fukushima, Hiroshi Tomita, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　3244-3247　2008年4月

DOI： 10.1143/JJAP.47.3244 　

ISSN：0021-4922

New reconfigurable memory architecture for parallel image-processing LSI with three-dimensional structure 査読有り

Shigeo Kodama, Daijirou Amano, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2774-2778　2008年4月

DOI： 10.1143/JJAP.47.2774 　

ISSN：0021-4922

3D System Integration Technology and 3D Systems 招待有り 査読有り

T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of Materials for Advanced Metallization Conference 2008 (MAM 2008)　37-38　2008年3月

Microbump Formation on Flexible Substrate using Imprint Technology for Integrated Nano-System with 3D-LSIs 査読有り

Yusuke Yamada, Hirokozu Kikuchi, T. Fukushima, T. Tanaka, M. Koyanagi

The 5th International Conference on Mechanical Science based on Nanotechnology　71-74　2008年3月

自己組織化ウェーハ張り合せによる三次元集積化技術 招待有り

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「多層配線」特集号　(99)　34-37　2008年2月8日

3-D integration technology for realizing super chip

Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi

2008 Proceedings - 25th International VLSI Multilevel Interconnection Conference, VMIC 2008　197-202　2008年

Deep trench etching for through-silicon vias in three-dimensional integration technology

Jun Liang, Hirokazu Kikuchi, Takayuki Konno, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2008-1　674-678　2008年

Three-Dimensional Super-Chip Integration Technology Using Self-Assembly Technique 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 IEEE SILICON NANOELECTRONICS WORKSHOP　23-24　2008年

Three-dimensional integration technology using self-assembly technique and super-chip integration 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE　10-12　2008年

ISSN：2380-632X

eISSN：2380-6338

New Three-Dimensional Integration Technology Using Reconfigured Wafers 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4　1180-1183　2008年

A Closed-loop Power Control Function for Bio-implantable devices 査読有り

Kouji Kiyoyama, Yoshito Tanaka, Mashahiro Onoda, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE　321-+　2008年

Electrical conductance properties for magnetic tunnel junctions with MgO barriers 査読有り

K. Tamanoi, M. Sato, M. Oogane, Y. Ando, T. Tanaka, Y. Uehara, T. Uzumaki

J. Magn. Magn. Mater.　320　2959-2962　2008年

DOI： 10.1016/j.jmmm.2008.08.004 　

Multichip self-assembly technique on flexible polymeric substrate 査読有り

T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS　1532-1537　2008年

DOI： 10.1109/ECTC.2008.4550179 　

ISSN：0569-5503

A Novel SPRAM (SPin-transfer torque RAM)-based Reconfigurable Logic Block for 3D-Stacked reconfigurable Spin Processor 査読有り

M. Sekikawa, K. Kiyoyama, H. Hasegawa, K. Miura, T. Fukushima, S. Ikeda, T. Tanaka, H. Ohno, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　935-+　2008年

DOI： 10.1109/IEDM.2008.4796645 　

New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method 査読有り

T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, A. Norki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　499-502　2008年

DOI： 10.1109/IEDM.2008.4796735 　

Development of Fully Implantable Retinal Prosthesis Module

T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

Proceedings of the 3rd Tohoku-NUS Joint Symposium on Nano-Biomedical Engineering in the East Asian-Pacific Rim Region　19-22　2007年12月

Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot 査読有り

Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　242-243　2007年9月

Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs 査読有り

H. Kikuchi, Y. Yamada, A. M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　482-483　2007年9月

Development of Power Supply System for Three-Dimensionally Stacked Retinal Prosthesis Chip 査読有り

K. Komiya, R. Kobayashi, T. Kobayashi, K. Sato, T. Fukushima, H. Tomita, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　658-689　2007年9月

Passive Optical Alignment with High Accuracy for Low-Loss Optical Interposer 査読有り

M. Fujiwara, S. Terada, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K.Takahama, T.Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007年9月

Investigation of FePt Nano-Dots Fabricated by Self-Assembled Nano-Dot Deposition Method Using X-ray Photoelectron Spectroscopy 査読有り

M. Murugesan, J. C. Bea, C.K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T.Fukushima, T. Tanaka, M. Miyao, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　1026-1027　2007年9月

New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure 査読有り

S. Kodama, D. Amano, T. Sugimura, T.Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　1067-1065　2007年9月

Fabrication of Magnetic Tunnel Junction with FePt Nanodots for Magnetic Nanodot Memory 査読有り

C.K. Yin, M. Murugesan, J.C. Bea, T.Fukushima, T. Tanaka, M. Koyanagi

The 6 th International Semiconductor Technology Conference (ISTC 2007)　418-422　2007年5月

Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap 査読有り

Takeaki Sugimura, Takeshi Sakaguchi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2226-2230　2007年4月

DOI： 10.1143/JJAP.46.2226 　

ISSN：0021-4922

Novel optical/electrical printed circuit board with polynorbornene optical waveguide 査読有り

Makoto Fujiwara, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2395-2400　2007年4月

DOI： 10.1143/JJAP.46.23951 　

ISSN：0021-4922

New magnetic nanodot memory with FePt nanodots 査読有り

Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Mikihiko Oogane, Takafumi Fukushima, Tetsu Tanaka, Shozo Kono, Seiji Samukawa, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2167-2171　2007年4月

DOI： 10.1143/JJAP.46.2167 　

ISSN：0021-4922

Evaluation of platinum-black stimulus electrode array for electrical stimulation of retinal cells in retinal prosthesis system 査読有り

Taiichiro Watanabe, Risato Kobayashi, Ken Komiya, Takafumi Fukushima, Hiroshi Tomita, Eriko Sugano, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2785-2791　2007年4月

DOI： 10.1143/JJAP.46.2785 　

ISSN：0021-4922

Highly Parallel Processing SystemUsing 3-Dimensional LSI 招待有り

T. Tanaka, T. Fukushima, M. Koyanagi

International 3D-System Integration Conference 2007　2007年3月

New three-dimensional integration technology to achieve a super chip 査読有り

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings　318-321　2007年

DOI： 10.1109/ICSICT.2006.306217 　

A passive telemetry interface system with closed-loop power control function for body-implanted applications 査読有り

Koji Kiyoyama, Yoshito Tanaka, Masahiro Onoda, Tetsu Tanaka, Mitsumasa Koyanagi

2007 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE　37-+　2007年

Self-assembly process for chip-to-wafer three-dimensional integration 査読有り

T. Fulcushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS　836-+　2007年

DOI： 10.1109/ECTC.2007.373895 　

ISSN：0569-5503

Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method 査読有り

C. K. Yin, H. Choi, J. C. Bea, M. Murugesan, J. H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi

2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings　4　401-404　2007年

Evaluation of Electrical Stimulus Current Applied to Retinal Cells for Retinal Prosthesis

T. Watanabe, K. Motonami, T. Fukushima, H. Kurino, T. Tanaka, M. Koyanag

Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　585-600　2007年1月

Development of Low Power 3D Integration Technology using SOI Wafer for Retinal Prosthesis Chip

Y. Yamada, J. Deguchi, T. Watanabe, T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　613-622　2007年1月

New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique 査読有り

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2　985-988　2007年

DOI： 10.1109/IEDM.2007.4419119 　

ISSN：2380-9248

High performance polynorbornene optical waveguide for Opto-Electric interconnections 査読有り

M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007　193-+　2007年

DOI： 10.1109/POLYTR.2007.4339166 　

Fully implantable retinal prosthesis chip with photodetector and stimulus current generator 査読有り

T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Watanabe, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2　1015-+　2007年

DOI： 10.1109/IEDM.2007.4419127 　

Novel Retinal Prosthesis with Three-dimensionally Stacked LSI and Evaluation of Electrically Evoked Potential

T. Tanaka, T. Watanabe, H. Kikuchi, J. Deguchi, K. Motonami, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

Proceedings of the 8th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　33-36　2006年12月

Three-dimensional integration technology based on wafer bonding with vertical buried interconnections 査読有り

Mitsumasa Koyanagi, Tomonori Nakamura, Yuusuke Yamada, Hirokazu Kikuchi, Takafumi Fukushima, Tetsu Tanaka, Hiroyuki Kurino

IEEE TRANSACTIONS ON ELECTRON DEVICES　53　(11)　2799-2808　2006年11月

DOI： 10.1109/TED.2006.884079 　

ISSN：0018-9383

eISSN：1557-9646

Super-Chip Integration Based on Chip-to-Wafer 3D Integration Technology 招待有り

T.Tanaka, T.Fukushima, M.Koyanagi

The 5th International Symposium on Microelectronics and Packaging　2006年10月

Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration 査読有り

H. Kikuchi, Y. Yamada, A. M. Ali, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　490-491　2006年9月

Low Power Spin-Transfer MRAM Writing Scheme with Selective World Line Bootstrap 査読有り

T. Sugimura, T. Sakaguchi, D. Amano, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　602-603　2006年9月

Novel Opto-Electro Printed Circuit Board with Polynorbornene Optical Waveguide 査読有り

M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　840-841　2006年9月

Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis by Using Platinum-Black (Pt-b) Stimulus Electrode Array 査読有り

T. Watanabe, K. Komiya, T. Kobayashi, R. Kobayashi, T. Fukushima, H. Tomita, E. Sugano, M. Sato, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　890-891　2006年9月

Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem 査読有り

R. Kobayashi, T. Watanabe, K. Komiya, T. Fukushima, K. Sakamoto, H. Kurino, T. Tanaka, N. Katayama, H. Mushiake, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　898-899　2006年9月

New Magnetic Nano-Dot Memory with FePt Nano-Dots 査読有り

C. K. Yin, J. C. Bea, M. Murugesan, M. Oogane, T. Fukushima, T. Tanaka, K. Natori, M. Miyao, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　994-995　2006年9月

Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method 査読有り

C. K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi, J. C. Bea, H. Choi, M. Nishijima, M. Miyao

APPLIED PHYSICS LETTERS　89　(6)　063109-1-063109-3　2006年8月

DOI： 10.1063/1.2335588 　

ISSN：0003-6951

A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory 査読有り

E Yoshida, T Tanaka

IEEE TRANSACTIONS ON ELECTRON DEVICES　53　(4)　692-697　2006年4月

DOI： 10.1109/TED.870283 　

ISSN：0018-9383

Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology 査読有り

T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi

Proceedings of International Conference on Electronics Packaging　220-224　2006年4月

Semiconductor-on-Low-K Substrate Technology

Tetsu Tanaka, Yusuke Yamada, Mungi Park, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2006-03　297-301　2006年

New non-volatile memory with magnetic nano-dots

Mitsumasa Koyanagi, J. C. Bea, C. K. Yin, Takafumi Fukushima, Tetsu Tanaka

ECS Transactions　2　(1)　209-215　2006年

ISSN：1938-5862 1938-6737

Research and development of transistor structure in nano-scale region 査読有り

M. Koyanagi, Y. Yamada, M. Park, T. Fukushima, T. Tanaka

2006 INTERNATIONAL WORKSHOP ON NANO CMOS, PROCEEDINGS　34-37　2006年

Development of new three-dimensional integration technology for retinal prosthesis 査読有り

Yusuke Yamada, Jun Deguchi, Taiichiro Watanabe, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　613-+　2006年

DOI： 10.1142/9781860948800_0067 　

Novel retinal prosthesis system with three dimensionally stacked LSI chip 査読有り

T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE　327-+　2006年

DOI： 10.1109/ESSDER.2006.307704 　

ISSN：1930-8876

Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips

Hircrazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　385-+　2006年

Biologically inspired vision chip fabricated using 3-dimensional integration technology

Hiroyuki Kurino, Yoshihiro Nakagawa, Tomonori Nakamura, Yusuke Yamada, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　261-+　2006年

Development of low-power retinal prosthesis with photodetectors and stimulus current generators

Taiichiro Watanabe, Jun Deguchi, Takafumi Fukushinia, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　321-+　2006年

Neuromorphic analog circuits for three-dimensionally stacked vision chip

Jun Liang, Yoshihiro Nakagawa, Jun Deguchi, Jeoung-Chill Shim, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　455-+　2006年

New Transistor Structure for Nano-Scale Range 招待有り

T.Tanaka, M.Park, H.Oh, Y.Yamada, H.Choi, T.Fukushima, M.Koyanagi

10th Photonics and Semiconductor Device Reliability Workshop　2005年12月1日

A study of highly scalable DG-FinDRAM 査読有り

E Yoshida, Miyashita, I, T Tanaka

IEEE ELECTRON DEVICE LETTERS　26　(9)　655-657　2005年9月

DOI： 10.1109/LED.2005.853666 　

ISSN：0741-3106

45-nm node CMOS integration with a novel STI structure and full-NCS/Cu interlayers for low-operation-power (LOP) applications 査読有り

M Okuno, K Okabe, T Sakuma, K Suzuki, T Miyashita, T Yao, H Morioka, M Terahara, Y Kojima, H Watatani, K Sugimoto, T Watanabe, Y Hayami, T Mon, T Kubo, Y Iba, Sugiura, I, H Fukutome, Y Morisaki, H Minakata, K Ikeda, S Kishii, N Shimizu, T Tanaka, S Asai, M Nakaishi, S Fukuyama, A Tsukune, M Yamabe, Hanyuu, I, M Miyajima, M Kase, K Watanabe, S Satoh, T Sugii

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST　57-60　2005年

Scalability study on a capacitorless 1T-DRAM: From single-gate PD-SOI to double-gate FinDRAM 招待有り 査読有り

T Tanaka, E Yoshida, T Miyashita

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST　919-922　2004年

Highly reliable dynamic random access memory technology for application specific memory with dual nitrogen concentration gate oxynitrides using selective nitrogen implantation 査読有り

T Sugizaki, A Murakoshi, R Katsumata, M Kojima, T Tanaka, T Nakanishi, Y Nara

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS　42　(4B)　1870-1873　2003年4月

DOI： 10.1143/JJAP.42.1870 　

ISSN：0021-4922

Process and device technologies for high-performance 0.13 mu m FCRAM 査読有り

Y Nara, S Nakamura, T Tanaka, K Hashimoto, D Matsunaga

FUJITSU SCIENTIFIC & TECHNICAL JOURNAL　39　(1)　62-71　2003年

ISSN：0016-2523

A design of a capacitorless 1T-DRAM cell using gate-induced drain leakage (GIDL) current for low-power and high-speed embedded memory 査読有り

E Yoshida, T Tanaka

2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST　913-916　2003年

A 65 nm CMOS technology with a high-performance and low-leakage transistor, a 0.55 mu m(2) 6T-SRAM cell and robust hybrid-ULK/Cu interconnects for mobile multimedia applications 査読有り

S Nakai, M Kojima, N Misawa, M Miyajima, S Asai, S Inagaki, Y Iba, T Ohba, M Kase, H Kitada, S Satoh, N Shimizu, Sugiura, I, F Sugimoto, Y Setta, T Tanaka, N Tamura, M Nakaishi, Y Nakata, J Nakahira, N Nishikawa, A Hasegawa, S Fukuyama, K Fujita, K Hosaka, N Horiguchi, H Matsuyama, T Minami, M Minamizawa, H Morioka, E Yano, A Yamaguchi, K Watanabe, T Nakamura, T Sugii

2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST　285-288　2003年

Suppression of SiN-induced boron penetration by using SiH-free silicon nitride films formed by tetrachlorosilane and ammonia 査読有り

M Tanaka, S Saida, Mizushima, I, F Inoue, M Kojima, T Tanaka, T Nakanishi, K Suguro, Y Tsunashima

IEEE TRANSACTIONS ON ELECTRON DEVICES　49　(9)　1526-1531　2002年9月

DOI： 10.1109/TED.2002.802630 　

ISSN：0018-9383

Impact of Thermal Budget Reduction on MOSFET Performance to Achieve High-speed and High-density DRAM-based System LSI 査読有り

E. Yoshida, T. Miyashita, H. Nitta, M. Tanaka, K. Ishii, Y. Akasaka, P. H. Chou, K. Hashimoto, Y. Kohyama, T. Tanaka, Y. Nara

Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials　732-733　2002年9月

Highly Reliable DRAM Technology for ASM with Dual Nitrogen Concentration Gate Oxynitrides using Selective Nitrogen Implantation 査読有り

T. Sugizaki, A. Murakoshi, T. Tanaka, R. Katsumata, T. Nakanishi, Y. Nara

Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials　736-737　2002年9月

Realization of 0.1 um buried-channel PMOSFETs by device restructuring using tilted well implantation technology 査読有り

T. Tanaka, Y. Momiyama, K. Goto, Y. Sambonsugi, M. Deura, T. Sugii

Symposium on VLSI Technology, Digest of Technical Papers　109-110　1999年6月

High frequency characteristics of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage 査読有り

T Tanaka, Y Momiyama, T Sugii

IEICE TRANSACTIONS ON ELECTRONICS　E82C　(3)　538-543　1999年3月

ISSN：0916-8524

eISSN：1745-1353

Ultra low energy boron implantation using cluster ions for decananometer MOSFETs 査読有り

T Sugii, K Goto, T Tanaka, J Matsuo, Yamada, I

APPLICATION OF ACCELERATORS IN RESEARCH AND INDUSTRY, PTS 1 AND 2　475　383-386　1999年

ISSN：0094-243X

Channel engineering using B10H14 ion implantation for low Vth and high SCE immunity of buried-channel PMOSFETs in 4-Gbit DRAMs and beyond 査読有り

T. Tanaka, H. Ogawa, K. Goto, K. Itabashi, T. Yamazaki, J. Matsuo, T. Sugii, I. Yamada

Symposium on VLSI Technology, Digest of Technical Papers　88-89　1998年6月

A study of ultra shallow junction and tilted channel implantation for high performance 0.1 mu m pMOSFETs 査読有り

K Goto, M Kase, K Momiyama, H Kurata, T Tanaka, M Deura, Y Sanbonsugi, T Sugii

INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST　631-634　1998年

Fmax enhancement of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage 査読有り

T Tanaka, Y Momiyama, T Sugii

INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST　423-426　1997年

A high performance 50nm PMOSFET using decaborane (B10H14) ion implantation and 2-step activation annealing process 査読有り

K Goto, J Matsuo, Y Tada, T Tanaka, Y Momiyama, T Sugii, Yamada, I

INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST　471-474　1997年

A comparative study of advanced MOSFET concepts 査読有り

CH Wann, K Noda, T Tanaka, M Yoshida, CM Hu

IEEE TRANSACTIONS ON ELECTRON DEVICES　43　(10)　1742-1753　1996年10月

DOI： 10.1109/16.536820 　

ISSN：0018-9383

eISSN：1557-9646

New Method of Extracting Inversion Layer Thickness and Charge Profile and Its Impact on Scaled MOSFETs 査読有り

T. Tanaka, T. Sugii, C. Hu

Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials　10-12　1996年8月

Advanced SOI devices using CMP and wafer bonding 査読有り

H. Horie, S. Nakamura, Y. Nara, K. Suzuki, T. Tanaka, A. Ito, Y. Arimoto, N. Sasaki

Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials　1996　473-475　1996年8月

A comparative study of advanced MOSFET structures 査読有り

CH Wann, R Tu, B Yu, CM Hu, K Noda, T Tanaka, M Yoshida, K Hui

1996 SYMPOSIUM ON VLSI TECHNOLOGY　32-33　1996年

HIGH-SPEED AND LOW-POWER N(+)-P(+) DOUBLE-GATE SOI CMOS 査読有り

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, T SUGII

IEICE TRANSACTIONS ON ELECTRONICS　E78C　(4)　360-367　1995年4月

ISSN：0916-8524

eISSN：1745-1353

15ps cryogenic operation of 0.19-mu m-L(G)n+-p+ double-gate SOI CMOS 査読有り

T Sugii, T Tanaka, H Horie, K Suzuki

MICROELECTRONIC DEVICE AND MULTILEVEL INTERCONNECTION TECHNOLOGY　2636　74-82　1995年

ULTRAFAST OPERATION OF 5TH-ADJUSTED P(+)-N(+) DOUBLE-GATE SOI MOSFETS 査読有り

T TANAKA, K SUZUKI, H HORIE, T SUGII

IEEE ELECTRON DEVICE LETTERS　15　(10)　386-388　1994年10月

DOI： 10.1109/55.320976 　

ISSN：0741-3106

SOURCE DRAIN CONTACT RESISTANCE OF SILICIDED THIN-FILM SOI MOSFETS 査読有り

K SUZUKI, T TANAKA, Y TOSAKA, T SUGII, S ANDOH

IEEE TRANSACTIONS ON ELECTRON DEVICES　41　(6)　1007-1012　1994年6月

DOI： 10.1109/16.293314 　

ISSN：0018-9383

eISSN：1557-9646

Predicted Propagation Delay Time of Double-Gate SOI MOSFETs Based on a Scaling Theory 査読有り

K. Suzuki, Y. Tosaka, T. Tanaka, T. Sugii

International Conference on Advanced Microelectronic Device and Processing　599-602　1994年3月

ANALYTICAL SURFACE-POTENTIAL EXPRESSION FOR THIN-FILM DOUBLE-GATE SOI MOSFETS 査読有り

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO, T ITOH

SOLID-STATE ELECTRONICS　37　(2)　327-332　1994年2月

DOI： 10.1016/0038-1101(94)90085-X 　

ISSN：0038-1101

eISSN：1879-2405

ULTRAFAST LOW-POWER OPERATION OF P+-N+ DOUBLE-GATE SOI MOSFETS 査読有り

T TANAKA, K SUZUKI, H HORIE, T SUGII

1994 SYMPOSIUM ON VLSI TECHNOLOGY　11-13　1994年

SCALING THEORY FOR DOUBLE-GATE SOI MOSFETS 査読有り

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO

IEEE TRANSACTIONS ON ELECTRON DEVICES　40　(12)　2326-2329　1993年12月

DOI： 10.1109/16.249482 　

ISSN：0018-9383

eISSN：1557-9646

ANALYTICAL MODELS FOR SYMMETRICAL THIN-FILM DOUBLE-GATE SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR-FIELD-EFFECT-TRANSISTORS 査読有り

K SUZUKI, S SATOH, T TANAKA, S ANDO

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　32　(11A)　4916-4922　1993年11月

ISSN：0021-4922

2.Analytical Surface Potential Expression For Double-gate SOI MOSFETs 査読有り

K. Suzuki, T. Tanaka, H. Horie, Y. Arimoto, T. Itoh

International Workshop on VLSI Process and Device Modeling Technical Digest　150-151　1993年5月

Fabrication of double-gate thin-film SOI MOSFETs using wafer bonding and polishing 査読有り

H. Horie, S. Ando, T. Tanaka, M. Imai, Y. Arimoto, S. Hijiya

Extended Abstracts of the 1991 International Conference on Solid State Devices　165-167　1991年8月

P+ polysilicon gate P-MOSFETs using BCl implantation 査読有り

K. Oikawa, S. Ando, N. Ando, H. Horie, Y. Toda, T. Tanaka, S. Hijiya

Technical Digest - International Electron Devices Meeting, IEDM　1991-　79-82　1991年

DOI： 10.1109/IEDM.1991.235419 　

ISSN：0163-1918

Analysis of p+ poly Si double-gate thin-film SOI MOSFETs 査読有り

Tetsu Tanaka, Hirpshi Horie, Satmhi Ando, Shinpei Hijiya

Technical Digest - International Electron Devices Meeting, IEDM　1991-　683-686　1991年

DOI： 10.1109/IEDM.1991.235330 　

ISSN：0163-1918

U-GROOVED SIT CMOS TECHNOLOGY WITH 3 FJ AND 49 PS (7 MW, 350 FJ) OPERATION 査読有り

J NISHIZAWA, N TAKEDA, S SUZUKI, T SUZUKI, T TANAKA

IEEE TRANSACTIONS ON ELECTRON DEVICES　37　(8)　1877-1883　1990年8月

DOI： 10.1109/16.57139 　

ISSN：0018-9383

eISSN：1557-9646