-
Development of tentacle-shaped bone marrow neural probe enabling ultra-low invasive and high electrode density recording
International-journal
Peer-reviewed
Naoki Iwanuma, Kazushi Tsuji, Shutaro Oba, Keigo Kitta, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 65 (3) 03SP29-03SP29 2026/02/13
Publisher:
IOP Publishing
DOI：
10.35848/1347-4065/ae396b
ISSN：
0021-4922
eISSN：
1347-4065
-
Development of Ultra-Low Power Ultra-Low Frequency Oscillator Using GIDL Current for Edge AI Devices for Long-Term and Intermittent Monitoring
International-journal
Peer-reviewed
Bang Du, Kohei Nakamura, Beiyutong Huang, Aoi Kataura, Ryo Hasegawa, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Electronics and Communications in Japan 108 (2) e12492 2025/05
Publisher:
Wiley
DOI：
10.1002/ecj.12492
ISSN：
1942-9533
eISSN：
1942-9541
-
Fabrication and evaluation of Wrap Around Neural-Pass to record and stimulate neural activity in the cervical spinal cord
Kazushi Tsuji, Atsuhiko Ninomiya, Naoki Iwanuma, Chenxi Qiu, Shutaro Oba, Hisashi Kino, Takafumi Fukushima, Norihiro Katayama, Kuniyasu Niizuma, Hidenori Endo, Tetsu Tanaka
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers 63 (12) 2024/12/02
DOI：
10.35848/1347-4065/ad9a6f
ISSN：
0021-4922
eISSN：
1347-4065
-
Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
Peer-reviewed
Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Mariappan Murugesan, Tetsu Tanaka, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 1 1335-1341 2024/05/28
Publisher:
IEEE
DOI：
10.1109/ectc51529.2024.00217
-
D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations
Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada, Mariappan Murugesan, Hiryuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 60 420-426 2024/05/28
Publisher:
IEEE
DOI：
10.1109/ectc51529.2024.00074
-
Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly
Atsushi Shinoda, Chang Liu, Akihiro Tominaga, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 849-854 2024/05/28
Publisher:
IEEE
DOI：
10.1109/ectc51529.2024.00136
-
Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics
Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Japanese Journal of Applied Physics 63 (4) 04SP74-04SP74 2024/04/01
Publisher:
IOP Publishing
DOI：
10.35848/1347-4065/ad375f
ISSN：
0021-4922
eISSN：
1347-4065
-
FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach
Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE CPMT Symposium Japan (ICSJ) 45-48 2023/11/15
Publisher:
IEEE
DOI：
10.1109/icsj59341.2023.10339614
-
FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display
Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE CPMT Symposium Japan (ICSJ) 49-52 2023/11/15
Publisher:
IEEE
DOI：
10.1109/icsj59341.2023.10339585
-
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction
Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS) 1-4 2023/10/19
Publisher:
IEEE
DOI：
10.1109/biocas58349.2023.10389082
-
High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials 2023/09/08
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2023.g-5-02
-
An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System
Yaogan Liang, Kohei Nakamura, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
ELECTRONICS 12 (13) 2023/07
DOI：
10.3390/electronics12132836
ISSN：
2079-9292
-
An Electronic Microsaccade Circuit with Charge-Balanced Stimulation and Flicker Vision Prevention for an Artificial Eyeball System
Yaogan Liang, Kohei Nakamura, Bang Du, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Electronics 12 2836 2023/06/27
Publisher:
MDPI AG
DOI：
10.3390/electronics12132836
eISSN：
2079-9292
-
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last
Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima
2023 IEEE International 3D Systems Integration Conference (3DIC) 499 1-4 2023/05/10
Publisher:
IEEE
DOI：
10.1109/3dic57175.2023.10154930
-
Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging
Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 25 596-600 2023/05
Publisher:
IEEE
DOI：
10.1109/ectc51909.2023.00105
-
Gapless Chip-in-Carrier Integration and Injectable Ag/AgCl-Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor
Invited
Peer-reviewed
Hiromichi Wakebe, Yuki Susumago, Takafumi Fukushima, Tetsu Tanaka
IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING 18 (3) 477-487 2023/03
DOI：
10.1002/tee.23744
-
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration
Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
IEICE Electronics Express 19 (23) 20220363-20220363 2022/12/10
Publisher:
Institute of Electronics, Information and Communications Engineers (IEICE)
DOI：
10.1587/elex.19.20220363
eISSN：
1349-2543
-
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip
Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2022 IEEE Biomedical Circuits and Systems Conference (BioCAS) 519-523 2022/10/13
Publisher:
IEEE
DOI：
10.1109/biocas54905.2022.9948542
-
Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display
Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022/09/29
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.e-7-02
-
Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration
Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022/09/28
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-4-02
-
Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip
Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022/09/27
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.d-1-03
-
Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022/09/27
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-1-01
-
Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis
Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials 2022/09/27
Publisher:
The Japan Society of Applied Physics
DOI：
10.7567/ssdm.2022.k-1-03
-
Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics
Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Journal of Vacuum Science & Technology B 40 (5) 052202-052202 2022/09
Publisher:
American Vacuum Society
DOI：
10.1116/6.0001836
ISSN：
2166-2746
eISSN：
2166-2754
-
Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2022 IEEE International Interconnect Technology Conference (IITC) 2022/06/27
Publisher:
IEEE
DOI：
10.1109/iitc52079.2022.9881288
-
Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor
Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka
Electronics and Communications in Japan 105 (2) 2022/06
Publisher:
Wiley
DOI：
10.1002/ecj.12343
ISSN：
1942-9533
eISSN：
1942-9541
-
Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs
Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022/05
Publisher:
IEEE
DOI：
10.1109/ectc51906.2022.00225
-
Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Applied Physics Express 15 (11) 111004-1-111004-5 2022/04
DOI：
10.35848/1882-0786/ac9d24
-
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System
Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2021 IEEE Biomedical Circuits and Systems Conference (BioCAS) 2021/10/07
Publisher:
IEEE
DOI：
10.1109/biocas49922.2021.9645034
-
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing
Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan
2021 IEEE International 3D Systems Integration Conference (3DIC) 2021/10
Publisher:
IEEE
DOI：
10.1109/3dic52383.2021.9687601
-
High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Applied Physics Express 14 (9) 2021/09
DOI：
10.35848/1882-0786/ac18b0
ISSN：
1882-0778
eISSN：
1882-0786
-
Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics
Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2021 IEEE International Interconnect Technology Conference, IITC 2021 2021/07/06
DOI：
10.1109/IITC51362.2021.9537540
-
Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2021 IEEE International Interconnect Technology Conference, IITC 2021 2021/07/06
DOI：
10.1109/IITC51362.2021.9537336
-
Direct fabrication of SU-8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor
Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka
IEEJ Transactions on Sensors and Micromachines 141 (10) 327-335 2021
Publisher:
Institute of Electrical Engineers of Japan
DOI：
10.1541/IEEJSMAS.141.327
ISSN：
1347-5525 1341-8939
-
Multimodal Functional Analysis Platform: 1. Ultrathin Fluorescence Endoscope Imaging System Enables Flexible Functional Brain Imaging
Makoto Osanai, Hideki Miwa, Atsushi Tamura, Satomi Kikuta, Yoshio Iguchi, Yuchio Yanagawa, Kazuto Kobayashi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake
Advances in Experimental Medicine and Biology 471-479 2021
Publisher:
Springer Singapore
DOI：
10.1007/978-981-15-8763-4_31
ISSN：
0065-2598
eISSN：
2214-8019
-
Multimodal Functional Analysis Platform: 2. Development of Si Opto-Electro Multifunctional Neural Probe with Multiple Optical Waveguides and Embedded Optical Fiber for Optogenetics.
International-journal
Tetsu Tanaka, Norihiro Katayama, Kazuhiro Sakamoto, Makoto Osanai, Hajime Mushiake
Advances in experimental medicine and biology 1293 481-491 2021
DOI：
10.1007/978-981-15-8763-4_32
-
Multimodal Functional Analysis Platform: 3. Spherical Treadmill System for Small Animals.
International-journal
Norihiro Katayama, Mitsuyuki Nakao, Tetsu Tanaka, Makoto Osanai, Hajime Mushiake
Advances in experimental medicine and biology 1293 493-500 2021
DOI：
10.1007/978-981-15-8763-4_33
-
Multimodal Functional Analysis Platform: 4. Optogenetics-Induced Oscillatory Activation to Explore Neural Circuits.
International-journal
Hajime Mushiake, Tomokazu Ohshiro, Shin-Ichiro Osawa, Ryosuke Hosaka, Norihiro Katayama, Tetsu Tanaka, Hiromu Yawo, Makoto Osanai
Advances in experimental medicine and biology 1293 501-509 2021
DOI：
10.1007/978-981-15-8763-4_34
-
On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO<inf>2</inf>
Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
Journal of Polymer Science 58 (16) 2248-2258 2020/08/15
DOI：
10.1002/pol.20200094
ISSN：
2642-4150
eISSN：
2642-4169
-
Significant Die-Shift Reduction and μlED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics
Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 (8) 1419-1422 2020/08
DOI：
10.1109/TCPMT.2020.3009640
ISSN：
2156-3950
eISSN：
2156-3985
-
Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion
Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Proceedings - Electronic Components and Technology Conference 2020-June 1199-1204 2020/06
DOI：
10.1109/ECTC32862.2020.00192
ISSN：
0569-5503
-
RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Proceedings - Electronic Components and Technology Conference 2020-June 811-816 2020/06
DOI：
10.1109/ECTC32862.2020.00132
ISSN：
0569-5503
-
7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration
Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Proceedings - Electronic Components and Technology Conference 2020-June 1453-1458 2020/06
DOI：
10.1109/ECTC32862.2020.00230
ISSN：
0569-5503
-
Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) 2020/04
Publisher:
IEEE
DOI：
10.1109/edtm47692.2020.9118027
-
Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory
Peer-reviewed
Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
Japanese Journal of Applied Physics 59 (SG) 2020/04
DOI：
10.35848/1347-4065/ab6867
ISSN：
0021-4922
eISSN：
1347-4065
-
Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
Peer-reviewed
Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 59 (SB) 2020/02/01
DOI：
10.7567/1347-4065/ab4f3c
ISSN：
0021-4922
eISSN：
1347-4065
-
Generation of STDP with non-volatile tunnel-FET memory for large-scale and low-power spiking neural networks
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE Journal of the Electron Devices Society 8 1266-1271 2020
DOI：
10.1109/JEDS.2020.3025336
eISSN：
2168-6734
-
PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System
Peer-reviewed
Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama
BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings 2019/10
DOI：
10.1109/BIOCAS.2019.8919027
-
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation
Peer-reviewed
Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI：
10.1109/3DIC48104.2019.9058843
-
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing
Peer-reviewed
Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI：
10.1109/3DIC48104.2019.9058856
-
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs
Peer-reviewed
Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI：
10.1109/3DIC48104.2019.9058841
-
Development of 3D-IC Embedded Flexible Hybrid System
Peer-reviewed
Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI：
10.1109/3DIC48104.2019.9058880
-
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI：
10.1109/3DIC48104.2019.9058838
-
Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application
Peer-reviewed
Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Proceedings - Electronic Components and Technology Conference 2019-May 264-269 2019/05
DOI：
10.1109/ECTC.2019.00046
ISSN：
0569-5503
-
Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
Peer-reviewed
Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 17 2019/05
DOI：
10.23919/LTB-3D.2019.8735115
-
Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
Peer-reviewed
Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 International Conference on Electronics Packaging, ICEP 2019 265-267 2019/04
DOI：
10.23919/ICEP.2019.8733416
-
Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate
Peer-reviewed
Young Taek Oh, Jae Min Sim, Nguyen Van Toan, Hisashi Kino, Takahito Ono, Tetsu Tanaka, Yun Heub Song
IEEE Transactions on Electron Devices 66 (4) 1741-1746 2019/04
DOI：
10.1109/TED.2019.2900155
ISSN：
0018-9383
-
Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 222-224 2019/03
DOI：
10.1109/EDTM.2019.8731161
-
High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs
Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1) 181-188 2019/01
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
DOI：
10.1109/tcpmt.2018.2871764
ISSN：
2156-3950
eISSN：
2156-3985
-
Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application
Peer-reviewed
Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019) 265-267 2019
-
Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter
Peer-reviewed
Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE ELECTRON DEVICE LETTERS 40 (1) 95-98 2019/01
DOI：
10.1109/LED.2018.2884452
ISSN：
0741-3106
eISSN：
1558-0563
-
Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter
Peer-reviewed
Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE Electron Device Letters 40 (1) 95-98 2019/01
DOI：
10.1109/LED.2018.2884452
ISSN：
0741-3106
-
The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS
Peer-reviewed
Young Taek Oh, Jae Min Sim, Hisashi Kino, Deok Kee Kim, Tetsu Tanaka, Yun Heub Song
IEEE Journal of the Electron Devices Society 7 382-387 2019
DOI：
10.1109/JEDS.2019.2901298
eISSN：
2168-6734
-
Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC
Peer-reviewed
Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
IEEE Journal of the Electron Devices Society 7 1225-1231 2019
DOI：
10.1109/JEDS.2019.2936180
eISSN：
2168-6734
-
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips
Peer-reviewed
Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka
2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings 2018/12/20
DOI：
10.1109/BIOCAS.2018.8584776
-
Process Integration for FlexTrate TM
Peer-reviewed
Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer
2018 International Flexible Electronics Technology Conference, IFETC 2018 2018/12/19
DOI：
10.1109/IFETC.2018.8584029
-
The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures
Peer-reviewed
Young Taek Oh, Il Pyo Roh, Hisashi Kino, Tetsu Tanaka, Yun Heub Song
IEEE Transactions on Electron Devices 65 (10) 4313-4319 2018/10
DOI：
10.1109/TED.2018.2865007
ISSN：
0018-9383
-
Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs
Peer-reviewed
Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka
2018 IEEE International Interconnect Technology Conference, IITC 2018 135-137 2018/08/08
DOI：
10.1109/IITC.2018.8430390
-
TSV liner dielectric technology with spin-on low-k polymer
Peer-reviewed
S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 346-349 2018/06/06
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.23919/ICEP.2018.8374320
-
Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system
Peer-reviewed
Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Japanese Journal of Applied Physics 57 (4) 2018/04/01
Publisher:
Japan Society of Applied Physics
DOI：
10.7567/JJAP.57.04FM11
ISSN：
1347-4065 0021-4922
-
Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 57 (4) 2018/04/01
Publisher:
Japan Society of Applied Physics
DOI：
10.7567/JJAP.57.04FE07
ISSN：
1347-4065 0021-4922
-
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current
Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings 2018- 1-4 2018/03/23
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/BIOCAS.2017.8325165
-
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip
Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings 2018- 1-4 2018/03/23
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/BIOCAS.2017.8325552
-
マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発
Peer-reviewed
菅原 陽平, 木野 久志, 福島 誉史, 田中 徹
電子情報通信学会論文誌 C J101-C (2) 58-65 2018/02/01
ISSN：
1881-0217
-
Self-Assembly Technologies for FlexTrate (TM)
Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) 1836-1841 2018
DOI：
10.1109/ECTC.2018.00275
ISSN：
0569-5503
eISSN：
2377-5726
-
Study of Al-doped ZnO transparent stimulus electrode for fully implantable retinal prosthesis with three-dimensionally stacked retinal prosthesis chip
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Sensors and Materials 30 (2) 225-234 2018
Publisher:
M Y U Scientific Publishing Division
DOI：
10.18494/SAM.2018.1741
ISSN：
0914-4935
-
Development of Biosignal Recording Board System with Agile Control of Circuit Characteristics for Various Biosignals
Peer-reviewed
Keita Ito, Takaharu Tani, Takuma Iwagami, Satoru Nishino, Koji Kiyoyama, Tetsu Tanaka
ELECTRONICS AND COMMUNICATIONS IN JAPAN 101 (1) 47-54 2018/01
DOI：
10.1002/ecj.12021
ISSN：
1942-9533
eISSN：
1942-9541
-
Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration
Peer-reviewed
Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 64 (12) 5065-5072 2017/12
DOI：
10.1109/TED.2017.2767598
ISSN：
0018-9383
eISSN：
1557-9646
-
Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Proceedings - Electronic Components and Technology Conference 1523-1528 2017/08/01
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ECTC.2017.209
ISSN：
0569-5503
-
New concept of TSV formation methodology using Directed Self-Assembly (DSA)
Peer-reviewed
Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017/07/05
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC.2016.7970022
-
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications
Peer-reviewed
Kangwook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi
2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017/07/05
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC.2016.7970027
-
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017/07/05
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC.2016.7970031
-
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology
Peer-reviewed
Murugesan Mariappan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi
2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 2017/07/05
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/3DIC.2016.7970017
-
Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission
Peer-reviewed
Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka
IITC 2017 - 2017 IEEE International Interconnect Technology Conference 2017/07/05
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/IITC-AMC.2017.7968936
-
3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration
Peer-reviewed
Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 64 (7) 2912-2918 2017/07
DOI：
10.1109/TED.2017.2705562
ISSN：
0018-9383
eISSN：
1557-9646
-
3D-IC technology and reliability challenges
Peer-reviewed
Tetsu Tanaka
17th International Workshop on Junction Technology, IWJT 2017 51-53 2017/06/30
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.23919/IWJT.2017.7966513
-
Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces
Peer-reviewed
Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Japanese Journal of Applied Physics 56 (4) 04CM04-1-04CM04-4 2017/04/01
Publisher:
Japan Society of Applied Physics
DOI：
10.7567/JJAP.56.04CM04
ISSN：
1347-4065 0021-4922
-
Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties
Peer-reviewed
Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka
Japanese Journal of Applied Physics 56 (4) 04CM05-1-04CM05-5 2017/04/01
Publisher:
Japan Society of Applied Physics
DOI：
10.7567/JJAP.56.04CM05
ISSN：
1347-4065 0021-4922
-
Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber
Peer-reviewed
Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 56 (4) 04CM08-1-04CM08-4 2017/04
DOI：
10.7567/JJAP.56.04CM08
ISSN：
0021-4922
eISSN：
1347-4065
-
Development of Integrated Photoplethysmography Sensor System for Trans-Nail Pulse-Rate Monitoring
Peer-reviewed
Qian Zhengyang, Takezawa Yoshiki, Shimokawa Kenji, Ito Keita, Nishino Satoru, Kiyoyama Koji, Tanaka Tetsu
Transactions of Japanese Society for Medical and Biological Engineering 55 (5) 464-464 2017
Publisher:
Japanese Society for Medical and Biological Engineering
DOI：
10.11239/jsmbe.55Annual.464
-
Development of biosignal recording board system with agile control of circuit characteristics for various biosignals
Peer-reviewed
Keita Ito, Takaharu Tani, Takuma Iwagami, Satoru Nishino, Koji Kiyoyama, Tetsu Tanaka
IEEJ Transactions on Electronics, Information and Systems 137 (2) 348-353 2017
Publisher:
Institute of Electrical Engineers of Japan
DOI：
10.1541/ieejeiss.137.348
ISSN：
1348-8155 0385-4221
-
三次元集積用テンポラリー接着剤の特性とウエハエッジの影響
Peer-reviewed
福島 誉史, マリアッパン ムルゲサン, 裵 志哲, 李 相勲, 李 康旭, 田中 徹, 小柳 光正
電子情報通信学会誌C J99-C (11) 493-500 2016/11/01
ISSN：
1881-0217
-
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
Peer-reviewed
Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Micromachines 7 (10) 184-1-184-18 2016/10
DOI：
10.3390/mi7100184
ISSN：
2072-666X
-
Fundamental characteristics of AZO transparent stimulus electrode for fully-implantable subretinal prosthesis
Kenji Shimokawa, Taiki Goto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016年第77回応用物理学会秋季学術講演会講演予稿集 77th 11-408-11-408 2016/09/16
-
Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique
Peer-reviewed
Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials 467-468 2016/09
-
Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber
Peer-reviewed
Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials 389-390 2016/09
-
Analysis of Charge Injection Characteristics of Stimulus Electrode with Wide-Range Analog Front-end for Body-Implanted Devices
Peer-reviewed
Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials 393-394 2016/09
-
Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring
Peer-reviewed
Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials 409-410 2016/09
-
3D Interconnect echnologies Based on TSV and Fine-Pitch Electrode
Invited
Peer-reviewed
福島誉史, 李康旭, 田中徹, 小柳光正
Journal of the Surface Finishing Society of Japan 67 (8) 414-420 2016/08/01
DOI：
10.4139/sfj.67.414
ISSN：
0915-1869
-
Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 6 (7) 1002-1008 2016/07
DOI：
10.1109/TCPMT.2016.2575070
ISSN：
2156-3950
eISSN：
2156-3985
-
Influence of Cu-TSVs, CuSnand PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips
Peer-reviewed
Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, Tetsu Tanaka
2016 Proceedings 66th Electronic Components and Technology Conference 50-55 2016/06
-
Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC
Peer-reviewed
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 2016/04
DOI：
10.7567/JJAP.55.04EC07
ISSN：
0021-4922
eISSN：
1347-4065
-
Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC
Peer-reviewed
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 04EC03-1-04EC03-4 2016/04
DOI：
10.7567/JJAP.55.04EC03
ISSN：
0021-4922
eISSN：
1347-4065
-
Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system
Peer-reviewed
Takuma Iwagami, Takaharu Tani, Keita Ito, Satoru Nishino, Takuya Harashima, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 04EM12-1-04EM12-5 2016/04
DOI：
10.7567/JJAP.55.04EM12
ISSN：
0021-4922
eISSN：
1347-4065
-
Evaluation of Local Bending Stress Effects on 3DIC with Retention Time Measurement of DRAM Cell Array
谷川 星野, 木野久志, 福島 誉史, 田中 徹
第63回応用物理学会春季学術講演会 講演予稿集 63rd 11-130 2016/03/20
-
Development of Si Neural Probe with Piezoresistive Strain Sensor
原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹
63回応用物理学会春季学術講演会予稿集 63rd 10-311-10-311 2016/03/20
-
Development of Flexible Si Neural Probe for Deep Brain Insertion and In-vivo Recording
森川 拓実, 谷 卓治, 原島 卓也, 鈴木 雄策, 木野 久志, 福島 誉史, 田中 徹
第63回応用物理学会春季学術講演会予稿集 63rd 2016/03/20
-
Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC
Peer-reviewed
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Japanese Journal of Applied Physics 55 (4S) 04EC07-1-04EC07-4 2016/03/17
DOI：
10.7567/JJAP.55.04EC07
-
Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration
Peer-reviewed
Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 25 (1) 91-100 2016/02
DOI：
10.1109/JMEMS.2015.2480787
ISSN：
1057-7157
eISSN：
1941-0158
-
New multichip-to-wafer 3D integration technology using Self-Assembly and Cu nano-pillar hybrid bonding
Peer-reviewed
M. Koyanagi, K. W. Lee, T. Fukushima, T. Tanaka
2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings 338-341 2016
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/ICSICT.2016.7998914
-
Impact of Interconnections on Vertically Stacked 20 mu m-thick DRAM Chips
Peer-reviewed
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, M. Koyanagi, S. Tanikawa, T. Tanaka
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 50-55 2016
DOI：
10.1109/ECTC.2016.255
ISSN：
0569-5503
-
Non-Conductive Film Underfill for 3D Integration of 20 mu m-Thick LSI Wafers with Fine Cu-TSVs
Peer-reviewed
M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka
2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 466-471 2016
ISSN：
1078-8743
-
Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding
Peer-reviewed
M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, S. H. Lee, M. Motoyoshi, T. Tanaka, K. W. Lee, M. Koyanagi
2016 International Conference on Electronics Packaging (ICEP) 265-269 2016
-
Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging
Invited
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
MRS Advances 1 (34) 2355-2366 2016
Publisher:
Materials Research Society
DOI：
10.1557/adv.2016.528
ISSN：
2059-8521
-
Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration
Peer-reviewed
Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 37 (1) 81-83 2016/01
DOI：
10.1109/LED.2015.2502584
ISSN：
0741-3106
eISSN：
1558-0563
-
Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip
Peer-reviewed
S. Tanikawa, H. Kino, T. Fukushima, K-W. Lee, M. Koyanagi, T. Tanaka
2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 6B-1-1-6B-1-6 2016
DOI：
10.1109/IRPS.2016.7574561
ISSN：
1541-7026
-
Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding
Peer-reviewed
T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 289-294 2016
DOI：
10.1109/ECTC.2016.298
ISSN：
0569-5503
-
Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra-fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration
Peer-reviewed
K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 350-355 2016
DOI：
10.1109/ECTC.2016.10
ISSN：
0569-5503
-
Highly Sensitive Pressure Sensor with Silicon-On-Nothing (SON) MOSFET for Sensor Integrated Heterogeneous System
Peer-reviewed
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW) 186-187 2016
DOI：
10.1109/SNW.2016.7578043
-
Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current
Peer-reviewed
Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, Tetsu Tanaka
PROCEEDINGS OF 2016 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS) 304-307 2016
DOI：
10.1109/BioCAS.2016.7833792
ISSN：
2163-4025
-
Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration
Peer-reviewed
T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 75 (9) 285-290 2016
DOI：
10.1149/07509.0285ecst
ISSN：
1938-5862
-
電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発
原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹
平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム 60-60 2015/12/17
-
柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-
鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹
平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム 60-60 2015/12/17
-
三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価
谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹
公益社団法人 応用物理学会東北支部 第70回学術講演会プログラム 70th 2015/12/03
-
シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向
Invited
福島 誉史, 李 康旭, 田中 徹, 小柳 光正
第32回「センサ・マイクロマシンと応用システム」シンポジウム予稿集 32nd 28pm3-D-1-1-28pm3-D-1-6 2015/10/28
-
Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC
Peer-reviewed
Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 56-57 2015/09/27
-
Development of Si Opto-Neural Probe having Multiple Optical Waveguides with Reflection Mirror for Cerebrum Cortex Stimulation
原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹
第76回応用物理学会秋季学術講演会予稿集 76th p11-381-p11-381 2015/09/15
-
DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価
谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹
2015年第76回応用物理学会秋季学術講演会講演予稿集 76th 12-124 2015/09/14
-
3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価
菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹
第76回応用物理学会秋季学術講演会講演予稿集 76th 12-123-12-123 2015/09/14
-
Study of local stress induced by circuit operation heating in 3D IC
木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹
第25回マイクロエレクトロニクスシンポジウム論文集 25th 355-358 2015/09/03
ISSN：
2434-396X
-
Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications
Peer-reviewed
Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, Kang-Wook Lee
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 70-71 2015/09
-
Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array
Peer-reviewed
Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 790-791 2015/09
-
Area-Efficient and Wide-Range Impedance Analysis Circuit for Multichannel High Quality Brain Signal Recording System
Peer-reviewed
Takuma Iwagami, Takaharu Tani, Keita ito, Satoru Nishino, Takuya Harashima, Koji Kiyoyama, Tetsu Tanaka
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials 822-823 2015/09
-
高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ
伊藤有香, 福島誉史, Murugesan Mariappan, 裵 志哲, 李 康旭, 田中 徹, 小柳光正
第29回 エレクトロニクス実装学会春季講演大会 29th 408-409 2015/03/17
ISSN：
1880-4616
-
高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層
橋口日出登, 福島誉史, 裵 志哲, Murugesan Mariappan, 李 康旭, 田中 徹, 小柳光正
第29回 エレクトロニクス実装学会春季講演大会 29th 410-412 2015/03/17
ISSN：
1880-4616
-
Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration
Peer-reviewed
Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 54 (3) 030206-1-030206-6 2015/03
DOI：
10.7567/JJAP.54.030206
ISSN：
0021-4922
eISSN：
1347-4065
-
Applications of three-dimensional LSI
Invited
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka
MRS BULLETIN 40 (3) 242-247 2015/03
DOI：
10.1557/mrs.2015.33
ISSN：
0883-7694
eISSN：
1938-1425
-
Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Peer-reviewed
Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka
ECS Transactions 64 (40) 63-75 2015
Publisher:
Electrochemical Society Inc.
DOI：
10.1149/06440.0063ecst
ISSN：
1938-6737 1938-5862
-
Development of glyoxylic acid based electroless copper deposition on ruthenium
Peer-reviewed
Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka
ECS Transactions 64 (40) 41-55 2015
Publisher:
Electrochemical Society Inc.
DOI：
10.1149/06440.0041ecst
ISSN：
1938-6737 1938-5862
-
Role of bath composition in electroless Cu seeding on Co liner for through-Si vias
Peer-reviewed
Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka
ECS Journal of Solid State Science and Technology 4 (1) N3108-N3112 2015
Publisher:
Electrochemical Society Inc.
DOI：
10.1149/2.0131501jss
ISSN：
2162-8777 2162-8769
-
Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University
Peer-reviewed
K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015
ISSN：
2164-0157
-
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM
Peer-reviewed
Kang-Wook Lee, Ji-Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 2015
ISSN：
1541-7026
-
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi
2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 260-263 2015
-
Consideration of Micro bump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC
Peer-reviewed
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 260-263 2015
DOI：
10.1109/3DIC.2015.7334596
ISSN：
2164-0157
-
Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration
Peer-reviewed
K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi
2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 185-188 2015
DOI：
10.1109/IEDM.2015.7409652
-
Development of Highly-Reliable Microbump Bonding Technology using Self-Assembly of NCF-Covered KGDs and Multi -Layer 3D Stacking Challenges
Peer-reviewed
Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 336-341 2015
DOI：
10.1109/ECTC.2015.7159614
ISSN：
0569-5503
-
Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV
Peer-reviewed
Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 822-827 2015
DOI：
10.1109/ECTC.2015.7159687
ISSN：
0569-5503
-
Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration
Peer-reviewed
H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1458-1463 2015
DOI：
10.1109/ECTC.2015.7159789
ISSN：
0569-5503
-
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers
Peer-reviewed
K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, J. C. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 31-34 2015
DOI：
10.1109/3DIC.2015.7334471
ISSN：
2164-0157
-
Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors
Peer-reviewed
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 59-61 2015
DOI：
10.1109/3DIC.2015.7334557
ISSN：
2164-0157
-
Transfer and Non-Transfer Stacking Technologies Based on Chip-to-Wafer Self-Asembly for High-Throughput and High-Precision Alignment and Microbump Bonding
Peer-reviewed
Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 134-137 2015
DOI：
10.1109/3DIC.2015.7334578
ISSN：
2164-0157
-
Mitigating Thermo Mechanical Stress in High Density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via _ mu-RS and mu-XRD Study
Peer-reviewed
M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 179-183 2015
DOI：
10.1109/3DIC.2015.7334579
ISSN：
2164-0157
-
Lower invasive in vivo brain insertion of the Si neural probe with triangular shank and sharpened tip
Peer-reviewed
Takuya Harashima, Takaharu Tani, Hisashi Kino, Norihiro Katayama, Tetsu Tanaka
Extended Abstracts of the 2014 International Conference on Solid State Device and Materials 606-607 2014/09
-
Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC
Peer-reviewed
Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstracts of the 2014 International Conference on Solid State Device and Materials 726-727 2014/09
-
Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording
Peer-reviewed
Takaharu Tani, Hideki Naganuma, Takuya Harashima, Takuma Iwagami, Hisashi Kino, Koji Kiyoyama, Minna Kellomäki, Jari Hyttinen, Tetsu Tanaka
Transactions of Japanese Society for Medical and Biological Engineering 52 377-O-378 2014/08/17
Publisher:
Japan Soc. of Med. Electronics and Biol. Engineering
DOI：
10.11239/jsmbe.52.O-377
ISSN：
1347-443X 1881-4379
-
Development of chip-surface stimulus electrode array for fully-implantable subretinal prosthesis chip
Peer-reviewed
Yuichiro Sasaki, Takuji Suzuki, Takuma Iwagami, Takaharu Tani, Hideki Naganuma, Hisashi Kino, Jari Hyttinen, Minna Kellomaki, Tetsu Tanaka
Transactions of Japanese Society for Medical and Biological Engineering 52 253-O-254 2014/08/17
Publisher:
Japan Soc. of Med. Electronics and Biol. Engineering
DOI：
10.11239/jsmbe.52.O-253
ISSN：
1347-443X 1881-4379
-
Development of Si opto-neural probe with multiple optical stimulation function
Peer-reviewed
Tetsu Tanaka
Transactions of Japanese Society for Medical and Biological Engineering 52 75 2014/08/17
Publisher:
Japan Soc. of Med. Electronics and Biol. Engineering
DOI：
10.11239/jsmbe.52.OS-75
ISSN：
1347-443X 1881-4379
-
Evaluation of sink and source patterns in the prefrontal cortex of a monkey
Peer-reviewed
Kazuhiro Sakamoto, Norihiko Kawaguchi, Kohei Yagi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake
Transactions of Japanese Society for Medical and Biological Engineering 52 73-OS-74 2014/08/17
Publisher:
Japan Soc. of Med. Electronics and Biol. Engineering
DOI：
10.11239/jsmbe.52.OS-73
ISSN：
1347-443X 1881-4379
-
Via Reveal and Backside Processing
Peer-reviewed
Mitsumasa Koyanagi, Tetsu Tanaka
Handbook of 3D Integration 3 227-240 2014/07/21
Publisher:
Wiley Blackwell
DOI：
10.1002/9783527670109.ch17
-
Envelope tracking CMOS power amplifier with high-speed CMOS envelope amplifier for mobile handsets
Peer-reviewed
Eiji Yoshida, Yasufumi Sakai, Kazuaki Oishi, Hiroshi Yamazaki, Toshihiko Mori, Shinji Yamaura, Kazuo Suto, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 53 (4) 04EE19-1-04EE19-4 2014/04
DOI：
10.7567/JJAP.53.04EE19
ISSN：
0021-4922
eISSN：
1347-4065
-
Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration
Peer-reviewed
Kang-Wook Lee, Ji-Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 14 (1) 451-462 2014/03
DOI：
10.1109/TDMR.2013.2258022
ISSN：
1530-4388
eISSN：
1558-2574
-
Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice
Peer-reviewed
Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 540-547 2014/02
DOI：
10.1109/TED.2013.2295463
ISSN：
0018-9383
eISSN：
1557-9646
-
Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film
Peer-reviewed
Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 533-539 2014/02
DOI：
10.1109/TED.2013.2294831
ISSN：
0018-9383
eISSN：
1557-9646
-
Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM
Peer-reviewed
Kang-Wook Lee, Seiya Tanikawa, Mariappan Murugesan, Hideki Naganuma, Ji-Choel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 61 (2) 379-385 2014/02
DOI：
10.1109/TED.2013.2295244
ISSN：
0018-9383
eISSN：
1557-9646
-
A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs
Peer-reviewed
H. Hashiguchi, T. Fukushima, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) 74-77 2014
-
Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration
Peer-reviewed
H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 14-14 2014
-
A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies
Peer-reviewed
K-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 304-308 2014
ISSN：
0569-5503
-
Micro-XRD Investigation of Fine-Pitch Cu-TSV Induced Thermo-Mechanical Stress in High-Density 3D-LSI
Peer-reviewed
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, T. Tanaka
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2014
ISSN：
2164-0157
-
Impacts of Cu Contamination in 3D Integration Process on Memory Retention Characteristics in Thinned DRAM Chip
Peer-reviewed
Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichel Bea, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM 2014
ISSN：
1541-7026
-
Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration
Peer-reviewed
Y. Ito, T. Fukushima, K. -W. Lee, K. Choki, T. Tanaka, M. Koyanagi
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 15-15 2014
-
Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV
Peer-reviewed
Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 35 (1) 114-116 2014/01
DOI：
10.1109/LED.2013.2287879
ISSN：
0741-3106
eISSN：
1558-0563
-
Electroless Cu Seed on Ru and Co Liners in High Aspect Ratio TSV
Peer-reviewed
F. Inoue, H. Philipsen, M. H. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf, T. Tanaka
2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC) 207-209 2014
DOI：
10.1109/IITC.2014.6831871
-
Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
Peer-reviewed
Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 636-640 2014
DOI：
10.1109/ECTC.2014.6897353
ISSN：
0569-5503
eISSN：
2377-5726
-
Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly
Peer-reviewed
H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 856-861 2014
DOI：
10.1109/ECTC.2014.6897386
ISSN：
0569-5503
-
Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive
Peer-reviewed
Hisashi Kino, Hideto Hashiguchi, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1110-1115 2014
DOI：
10.1109/ECTC.2014.6897428
ISSN：
0569-5503
-
Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies
Peer-reviewed
Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1148-1153 2014
DOI：
10.1109/ECTC.2014.6897434
ISSN：
0569-5503
-
Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent
Peer-reviewed
Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 161 (14) D768-D774 2014
DOI：
10.1149/2.0361414jes
ISSN：
0013-4651
eISSN：
1945-7111
-
Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration
Peer-reviewed
Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2014
DOI：
10.1109/3DIC.2014.7152145
ISSN：
2164-0157
-
Cu Seeding Using Electroless Deposition on Ru Liner for High Aspect Ratio Through-Si Vias
Peer-reviewed
Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2014
DOI：
10.1109/3DIC.2014.7152147
ISSN：
2164-0157
-
Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV
Peer-reviewed
K. W. Lee, C. Nagai, A. Nakamura, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2014
DOI：
10.1109/3DIC.2014.7152153
ISSN：
2164-0157
-
Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology
Peer-reviewed
K-W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J-C Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 669-672 2014
DOI：
10.1109/IEDM.2014.7047128
-
Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration
Peer-reviewed
Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan, Hideki Naganuma, Haro Shimamoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 34 (8) 1038-1040 2013/08
DOI：
10.1109/LED.2013.2265336
ISSN：
0741-3106
eISSN：
1558-0563
-
Development and In Vivo Evaluation of Conductive Polymer (PEDOT) Stimulus Electrodes for Fully Implantable Retinal Prosthesis
Peer-reviewed
Chikashi kigure, Hideki Naganuma, Yuichiro Sasaki, Hiroshi Kino, Tetsu Tanaka
Japanese Journal of Applied Physics 52 (4) 04CL03-1-04CL03-5 2013/04/22
DOI：
10.7567/JJAP.52.04CL03
-
Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration
Peer-reviewed
Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Japanese Journal of Applied Physics 52 (4) 04CB11-1-04CB11-6 2013/04/22
DOI：
10.7567/JJAP.52.04CB1
-
Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis
Peer-reviewed
Chikashi Kigure, Hideki Naganuma, Yuichiro Sasaki, Hisashi Kino, Hiroshi Tomita, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 52 (4) 2013/04
DOI：
10.7567/JJAP.52.04CL03
ISSN：
0021-4922
eISSN：
1347-4065
-
Investigation of local bending stress effect on complementary metal-oxide-semiconductor characteristics in thinned si chip for chip-to-wafer three-dimensional integration
Peer-reviewed
Hisashi Kino, Ji Choel Bea, Mariappan Murugesan, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Japanese Journal of Applied Physics 52 (4) 04CB11-1-04CB11-5 2013/04
DOI：
10.7567/JJAP.52.04CB11
ISSN：
0021-4922 1347-4065
-
Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration
Peer-reviewed
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 52 (4) 04CB09-1-04CB09-6 2013/04
DOI：
10.7567/JJAP.52.04CB09
ISSN：
0021-4922
eISSN：
1347-4065
-
Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain
Peer-reviewed
Sanghoon Lee, Soichiro Kanno, Hisashi Kino, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS 52 (4) 04CL04-1-04CL04-6 2013/04
DOI：
10.7567/JJAP.52.04CL04
ISSN：
0021-4922
eISSN：
1347-4065
-
Development of 3D-stacked reconfigurable spin logic chip using via-last backside-via 3D integration technology
Peer-reviewed
T. Tanaka, H. Kino, K. Kiyoyama, H. Ohno, M. Koyanagi
Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013 2013
DOI：
10.1109/IITC.2013.6615594
-
3D Hetero-Integration Technology with Backside TSV and Reliability Challenges
Peer-reviewed
Kang-Wook Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) 2013
-
Challenges in 3D Integration
Peer-reviewed
Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka
SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3 53 (3) 237-244 2013
DOI：
10.1149/05303.0237ecst
ISSN：
1938-5862
eISSN：
1938-6737
-
Characterization and Reliability of 3D LSI and SiP
Peer-reviewed
K-W. Lee, M. Murugesan, Jichel Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 176-179 2013
DOI：
10.1109/IEDM.2013.6724579
-
Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
Peer-reviewed
H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
Proceedings of International Conference on Electronics Packaging (ICEP) 502-505 2013
-
3D Integration technologies using self-assembly and electrostatic temporary multichip bonding
Peer-reviewed
T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
Proceedings - Electronic Components and Technology Conference 58-63 2013
DOI：
10.1109/ECTC.2013.6575550
ISSN：
0569-5503
-
Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI
Peer-reviewed
H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka
Proceedings - Electronic Components and Technology Conference 360-365 2013
DOI：
10.1109/ECTC.2013.6575596
ISSN：
0569-5503
-
Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration
Peer-reviewed
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 891-896 2013
DOI：
10.1109/ECTC.2013.6575679
-
Young Modulus of Si in 3D-LSIs and Reliability
Peer-reviewed
M. Murugesan, J.C. Bea, T. Fukushima, K.W. Lee, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 38-39 2013
-
Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration
Peer-reviewed
H. Hashiguchi, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 40-41 2013
-
Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D-IC
Peer-reviewed
H. Kino, T. Fukushima, K.-W. Lee, M. Koyanagi, T. Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 862-863 2013
-
Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration
Peer-reviewed
Y. Ito, T. Fukushima, K.W. Lee, K. Choki, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 988-989 2013
-
Mechanical Characteristics of Thin Dies/Wafers in Three-Dimensional Large-Scale Integrated systems
Peer-reviewed
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, T. Tanaka
2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) 66-69 2013
DOI：
10.1109/ASMC.2013.6552777
ISSN：
1078-8743
-
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory
Peer-reviewed
K-W Lee, S. Tanikawa, M. Murugesan, H. Naganuma, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013
DOI：
10.1109/3DIC.2013.6702336
ISSN：
2164-0157
-
Highly Efficient TSV Repair Technology for Resilient 3-D Stacked Multicore Processor System
Peer-reviewed
H. Hashimoto, T. Fukushima, K. W. Lee, M. Koyanagi, T. Tanaka
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013
DOI：
10.1109/3DIC.2013.6702338
ISSN：
2164-0157
-
A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor
Peer-reviewed
K. Kiyoyama, Y. Sato, H. Hashimoto, K-W Lee, T. Fukushima, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013
DOI：
10.1109/3DIC.2013.6702363
ISSN：
2164-0157
-
Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV
Peer-reviewed
M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike
2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013
DOI：
10.1109/3DIC.2013.6702364
ISSN：
2164-0157
-
Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics
Peer-reviewed
S. Kanno, S. Lee, T. Harashima, T. Kuki, H. Kino, H. Mushiake, H. Yao, T. Tanaka
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 253-256 2013
DOI：
10.1109/EMBC.2013.6609485
ISSN：
1557-170X
-
Die-level 3-D integration technology for rapid prototyping of high-performance multifunctionality hetero-integrated systems
Peer-reviewed
Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE Transactions on Electron Devices 60 (11) 3842-3848 2013
DOI：
10.1109/TED.2013.2280273
ISSN：
0018-9383
-
Revisiting the Silicon-Lattice in the High-Density 3D-LSIs - In the Perspective of Device Reliability
Peer-reviewed
M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi
2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 172-175 2013
DOI：
10.1109/IEDM.2013.6724578
-
Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 59 (11) 2956-2963 2012/11
DOI：
10.1109/TED.2012.2212709
ISSN：
0018-9383
eISSN：
1557-9646
-
Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis
Peer-reviewed
Kang-Wook Lee, Yoshinobu Watanabe, Chikashi Kigure, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22 (10) 105015-1-105015-11 2012/10
DOI：
10.1088/0960-1317/22/10/105015
ISSN：
0960-1317
eISSN：
1361-6439
-
Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration
Peer-reviewed
Kangwook Lee, Takaharu Tani, Hideki Naganuma, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 33 (9) 1297-1299 2012/09
DOI：
10.1109/LED.2012.2202631
ISSN：
0741-3106
eISSN：
1558-0563
-
High-step-coverage Cu-lateral interconnections over 100 mu m thick chips on a polymer substrate-an alternative method to wire bonding
Peer-reviewed
M. Murugesan, T. Fukushima, K. Kiyoyama, J. C. Bea, T. Tanaka, M. Koyanagi
JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22 (8) 085033-1-085033-9 2012/08
DOI：
10.1088/0960-1317/22/8/085033
ISSN：
0960-1317
eISSN：
1361-6439
-
Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking
Peer-reviewed
M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi
JOURNAL OF ELECTRONIC MATERIALS 41 (4) 720-729 2012/04
DOI：
10.1007/s11664-012-1949-1
ISSN：
0361-5235
-
Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI
Peer-reviewed
Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 33 (2) 221-223 2012/02
DOI：
10.1109/LED.2011.2174608
ISSN：
0741-3106
-
A 37 × 37 pixels artificial retina chip with edge enhancement function for 3-D stacked fully implantable retinal prosthesis
Peer-reviewed
H. Naganuma, K. Kiyoyama, T. Tanaka
2012 IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Electronics and Systems for Better Life and Better Environment, BioCAS 2012 - Conference Publications 212-215 2012
DOI：
10.1109/BioCAS.2012.6418459
-
The road to recovery from the great east Japan earthquake in micro/nano machining research and education center, Tohoku university
Peer-reviewed
Toshiya Kojima, Tetsu Tanaka
Journal of the Vacuum Society of Japan 55 (9) 413-416 2012
DOI：
10.3131/jvsj2.55.413
ISSN：
1882-2398 1882-4749
-
Ultrafast parallel reconfiguration of 3D-stacked reconfigurable spin logic chip with on-chip SPRAM (SPin-transfer torque RAM)
Peer-reviewed
T. Tanaka, H. Kino, R. Nakazawa, K. Kiyoyama, H. Ohno, M. Koyanagi
Digest of Technical Papers - Symposium on VLSI Technology 169-170 2012
DOI：
10.1109/VLSIT.2012.6242515
ISSN：
0743-1562
-
Study for CMOS device characteristics affected by Ultra Thin Wafer Thinning
Peer-reviewed
Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Shigeaki Saito, Koske Kitaichi, Shoji Yasunaga, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2012 2ND IEEE CPMT SYMPOSIUM JAPAN 2012
ISSN：
2373-5449
-
Heterogeneous 3D Integration Technology and New 3D LSIs
Peer-reviewed
Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka
2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 240-243 2012
-
Chip-Based Hetero-Integration Technology for High-Performance 3D Stacked Image Sensor
Peer-reviewed
Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2012 2ND IEEE CPMT SYMPOSIUM JAPAN 2012
ISSN：
2373-5449
-
Impact of Cu Diffusion from Cu Through-Silicon Via (TSV) on Device Reliability in 3-D LSIs Evaluated by Transient Capacitance Measurement
Peer-reviewed
Kangwook Lee, Jichel Bea, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 2B.4.1-2B.4.6 2012
DOI：
10.1109/IRPS.2012.6241777
-
Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs
Peer-reviewed
Kangwook Lee, Itakafumi Fukushima, Tetsu Tanaka, Imitsumasa Koyanagi
2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) 5F.2.1-5F.2.4 2012
DOI：
10.1109/IRPS.2012.6241860
-
Self-assembly-based 3D integration technologies
Peer-reviewed
T. Fukushima, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 151-152 2012
DOI：
10.1109/LTB-3D.2012.6238075
-
Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration
Peer-reviewed
T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 393-398 2012
DOI：
10.1109/ECTC.2012.6248860
-
Locally Induced Stress in Stacked Ultrathin Si wafers: XPS and mu-Raman study
Peer-reviewed
M. Murugesan, H. Nohira, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 625-629 2012
DOI：
10.1109/ECTC.2012.6248896
-
Optical interconnect technology for 3-D LSI and neural engineering applications
Peer-reviewed
T. Tanaka, A. Noriki, T. Kukushima, K-W Lee, M. Koyanagi
2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) 2012
-
10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
Peer-reviewed
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 46-47 2012
-
Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps
Peer-reviewed
Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 48-49 2012
-
The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3D LSI by Using C–V and C–t Measurements
Peer-reviewed
Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 50-51 2012
-
Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisted Self-Assembly with Cu/Sn Microbump
Peer-reviewed
Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1176-1177 2012
-
Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration
Peer-reviewed
Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1183-1184 2012
-
Reliability Challenges in High-Density 3D-Integration
Peer-reviewed
M. Murugesan, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1185-1186 2012
-
Cu Contamination Assessment and Control in 3-D Integration
Peer-reviewed
Mitsumasa Koyanagi, Kang Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka
The 222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
-
Long Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride
Peer-reviewed
Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
Materials Research Society (MRS) 2008 Spring Meeting, Symposium F: Materials Science and Technology for Nonvolatile Memories, F2.4 2012
-
New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding
Peer-reviewed
T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 789-792 2012
DOI：
10.1109/IEDM.2012.6479157
-
Characterization of Chip-level Hetero-Integration Technology for High-Speed, Highly Parallel 3D-Stacked Image Processing System
Peer-reviewed
K-W Lee, Y. Ohara, K. Kiyoyama, S. Konno, Y. Sato, S. Watanabe, A. Yabata, T. Kamada, J-C Bea, H. Hashimoto, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 785-788 2012
DOI：
10.1109/IEDM.2012.6479156
-
Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs
Peer-reviewed
M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi
2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 657-660 2012
DOI：
10.1109/IEDM.2012.6479124
-
Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 1 (12) 1873-1884 2011/12
DOI：
10.1109/TCPMT.2011.2160266
ISSN：
2156-3950
eISSN：
2156-3985
-
三次元集積化技術とヘテロインテグレーション
Invited
Peer-reviewed
小柳光正, 福島誉史, 李康旭, 田中徹
電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集） J94-C (11) 355-364 2011/11
ISSN：
1345-2827
-
三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術
Peer-reviewed
大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正
電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集） J94-C (11) 394-401 2011/11
ISSN：
1345-2827
-
シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価
Peer-reviewed
木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正
電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集） J94-C (11) 411-418 2011/11
ISSN：
1345-2827
-
Effects of Annealing Temperature in a Metal Alloy Nano-dot Memory
Peer-reviewed
Jung Min Lee, Gae Hun Lee, Yun Heub Song, Ji Cheol Bea, Tetsu Tanaka
JOURNAL OF THE KOREAN PHYSICAL SOCIETY 59 (4) 2782-2785 2011/10
DOI：
10.3938/jkps.59.2782
ISSN：
0374-4884
-
Advanced die-to-wafer 3D integration platform: Self-assembly technology
Peer-reviewed
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
3D Integration for VLSI Systems 153-174 2011/09/30
Publisher:
Pan Stanford Publishing Pte. Ltd.
DOI：
10.4032/9789814303828
-
Multilevel Charge Storage in a Multiple Alloy Nanodot Memory
Peer-reviewed
Gae-Hun Lee, Jung-Min Lee, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 50 (9) 2011/09
DOI：
10.1143/JJAP.50.095001
ISSN：
0021-4922
eISSN：
1347-4065
-
Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement
Peer-reviewed
Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 32 (7) 940-942 2011/07
DOI：
10.1109/LED.2011.2141109
ISSN：
0741-3106
eISSN：
1558-0563
-
MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric
Peer-reviewed
Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON NANOTECHNOLOGY 10 (3) 528-531 2011/05
DOI：
10.1109/TNANO.2010.2050331
ISSN：
1536-125X
-
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Peer-reviewed
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
MICROMACHINES 2 (1) 49-68 2011/03
DOI：
10.3390/mi2010049
ISSN：
2072-666X
-
Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
Peer-reviewed
Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON ELECTRON DEVICES 58 (3) 748-757 2011/03
DOI：
10.1109/TED.2010.2099870
ISSN：
0018-9383
eISSN：
1557-9646
-
Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement
Peer-reviewed
K-W Lee, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
SEMICONDUCTOR SCIENCE AND TECHNOLOGY 26 (2) 2011/02
DOI：
10.1088/0268-1242/26/2/025007
ISSN：
0268-1242
eISSN：
1361-6641
-
Development of Si neural probe with optical waveguide for highly accurate optical stimulation of neuron
Peer-reviewed
R. Kobayashi, S. Kanno, S. Sakai, S. Lee, M. Koyanagi, H. Yao, T. Tanaka
2011 5th International IEEE/EMBS Conference on Neural Engineering, NER 2011 294-297 2011
DOI：
10.1109/NER.2011.5910545
-
Comparison of electrode materials for the use of retinal prosthesis
Peer-reviewed
Onnela Niina, Takeshita Hirotaka, Kaiho Yoshiuki, Kojima Toshiya, Kobayashi Risato, Tanaka Tetsu, Hyttinen Jari
Bio-Medical Materials and Engineering 21 (2) 83-97 2011
DOI：
10.3233/BME-2011-0658
ISSN：
0959-2989
-
3D Integration Technology and Reliability Challenges
Peer-reviewed
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) 2011
ISSN：
2151-1225
-
Energy Band Engineering of Metal Nanodots for High Performance Nonvolatile Memory Application
Peer-reviewed
Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS 470 140-+ 2011
DOI：
10.4028/www.scientific.net/KEM.470.140
ISSN：
1013-9826
-
Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration
Peer-reviewed
T. Fukushima, Y. Ohara, M. Murugesan, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi
2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2050-2055 2011
ISSN：
0569-5503
-
Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement
Peer-reviewed
K-W. Lee, J-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 158 (8) H795-H799 2011
DOI：
10.1149/1.3597317
ISSN：
0013-4651
eISSN：
1945-7111
-
High Density 3D LSI Technology using W/Cu Hybrid TSVs
Peer-reviewed
M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) 2011
-
Development of 5 µm Diameter Backside Cu TSV Technology for 3D LSI
Peer-reviewed
Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings of the International Conference on Electronics Packaging (ICEP) 237-240 2011
-
3D LSI Technology and Reliability Issues
Peer-reviewed
T. Tanaka, J. Bea, M. Murugesan, K. Lee, T. Fukushima, M. Koyanagi
Proceedings of the 2011 Symposium on VLSI Technology 184-185 2011
-
Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer
Peer-reviewed
M. Murugesan, H. Nohira, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 50-51 2011
-
Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor
Peer-reviewed
H. Hashimoto, T. Fukushima, K-W. Lee, T. Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 168-169 2011
-
Development of Implantable Si Neural Probe with Stimulus and Recording Electrodes for Deep Brain Stimulation
Peer-reviewed
Yoshiho Yukita, Sanghoon Lee, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 408-409 2011
-
Impacts of Microbump-Induced Local Bending Stress in 3D-LSI
Peer-reviewed
H. Kino, M. Murugesan, K.-W. Lee, J.-C. Bea, C. Miyazaki, H. Kobayashi, H. Shimamoto, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 785-786 2011
-
Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs
Peer-reviewed
H. Hashiguchi, M. Murugesan, J.C. Bea, K.W. Lee, T. Fukushima, H. Kobayashi, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 795-796 2011
-
A Block-Parallel SAR ADC for CMOS Image Sensor with 3-D Stacked Structure
Peer-reviewed
K. Kiyoyama, K-W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1055-1056 2011
-
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration
Peer-reviewed
Yuki Ohara, Lee Kangwook, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262950
-
Temporary bonding strength control for self-assembly-based 3D integration
Peer-reviewed
Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262954
-
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI
Peer-reviewed
Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262957
-
A very low area ADC for 3-D stacked CMOS image processing system
Peer-reviewed
K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262958
-
High density Cu-TSVs and reliability issues
Peer-reviewed
Murugesan Mariappan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262969
-
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress
Peer-reviewed
Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262970
-
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs
Peer-reviewed
K. W. Lee, J. C. Bea, T. Fukushima, Y. Ohara, T. Tanaka, M. Koyanagi
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI：
10.1109/3DIC.2012.6262975
-
Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement
Peer-reviewed
Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE ELECTRON DEVICE LETTERS 32 (1) 66-68 2011/01
DOI：
10.1109/LED.2010.2087004
ISSN：
0741-3106
eISSN：
1558-0563
-
A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module
Peer-reviewed
Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 19 (6) 1284-1291 2010/12
DOI：
10.1109/JMEMS.2010.2082497
ISSN：
1057-7157
eISSN：
1941-0158
-
Leakage Current Characteristics of the Multiple Metal Alloy Nanodot Memory
Peer-reviewed
Gae Hun Lee, Jung Min Lee, Hyung Jun Yang, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka
JOURNAL OF THE KOREAN PHYSICAL SOCIETY 57 (5) 1248-1252 2010/11
DOI：
10.3938/jkps.57.1248
ISSN：
0374-4884
-
三次元積層型集積回路のための自己組織化チップ位置合わせ技術
Peer-reviewed
岩田永司, 福島誉史, 大原悠希, 李康旭, 田中徹, 小柳光正
電子情報通信学会論文誌C J93-C (11) 493-502 2010/11/01
ISSN：
1345-2827
-
極限集積化を目指すスーパーチップ
Peer-reviewed
小柳光正, 福島誉史, 李康旭, 田中徹
電子情報通信学会誌 93 (11) 918-922 2010/11/01
ISSN：
0913-5693
-
Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application
Peer-reviewed
Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 49 (6) 066503-1-066503-4 2010/06
DOI：
10.1143/JJAP.49.066503
ISSN：
0021-4922
-
３次元積層型集積回路に向けた自己組織化チップ実装技術
福島誉史, 李康旭, 田中徹, 小柳光正
電子材料 49 (6) 17--24 2010/06
ISSN：
0387-0774
-
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
Peer-reviewed
T. Fukushima, E. Iwata, T. Konno, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi
APPLIED PHYSICS LETTERS 96 (15) 154105-1-154105-3 2010/04
DOI：
10.1063/1.3328098
ISSN：
0003-6951
-
Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010 2010
-
Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability
Peer-reviewed
Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 49 (7) 2010
DOI：
10.1143/JJAP.49.074201
ISSN：
0021-4922
-
Development of Retinal Prosthesis Module for Fully Implantable Retinal Prosthesis
Peer-reviewed
Kangwook Lee, Tetsu Tanaka
6TH WORLD CONGRESS OF BIOMECHANICS (WCB 2010), PTS 1-3 31 1625-+ 2010
ISSN：
1680-0737
-
Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration
Peer-reviewed
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Technical Digest of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 433-437 2010
-
Impact of Remnant Stress/Strain in 3D Stacked Retinal Chip by Wafer Thinning and Bonding
Peer-reviewed
Hisashi Kino, Tatsuro Hiraki, Mariappan Murugesan, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region 123-124 2010
-
Electrical and Mechanical Characteristics of Si Double-sided Neural Probe for In-vivo Recording
Peer-reviewed
Sanghoon Lee, Risato Kobayashi, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region 127-128 2010
-
Highly Accurate Optical Stimulation of Neuron using Si Neural Probe with Optical Waveguide
Peer-reviewed
Risato Kobayashi, Sanghoon Lee, Soichiro Kanno, Yoshiho Yukita, Kangwook Lee, Takafumi Fukushima, Toru Ishizuka, Hajime Mushiake, Hiromu Yao, Mitsumasa Koyanagi, Tetsu Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 181-182 2010
-
Development of Versatile Backside Via Technology for 3D System on Chip
Peer-reviewed
Y. Ohara, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 237-238 2010
-
Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement
Peer-reviewed
J.-C. Bea, K.-W. Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1196-1197 2010
-
Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI
Peer-reviewed
Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1198-1199 2010
-
Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration
Peer-reviewed
Eiji Iwata, Yuki Ohara, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1202-1203 2010
-
Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study
Peer-reviewed
M. Murugesan, Y. Ohara, J.C Bea, K.W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 1204-1205 2010
-
Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application
Peer-reviewed
Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings of the China Semiconductor Technology International Conference (CSTIC) 55-55 2010
-
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding
Peer-reviewed
Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010
DOI：
10.1109/3DIC.2010.5751432
-
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature
Peer-reviewed
T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010
DOI：
10.1109/3DIC.2010.5751436
-
A block-parallel signal processing system for CMOS image sensor with three-dimensional structure
Peer-reviewed
K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi
IEEE 3D System Integration Conference 2010, 3DIC 2010 2010
DOI：
10.1109/3DIC.2010.5751479
-
Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer
Peer-reviewed
T. Tanaka, T. Fukushima, K. -W. Lee, M. Murugesan, M. Koyanagi
2010 IEEE INTERNATIONAL SOI CONFERENCE 60-63 2010
DOI：
10.1109/SOI.2010.5641471
ISSN：
1078-621X
-
Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration
Peer-reviewed
T. Fukushima, E. Iwata, K. -W. Lee, T. Tanaka, M. Koyanagi
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1050-1055 2010
DOI：
10.1109/ECTC.2010.5490830
ISSN：
0569-5503
-
3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems
Peer-reviewed
Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS 33 (12) 71-90 2010
DOI：
10.1149/1.3501035
ISSN：
1938-5862
-
Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias
Peer-reviewed
M. Murugesan, H. Kino, H. Nohira, J. C. Bea, A. Horibe, F. Yamada, C. Miyazaki, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi
2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST 30-34 2010
DOI：
10.1109/IEDM.2010.5703279
-
Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE IEDM Technical Digest 109 (408(SDM2009 171-181)) 349-352 2009/12
ISSN：
0913-5685
-
A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density
Peer-reviewed
Yun Heub Song, Ji Chel Bea, Kang Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (10) 2009/10
DOI：
10.1143/JJAP.48.106505
ISSN：
0021-4922
-
Cannula-aided penetration: A simple method to insert structurally weak electrodes into brain through the dura mater
Peer-reviewed
Yoshiya Matsuzaka, Kazuhiro Sakamoto, Tetsu Tanaka, Yoshihito Furusawa, Hajime Mushiake
NEUROSCIENCE RESEARCH 65 (1) 126-129 2009/09
DOI：
10.1016/j.neures.2009.05.009
ISSN：
0168-0102
-
セルフアセンブリ法を用いた新しいヘテロインテグレーション技術
Invited
福島誉史, 田中徹, 小柳光正
応用物理学会分科会 シリコンテクノロジー 「VLSIシンポジウム特集(先端CMOSデバイス・プロセス技術)」 115 17-22 2009/08/03
-
Cell characteristics of a multiple alloy nano-dots memory structure
Peer-reviewed
Ji Chel Bea, Yun Heub Song, Kang-Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi
SEMICONDUCTOR SCIENCE AND TECHNOLOGY 24 (8) 2009/08
DOI：
10.1088/0268-1242/24/8/085013
ISSN：
0268-1242
-
Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric
Peer-reviewed
Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 95 (3) 033118-1-033118-3 2009/07
DOI：
10.1063/1.3189085
ISSN：
0003-6951
-
三次元積層型チップのためのSi貫通ビア(TSV)形成技術
Peer-reviewed
福島誉史, 田中徹, 小柳光正
エレクトロニクス実装学会誌 12 (2) 104-109 2009/05/01
DOI：
10.5104/jiep.12.104
ISSN：
1343-9677
-
Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection
Peer-reviewed
Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C113-1-C113-5 2009/04
DOI：
10.1143/JJAP.48.04C113
ISSN：
0021-4922
-
Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System
Peer-reviewed
Kenji Makita, Kouji Kiyoyarna, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C077-1-C077-5 2009/04
DOI：
10.1143/JJAP.48.04C077
ISSN：
0021-4922
-
Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films
Peer-reviewed
Woo-Cheol Jeong, Kouji Kiyoyama, Kang-Wook Lee, Akihiro Noriki, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C157-1-C157-4 2009/04
DOI：
10.1143/JJAP.48.04C157
ISSN：
0021-4922
eISSN：
1347-4065
-
Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding
Peer-reviewed
Soichiro Kanno, Risato Kobayashi, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C189-1-C189-4 2009/04
DOI：
10.1143/JJAP.48.04C189
ISSN：
0021-4922
-
Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System
Peer-reviewed
Risato Kobayashi, Soichiro Kanno, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 48 (4) C194-1-C194-5 2009/04
DOI：
10.1143/JJAP.48.04C194
ISSN：
0021-4922
-
MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition
Peer-reviewed
Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi
SEMICONDUCTOR SCIENCE AND TECHNOLOGY 24 (4) 045022-045025 2009/04
DOI：
10.1088/0268-1242/24/4/045022
ISSN：
0268-1242
-
Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application
Peer-reviewed
Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 94 (6) 063108-063110 2009/02
DOI：
10.1063/1.3081042
ISSN：
0003-6951
-
Super chip integration technology for three-dimensionally stacked retinal prosthesis chips
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Smart Systems Integration 2009, SSI 2009 299-306 2009
Publisher:
AKA Verlag
-
Development of Medical Micro/Nano System : Retinal Prosthesis and Intelligent Si Neural Probe
TANAKA Tetsu
The Reference Collection of Annual Meeting 2009 243-244 2009
Publisher:
The Japan Society of Mechanical Engineers
DOI：
10.1299/jsmemecjsm.2009.9.0_243
-
Erratum: TSV (Through-Si-Via) Formation Technologies for Three-Dimensionally Stacked Chips [Journal of Japan Institute of Electronics Packaging 12(2): 104-109 (2009)]
Fukushima Takafumi, Tanaka Tetsu, Koyanagi Mitsumasa
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 12 (3) 262-262 2009
Publisher:
The Japan Institute of Electronics Packaging
DOI：
10.5104/jiep.12.262
ISSN：
1343-9677
-
Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding
Peer-reviewed
M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanag
Technical Digest - International Electron Devices Meeting, IEDM 14.5.4 2009
DOI：
10.1109/IEDM.2009.5424348
ISSN：
0163-1918
-
3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
Technical Digest - International Electron Devices Meeting, IEDM 14.2.4 2009
DOI：
10.1109/IEDM.2009.5424351
ISSN：
0163-1918
-
3D integration technology for 3D stacked retinal chip
Peer-reviewed
Y. Kaiho, Y. Ohara, H. Takeshita, K. Kiyoyama, K. W. Lee, T. Tanaka, M. Koyanagi
2009 IEEE International Conference on 3D System Integration, 3DIC 2009 2009
DOI：
10.1109/3DIC.2009.5306564
-
Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 323-326 2009
ISSN：
2380-9248
-
Three-Dimensional Integration Technology and Integrated Systems
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009 409-415 2009
ISSN：
2153-6961
-
3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon (SOS)
Peer-reviewed
K-W Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W-C Jeong, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 495-498 2009
-
Development of Double-sided Si Neural Probe with Microfluidic Channels Using Wafer Direct Bonding Technique
Peer-reviewed
R. Kobayashi, S. Kanno, S. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka
2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING 96-+ 2009
ISSN：
1948-3546
-
Fabrication of Multichannel Neural Microelectrodes with Microfluidic Channels Based on Wafer Bonding Technology
Peer-reviewed
R. Kobayashi, S. Kann, T. Fukushima, T. Tanaka, M. Koyanagi
13TH INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING, VOLS 1-3 23 (1-3) 2258-+ 2009
ISSN：
1680-0737
-
Development of A Silicon Neural Probe for An Intelligent Silicon Neural Probe System
Risato Kobayashi, Lee Sanghoon, Soichiro Kanno, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi
Nano-Biomedical Engineering 2009 297-308 2009
-
Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride
Peer-reviewed
Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
Proceedings of the International Semiconductor Technology Conference/China Semiconductor Technology International Conference (ISTC/CSTIC) 85-89 2009
-
Super Hetero-Integration Technology for LSI /MEMS Integration
Peer-reviewed
M. Koyanagi, K.-W. Lee, T. Fukushima, T. Tanaka
Proceedings of the International Conference on Electronics Packaging (ICEP) 589-595 2009
-
Cu Lateral Interconnects Formed Between 100-mu m-Thick Self-Assembled Chips on Flexible Substrates
Peer-reviewed
M. Murugesan, J. -C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. -C. Jeong, H. Kino, A. Noriki, K. -W. Lee, T. Tanaka, M. Koyanagi
2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 1496-1501 2009
DOI：
10.1109/ECTC.2009.5074210
-
Development of EEB (Electroplated Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps
Peer-reviewed
Y. Ohara, A. Noriki, E. Iwata, T. Hiraki, K.-W. Lee, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 86-87 2009
-
High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module
Peer-reviewed
A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K.-W. Lee, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 88-89 2009
-
Evaluation of Thin LSI Wafers by Capacitance-Time (C-t) Measurement for the Process Characterization of Three-Dimensional (3D) Integration
Peer-reviewed
J.-C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of International Conference on Solid State Devices and Materials (SSDM) 370-371 2009
-
In vivo Neural Signal Recording using Double-sided Si Neural Probe
Peer-reviewed
S. Lee, R. Kobayashi, S. Kanno, K. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka
Extended Abstract of International Conference on Solid State Devices and Materials (SSDM) 691-692 2009
-
Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module
Peer-reviewed
K-W Lee, S. Kanno, Y. Ohara, K. Kiyoyama, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 6-+ 2009
ISSN：
2164-0157
-
A Parallel ADC for High-Speed CMOS Image Processing System with 3D Structure
Peer-reviewed
K. Kiyoyama, Y. Ohara, K-W Lee, Y. Yang, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 101-+ 2009
ISSN：
2164-0157
-
Micro-Raman Spectroscopy Analysis and Capacitance-Time (C-t) Measurement of Thinned Silicon Substrates for 3D Integration
Peer-reviewed
J. -C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. -W Lee, T. Fukushima, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 189-193 2009
ISSN：
2164-0157
-
10 mu m Fine Pitch Cu/Sn Micro-Bumps for 3-D Super-Chip Stack
Peer-reviewed
Yuki Ohara, Akihiro Noriki, Katsuyuki Sukuma, Kang-Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 389-+ 2009
ISSN：
2164-0157
-
Development of a New Self-Assembled Die Bonder to Three-Dimensionally Stack Known Good Dies in Batch
Peer-reviewed
Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION 434-437 2009
ISSN：
2164-0157
-
Ultra Low Power Vertical MOS Devices for Fully Implantable Rtinal Prosthesis
Peer-reviewed
H. Kino, T. Hiraki, J-C. Bea, T. Fukushima, M. Koyanagi, T. Tanaka
3rd East Asian Pacific Student Workshop on Nano-Biomedical Engineering 112-113 2009
-
Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking
Invited
Peer-reviewed
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION 1112 121-130 2009
ISSN：
0272-9172
-
A Simple Device Allowing Silicon Microelectrode Insertion for Chronic Neural Recording in Primates
Peer-reviewed
Kazuhiro Sakamoto, Yoshia Matsuzaka, Tamotsu Suenaga, Hiroshi Watanabe, Risato Kobayashi, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka, Mitsumasa Koyanagi, Hajime Mushiake
2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING 104-+ 2009
DOI：
10.1109/NER.2009.5109245
ISSN：
1948-3546
-
Electrical characterization of MOS memory devices with self-assembled tungsten nano-dots dispersed in silicon nitride
Peer-reviewed
Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi
ECS Transactions 18 (1) 33-37 2009
DOI：
10.1149/1.3096423
ISSN：
1938-5862 1938-6737
-
3D System Integration Technology and 3D Systems
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Conference Proceedings Advanced Metallization Conference 2008 (AMC 2008) 479-485 2009
-
High-Density Through Silicon Vias for 3-D LSIs
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE IEEE 97 (1) 49-59 2009/01
DOI：
10.1109/JPROC.2008.2007463
ISSN：
0018-9219
eISSN：
1558-2256
-
3D heterogeneous opto-electronic integration technology for system-on-silicon (SOS)
Peer-reviewed
K. W. Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W. C. Jeong, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
Technical Digest - International Electron Devices Meeting, IEDM 22.2.4-534 2009
DOI：
10.1109/IEDM.2009.5424305
ISSN：
0163-1918
-
Impact of Remnant Stress/Strain and Metal Contamination in 3D-LSIs with Through-Si Vias Fabricated by Wafer Thinning and Bonding
Peer-reviewed
M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanagi
2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING 335-+ 2009
ISSN：
2380-9248
-
東北大学内連携プロジェクトによる多機能集積化半導体電極の開発と神経活動の多元的解読
Peer-reviewed
坂本一寛, 虫明元, 田中徹, 片山統裕, 小柳光正
BIO INDUSTRY 25 (12) 96-101 2008/12
Publisher:
ISSN：
0910-6545
-
LSI用光インターコネクションの技術動向と新展開
Peer-reviewed
田中徹
第17回フォトニックデバイス・応用技術報告書 25-42 2008/11
-
Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy
Peer-reviewed
M. Murugesan, J. C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
JOURNAL OF APPLIED PHYSICS 104 (7) 074316-1-074316-5 2008/10
DOI：
10.1063/1.2973665
ISSN：
0021-8979
-
Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride
Peer-reviewed
Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
APPLIED PHYSICS LETTERS 93 (11) 2008/09
DOI：
10.1063/1.2986409
ISSN：
0003-6951
eISSN：
1077-3118
-
Three-Dimensional Integration Technology Using Adhesive Injection Method and W/poly-Si TSV
Peer-reviewed
M.Koyanagi, T.Fukushima, T.Tanaka
Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008) 31-44 2008/05
-
Chip Self-Assembly Technique for 3D LSI Fabrication
Peer-reviewed
K.Kiyoyama, S.Kodama, D.Amano, T.Sugimura, F.Fukushima, T.Tanaka, M.Koyanagi
Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008) 205-216 2008/05
-
Study of Retinal Prosthesis with Three-Dimensionally Stacked LSI
Peer-reviewed
K.Sato, T.Fukushima, H.Tomiya, H.Kurino, T.Tanaka, M.Koyanagi
Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008) 229-239 2008/05
-
Tungsten through-silicon via technology for three-dimensional LSIs
Peer-reviewed
Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2801-2806 2008/04
DOI：
10.1143/JJAP.47.2801
ISSN：
0021-4922
-
Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate
Peer-reviewed
Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2936-2940 2008/04
DOI：
10.1143/JJAP.47.29361
ISSN：
0021-4922
eISSN：
1347-4065
-
Electrical characterization of metal-oxide-semiconductor memory devices with high-density self-assembled tungsten nanodots
Peer-reviewed
Yan-Li Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2680-2683 2008/04
DOI：
10.1143/JJAP.47.2680
ISSN：
0021-4922
-
Power supply system using electromagnetic induction for three-dimensionally stacked retinal prosthesis chip
Peer-reviewed
Ken Komiya, Risato Kobayashi, Takafumi Kobayashi, Keigo Sato, Takafumi Fukushima, Hiroshi Tomita, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 3244-3247 2008/04
DOI：
10.1143/JJAP.47.3244
ISSN：
0021-4922
-
New reconfigurable memory architecture for parallel image-processing LSI with three-dimensional structure
Peer-reviewed
Shigeo Kodama, Daijirou Amano, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS 47 (4) 2774-2778 2008/04
DOI：
10.1143/JJAP.47.2774
ISSN：
0021-4922
-
3D System Integration Technology and 3D Systems
Invited
Peer-reviewed
T. Fukushima, T. Tanaka, M. Koyanagi
Proceedings of Materials for Advanced Metallization Conference 2008 (MAM 2008) 37-38 2008/03
-
Microbump Formation on Flexible Substrate using Imprint Technology for Integrated Nano-System with 3D-LSIs
Peer-reviewed
Yusuke Yamada, Hirokozu Kikuchi, T. Fukushima, T. Tanaka, M. Koyanagi
The 5th International Conference on Mechanical Science based on Nanotechnology 71-74 2008/03
-
自己組織化ウェーハ張り合せによる三次元集積化技術
Invited
福島誉史, 田中徹, 小柳光正
応用物理学会分科会 シリコンテクノロジー 「多層配線」特集号 (99) 34-37 2008/02/08
-
3-D integration technology for realizing super chip
Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi
2008 Proceedings - 25th International VLSI Multilevel Interconnection Conference, VMIC 2008 197-202 2008
-
Deep trench etching for through-silicon vias in three-dimensional integration technology
Jun Liang, Hirokazu Kikuchi, Takayuki Konno, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Proceedings - Electrochemical Society PV 2008-1 674-678 2008
-
Three-Dimensional Super-Chip Integration Technology Using Self-Assembly Technique
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2008 IEEE SILICON NANOELECTRONICS WORKSHOP 23-24 2008
-
Three-dimensional integration technology using self-assembly technique and super-chip integration
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE 10-12 2008
ISSN：
2380-632X
eISSN：
2380-6338
-
New Three-Dimensional Integration Technology Using Reconfigured Wafers
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4 1180-1183 2008
-
A Closed-loop Power Control Function for Bio-implantable devices
Peer-reviewed
Kouji Kiyoyama, Yoshito Tanaka, Mashahiro Onoda, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE 321-+ 2008
-
Electrical conductance properties for magnetic tunnel junctions with MgO barriers
Peer-reviewed
K. Tamanoi, M. Sato, M. Oogane, Y. Ando, T. Tanaka, Y. Uehara, T. Uzumaki
J. Magn. Magn. Mater. 320 2959-2962 2008
DOI：
10.1016/j.jmmm.2008.08.004
-
Multichip self-assembly technique on flexible polymeric substrate
Peer-reviewed
T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS 1532-1537 2008
DOI：
10.1109/ECTC.2008.4550179
ISSN：
0569-5503
-
A Novel SPRAM (SPin-transfer torque RAM)-based Reconfigurable Logic Block for 3D-Stacked reconfigurable Spin Processor
Peer-reviewed
M. Sekikawa, K. Kiyoyama, H. Hasegawa, K. Miura, T. Fukushima, S. Ikeda, T. Tanaka, H. Ohno, M. Koyanagi
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST 935-+ 2008
DOI：
10.1109/IEDM.2008.4796645
-
New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method
Peer-reviewed
T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, A. Norki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST 499-502 2008
DOI：
10.1109/IEDM.2008.4796735
-
Development of Fully Implantable Retinal Prosthesis Module
T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi
Proceedings of the 3rd Tohoku-NUS Joint Symposium on Nano-Biomedical Engineering in the East Asian-Pacific Rim Region 19-22 2007/12
-
Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot
Peer-reviewed
Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 242-243 2007/09
-
Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs
Peer-reviewed
H. Kikuchi, Y. Yamada, A. M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 2007 482-483 2007/09
-
Development of Power Supply System for Three-Dimensionally Stacked Retinal Prosthesis Chip
Peer-reviewed
K. Komiya, R. Kobayashi, T. Kobayashi, K. Sato, T. Fukushima, H. Tomita, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 658-689 2007/09
-
Passive Optical Alignment with High Accuracy for Low-Loss Optical Interposer
Peer-reviewed
M. Fujiwara, S. Terada, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K.Takahama, T.Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 2007/09
-
Investigation of FePt Nano-Dots Fabricated by Self-Assembled Nano-Dot Deposition Method Using X-ray Photoelectron Spectroscopy
Peer-reviewed
M. Murugesan, J. C. Bea, C.K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T.Fukushima, T. Tanaka, M. Miyao, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 2007 1026-1027 2007/09
-
New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure
Peer-reviewed
S. Kodama, D. Amano, T. Sugimura, T.Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2007 International Conference on Solid State Device 2007 1067-1065 2007/09
-
Fabrication of Magnetic Tunnel Junction with FePt Nanodots for Magnetic Nanodot Memory
Peer-reviewed
C.K. Yin, M. Murugesan, J.C. Bea, T.Fukushima, T. Tanaka, M. Koyanagi
The 6 th International Semiconductor Technology Conference (ISTC 2007) 418-422 2007/05
-
Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap
Peer-reviewed
Takeaki Sugimura, Takeshi Sakaguchi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2226-2230 2007/04
DOI：
10.1143/JJAP.46.2226
ISSN：
0021-4922
-
Novel optical/electrical printed circuit board with polynorbornene optical waveguide
Peer-reviewed
Makoto Fujiwara, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2395-2400 2007/04
DOI：
10.1143/JJAP.46.23951
ISSN：
0021-4922
-
New magnetic nanodot memory with FePt nanodots
Peer-reviewed
Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Mikihiko Oogane, Takafumi Fukushima, Tetsu Tanaka, Shozo Kono, Seiji Samukawa, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2167-2171 2007/04
DOI：
10.1143/JJAP.46.2167
ISSN：
0021-4922
-
Evaluation of platinum-black stimulus electrode array for electrical stimulation of retinal cells in retinal prosthesis system
Peer-reviewed
Taiichiro Watanabe, Risato Kobayashi, Ken Komiya, Takafumi Fukushima, Hiroshi Tomita, Eriko Sugano, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 46 (4B) 2785-2791 2007/04
DOI：
10.1143/JJAP.46.2785
ISSN：
0021-4922
-
Highly Parallel Processing SystemUsing 3-Dimensional LSI
Invited
T. Tanaka, T. Fukushima, M. Koyanagi
International 3D-System Integration Conference 2007 2007/03
-
New three-dimensional integration technology to achieve a super chip
Peer-reviewed
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings 318-321 2007
DOI：
10.1109/ICSICT.2006.306217
-
A passive telemetry interface system with closed-loop power control function for body-implanted applications
Peer-reviewed
Koji Kiyoyama, Yoshito Tanaka, Masahiro Onoda, Tetsu Tanaka, Mitsumasa Koyanagi
2007 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE 37-+ 2007
-
Self-assembly process for chip-to-wafer three-dimensional integration
Peer-reviewed
T. Fulcushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS 836-+ 2007
DOI：
10.1109/ECTC.2007.373895
ISSN：
0569-5503
-
Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method
Peer-reviewed
C. K. Yin, H. Choi, J. C. Bea, M. Murugesan, J. H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi
2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings 4 401-404 2007
-
Evaluation of Electrical Stimulus Current Applied to Retinal Cells for Retinal Prosthesis
T. Watanabe, K. Motonami, T. Fukushima, H. Kurino, T. Tanaka, M. Koyanag
Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology 585-600 2007/01
-
Development of Low Power 3D Integration Technology using SOI Wafer for Retinal Prosthesis Chip
Y. Yamada, J. Deguchi, T. Watanabe, T. Fukushima, T. Tanaka, M. Koyanagi
Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology 613-622 2007/01
-
New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique
Peer-reviewed
Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 985-988 2007
DOI：
10.1109/IEDM.2007.4419119
ISSN：
2380-9248
-
High performance polynorbornene optical waveguide for Opto-Electric interconnections
Peer-reviewed
M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi
6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007 193-+ 2007
DOI：
10.1109/POLYTR.2007.4339166
-
Fully implantable retinal prosthesis chip with photodetector and stimulus current generator
Peer-reviewed
T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Watanabe, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 1015-+ 2007
DOI：
10.1109/IEDM.2007.4419127
-
Novel Retinal Prosthesis with Three-dimensionally Stacked LSI and Evaluation of Electrically Evoked Potential
T. Tanaka, T. Watanabe, H. Kikuchi, J. Deguchi, K. Motonami, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi
Proceedings of the 8th International Symposium of Future Medical Engineering Based on Bio-nanotechnology 33-36 2006/12
-
Three-dimensional integration technology based on wafer bonding with vertical buried interconnections
Peer-reviewed
Mitsumasa Koyanagi, Tomonori Nakamura, Yuusuke Yamada, Hirokazu Kikuchi, Takafumi Fukushima, Tetsu Tanaka, Hiroyuki Kurino
IEEE TRANSACTIONS ON ELECTRON DEVICES 53 (11) 2799-2808 2006/11
DOI：
10.1109/TED.2006.884079
ISSN：
0018-9383
eISSN：
1557-9646
-
Super-Chip Integration Based on Chip-to-Wafer 3D Integration Technology
Invited
T.Tanaka, T.Fukushima, M.Koyanagi
The 5th International Symposium on Microelectronics and Packaging 2006/10
-
Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration
Peer-reviewed
H. Kikuchi, Y. Yamada, A. M. Ali, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 490-491 2006/09
-
Low Power Spin-Transfer MRAM Writing Scheme with Selective World Line Bootstrap
Peer-reviewed
T. Sugimura, T. Sakaguchi, D. Amano, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 2006 602-603 2006/09
-
Novel Opto-Electro Printed Circuit Board with Polynorbornene Optical Waveguide
Peer-reviewed
M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 2006 840-841 2006/09
-
Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis by Using Platinum-Black (Pt-b) Stimulus Electrode Array
Peer-reviewed
T. Watanabe, K. Komiya, T. Kobayashi, R. Kobayashi, T. Fukushima, H. Tomita, E. Sugano, M. Sato, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 2006 890-891 2006/09
-
Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
Peer-reviewed
R. Kobayashi, T. Watanabe, K. Komiya, T. Fukushima, K. Sakamoto, H. Kurino, T. Tanaka, N. Katayama, H. Mushiake, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 898-899 2006/09
-
New Magnetic Nano-Dot Memory with FePt Nano-Dots
Peer-reviewed
C. K. Yin, J. C. Bea, M. Murugesan, M. Oogane, T. Fukushima, T. Tanaka, K. Natori, M. Miyao, M. Koyanagi
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials 2006 994-995 2006/09
-
Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method
Peer-reviewed
C. K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi, J. C. Bea, H. Choi, M. Nishijima, M. Miyao
APPLIED PHYSICS LETTERS 89 (6) 063109-1-063109-3 2006/08
DOI：
10.1063/1.2335588
ISSN：
0003-6951
-
A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory
Peer-reviewed
E Yoshida, T Tanaka
IEEE TRANSACTIONS ON ELECTRON DEVICES 53 (4) 692-697 2006/04
DOI：
10.1109/TED.870283
ISSN：
0018-9383
-
Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology
Peer-reviewed
T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi
Proceedings of International Conference on Electronics Packaging 220-224 2006/04
-
Semiconductor-on-Low-K Substrate Technology
Tetsu Tanaka, Yusuke Yamada, Mungi Park, Takafumi Fukushima, Mitsumasa Koyanagi
Proceedings - Electrochemical Society PV 2006-03 297-301 2006
-
New non-volatile memory with magnetic nano-dots
Mitsumasa Koyanagi, J. C. Bea, C. K. Yin, Takafumi Fukushima, Tetsu Tanaka
ECS Transactions 2 (1) 209-215 2006
ISSN：
1938-5862 1938-6737
-
Research and development of transistor structure in nano-scale region
Peer-reviewed
M. Koyanagi, Y. Yamada, M. Park, T. Fukushima, T. Tanaka
2006 INTERNATIONAL WORKSHOP ON NANO CMOS, PROCEEDINGS 34-37 2006
-
Development of new three-dimensional integration technology for retinal prosthesis
Peer-reviewed
Yusuke Yamada, Jun Deguchi, Taiichiro Watanabe, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 613-+ 2006
DOI：
10.1142/9781860948800_0067
-
Novel retinal prosthesis system with three dimensionally stacked LSI chip
Peer-reviewed
T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi
ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE 327-+ 2006
DOI：
10.1109/ESSDER.2006.307704
ISSN：
1930-8876
-
Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips
Hircrazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 385-+ 2006
-
Biologically inspired vision chip fabricated using 3-dimensional integration technology
Hiroyuki Kurino, Yoshihiro Nakagawa, Tomonori Nakamura, Yusuke Yamada, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 261-+ 2006
-
Development of low-power retinal prosthesis with photodetectors and stimulus current generators
Taiichiro Watanabe, Jun Deguchi, Takafumi Fukushinia, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 321-+ 2006
-
Neuromorphic analog circuits for three-dimensionally stacked vision chip
Jun Liang, Yoshihiro Nakagawa, Jun Deguchi, Jeoung-Chill Shim, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi
FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS 455-+ 2006
-
New Transistor Structure for Nano-Scale Range
Invited
T.Tanaka, M.Park, H.Oh, Y.Yamada, H.Choi, T.Fukushima, M.Koyanagi
10th Photonics and Semiconductor Device Reliability Workshop 2005/12/01
-
A study of highly scalable DG-FinDRAM
Peer-reviewed
E Yoshida, Miyashita, I, T Tanaka
IEEE ELECTRON DEVICE LETTERS 26 (9) 655-657 2005/09
DOI：
10.1109/LED.2005.853666
ISSN：
0741-3106
-
45-nm node CMOS integration with a novel STI structure and full-NCS/Cu interlayers for low-operation-power (LOP) applications
Peer-reviewed
M Okuno, K Okabe, T Sakuma, K Suzuki, T Miyashita, T Yao, H Morioka, M Terahara, Y Kojima, H Watatani, K Sugimoto, T Watanabe, Y Hayami, T Mon, T Kubo, Y Iba, Sugiura, I, H Fukutome, Y Morisaki, H Minakata, K Ikeda, S Kishii, N Shimizu, T Tanaka, S Asai, M Nakaishi, S Fukuyama, A Tsukune, M Yamabe, Hanyuu, I, M Miyajima, M Kase, K Watanabe, S Satoh, T Sugii
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST 57-60 2005
-
Scalability study on a capacitorless 1T-DRAM: From single-gate PD-SOI to double-gate FinDRAM
Invited
Peer-reviewed
T Tanaka, E Yoshida, T Miyashita
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST 919-922 2004
-
Highly reliable dynamic random access memory technology for application specific memory with dual nitrogen concentration gate oxynitrides using selective nitrogen implantation
Peer-reviewed
T Sugizaki, A Murakoshi, R Katsumata, M Kojima, T Tanaka, T Nakanishi, Y Nara
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 42 (4B) 1870-1873 2003/04
DOI：
10.1143/JJAP.42.1870
ISSN：
0021-4922
-
Process and device technologies for high-performance 0.13 mu m FCRAM
Peer-reviewed
Y Nara, S Nakamura, T Tanaka, K Hashimoto, D Matsunaga
FUJITSU SCIENTIFIC & TECHNICAL JOURNAL 39 (1) 62-71 2003
ISSN：
0016-2523
-
A design of a capacitorless 1T-DRAM cell using gate-induced drain leakage (GIDL) current for low-power and high-speed embedded memory
Peer-reviewed
E Yoshida, T Tanaka
2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 913-916 2003
-
A 65 nm CMOS technology with a high-performance and low-leakage transistor, a 0.55 mu m(2) 6T-SRAM cell and robust hybrid-ULK/Cu interconnects for mobile multimedia applications
Peer-reviewed
S Nakai, M Kojima, N Misawa, M Miyajima, S Asai, S Inagaki, Y Iba, T Ohba, M Kase, H Kitada, S Satoh, N Shimizu, Sugiura, I, F Sugimoto, Y Setta, T Tanaka, N Tamura, M Nakaishi, Y Nakata, J Nakahira, N Nishikawa, A Hasegawa, S Fukuyama, K Fujita, K Hosaka, N Horiguchi, H Matsuyama, T Minami, M Minamizawa, H Morioka, E Yano, A Yamaguchi, K Watanabe, T Nakamura, T Sugii
2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 285-288 2003
-
Suppression of SiN-induced boron penetration by using SiH-free silicon nitride films formed by tetrachlorosilane and ammonia
Peer-reviewed
M Tanaka, S Saida, Mizushima, I, F Inoue, M Kojima, T Tanaka, T Nakanishi, K Suguro, Y Tsunashima
IEEE TRANSACTIONS ON ELECTRON DEVICES 49 (9) 1526-1531 2002/09
DOI：
10.1109/TED.2002.802630
ISSN：
0018-9383
-
Impact of Thermal Budget Reduction on MOSFET Performance to Achieve High-speed and High-density DRAM-based System LSI
Peer-reviewed
E. Yoshida, T. Miyashita, H. Nitta, M. Tanaka, K. Ishii, Y. Akasaka, P. H. Chou, K. Hashimoto, Y. Kohyama, T. Tanaka, Y. Nara
Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials 732-733 2002/09
-
Highly Reliable DRAM Technology for ASM with Dual Nitrogen Concentration Gate Oxynitrides using Selective Nitrogen Implantation
Peer-reviewed
T. Sugizaki, A. Murakoshi, T. Tanaka, R. Katsumata, T. Nakanishi, Y. Nara
Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials 736-737 2002/09
-
Realization of 0.1 um buried-channel PMOSFETs by device restructuring using tilted well implantation technology
Peer-reviewed
T. Tanaka, Y. Momiyama, K. Goto, Y. Sambonsugi, M. Deura, T. Sugii
Symposium on VLSI Technology, Digest of Technical Papers 109-110 1999/06
-
High frequency characteristics of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage
Peer-reviewed
T Tanaka, Y Momiyama, T Sugii
IEICE TRANSACTIONS ON ELECTRONICS E82C (3) 538-543 1999/03
ISSN：
0916-8524
eISSN：
1745-1353
-
Ultra low energy boron implantation using cluster ions for decananometer MOSFETs
Peer-reviewed
T Sugii, K Goto, T Tanaka, J Matsuo, Yamada, I
APPLICATION OF ACCELERATORS IN RESEARCH AND INDUSTRY, PTS 1 AND 2 475 383-386 1999
ISSN：
0094-243X
-
Channel engineering using B10H14 ion implantation for low Vth and high SCE immunity of buried-channel PMOSFETs in 4-Gbit DRAMs and beyond
Peer-reviewed
T. Tanaka, H. Ogawa, K. Goto, K. Itabashi, T. Yamazaki, J. Matsuo, T. Sugii, I. Yamada
Symposium on VLSI Technology, Digest of Technical Papers 88-89 1998/06
-
A study of ultra shallow junction and tilted channel implantation for high performance 0.1 mu m pMOSFETs
Peer-reviewed
K Goto, M Kase, K Momiyama, H Kurata, T Tanaka, M Deura, Y Sanbonsugi, T Sugii
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST 631-634 1998
-
Fmax enhancement of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage
Peer-reviewed
T Tanaka, Y Momiyama, T Sugii
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST 423-426 1997
-
A high performance 50nm PMOSFET using decaborane (B10H14) ion implantation and 2-step activation annealing process
Peer-reviewed
K Goto, J Matsuo, Y Tada, T Tanaka, Y Momiyama, T Sugii, Yamada, I
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST 471-474 1997
-
A comparative study of advanced MOSFET concepts
Peer-reviewed
CH Wann, K Noda, T Tanaka, M Yoshida, CM Hu
IEEE TRANSACTIONS ON ELECTRON DEVICES 43 (10) 1742-1753 1996/10
DOI：
10.1109/16.536820
ISSN：
0018-9383
eISSN：
1557-9646
-
New Method of Extracting Inversion Layer Thickness and Charge Profile and Its Impact on Scaled MOSFETs
Peer-reviewed
T. Tanaka, T. Sugii, C. Hu
Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials 10-12 1996/08
-
Advanced SOI devices using CMP and wafer bonding
Peer-reviewed
H. Horie, S. Nakamura, Y. Nara, K. Suzuki, T. Tanaka, A. Ito, Y. Arimoto, N. Sasaki
Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials 1996 473-475 1996/08
-
A comparative study of advanced MOSFET structures
Peer-reviewed
CH Wann, R Tu, B Yu, CM Hu, K Noda, T Tanaka, M Yoshida, K Hui
1996 SYMPOSIUM ON VLSI TECHNOLOGY 32-33 1996
-
HIGH-SPEED AND LOW-POWER N(+)-P(+) DOUBLE-GATE SOI CMOS
Peer-reviewed
K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, T SUGII
IEICE TRANSACTIONS ON ELECTRONICS E78C (4) 360-367 1995/04
ISSN：
0916-8524
eISSN：
1745-1353
-
15ps cryogenic operation of 0.19-mu m-L(G)n+-p+ double-gate SOI CMOS
Peer-reviewed
T Sugii, T Tanaka, H Horie, K Suzuki
MICROELECTRONIC DEVICE AND MULTILEVEL INTERCONNECTION TECHNOLOGY 2636 74-82 1995
-
ULTRAFAST OPERATION OF 5TH-ADJUSTED P(+)-N(+) DOUBLE-GATE SOI MOSFETS
Peer-reviewed
T TANAKA, K SUZUKI, H HORIE, T SUGII
IEEE ELECTRON DEVICE LETTERS 15 (10) 386-388 1994/10
DOI：
10.1109/55.320976
ISSN：
0741-3106
-
SOURCE DRAIN CONTACT RESISTANCE OF SILICIDED THIN-FILM SOI MOSFETS
Peer-reviewed
K SUZUKI, T TANAKA, Y TOSAKA, T SUGII, S ANDOH
IEEE TRANSACTIONS ON ELECTRON DEVICES 41 (6) 1007-1012 1994/06
DOI：
10.1109/16.293314
ISSN：
0018-9383
eISSN：
1557-9646
-
Predicted Propagation Delay Time of Double-Gate SOI MOSFETs Based on a Scaling Theory
Peer-reviewed
K. Suzuki, Y. Tosaka, T. Tanaka, T. Sugii
International Conference on Advanced Microelectronic Device and Processing 599-602 1994/03
-
ANALYTICAL SURFACE-POTENTIAL EXPRESSION FOR THIN-FILM DOUBLE-GATE SOI MOSFETS
Peer-reviewed
K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO, T ITOH
SOLID-STATE ELECTRONICS 37 (2) 327-332 1994/02
DOI：
10.1016/0038-1101(94)90085-X
ISSN：
0038-1101
eISSN：
1879-2405
-
ULTRAFAST LOW-POWER OPERATION OF P+-N+ DOUBLE-GATE SOI MOSFETS
Peer-reviewed
T TANAKA, K SUZUKI, H HORIE, T SUGII
1994 SYMPOSIUM ON VLSI TECHNOLOGY 11-13 1994
-
SCALING THEORY FOR DOUBLE-GATE SOI MOSFETS
Peer-reviewed
K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO
IEEE TRANSACTIONS ON ELECTRON DEVICES 40 (12) 2326-2329 1993/12
DOI：
10.1109/16.249482
ISSN：
0018-9383
eISSN：
1557-9646
-
ANALYTICAL MODELS FOR SYMMETRICAL THIN-FILM DOUBLE-GATE SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR-FIELD-EFFECT-TRANSISTORS
Peer-reviewed
K SUZUKI, S SATOH, T TANAKA, S ANDO
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 32 (11A) 4916-4922 1993/11
ISSN：
0021-4922
-
2.Analytical Surface Potential Expression For Double-gate SOI MOSFETs
Peer-reviewed
K. Suzuki, T. Tanaka, H. Horie, Y. Arimoto, T. Itoh
International Workshop on VLSI Process and Device Modeling Technical Digest 150-151 1993/05
-
Fabrication of double-gate thin-film SOI MOSFETs using wafer bonding and polishing
Peer-reviewed
H. Horie, S. Ando, T. Tanaka, M. Imai, Y. Arimoto, S. Hijiya
Extended Abstracts of the 1991 International Conference on Solid State Devices 165-167 1991/08
-
P+ polysilicon gate P-MOSFETs using BCl implantation
Peer-reviewed
K. Oikawa, S. Ando, N. Ando, H. Horie, Y. Toda, T. Tanaka, S. Hijiya
Technical Digest - International Electron Devices Meeting, IEDM 1991- 79-82 1991
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/IEDM.1991.235419
ISSN：
0163-1918
-
Analysis of p+ poly Si double-gate thin-film SOI MOSFETs
Peer-reviewed
Tetsu Tanaka, Hirpshi Horie, Satmhi Ando, Shinpei Hijiya
Technical Digest - International Electron Devices Meeting, IEDM 1991- 683-686 1991
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI：
10.1109/IEDM.1991.235330
ISSN：
0163-1918
-
U-GROOVED SIT CMOS TECHNOLOGY WITH 3 FJ AND 49 PS (7 MW, 350 FJ) OPERATION
Peer-reviewed
J NISHIZAWA, N TAKEDA, S SUZUKI, T SUZUKI, T TANAKA
IEEE TRANSACTIONS ON ELECTRON DEVICES 37 (8) 1877-1883 1990/08
DOI：
10.1109/16.57139
ISSN：
0018-9383
eISSN：
1557-9646
