FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach

Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　45-48　2023/11/15

DOI： 10.1109/icsj59341.2023.10339614 　

FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display

Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE CPMT Symposium Japan (ICSJ)　49-52　2023/11/15

DOI： 10.1109/icsj59341.2023.10339585 　

Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction

Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)　1-4　2023/10/19

DOI： 10.1109/biocas58349.2023.10389082 　

High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials　2023/09/08

DOI： 10.7567/ssdm.2023.g-5-02 　

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last

Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

2023 IEEE International 3D Systems Integration Conference (3DIC)　499　1-4　2023/05/10

DOI： 10.1109/3dic57175.2023.10154930 　

Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)　25　596-600　2023/05

DOI： 10.1109/ectc51909.2023.00105 　

Gapless Chip-in-Carrier Integration and Injectable Ag/AgCl-Epoxy Reference Electrode for Bilayer Lipid Membrane Sensor Invited Peer-reviewed

Hiromichi Wakebe, Yuki Susumago, Takafumi Fukushima, Tetsu Tanaka

IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING　18　(3)　477-487　2023/03

DOI： 10.1002/tee.23744 　

3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration

Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

IEICE Electronics Express　19　(23)　20220363-20220363　2022/12/10

DOI： 10.1587/elex.19.20220363 　

eISSN： 1349-2543

Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)　519-523　2022/10/13

DOI： 10.1109/biocas54905.2022.9948542 　

Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/29

DOI： 10.7567/ssdm.2022.e-7-02 　

Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration

Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/28

DOI： 10.7567/ssdm.2022.k-4-02 　

Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip

Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.d-1-03 　

Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.k-1-01 　

Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis

Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials　2022/09/27

DOI： 10.7567/ssdm.2022.k-1-03 　

Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics

Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Journal of Vacuum Science & Technology B　40　(5)　052202-052202　2022/09

DOI： 10.1116/6.0001836 　

ISSN： 2166-2746

eISSN： 2166-2754

Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2022 IEEE International Interconnect Technology Conference (IITC)　2022/06/27

DOI： 10.1109/iitc52079.2022.9881288 　

Direct fabrication of SU‐8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor

Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka

Electronics and Communications in Japan　105　(2)　2022/06

DOI： 10.1002/ecj.12343 　

ISSN： 1942-9533

eISSN： 1942-9541

Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs

Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)　2022/05

DOI： 10.1109/ectc51906.2022.00225 　

Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　15　(11)　111004-1-111004-5　2022/04

DOI： 10.35848/1882-0786/ac9d24 　

Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System

Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2021 IEEE Biomedical Circuits and Systems Conference (BioCAS)　2021/10/07

DOI： 10.1109/biocas49922.2021.9645034 　

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan

2021 IEEE International 3D Systems Integration Conference (3DIC)　2021/10

DOI： 10.1109/3dic52383.2021.9687601 　

High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Applied Physics Express　14　(9)　2021/09

DOI： 10.35848/1882-0786/ac18b0 　

ISSN： 1882-0778

eISSN： 1882-0786

Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021/07/06

DOI： 10.1109/IITC51362.2021.9537540 　

Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2021 IEEE International Interconnect Technology Conference, IITC 2021　2021/07/06

DOI： 10.1109/IITC51362.2021.9537336 　

Direct fabrication of SU-8 microchannel across an embedded chip for potentiometric bilayer lipid membrane sensor

Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka

IEEJ Transactions on Sensors and Micromachines　141　(10)　327-335　2021

DOI： 10.1541/IEEJSMAS.141.327 　

ISSN： 1347-5525 1341-8939

Multimodal Functional Analysis Platform: 1. Ultrathin Fluorescence Endoscope Imaging System Enables Flexible Functional Brain Imaging

Makoto Osanai, Hideki Miwa, Atsushi Tamura, Satomi Kikuta, Yoshio Iguchi, Yuchio Yanagawa, Kazuto Kobayashi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake

Advances in Experimental Medicine and Biology　471-479　2021

DOI： 10.1007/978-981-15-8763-4_31 　

ISSN： 0065-2598

eISSN： 2214-8019

Multimodal Functional Analysis Platform: 2. Development of Si Opto-Electro Multifunctional Neural Probe with Multiple Optical Waveguides and Embedded Optical Fiber for Optogenetics. International-journal

Tetsu Tanaka, Norihiro Katayama, Kazuhiro Sakamoto, Makoto Osanai, Hajime Mushiake

Advances in experimental medicine and biology　1293　481-491　2021

DOI： 10.1007/978-981-15-8763-4_32 　

Multimodal Functional Analysis Platform: 3. Spherical Treadmill System for Small Animals. International-journal

Norihiro Katayama, Mitsuyuki Nakao, Tetsu Tanaka, Makoto Osanai, Hajime Mushiake

Advances in experimental medicine and biology　1293　493-500　2021

DOI： 10.1007/978-981-15-8763-4_33 　

Multimodal Functional Analysis Platform: 4. Optogenetics-Induced Oscillatory Activation to Explore Neural Circuits. International-journal

Hajime Mushiake, Tomokazu Ohshiro, Shin-Ichiro Osawa, Ryosuke Hosaka, Norihiro Katayama, Tetsu Tanaka, Hiromu Yawo, Makoto Osanai

Advances in experimental medicine and biology　1293　501-509　2021

DOI： 10.1007/978-981-15-8763-4_34 　

On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO<inf>2</inf>

Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

Journal of Polymer Science　58　(16)　2248-2258　2020/08/15

DOI： 10.1002/pol.20200094 　

ISSN： 2642-4150

eISSN： 2642-4169

Significant Die-Shift Reduction and μlED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka

IEEE Transactions on Components, Packaging and Manufacturing Technology　10　(8)　1419-1422　2020/08

DOI： 10.1109/TCPMT.2020.3009640 　

ISSN： 2156-3950

eISSN： 2156-3985

Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　2020-June　1199-1204　2020/06

DOI： 10.1109/ECTC32862.2020.00192 　

ISSN： 0569-5503

RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Proceedings - Electronic Components and Technology Conference　2020-June　811-816　2020/06

DOI： 10.1109/ECTC32862.2020.00132 　

ISSN： 0569-5503

7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　2020-June　1453-1458　2020/06

DOI： 10.1109/ECTC32862.2020.00230 　

ISSN： 0569-5503

Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)　2020/04

DOI： 10.1109/edtm47692.2020.9118027 　

Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory Peer-reviewed

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

Japanese Journal of Applied Physics　59　(SG)　2020/04

DOI： 10.35848/1347-4065/ab6867 　

ISSN： 0021-4922

eISSN： 1347-4065

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration Peer-reviewed

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　59　(SB)　2020/02/01

DOI： 10.7567/1347-4065/ab4f3c 　

ISSN： 0021-4922

eISSN： 1347-4065

Generation of STDP with non-volatile tunnel-FET memory for large-scale and low-power spiking neural networks

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　8　1266-1271　2020

DOI： 10.1109/JEDS.2020.3025336 　

eISSN： 2168-6734

PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System Peer-reviewed

Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama

BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings　2019/10

DOI： 10.1109/BIOCAS.2019.8919027 　

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation Peer-reviewed

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058843 　

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing Peer-reviewed

Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058856 　

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs Peer-reviewed

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058841 　

Development of 3D-IC Embedded Flexible Hybrid System Peer-reviewed

Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058880 　

Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019　2019/10

DOI： 10.1109/3DIC48104.2019.9058838 　

Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application Peer-reviewed

Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Proceedings - Electronic Components and Technology Conference　2019-May　264-269　2019/05

DOI： 10.1109/ECTC.2019.00046 　

ISSN： 0569-5503

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration Peer-reviewed

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019　17　2019/05

DOI： 10.23919/LTB-3D.2019.8735115 　

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application Peer-reviewed

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 International Conference on Electronics Packaging, ICEP 2019　265-267　2019/04

DOI： 10.23919/ICEP.2019.8733416 　

Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate Peer-reviewed

Young Taek Oh, Jae Min Sim, Nguyen Van Toan, Hisashi Kino, Takahito Ono, Tetsu Tanaka, Yun Heub Song

IEEE Transactions on Electron Devices　66　(4)　1741-1746　2019/04

DOI： 10.1109/TED.2019.2900155 　

ISSN： 0018-9383

Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019　222-224　2019/03

DOI： 10.1109/EDTM.2019.8731161 　

High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs

Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE Transactions on Components, Packaging and Manufacturing Technology　9　(1)　181-188　2019/01

DOI： 10.1109/tcpmt.2018.2871764 　

ISSN： 2156-3950

eISSN： 2156-3985

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application Peer-reviewed

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)　265-267　2019

Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter Peer-reviewed

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE ELECTRON DEVICE LETTERS　40　(1)　95-98　2019/01

DOI： 10.1109/LED.2018.2884452 　

ISSN： 0741-3106

eISSN： 1558-0563

Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter Peer-reviewed

Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

IEEE Electron Device Letters　40　(1)　95-98　2019/01

DOI： 10.1109/LED.2018.2884452 　

ISSN： 0741-3106

The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS Peer-reviewed

Young Taek Oh, Jae Min Sim, Hisashi Kino, Deok Kee Kim, Tetsu Tanaka, Yun Heub Song

IEEE Journal of the Electron Devices Society　7　382-387　2019

DOI： 10.1109/JEDS.2019.2901298 　

eISSN： 2168-6734

Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC Peer-reviewed

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

IEEE Journal of the Electron Devices Society　7　1225-1231　2019

DOI： 10.1109/JEDS.2019.2936180 　

eISSN： 2168-6734

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips Peer-reviewed

Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka

2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings　2018/12/20

DOI： 10.1109/BIOCAS.2018.8584776 　

Process Integration for FlexTrate ^TM Peer-reviewed

Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 International Flexible Electronics Technology Conference, IFETC 2018　2018/12/19

DOI： 10.1109/IFETC.2018.8584029 　

The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures Peer-reviewed

Young Taek Oh, Il Pyo Roh, Hisashi Kino, Tetsu Tanaka, Yun Heub Song

IEEE Transactions on Electron Devices　65　(10)　4313-4319　2018/10

DOI： 10.1109/TED.2018.2865007 　

ISSN： 0018-9383

Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs Peer-reviewed

Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka

2018 IEEE International Interconnect Technology Conference, IITC 2018　135-137　2018/08/08

DOI： 10.1109/IITC.2018.8430390 　

TSV liner dielectric technology with spin-on low-k polymer Peer-reviewed

S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018　346-349　2018/06/06

DOI： 10.23919/ICEP.2018.8374320 　

Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system Peer-reviewed

Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018/04/01

DOI： 10.7567/JJAP.57.04FM11 　

ISSN： 1347-4065 0021-4922

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　57　(4)　2018/04/01

DOI： 10.7567/JJAP.57.04FE07 　

ISSN： 1347-4065 0021-4922

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current

Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018/03/23

DOI： 10.1109/BIOCAS.2017.8325165 　

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip

Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings　2018-　1-4　2018/03/23

DOI： 10.1109/BIOCAS.2017.8325552 　

マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発 Peer-reviewed

菅原 陽平, 木野 久志, 福島 誉史, 田中 徹

電子情報通信学会論文誌 C　J101-C　(2)　58-65　2018/02/01

ISSN： 1881-0217

Self-Assembly Technologies for FlexTrate (TM)

Takafumi Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)　1836-1841　2018

DOI： 10.1109/ECTC.2018.00275 　

ISSN： 0569-5503

eISSN： 2377-5726

Study of Al-doped ZnO transparent stimulus electrode for fully implantable retinal prosthesis with three-dimensionally stacked retinal prosthesis chip Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Sensors and Materials　30　(2)　225-234　2018

DOI： 10.18494/SAM.2018.1741 　

ISSN： 0914-4935

Development of Biosignal Recording Board System with Agile Control of Circuit Characteristics for Various Biosignals Peer-reviewed

Keita Ito, Takaharu Tani, Takuma Iwagami, Satoru Nishino, Koji Kiyoyama, Tetsu Tanaka

ELECTRONICS AND COMMUNICATIONS IN JAPAN　101　(1)　47-54　2018/01

DOI： 10.1002/ecj.12021 　

ISSN： 1942-9533

eISSN： 1942-9541

Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration Peer-reviewed

Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(12)　5065-5072　2017/12

DOI： 10.1109/TED.2017.2767598 　

ISSN： 0018-9383

eISSN： 1557-9646

Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Proceedings - Electronic Components and Technology Conference　1523-1528　2017/08/01

DOI： 10.1109/ECTC.2017.209 　

ISSN： 0569-5503

New concept of TSV formation methodology using Directed Self-Assembly (DSA) Peer-reviewed

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017/07/05

DOI： 10.1109/3DIC.2016.7970022 　

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications Peer-reviewed

Kangwook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017/07/05

DOI： 10.1109/3DIC.2016.7970027 　

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017/07/05

DOI： 10.1109/3DIC.2016.7970031 　

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology Peer-reviewed

Murugesan Mariappan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016　2017/07/05

DOI： 10.1109/3DIC.2016.7970017 　

Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission Peer-reviewed

Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka

IITC 2017 - 2017 IEEE International Interconnect Technology Conference　2017/07/05

DOI： 10.1109/IITC-AMC.2017.7968936 　

3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration Peer-reviewed

Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　64　(7)　2912-2918　2017/07

DOI： 10.1109/TED.2017.2705562 　

ISSN： 0018-9383

eISSN： 1557-9646

3D-IC technology and reliability challenges Peer-reviewed

Tetsu Tanaka

17th International Workshop on Junction Technology, IWJT 2017　51-53　2017/06/30

DOI： 10.23919/IWJT.2017.7966513 　

Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces Peer-reviewed

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Japanese Journal of Applied Physics　56　(4)　04CM04-1-04CM04-4　2017/04/01

DOI： 10.7567/JJAP.56.04CM04 　

ISSN： 1347-4065 0021-4922

Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties Peer-reviewed

Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

Japanese Journal of Applied Physics　56　(4)　04CM05-1-04CM05-5　2017/04/01

DOI： 10.7567/JJAP.56.04CM05 　

ISSN： 1347-4065 0021-4922

Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber Peer-reviewed

Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　56　(4)　04CM08-1-04CM08-4　2017/04

DOI： 10.7567/JJAP.56.04CM08 　

ISSN： 0021-4922

eISSN： 1347-4065

Development of Integrated Photoplethysmography Sensor System for Trans-Nail Pulse-Rate Monitoring Peer-reviewed

Qian Zhengyang, Takezawa Yoshiki, Shimokawa Kenji, Ito Keita, Nishino Satoru, Kiyoyama Koji, Tanaka Tetsu

Transactions of Japanese Society for Medical and Biological Engineering　55　(5)　464-464　2017

DOI： 10.11239/jsmbe.55Annual.464 　

Development of biosignal recording board system with agile control of circuit characteristics for various biosignals Peer-reviewed

Keita Ito, Takaharu Tani, Takuma Iwagami, Satoru Nishino, Koji Kiyoyama, Tetsu Tanaka

IEEJ Transactions on Electronics, Information and Systems　137　(2)　348-353　2017

DOI： 10.1541/ieejeiss.137.348 　

ISSN： 1348-8155 0385-4221

三次元集積用テンポラリー接着剤の特性とウエハエッジの影響 Peer-reviewed

福島 誉史, マリアッパン ムルゲサン, 裵 志哲, 李 相勲, 李 康旭, 田中 徹, 小柳 光正

電子情報通信学会誌C　J99-C　(11)　493-500　2016/11/01

ISSN： 1881-0217

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Peer-reviewed

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines　7　(10)　184-1-184-18　2016/10

DOI： 10.3390/mi7100184 　

ISSN： 2072-666X

Fundamental characteristics of AZO transparent stimulus electrode for fully-implantable subretinal prosthesis

Kenji Shimokawa, Taiki Goto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016年第77回応用物理学会秋季学術講演会講演予稿集　77th　11-408-11-408　2016/09/16

Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique Peer-reviewed

Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　467-468　2016/09

Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber Peer-reviewed

Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　389-390　2016/09

Analysis of Charge Injection Characteristics of Stimulus Electrode with Wide-Range Analog Front-end for Body-Implanted Devices Peer-reviewed

Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　393-394　2016/09

Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring Peer-reviewed

Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials　409-410　2016/09

3D Interconnect echnologies Based on TSV and Fine-Pitch Electrode Invited Peer-reviewed

福島誉史, 李康旭, 田中徹, 小柳光正

Journal of the Surface Finishing Society of Japan　67　(8)　414-420　2016/08/01

DOI： 10.4139/sfj.67.414 　

ISSN： 0915-1869

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　6　(7)　1002-1008　2016/07

DOI： 10.1109/TCPMT.2016.2575070 　

ISSN： 2156-3950

eISSN： 2156-3985

Influence of Cu-TSVs, CuSnand PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips Peer-reviewed

Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, Tetsu Tanaka

2016 Proceedings 66th Electronic Components and Technology Conference　50-55　2016/06

Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　2016/04

DOI： 10.7567/JJAP.55.04EC07 　

ISSN： 0021-4922

eISSN： 1347-4065

Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　04EC03-1-04EC03-4　2016/04

DOI： 10.7567/JJAP.55.04EC03 　

ISSN： 0021-4922

eISSN： 1347-4065

Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system Peer-reviewed

Takuma Iwagami, Takaharu Tani, Keita Ito, Satoru Nishino, Takuya Harashima, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　55　(4)　04EM12-1-04EM12-5　2016/04

DOI： 10.7567/JJAP.55.04EM12 　

ISSN： 0021-4922

eISSN： 1347-4065

Evaluation of Local Bending Stress Effects on 3DIC with Retention Time Measurement of DRAM Cell Array

谷川 星野, 木野久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会 講演予稿集　63rd　11-130　2016/03/20

Development of Si Neural Probe with Piezoresistive Strain Sensor

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

63回応用物理学会春季学術講演会予稿集　63rd　10-311-10-311　2016/03/20

Development of Flexible Si Neural Probe for Deep Brain Insertion and In-vivo Recording

森川 拓実, 谷 卓治, 原島 卓也, 鈴木 雄策, 木野 久志, 福島 誉史, 田中 徹

第63回応用物理学会春季学術講演会予稿集　63rd　2016/03/20

Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　55　(4S)　04EC07-1-04EC07-4　2016/03/17

DOI： 10.7567/JJAP.55.04EC07 　

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　25　(1)　91-100　2016/02

DOI： 10.1109/JMEMS.2015.2480787 　

ISSN： 1057-7157

eISSN： 1941-0158

New multichip-to-wafer 3D integration technology using Self-Assembly and Cu nano-pillar hybrid bonding Peer-reviewed

M. Koyanagi, K. W. Lee, T. Fukushima, T. Tanaka

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2016 - Proceedings　338-341　2016

DOI： 10.1109/ICSICT.2016.7998914 　

Impact of Interconnections on Vertically Stacked 20 mu m-thick DRAM Chips Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, M. Koyanagi, S. Tanikawa, T. Tanaka

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　50-55　2016

DOI： 10.1109/ECTC.2016.255 　

ISSN： 0569-5503

Non-Conductive Film Underfill for 3D Integration of 20 mu m-Thick LSI Wafers with Fine Cu-TSVs Peer-reviewed

M. Murugesan, J. C. Bea, M. Koyanagi, Y. Ito, T. Fukushima, T. Tanaka

2016 27TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　466-471　2016

ISSN： 1078-8743

Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, H. Hashimoto, S. H. Lee, M. Motoyoshi, T. Tanaka, K. W. Lee, M. Koyanagi

2016 International Conference on Electronics Packaging (ICEP)　265-269　2016

Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging Invited

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MRS Advances　1　(34)　2355-2366　2016

DOI： 10.1557/adv.2016.528 　

ISSN： 2059-8521

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration Peer-reviewed

Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　37　(1)　81-83　2016/01

DOI： 10.1109/LED.2015.2502584 　

ISSN： 0741-3106

eISSN： 1558-0563

Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip Peer-reviewed

S. Tanikawa, H. Kino, T. Fukushima, K-W. Lee, M. Koyanagi, T. Tanaka

2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　6B-1-1-6B-1-6　2016

DOI： 10.1109/IRPS.2016.7574561 　

ISSN： 1541-7026

Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, H. Kino, T. Tanaka, M. Murugesan, J. Bea, H. Hashimoto, K. Lee, M. Koyanagi

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　289-294　2016

DOI： 10.1109/ECTC.2016.298 　

ISSN： 0569-5503

Novel W2W/C2W hybrid bonding technology with high stacking yield using ultra-fine size, ultra-high density Cu nano-pillar (CNP) for exascale 2.5D/3D integration Peer-reviewed

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi, R. Suresh, X. Wu

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　350-355　2016

DOI： 10.1109/ECTC.2016.10 　

ISSN： 0569-5503

Highly Sensitive Pressure Sensor with Silicon-On-Nothing (SON) MOSFET for Sensor Integrated Heterogeneous System Peer-reviewed

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW)　186-187　2016

DOI： 10.1109/SNW.2016.7578043 　

Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current Peer-reviewed

Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, Tetsu Tanaka

PROCEEDINGS OF 2016 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS)　304-307　2016

DOI： 10.1109/BioCAS.2016.7833792 　

ISSN： 2163-4025

Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration Peer-reviewed

T. Fukushima, K. W. Lee, T. Tanaka, M. Koyanagi

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14　75　(9)　285-290　2016

DOI： 10.1149/07509.0285ecst 　

ISSN： 1938-5862

電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム　60-60　2015/12/17

柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-

鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹

平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム　60-60　2015/12/17

三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価

谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹

公益社団法人 応用物理学会東北支部 第70回学術講演会プログラム　70th　2015/12/03

シリコン貫通配線（ TSV ）と三次元集積化技術の研究開発動向 Invited

福島 誉史, 李 康旭, 田中 徹, 小柳 光正

第32回「センサ・マイクロマシンと応用システム」シンポジウム予稿集　32nd　28pm3-D-1-1-28pm3-D-1-6　2015/10/28

Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC Peer-reviewed

Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　56-57　2015/09/27

Development of Si Opto-Neural Probe having Multiple Optical Waveguides with Reflection Mirror for Cerebrum Cortex Stimulation

原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

第76回応用物理学会秋季学術講演会予稿集　76th　p11-381-p11-381　2015/09/15

DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価

谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹

2015年第76回応用物理学会秋季学術講演会講演予稿集　76th　12-124　2015/09/14

3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価

菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹

第76回応用物理学会秋季学術講演会講演予稿集　76th　12-123-12-123　2015/09/14

Study of local stress induced by circuit operation heating in 3D IC

木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹

第25回マイクロエレクトロニクスシンポジウム論文集　25th　355-358　2015/09/03

ISSN： 2434-396X

Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications Peer-reviewed

Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, Kang-Wook Lee

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　70-71　2015/09

Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array Peer-reviewed

Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　790-791　2015/09

Area-Efficient and Wide-Range Impedance Analysis Circuit for Multichannel High Quality Brain Signal Recording System Peer-reviewed

Takuma Iwagami, Takaharu Tani, Keita ito, Satoru Nishino, Takuya Harashima, Koji Kiyoyama, Tetsu Tanaka

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials　822-823　2015/09

高分子材料を用いた三次元集積技術I：セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ

伊藤有香, 福島誉史, Murugesan Mariappan, 裵 志哲, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　408-409　2015/03/17

ISSN： 1880-4616

高分子材料を用いた三次元集積技術II：ビアラストTSV形成のための高耐熱テンポラリー無機接着層

橋口日出登, 福島誉史, 裵 志哲, Murugesan Mariappan, 李 康旭, 田中 徹, 小柳光正

第29回 エレクトロニクス実装学会春季講演大会　29th　410-412　2015/03/17

ISSN： 1880-4616

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　54　(3)　030206-1-030206-6　2015/03

DOI： 10.7567/JJAP.54.030206 　

ISSN： 0021-4922

eISSN： 1347-4065

Applications of three-dimensional LSI Invited Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka

MRS BULLETIN　40　(3)　242-247　2015/03

DOI： 10.1557/mrs.2015.33 　

ISSN： 0883-7694

eISSN： 1938-1425

Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner Peer-reviewed

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

ECS Transactions　64　(40)　63-75　2015

DOI： 10.1149/06440.0063ecst 　

ISSN： 1938-6737 1938-5862

Development of glyoxylic acid based electroless copper deposition on ruthenium Peer-reviewed

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

ECS Transactions　64　(40)　41-55　2015

DOI： 10.1149/06440.0041ecst 　

ISSN： 1938-6737 1938-5862

Role of bath composition in electroless Cu seeding on Co liner for through-Si vias Peer-reviewed

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka

ECS Journal of Solid State Science and Technology　4　(1)　N3108-N3112　2015

DOI： 10.1149/2.0131501jss 　

ISSN： 2162-8777 2162-8769

Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University Peer-reviewed

K. W. Lee, J. C. Bea, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　2015

ISSN： 2164-0157

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM Peer-reviewed

Kang-Wook Lee, Ji-Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2015

ISSN： 1541-7026

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　260-263　2015

Consideration of Micro bump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　260-263　2015

DOI： 10.1109/3DIC.2015.7334596 　

ISSN： 2164-0157

Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration Peer-reviewed

K-W Lee, C. Nagai, J-C Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　185-188　2015

DOI： 10.1109/IEDM.2015.7409652 　

Development of Highly-Reliable Microbump Bonding Technology using Self-Assembly of NCF-Covered KGDs and Multi -Layer 3D Stacking Challenges Peer-reviewed

Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　336-341　2015

DOI： 10.1109/ECTC.2015.7159614 　

ISSN： 0569-5503

Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV Peer-reviewed

Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　822-827　2015

DOI： 10.1109/ECTC.2015.7159687 　

ISSN： 0569-5503

Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration Peer-reviewed

H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1458-1463　2015

DOI： 10.1109/ECTC.2015.7159789 　

ISSN： 0569-5503

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers Peer-reviewed

K. W. Lee, C. Nagai, A. Nakamura, H. Aizawa, J. C. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　31-34　2015

DOI： 10.1109/3DIC.2015.7334471 　

ISSN： 2164-0157

Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors Peer-reviewed

Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　59-61　2015

DOI： 10.1109/3DIC.2015.7334557 　

ISSN： 2164-0157

Transfer and Non-Transfer Stacking Technologies Based on Chip-to-Wafer Self-Asembly for High-Throughput and High-Precision Alignment and Microbump Bonding Peer-reviewed

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　134-137　2015

DOI： 10.1109/3DIC.2015.7334578 　

ISSN： 2164-0157

Mitigating Thermo Mechanical Stress in High Density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via _ mu-RS and mu-XRD Study Peer-reviewed

M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka

2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015)　179-183　2015

DOI： 10.1109/3DIC.2015.7334579 　

ISSN： 2164-0157

Lower invasive in vivo brain insertion of the Si neural probe with triangular shank and sharpened tip Peer-reviewed

Takuya Harashima, Takaharu Tani, Hisashi Kino, Norihiro Katayama, Tetsu Tanaka

Extended Abstracts of the 2014 International Conference on Solid State Device and Materials　606-607　2014/09

Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC Peer-reviewed

Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstracts of the 2014 International Conference on Solid State Device and Materials　726-727　2014/09

Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording Peer-reviewed

Takaharu Tani, Hideki Naganuma, Takuya Harashima, Takuma Iwagami, Hisashi Kino, Koji Kiyoyama, Minna Kellomäki, Jari Hyttinen, Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　377-O-378　2014/08/17

DOI： 10.11239/jsmbe.52.O-377 　

ISSN： 1347-443X 1881-4379

Development of chip-surface stimulus electrode array for fully-implantable subretinal prosthesis chip Peer-reviewed

Yuichiro Sasaki, Takuji Suzuki, Takuma Iwagami, Takaharu Tani, Hideki Naganuma, Hisashi Kino, Jari Hyttinen, Minna Kellomaki, Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　253-O-254　2014/08/17

DOI： 10.11239/jsmbe.52.O-253 　

ISSN： 1347-443X 1881-4379

Development of Si opto-neural probe with multiple optical stimulation function Peer-reviewed

Tetsu Tanaka

Transactions of Japanese Society for Medical and Biological Engineering　52　75　2014/08/17

DOI： 10.11239/jsmbe.52.OS-75 　

ISSN： 1347-443X 1881-4379

Evaluation of sink and source patterns in the prefrontal cortex of a monkey Peer-reviewed

Kazuhiro Sakamoto, Norihiko Kawaguchi, Kohei Yagi, Norihiro Katayama, Tetsu Tanaka, Hajime Mushiake

Transactions of Japanese Society for Medical and Biological Engineering　52　73-OS-74　2014/08/17

DOI： 10.11239/jsmbe.52.OS-73 　

ISSN： 1347-443X 1881-4379

Via Reveal and Backside Processing Peer-reviewed

Mitsumasa Koyanagi, Tetsu Tanaka

Handbook of 3D Integration　3　227-240　2014/07/21

DOI： 10.1002/9783527670109.ch17 　

Envelope tracking CMOS power amplifier with high-speed CMOS envelope amplifier for mobile handsets Peer-reviewed

Eiji Yoshida, Yasufumi Sakai, Kazuaki Oishi, Hiroshi Yamazaki, Toshihiko Mori, Shinji Yamaura, Kazuo Suto, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　53　(4)　04EE19-1-04EE19-4　2014/04

DOI： 10.7567/JJAP.53.04EE19 　

ISSN： 0021-4922

eISSN： 1347-4065

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration Peer-reviewed

Kang-Wook Lee, Ji-Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY　14　(1)　451-462　2014/03

DOI： 10.1109/TDMR.2013.2258022 　

ISSN： 1530-4388

eISSN： 1558-2574

Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice Peer-reviewed

Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　540-547　2014/02

DOI： 10.1109/TED.2013.2295463 　

ISSN： 0018-9383

eISSN： 1557-9646

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film Peer-reviewed

Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　533-539　2014/02

DOI： 10.1109/TED.2013.2294831 　

ISSN： 0018-9383

eISSN： 1557-9646

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM Peer-reviewed

Kang-Wook Lee, Seiya Tanikawa, Mariappan Murugesan, Hideki Naganuma, Ji-Choel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　61　(2)　379-385　2014/02

DOI： 10.1109/TED.2013.2295244 　

ISSN： 0018-9383

eISSN： 1557-9646

A New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs Peer-reviewed

H. Hashiguchi, T. Fukushima, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)　74-77　2014

Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration Peer-reviewed

H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　14-14　2014

A Resilient 3-D Stacked Multicore Processor Fabricated Using Die-level 3-D Integration and Backside TSV Technologies Peer-reviewed

K-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, M. Murugesan, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　304-308　2014

ISSN： 0569-5503

Micro-XRD Investigation of Fine-Pitch Cu-TSV Induced Thermo-Mechanical Stress in High-Density 3D-LSI Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, Y. Imai, S. Kimura, T. Tanaka

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014

ISSN： 2164-0157

Impacts of Cu Contamination in 3D Integration Process on Memory Retention Characteristics in Thinned DRAM Chip Peer-reviewed

Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichel Bea, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM　2014

ISSN： 1541-7026

Surface-Tension Driven Self-Assembly for VCSEL Chip Bonding to Achieve 3D and Hetero Integration Peer-reviewed

Y. Ito, T. Fukushima, K. -W. Lee, K. Choki, T. Tanaka, M. Koyanagi

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)　15-15　2014

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV Peer-reviewed

Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　35　(1)　114-116　2014/01

DOI： 10.1109/LED.2013.2287879 　

ISSN： 0741-3106

eISSN： 1558-0563

Electroless Cu Seed on Ru and Co Liners in High Aspect Ratio TSV Peer-reviewed

F. Inoue, H. Philipsen, M. H. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf, T. Tanaka

2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC)　207-209　2014

DOI： 10.1109/IITC.2014.6831871 　

Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits Peer-reviewed

Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　636-640　2014

DOI： 10.1109/ECTC.2014.6897353 　

ISSN： 0569-5503

eISSN： 2377-5726

Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly Peer-reviewed

H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K. -W. Lee, T. Tanaka, M. Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　856-861　2014

DOI： 10.1109/ECTC.2014.6897386 　

ISSN： 0569-5503

Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive Peer-reviewed

Hisashi Kino, Hideto Hashiguchi, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Kangwook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1110-1115　2014

DOI： 10.1109/ECTC.2014.6897428 　

ISSN： 0569-5503

Direct Multichip-to-Wafer 3D Integration Technology Using Flip-Chip Self-Assembly of NCF-Covered Known Good Dies Peer-reviewed

Yuka Ito, Mariappan Murugesan, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1148-1153　2014

DOI： 10.1109/ECTC.2014.6897434 　

ISSN： 0569-5503

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent Peer-reviewed

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Tetsu Tanaka

JOURNAL OF THE ELECTROCHEMICAL SOCIETY　161　(14)　D768-D774　2014

DOI： 10.1149/2.0361414jes 　

ISSN： 0013-4651

eISSN： 1945-7111

Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration Peer-reviewed

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014

DOI： 10.1109/3DIC.2014.7152145 　

ISSN： 2164-0157

Cu Seeding Using Electroless Deposition on Ru Liner for High Aspect Ratio Through-Si Vias Peer-reviewed

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014

DOI： 10.1109/3DIC.2014.7152147 　

ISSN： 2164-0157

Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV Peer-reviewed

K. W. Lee, C. Nagai, A. Nakamura, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2014

DOI： 10.1109/3DIC.2014.7152153 　

ISSN： 2164-0157

Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology Peer-reviewed

K-W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J-C Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　669-672　2014

DOI： 10.1109/IEDM.2014.7047128 　

Degradation of Memory Retention Characteristics in DRAM Chip by Si Thinning for 3-D Integration Peer-reviewed

Kangwook Lee, Seiya Tanikawa, Mariappine Murugesan, Hideki Naganuma, Haro Shimamoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　34　(8)　1038-1040　2013/08

DOI： 10.1109/LED.2013.2265336 　

ISSN： 0741-3106

eISSN： 1558-0563

Development and In Vivo Evaluation of Conductive Polymer (PEDOT) Stimulus Electrodes for Fully Implantable Retinal Prosthesis Peer-reviewed

Chikashi kigure, Hideki Naganuma, Yuichiro Sasaki, Hiroshi Kino, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CL03-1-04CL03-5　2013/04/22

DOI： 10.7567/JJAP.52.04CL03 　

Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration Peer-reviewed

Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CB11-1-04CB11-6　2013/04/22

DOI： 10.7567/JJAP.52.04CB1 　

Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis Peer-reviewed

Chikashi Kigure, Hideki Naganuma, Yuichiro Sasaki, Hisashi Kino, Hiroshi Tomita, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　2013/04

DOI： 10.7567/JJAP.52.04CL03 　

ISSN： 0021-4922

eISSN： 1347-4065

Investigation of local bending stress effect on complementary metal-oxide-semiconductor characteristics in thinned si chip for chip-to-wafer three-dimensional integration Peer-reviewed

Hisashi Kino, Ji Choel Bea, Mariappan Murugesan, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Japanese Journal of Applied Physics　52　(4)　04CB11-1-04CB11-5　2013/04

DOI： 10.7567/JJAP.52.04CB11 　

ISSN： 0021-4922 1347-4065

Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　04CB09-1-04CB09-6　2013/04

DOI： 10.7567/JJAP.52.04CB09 　

ISSN： 0021-4922

eISSN： 1347-4065

Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain Peer-reviewed

Sanghoon Lee, Soichiro Kanno, Hisashi Kino, Tetsu Tanaka

JAPANESE JOURNAL OF APPLIED PHYSICS　52　(4)　04CL04-1-04CL04-6　2013/04

DOI： 10.7567/JJAP.52.04CL04 　

ISSN： 0021-4922

eISSN： 1347-4065

Development of 3D-stacked reconfigurable spin logic chip using via-last backside-via 3D integration technology Peer-reviewed

T. Tanaka, H. Kino, K. Kiyoyama, H. Ohno, M. Koyanagi

Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013　2013

DOI： 10.1109/IITC.2013.6615594 　

3D Hetero-Integration Technology with Backside TSV and Reliability Challenges Peer-reviewed

Kang-Wook Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S)　2013

Challenges in 3D Integration Peer-reviewed

Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka

SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3　53　(3)　237-244　2013

DOI： 10.1149/05303.0237ecst 　

ISSN： 1938-5862

eISSN： 1938-6737

Characterization and Reliability of 3D LSI and SiP Peer-reviewed

K-W. Lee, M. Murugesan, Jichel Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　176-179　2013

DOI： 10.1109/IEDM.2013.6724579 　

Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding Peer-reviewed

H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi

Proceedings of International Conference on Electronics Packaging (ICEP)　502-505　2013

3D Integration technologies using self-assembly and electrostatic temporary multichip bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings - Electronic Components and Technology Conference　58-63　2013

DOI： 10.1109/ECTC.2013.6575550 　

ISSN： 0569-5503

Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI Peer-reviewed

H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka

Proceedings - Electronic Components and Technology Conference　360-365　2013

DOI： 10.1109/ECTC.2013.6575596 　

ISSN： 0569-5503

Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　891-896　2013

DOI： 10.1109/ECTC.2013.6575679 　

Young Modulus of Si in 3D-LSIs and Reliability Peer-reviewed

M. Murugesan, J.C. Bea, T. Fukushima, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　38-39　2013

Self-Assembly and Electrostatic (SAE) Carrier Technology for Via-Last Backside-Via Multichip-to-Wafer 3D Integration Peer-reviewed

H. Hashiguchi, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　40-41　2013

Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D-IC Peer-reviewed

H. Kino, T. Fukushima, K.-W. Lee, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　862-863　2013

Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration Peer-reviewed

Y. Ito, T. Fukushima, K.W. Lee, K. Choki, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　988-989　2013

Mechanical Characteristics of Thin Dies/Wafers in Three-Dimensional Large-Scale Integrated systems Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, M. Koyanagi, T. Tanaka

2013 24TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)　66-69　2013

DOI： 10.1109/ASMC.2013.6552777 　

ISSN： 1078-8743

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory Peer-reviewed

K-W Lee, S. Tanikawa, M. Murugesan, H. Naganuma, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702336 　

ISSN： 2164-0157

Highly Efficient TSV Repair Technology for Resilient 3-D Stacked Multicore Processor System Peer-reviewed

H. Hashimoto, T. Fukushima, K. W. Lee, M. Koyanagi, T. Tanaka

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702338 　

ISSN： 2164-0157

A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor Peer-reviewed

K. Kiyoyama, Y. Sato, H. Hashimoto, K-W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702363 　

ISSN： 2164-0157

Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV Peer-reviewed

M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike

2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC)　2013

DOI： 10.1109/3DIC.2013.6702364 　

ISSN： 2164-0157

Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics Peer-reviewed

S. Kanno, S. Lee, T. Harashima, T. Kuki, H. Kino, H. Mushiake, H. Yao, T. Tanaka

Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS　253-256　2013

DOI： 10.1109/EMBC.2013.6609485 　

ISSN： 1557-170X

Die-level 3-D integration technology for rapid prototyping of high-performance multifunctionality hetero-integrated systems Peer-reviewed

Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE Transactions on Electron Devices　60　(11)　3842-3848　2013

DOI： 10.1109/TED.2013.2280273 　

ISSN： 0018-9383

Revisiting the Silicon-Lattice in the High-Density 3D-LSIs - In the Perspective of Device Reliability Peer-reviewed

M. Murugesan, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　172-175　2013

DOI： 10.1109/IEDM.2013.6724578 　

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　59　(11)　2956-2963　2012/11

DOI： 10.1109/TED.2012.2212709 　

ISSN： 0018-9383

eISSN： 1557-9646

Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis Peer-reviewed

Kang-Wook Lee, Yoshinobu Watanabe, Chikashi Kigure, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

JOURNAL OF MICROMECHANICS AND MICROENGINEERING　22　(10)　105015-1-105015-11　2012/10

DOI： 10.1088/0960-1317/22/10/105015 　

ISSN： 0960-1317

eISSN： 1361-6439

Impact of Cu Contamination on Memory Retention Characteristics in Thinned DRAM Chip for 3-D Integration Peer-reviewed

Kangwook Lee, Takaharu Tani, Hideki Naganuma, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(9)　1297-1299　2012/09

DOI： 10.1109/LED.2012.2202631 　

ISSN： 0741-3106

eISSN： 1558-0563

High-step-coverage Cu-lateral interconnections over 100 mu m thick chips on a polymer substrate-an alternative method to wire bonding Peer-reviewed

M. Murugesan, T. Fukushima, K. Kiyoyama, J. C. Bea, T. Tanaka, M. Koyanagi

JOURNAL OF MICROMECHANICS AND MICROENGINEERING　22　(8)　085033-1-085033-9　2012/08

DOI： 10.1088/0960-1317/22/8/085033 　

ISSN： 0960-1317

eISSN： 1361-6439

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking Peer-reviewed

M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF ELECTRONIC MATERIALS　41　(4)　720-729　2012/04

DOI： 10.1007/s11664-012-1949-1 　

ISSN： 0361-5235

Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI Peer-reviewed

Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　33　(2)　221-223　2012/02

DOI： 10.1109/LED.2011.2174608 　

ISSN： 0741-3106

A 37 × 37 pixels artificial retina chip with edge enhancement function for 3-D stacked fully implantable retinal prosthesis Peer-reviewed

H. Naganuma, K. Kiyoyama, T. Tanaka

2012 IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Electronics and Systems for Better Life and Better Environment, BioCAS 2012 - Conference Publications　212-215　2012

DOI： 10.1109/BioCAS.2012.6418459 　

The road to recovery from the great east Japan earthquake in micro/nano machining research and education center, Tohoku university Peer-reviewed

Toshiya Kojima, Tetsu Tanaka

Journal of the Vacuum Society of Japan　55　(9)　413-416　2012

DOI： 10.3131/jvsj2.55.413 　

ISSN： 1882-2398 1882-4749

Ultrafast parallel reconfiguration of 3D-stacked reconfigurable spin logic chip with on-chip SPRAM (SPin-transfer torque RAM) Peer-reviewed

T. Tanaka, H. Kino, R. Nakazawa, K. Kiyoyama, H. Ohno, M. Koyanagi

Digest of Technical Papers - Symposium on VLSI Technology　169-170　2012

DOI： 10.1109/VLSIT.2012.6242515 　

ISSN： 0743-1562

Study for CMOS device characteristics affected by Ultra Thin Wafer Thinning Peer-reviewed

Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Shigeaki Saito, Koske Kitaichi, Shoji Yasunaga, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　2012

ISSN： 2373-5449

Heterogeneous 3D Integration Technology and New 3D LSIs Peer-reviewed

Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka

2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012)　240-243　2012

Chip-Based Hetero-Integration Technology for High-Performance 3D Stacked Image Sensor Peer-reviewed

Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 2ND IEEE CPMT SYMPOSIUM JAPAN　2012

ISSN： 2373-5449

Impact of Cu Diffusion from Cu Through-Silicon Via (TSV) on Device Reliability in 3-D LSIs Evaluated by Transient Capacitance Measurement Peer-reviewed

Kangwook Lee, Jichel Bea, Yuki Ohara, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　2B.4.1-2B.4.6　2012

DOI： 10.1109/IRPS.2012.6241777 　

Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs Peer-reviewed

Kangwook Lee, Itakafumi Fukushima, Tetsu Tanaka, Imitsumasa Koyanagi

2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)　5F.2.1-5F.2.4　2012

DOI： 10.1109/IRPS.2012.6241860 　

Self-assembly-based 3D integration technologies Peer-reviewed

T. Fukushima, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012　151-152　2012

DOI： 10.1109/LTB-3D.2012.6238075 　

Non-Conductive Film and Compression Molding Technology for Self-Assembly-Based 3D Integration Peer-reviewed

T. Fukushima, Y. Ohara, J. Bea, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　393-398　2012

DOI： 10.1109/ECTC.2012.6248860 　

Locally Induced Stress in Stacked Ultrathin Si wafers: XPS and mu-Raman study Peer-reviewed

M. Murugesan, H. Nohira, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　625-629　2012

DOI： 10.1109/ECTC.2012.6248896 　

Optical interconnect technology for 3-D LSI and neural engineering applications Peer-reviewed

T. Tanaka, A. Noriki, T. Kukushima, K-W Lee, M. Koyanagi

2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)　2012

10μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications Peer-reviewed

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　46-47　2012

Grapho-Assembly Technology for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps Peer-reviewed

Takafumi Fukushima, Masaki Onishi, Jichoel Bea, Sayuri Hioki, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　48-49　2012

The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3D LSI by Using C–V and C–t Measurements Peer-reviewed

Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2012

Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisted Self-Assembly with Cu/Sn Microbump Peer-reviewed

Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1176-1177　2012

Electrostatic Temporary Bonding Technology and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration Peer-reviewed

Hideto Hashiguchi, Jichoel Bea, Yuki Ohara, Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1183-1184　2012

Reliability Challenges in High-Density 3D-Integration Peer-reviewed

M. Murugesan, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1185-1186　2012

Cu Contamination Assessment and Control in 3-D Integration Peer-reviewed

Mitsumasa Koyanagi, Kang Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka

The 222nd ECS Meeting: PRiME (Pacific Rim Meeting)　2012

Long Term Retention Characteristics of MOS Memory Devices with Self-Assembled Tungsten Nano-Dot Dispersed in Silicon Nitride Peer-reviewed

Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi

Materials Research Society (MRS) 2008 Spring Meeting, Symposium F: Materials Science and Technology for Nonvolatile Memories, F2.4　2012

New Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding Peer-reviewed

T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K. -W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　789-792　2012

DOI： 10.1109/IEDM.2012.6479157 　

Characterization of Chip-level Hetero-Integration Technology for High-Speed, Highly Parallel 3D-Stacked Image Processing System Peer-reviewed

K-W Lee, Y. Ohara, K. Kiyoyama, S. Konno, Y. Sato, S. Watanabe, A. Yabata, T. Kamada, J-C Bea, H. Hashimoto, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　785-788　2012

DOI： 10.1109/IEDM.2012.6479156 　

Minimizing the Local Deformation Induced around Cu-TSVs and CuSn/InAu-Microbumps in High-Density 3D-LSIs Peer-reviewed

M. Murugesan, H. Kobayashi, H. Shimamoto, F. Yamada, T. Fukushima, J. C. Bea, K. W. Lee, T. Tanaka, M. Koyanagi

2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　657-660　2012

DOI： 10.1109/IEDM.2012.6479124 　

Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY　1　(12)　1873-1884　2011/12

DOI： 10.1109/TCPMT.2011.2160266 　

ISSN： 2156-3950

eISSN： 2156-3985

三次元集積化技術とヘテロインテグレーション Invited Peer-reviewed

小柳光正, 福島誉史, 李康旭, 田中徹

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　355-364　2011/11

ISSN： 1345-2827

三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術 Peer-reviewed

大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　394-401　2011/11

ISSN： 1345-2827

シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価 Peer-reviewed

木野久志, マリアッパンムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正

電子情報通信学会論文誌C（電子デバイスの高速・高密度実装とインテグレーション技術論文特集）　J94-C　(11)　411-418　2011/11

ISSN： 1345-2827

Effects of Annealing Temperature in a Metal Alloy Nano-dot Memory Peer-reviewed

Jung Min Lee, Gae Hun Lee, Yun Heub Song, Ji Cheol Bea, Tetsu Tanaka

JOURNAL OF THE KOREAN PHYSICAL SOCIETY　59　(4)　2782-2785　2011/10

DOI： 10.3938/jkps.59.2782 　

ISSN： 0374-4884

Advanced die-to-wafer 3D integration platform: Self-assembly technology Peer-reviewed

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

3D Integration for VLSI Systems　153-174　2011/09/30

DOI： 10.4032/9789814303828 　

Multilevel Charge Storage in a Multiple Alloy Nanodot Memory Peer-reviewed

Gae-Hun Lee, Jung-Min Lee, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　50　(9)　2011/09

DOI： 10.1143/JJAP.50.095001 　

ISSN： 0021-4922

eISSN： 1347-4065

Evaluation of Cu Diffusion From Cu Through-Silicon Via (TSV) in Three-Dimensional LSI by Transient Capacitance Measurement Peer-reviewed

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(7)　940-942　2011/07

DOI： 10.1109/LED.2011.2141109 　

ISSN： 0741-3106

eISSN： 1558-0563

MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric Peer-reviewed

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON NANOTECHNOLOGY　10　(3)　528-531　2011/05

DOI： 10.1109/TNANO.2010.2050331 　

ISSN： 1536-125X

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration Peer-reviewed

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

MICROMACHINES　2　(1)　49-68　2011/03

DOI： 10.3390/mi2010049 　

ISSN： 2072-666X

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems Peer-reviewed

Kang-Wook Lee, Akihiro Noriki, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE TRANSACTIONS ON ELECTRON DEVICES　58　(3)　748-757　2011/03

DOI： 10.1109/TED.2010.2099870 　

ISSN： 0018-9383

eISSN： 1557-9646

Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement Peer-reviewed

K-W Lee, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　26　(2)　2011/02

DOI： 10.1088/0268-1242/26/2/025007 　

ISSN： 0268-1242

eISSN： 1361-6641

Development of Si neural probe with optical waveguide for highly accurate optical stimulation of neuron Peer-reviewed

R. Kobayashi, S. Kanno, S. Sakai, S. Lee, M. Koyanagi, H. Yao, T. Tanaka

2011 5th International IEEE/EMBS Conference on Neural Engineering, NER 2011　294-297　2011

DOI： 10.1109/NER.2011.5910545 　

Comparison of electrode materials for the use of retinal prosthesis Peer-reviewed

Onnela Niina, Takeshita Hirotaka, Kaiho Yoshiuki, Kojima Toshiya, Kobayashi Risato, Tanaka Tetsu, Hyttinen Jari

Bio-Medical Materials and Engineering　21　(2)　83-97　2011

DOI： 10.3233/BME-2011-0658 　

ISSN： 0959-2989

3D Integration Technology and Reliability Challenges Peer-reviewed

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS)　2011

ISSN： 2151-1225

Energy Band Engineering of Metal Nanodots for High Performance Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS　470　140-+　2011

DOI： 10.4028/www.scientific.net/KEM.470.140 　

ISSN： 1013-9826

Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration Peer-reviewed

T. Fukushima, Y. Ohara, M. Murugesan, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　2050-2055　2011

ISSN： 0569-5503

Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement Peer-reviewed

K-W. Lee, J-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

JOURNAL OF THE ELECTROCHEMICAL SOCIETY　158　(8)　H795-H799　2011

DOI： 10.1149/1.3597317 　

ISSN： 0013-4651

eISSN： 1945-7111

High Density 3D LSI Technology using W/Cu Hybrid TSVs Peer-reviewed

M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)　2011

Development of 5 µm Diameter Backside Cu TSV Technology for 3D LSI Peer-reviewed

Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the International Conference on Electronics Packaging (ICEP)　237-240　2011

3D LSI Technology and Reliability Issues Peer-reviewed

T. Tanaka, J. Bea, M. Murugesan, K. Lee, T. Fukushima, M. Koyanagi

Proceedings of the 2011 Symposium on VLSI Technology　184-185　2011

Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer Peer-reviewed

M. Murugesan, H. Nohira, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　50-51　2011

Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor Peer-reviewed

H. Hashimoto, T. Fukushima, K-W. Lee, T. Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　168-169　2011

Development of Implantable Si Neural Probe with Stimulus and Recording Electrodes for Deep Brain Stimulation Peer-reviewed

Yoshiho Yukita, Sanghoon Lee, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　408-409　2011

Impacts of Microbump-Induced Local Bending Stress in 3D-LSI Peer-reviewed

H. Kino, M. Murugesan, K.-W. Lee, J.-C. Bea, C. Miyazaki, H. Kobayashi, H. Shimamoto, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　785-786　2011

Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs Peer-reviewed

H. Hashiguchi, M. Murugesan, J.C. Bea, K.W. Lee, T. Fukushima, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　795-796　2011

A Block-Parallel SAR ADC for CMOS Image Sensor with 3-D Stacked Structure Peer-reviewed

K. Kiyoyama, K-W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1055-1056　2011

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration Peer-reviewed

Yuki Ohara, Lee Kangwook, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262950 　

Temporary bonding strength control for self-assembly-based 3D integration Peer-reviewed

Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262954 　

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262957 　

A very low area ADC for 3-D stacked CMOS image processing system Peer-reviewed

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262958 　

High density Cu-TSVs and reliability issues Peer-reviewed

Murugesan Mariappan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262969 　

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress Peer-reviewed

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262970 　

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs Peer-reviewed

K. W. Lee, J. C. Bea, T. Fukushima, Y. Ohara, T. Tanaka, M. Koyanagi

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011　2011

DOI： 10.1109/3DIC.2012.6262975 　

Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement Peer-reviewed

Jichel Bea, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE ELECTRON DEVICE LETTERS　32　(1)　66-68　2011/01

DOI： 10.1109/LED.2010.2087004 　

ISSN： 0741-3106

eISSN： 1558-0563

A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module Peer-reviewed

Kang-Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS　19　(6)　1284-1291　2010/12

DOI： 10.1109/JMEMS.2010.2082497 　

ISSN： 1057-7157

eISSN： 1941-0158

Leakage Current Characteristics of the Multiple Metal Alloy Nanodot Memory Peer-reviewed

Gae Hun Lee, Jung Min Lee, Hyung Jun Yang, Yun Heub Song, Ji Chel Bea, Tetsu Tanaka

JOURNAL OF THE KOREAN PHYSICAL SOCIETY　57　(5)　1248-1252　2010/11

DOI： 10.3938/jkps.57.1248 　

ISSN： 0374-4884

三次元積層型集積回路のための自己組織化チップ位置合わせ技術 Peer-reviewed

岩田永司, 福島誉史, 大原悠希, 李康旭, 田中徹, 小柳光正

電子情報通信学会論文誌C　J93-C　(11)　493-502　2010/11/01

ISSN： 1345-2827

極限集積化を目指すスーパーチップ Peer-reviewed

小柳光正, 福島誉史, 李康旭, 田中徹

電子情報通信学会誌　93　(11)　918-922　2010/11/01

ISSN： 0913-5693

Effects of Postdeposition Annealing on Cobalt Nanodots Embedded in Silica for Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Toshiya Kojima, Tatsuro Hiraki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　49　(6)　066503-1-066503-4　2010/06

DOI： 10.1143/JJAP.49.066503 　

ISSN： 0021-4922

３次元積層型集積回路に向けた自己組織化チップ実装技術

福島誉史, 李康旭, 田中徹, 小柳光正

電子材料　49　(6)　17--24　2010/06

ISSN： 0387-0774

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits Peer-reviewed

T. Fukushima, E. Iwata, T. Konno, J. -C. Bea, K. -W. Lee, T. Tanaka, M. Koyanagi

APPLIED PHYSICS LETTERS　96　(15)　154105-1-154105-3　2010/04

DOI： 10.1063/1.3328098 　

ISSN： 0003-6951

Three-Dimensional Integration Technology Using Through-Si Via Based on Reconfigured Wafer-to-Wafer Bonding Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010　2010

Characteristics of a Multiple Alloy Nanodot Memory with an Enhanced Charge Storage Capability Peer-reviewed

Yun Heub Song, Ji Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　49　(7)　2010

DOI： 10.1143/JJAP.49.074201 　

ISSN： 0021-4922

Development of Retinal Prosthesis Module for Fully Implantable Retinal Prosthesis Peer-reviewed

Kangwook Lee, Tetsu Tanaka

6TH WORLD CONGRESS OF BIOMECHANICS (WCB 2010), PTS 1-3　31　1625-+　2010

ISSN： 1680-0737

Self-Assembly Technology for Advanced Die-to-Wafer 3D Integration Peer-reviewed

Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)　433-437　2010

Impact of Remnant Stress/Strain in 3D Stacked Retinal Chip by Wafer Thinning and Bonding Peer-reviewed

Hisashi Kino, Tatsuro Hiraki, Mariappan Murugesan, Jicheol Bea, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　123-124　2010

Electrical and Mechanical Characteristics of Si Double-sided Neural Probe for In-vivo Recording Peer-reviewed

Sanghoon Lee, Risato Kobayashi, Soichiro Kanno, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 12th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre, Nano^Biomedical Engineering in the East Asian-Pacific Rim Region　127-128　2010

Highly Accurate Optical Stimulation of Neuron using Si Neural Probe with Optical Waveguide Peer-reviewed

Risato Kobayashi, Sanghoon Lee, Soichiro Kanno, Yoshiho Yukita, Kangwook Lee, Takafumi Fukushima, Toru Ishizuka, Hajime Mushiake, Hiromu Yao, Mitsumasa Koyanagi, Tetsu Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　181-182　2010

Development of Versatile Backside Via Technology for 3D System on Chip Peer-reviewed

Y. Ohara, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　237-238　2010

Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement Peer-reviewed

J.-C. Bea, K.-W. Lee, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1196-1197　2010

Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI Peer-reviewed

Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1198-1199　2010

Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration Peer-reviewed

Eiji Iwata, Yuki Ohara, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1202-1203　2010

Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study Peer-reviewed

M. Murugesan, Y. Ohara, J.C Bea, K.W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　1204-1205　2010

Formation of Cobalt Nanodots Embedded in Silicon Oxide for Nonvolatile Memory Application Peer-reviewed

Yanli Pei, Tatsuro Hiraki, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the China Semiconductor Technology International Conference (CSTIC)　55-55　2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding Peer-reviewed

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang-Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751432 　

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature Peer-reviewed

T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751436 　

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure Peer-reviewed

K. Kiyoyama, K. W. Lee, T. Fukushima, H. Naganuma, H. Kobayashi, T. Tanaka, M. Koyanagi

IEEE 3D System Integration Conference 2010, 3DIC 2010　2010

DOI： 10.1109/3DIC.2010.5751479 　

Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer Peer-reviewed

T. Tanaka, T. Fukushima, K. -W. Lee, M. Murugesan, M. Koyanagi

2010 IEEE INTERNATIONAL SOI CONFERENCE　60-63　2010

DOI： 10.1109/SOI.2010.5641471 　

ISSN： 1078-621X

Self-Assembly Technology for Reconfigured Wafer-to-Wafer 3D Integration Peer-reviewed

T. Fukushima, E. Iwata, K. -W. Lee, T. Tanaka, M. Koyanagi

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)　1050-1055　2010

DOI： 10.1109/ECTC.2010.5490830 　

ISSN： 0569-5503

3D Hybrid Integration Technology for Opto-Electronic Hetero-Integrated Systems Peer-reviewed

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

PROCESSING, MATERIALS, AND INTEGRATION OF DAMASCENE AND 3D INTERCONNECTS　33　(12)　71-90　2010

DOI： 10.1149/1.3501035 　

ISSN： 1938-5862

Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias Peer-reviewed

M. Murugesan, H. Kino, H. Nohira, J. C. Bea, A. Horibe, F. Yamada, C. Miyazaki, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST　30-34　2010

DOI： 10.1109/IEDM.2010.5703279 　

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

IEEE IEDM Technical Digest　109　(408(SDM2009 171-181))　349-352　2009/12

ISSN： 0913-5685

A Reliable Nonvolatile Memory Using Alloy Nanodot Layer with Extremely High Density Peer-reviewed

Yun Heub Song, Ji Chel Bea, Kang Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(10)　2009/10

DOI： 10.1143/JJAP.48.106505 　

ISSN： 0021-4922

Cannula-aided penetration: A simple method to insert structurally weak electrodes into brain through the dura mater Peer-reviewed

Yoshiya Matsuzaka, Kazuhiro Sakamoto, Tetsu Tanaka, Yoshihito Furusawa, Hajime Mushiake

NEUROSCIENCE RESEARCH　65　(1)　126-129　2009/09

DOI： 10.1016/j.neures.2009.05.009 　

ISSN： 0168-0102

セルフアセンブリ法を用いた新しいヘテロインテグレーション技術 Invited

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「VLSIシンポジウム特集(先端CMOSデバイス・プロセス技術)」　115　17-22　2009/08/03

Cell characteristics of a multiple alloy nano-dots memory structure Peer-reviewed

Ji Chel Bea, Yun Heub Song, Kang-Wook Lee, Gae-Hun Lee, Tetsu Tanaka, Mitsumasa Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　24　(8)　2009/08

DOI： 10.1088/0268-1242/24/8/085013 　

ISSN： 0268-1242

Memory characteristics of metal-oxide-semiconductor capacitor with high density cobalt nanodots floating gate and HfO2 blocking dielectric Peer-reviewed

Yanli Pei, Chengkuan Yin, Toshiya Kojima, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　95　(3)　033118-1-033118-3　2009/07

DOI： 10.1063/1.3189085 　

ISSN： 0003-6951

三次元積層型チップのためのSi貫通ビア(TSV)形成技術 Peer-reviewed

福島誉史, 田中徹, 小柳光正

エレクトロニクス実装学会誌　12　(2)　104-109　2009/05/01

DOI： 10.5104/jiep.12.104 　

ISSN： 1343-9677

Optical Interposer Technology using Buried Vertical-Cavity Surface-Emitting Laser Chip and Tapered Through-Silicon Via for High-Speed Chip-to-Chip Optical Interconnection Peer-reviewed

Akihiro Noriki, Makoto Fujiwara, Kang-Wook Lee, Woo-Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C113-1-C113-5　2009/04

DOI： 10.1143/JJAP.48.04C113 　

ISSN： 0021-4922

Fundamental Study of Complementary Metal Oxide Semiconductor Image Sensor for Three-Dimensional Image Processing System Peer-reviewed

Kenji Makita, Kouji Kiyoyarna, Takeaki Sugimura, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C077-1-C077-5　2009/04

DOI： 10.1143/JJAP.48.04C077 　

ISSN： 0021-4922

Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films Peer-reviewed

Woo-Cheol Jeong, Kouji Kiyoyama, Kang-Wook Lee, Akihiro Noriki, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C157-1-C157-4　2009/04

DOI： 10.1143/JJAP.48.04C157 　

ISSN： 0021-4922

eISSN： 1347-4065

Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding Peer-reviewed

Soichiro Kanno, Risato Kobayashi, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C189-1-C189-4　2009/04

DOI： 10.1143/JJAP.48.04C189 　

ISSN： 0021-4922

Development of Si Double-Sided Microelectrode for Platform of Brain Signal Processing System Peer-reviewed

Risato Kobayashi, Soichiro Kanno, Lee Sanghoon, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　48　(4)　C194-1-C194-5　2009/04

DOI： 10.1143/JJAP.48.04C194 　

ISSN： 0021-4922

MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition Peer-reviewed

Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi

SEMICONDUCTOR SCIENCE AND TECHNOLOGY　24　(4)　045022-045025　2009/04

DOI： 10.1088/0268-1242/24/4/045022 　

ISSN： 0268-1242

Formation of high density tungsten nanodots embedded in silicon nitride for nonvolatile memory application Peer-reviewed

Yanli Pei, Chengkuan Yin, Masahiko Nishijima, Toshiya Kojima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　94　(6)　063108-063110　2009/02

DOI： 10.1063/1.3081042 　

ISSN： 0003-6951

Super chip integration technology for three-dimensionally stacked retinal prosthesis chips

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Smart Systems Integration 2009, SSI 2009　299-306　2009

Development of Medical Micro/Nano System : Retinal Prosthesis and Intelligent Si Neural Probe

TANAKA Tetsu

The Reference Collection of Annual Meeting　2009　243-244　2009

DOI： 10.1299/jsmemecjsm.2009.9.0_243 　

Erratum: TSV (Through-Si-Via) Formation Technologies for Three-Dimensionally Stacked Chips [Journal of Japan Institute of Electronics Packaging 12(2): 104-109 (2009)]

Fukushima Takafumi, Tanaka Tetsu, Koyanagi Mitsumasa

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits　12　(3)　262-262　2009

DOI： 10.5104/jiep.12.262 　

ISSN： 1343-9677

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding Peer-reviewed

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanag

Technical Digest - International Electron Devices Meeting, IEDM　14.5.4　2009

DOI： 10.1109/IEDM.2009.5424348 　

ISSN： 0163-1918

3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　14.2.4　2009

DOI： 10.1109/IEDM.2009.5424351 　

ISSN： 0163-1918

3D integration technology for 3D stacked retinal chip Peer-reviewed

Y. Kaiho, Y. Ohara, H. Takeshita, K. Kiyoyama, K. W. Lee, T. Tanaka, M. Koyanagi

2009 IEEE International Conference on 3D System Integration, 3DIC 2009　2009

DOI： 10.1109/3DIC.2009.5306564 　

Three-Dimensional Integration Technology Based on Reconfigured Wafer-to-Wafer and Multichip-to-Wafer Stacking Using Self-Assembly Method Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Akihiro Noriki, Kiyoshi Inamura, Kang-Wook Lee, Jicheol Bea, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　323-326　2009

ISSN： 2380-9248

Three-Dimensional Integration Technology and Integrated Systems Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009　409-415　2009

ISSN： 2153-6961

3D Heterogeneous Opto-Electronic Integration Technology for System-on-Silicon (SOS) Peer-reviewed

K-W Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W-C Jeong, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　495-498　2009

Development of Double-sided Si Neural Probe with Microfluidic Channels Using Wafer Direct Bonding Technique Peer-reviewed

R. Kobayashi, S. Kanno, S. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　96-+　2009

ISSN： 1948-3546

Fabrication of Multichannel Neural Microelectrodes with Microfluidic Channels Based on Wafer Bonding Technology Peer-reviewed

R. Kobayashi, S. Kann, T. Fukushima, T. Tanaka, M. Koyanagi

13TH INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING, VOLS 1-3　23　(1-3)　2258-+　2009

ISSN： 1680-0737

Development of A Silicon Neural Probe for An Intelligent Silicon Neural Probe System

Risato Kobayashi, Lee Sanghoon, Soichiro Kanno, Bea Jicheol, Takafumi Fukushima, Kazuhiro Sakamoto, Norihiro Katayama, Hajime Mushiake, Tetsu Tanaka, Mitsumasa Koyanagi

Nano-Biomedical Engineering 2009　297-308　2009

Electrical Characterization of MOS Memory Devices with Self-assembled Tungsten Nano-dots Dispersed in Silicon Nitride Peer-reviewed

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of the International Semiconductor Technology Conference/China Semiconductor Technology International Conference (ISTC/CSTIC)　85-89　2009

Super Hetero-Integration Technology for LSI /MEMS Integration Peer-reviewed

M. Koyanagi, K.-W. Lee, T. Fukushima, T. Tanaka

Proceedings of the International Conference on Electronics Packaging (ICEP)　589-595　2009

Cu Lateral Interconnects Formed Between 100-mu m-Thick Self-Assembled Chips on Flexible Substrates Peer-reviewed

M. Murugesan, J. -C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. -C. Jeong, H. Kino, A. Noriki, K. -W. Lee, T. Tanaka, M. Koyanagi

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4　1496-1501　2009

DOI： 10.1109/ECTC.2009.5074210 　

Development of EEB (Electroplated Evaporation Bumping) Technology for Fine Pitch and Low Resistance Cu/Sn Micro-Bumps Peer-reviewed

Y. Ohara, A. Noriki, E. Iwata, T. Hiraki, K.-W. Lee, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　86-87　2009

High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module Peer-reviewed

A. Noriki, Y. Kaiho, E. Iwata, Y. Ohara, M. Murugesan, K.-W. Lee, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　88-89　2009

Evaluation of Thin LSI Wafers by Capacitance-Time (C-t) Measurement for the Process Characterization of Three-Dimensional (3D) Integration Peer-reviewed

J.-C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K.-W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of International Conference on Solid State Devices and Materials (SSDM)　370-371　2009

In vivo Neural Signal Recording using Double-sided Si Neural Probe Peer-reviewed

S. Lee, R. Kobayashi, S. Kanno, K. Lee, T. Fukushima, K. Sakamoto, Y. Matsuzaka, N. Katayama, H. Mushiake, M. Koyanagi, T. Tanaka

Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)　691-692　2009

Heterogeneous Integration Technology for MEMS-LSI Multi-Chip Module Peer-reviewed

K-W Lee, S. Kanno, Y. Ohara, K. Kiyoyama, J-C Bea, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　6-+　2009

ISSN： 2164-0157

A Parallel ADC for High-Speed CMOS Image Processing System with 3D Structure Peer-reviewed

K. Kiyoyama, Y. Ohara, K-W Lee, Y. Yang, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　101-+　2009

ISSN： 2164-0157

Micro-Raman Spectroscopy Analysis and Capacitance-Time (C-t) Measurement of Thinned Silicon Substrates for 3D Integration Peer-reviewed

J. -C. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. -W Lee, T. Fukushima, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　189-193　2009

ISSN： 2164-0157

10 mu m Fine Pitch Cu/Sn Micro-Bumps for 3-D Super-Chip Stack Peer-reviewed

Yuki Ohara, Akihiro Noriki, Katsuyuki Sukuma, Kang-Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　389-+　2009

ISSN： 2164-0157

Development of a New Self-Assembled Die Bonder to Three-Dimensionally Stack Known Good Dies in Batch Peer-reviewed

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION　434-437　2009

ISSN： 2164-0157

Ultra Low Power Vertical MOS Devices for Fully Implantable Rtinal Prosthesis Peer-reviewed

H. Kino, T. Hiraki, J-C. Bea, T. Fukushima, M. Koyanagi, T. Tanaka

3rd East Asian Pacific Student Workshop on Nano-Biomedical Engineering　112-113　2009

Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking Invited Peer-reviewed

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION　1112　121-130　2009

ISSN： 0272-9172

A Simple Device Allowing Silicon Microelectrode Insertion for Chronic Neural Recording in Primates Peer-reviewed

Kazuhiro Sakamoto, Yoshia Matsuzaka, Tamotsu Suenaga, Hiroshi Watanabe, Risato Kobayashi, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka, Mitsumasa Koyanagi, Hajime Mushiake

2009 4TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING　104-+　2009

DOI： 10.1109/NER.2009.5109245 　

ISSN： 1948-3546

Electrical characterization of MOS memory devices with self-assembled tungsten nano-dots dispersed in silicon nitride Peer-reviewed

Y. Pei, C. Yin, M. Nishijima, T. Kojima, H. Nohira, T. Fukushima, T. Tanaka, M. Koyanagi

ECS Transactions　18　(1)　33-37　2009

DOI： 10.1149/1.3096423 　

ISSN： 1938-5862 1938-6737

3D System Integration Technology and 3D Systems

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Conference Proceedings Advanced Metallization Conference 2008 (AMC 2008)　479-485　2009

High-Density Through Silicon Vias for 3-D LSIs Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE　97　(1)　49-59　2009/01

DOI： 10.1109/JPROC.2008.2007463 　

ISSN： 0018-9219

eISSN： 1558-2256

3D heterogeneous opto-electronic integration technology for system-on-silicon (SOS) Peer-reviewed

K. W. Lee, A. Noriki, K. Kiyoyama, S. Kanno, R. Kobayashi, W. C. Jeong, J. C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi

Technical Digest - International Electron Devices Meeting, IEDM　22.2.4-534　2009

DOI： 10.1109/IEDM.2009.5424305 　

ISSN： 0163-1918

Impact of Remnant Stress/Strain and Metal Contamination in 3D-LSIs with Through-Si Vias Fabricated by Wafer Thinning and Bonding Peer-reviewed

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, T. Hattori, E. Ikenaga, T. Tanaka, M. Koyanagi

2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING　335-+　2009

ISSN： 2380-9248

東北大学内連携プロジェクトによる多機能集積化半導体電極の開発と神経活動の多元的解読 Peer-reviewed

坂本一寛, 虫明元, 田中徹, 片山統裕, 小柳光正

BIO INDUSTRY　25　(12)　96-101　2008/12

ISSN： 0910-6545

LSI用光インターコネクションの技術動向と新展開 Peer-reviewed

田中徹

第17回フォトニックデバイス・応用技術報告書　25-42　2008/11

Investigation of the effect of in situ annealing of FePt nanodots under high vacuum on the chemical states of Fe and Pt by x-ray photoelectron spectroscopy Peer-reviewed

M. Murugesan, J. C. Bea, C. -K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T. Fukushima, T. Tanaka, M. Miyao, M. Koyanagi

JOURNAL OF APPLIED PHYSICS　104　(7)　074316-1-074316-5　2008/10

DOI： 10.1063/1.2973665 　

ISSN： 0021-8979

Memory characteristics of self-assembled tungsten nanodots dispersed in silicon nitride Peer-reviewed

Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

APPLIED PHYSICS LETTERS　93　(11)　2008/09

DOI： 10.1063/1.2986409 　

ISSN： 0003-6951

eISSN： 1077-3118

Three-Dimensional Integration Technology Using Adhesive Injection Method and W/poly-Si TSV Peer-reviewed

M.Koyanagi, T.Fukushima, T.Tanaka

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　31-44　2008/05

Chip Self-Assembly Technique for 3D LSI Fabrication Peer-reviewed

K.Kiyoyama, S.Kodama, D.Amano, T.Sugimura, F.Fukushima, T.Tanaka, M.Koyanagi

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　205-216　2008/05

Study of Retinal Prosthesis with Three-Dimensionally Stacked LSI Peer-reviewed

K.Sato, T.Fukushima, H.Tomiya, H.Kurino, T.Tanaka, M.Koyanagi

Technical Digest of the International 3D System Integration Conference 2008(3D-SIC 2008)　229-239　2008/05

Tungsten through-silicon via technology for three-dimensional LSIs Peer-reviewed

Hirokazu Kikuchi, Yusuke Yamada, Atif Mossad Ali, Jun Liang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2801-2806　2008/04

DOI： 10.1143/JJAP.47.2801 　

ISSN： 0021-4922

Low-loss optical interposer with recessed vertical-cavity surface-emitting laser diode and photodiode chips into Si substrate Peer-reviewed

Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2936-2940　2008/04

DOI： 10.1143/JJAP.47.29361 　

ISSN： 0021-4922

eISSN： 1347-4065

Electrical characterization of metal-oxide-semiconductor memory devices with high-density self-assembled tungsten nanodots Peer-reviewed

Yan-Li Pei, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2680-2683　2008/04

DOI： 10.1143/JJAP.47.2680 　

ISSN： 0021-4922

Power supply system using electromagnetic induction for three-dimensionally stacked retinal prosthesis chip Peer-reviewed

Ken Komiya, Risato Kobayashi, Takafumi Kobayashi, Keigo Sato, Takafumi Fukushima, Hiroshi Tomita, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　3244-3247　2008/04

DOI： 10.1143/JJAP.47.3244 　

ISSN： 0021-4922

New reconfigurable memory architecture for parallel image-processing LSI with three-dimensional structure Peer-reviewed

Shigeo Kodama, Daijirou Amano, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS　47　(4)　2774-2778　2008/04

DOI： 10.1143/JJAP.47.2774 　

ISSN： 0021-4922

3D System Integration Technology and 3D Systems Invited Peer-reviewed

T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of Materials for Advanced Metallization Conference 2008 (MAM 2008)　37-38　2008/03

Microbump Formation on Flexible Substrate using Imprint Technology for Integrated Nano-System with 3D-LSIs Peer-reviewed

Yusuke Yamada, Hirokozu Kikuchi, T. Fukushima, T. Tanaka, M. Koyanagi

The 5th International Conference on Mechanical Science based on Nanotechnology　71-74　2008/03

自己組織化ウェーハ張り合せによる三次元集積化技術 Invited

福島誉史, 田中徹, 小柳光正

応用物理学会分科会 シリコンテクノロジー 「多層配線」特集号　(99)　34-37　2008/02/08

3-D integration technology for realizing super chip

Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi

2008 Proceedings - 25th International VLSI Multilevel Interconnection Conference, VMIC 2008　197-202　2008

Deep trench etching for through-silicon vias in three-dimensional integration technology

Jun Liang, Hirokazu Kikuchi, Takayuki Konno, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2008-1　674-678　2008

Three-Dimensional Super-Chip Integration Technology Using Self-Assembly Technique Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 IEEE SILICON NANOELECTRONICS WORKSHOP　23-24　2008

Three-dimensional integration technology using self-assembly technique and super-chip integration Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE　10-12　2008

ISSN： 2380-632X

eISSN： 2380-6338

New Three-Dimensional Integration Technology Using Reconfigured Wafers Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4　1180-1183　2008

A Closed-loop Power Control Function for Bio-implantable devices Peer-reviewed

Kouji Kiyoyama, Yoshito Tanaka, Mashahiro Onoda, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

2008 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE　321-+　2008

Electrical conductance properties for magnetic tunnel junctions with MgO barriers Peer-reviewed

K. Tamanoi, M. Sato, M. Oogane, Y. Ando, T. Tanaka, Y. Uehara, T. Uzumaki

J. Magn. Magn. Mater.　320　2959-2962　2008

DOI： 10.1016/j.jmmm.2008.08.004 　

Multichip self-assembly technique on flexible polymeric substrate Peer-reviewed

T. Fukushima, T. Konno, T. Tanaka, M. Koyanagi

58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS　1532-1537　2008

DOI： 10.1109/ECTC.2008.4550179 　

ISSN： 0569-5503

A Novel SPRAM (SPin-transfer torque RAM)-based Reconfigurable Logic Block for 3D-Stacked reconfigurable Spin Processor Peer-reviewed

M. Sekikawa, K. Kiyoyama, H. Hasegawa, K. Miura, T. Fukushima, S. Ikeda, T. Tanaka, H. Ohno, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　935-+　2008

DOI： 10.1109/IEDM.2008.4796645 　

New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method Peer-reviewed

T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, A. Norki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST　499-502　2008

DOI： 10.1109/IEDM.2008.4796735 　

Development of Fully Implantable Retinal Prosthesis Module

T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

Proceedings of the 3rd Tohoku-NUS Joint Symposium on Nano-Biomedical Engineering in the East Asian-Pacific Rim Region　19-22　2007/12

Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot Peer-reviewed

Y. Pei, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　242-243　2007/09

Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs Peer-reviewed

H. Kikuchi, Y. Yamada, A. M. Ali, J. Liang, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　482-483　2007/09

Development of Power Supply System for Three-Dimensionally Stacked Retinal Prosthesis Chip Peer-reviewed

K. Komiya, R. Kobayashi, T. Kobayashi, K. Sato, T. Fukushima, H. Tomita, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　658-689　2007/09

Passive Optical Alignment with High Accuracy for Low-Loss Optical Interposer Peer-reviewed

M. Fujiwara, S. Terada, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K.Takahama, T.Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007/09

Investigation of FePt Nano-Dots Fabricated by Self-Assembled Nano-Dot Deposition Method Using X-ray Photoelectron Spectroscopy Peer-reviewed

M. Murugesan, J. C. Bea, C.K. Yin, H. Nohira, E. Ikenaga, T. Hattori, M. Nishijima, T.Fukushima, T. Tanaka, M. Miyao, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　1026-1027　2007/09

New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure Peer-reviewed

S. Kodama, D. Amano, T. Sugimura, T.Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2007 International Conference on Solid State Device　2007　1067-1065　2007/09

Fabrication of Magnetic Tunnel Junction with FePt Nanodots for Magnetic Nanodot Memory Peer-reviewed

C.K. Yin, M. Murugesan, J.C. Bea, T.Fukushima, T. Tanaka, M. Koyanagi

The 6 th International Semiconductor Technology Conference (ISTC 2007)　418-422　2007/05

Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap Peer-reviewed

Takeaki Sugimura, Takeshi Sakaguchi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2226-2230　2007/04

DOI： 10.1143/JJAP.46.2226 　

ISSN： 0021-4922

Novel optical/electrical printed circuit board with polynorbornene optical waveguide Peer-reviewed

Makoto Fujiwara, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2395-2400　2007/04

DOI： 10.1143/JJAP.46.23951 　

ISSN： 0021-4922

New magnetic nanodot memory with FePt nanodots Peer-reviewed

Cheng-Kuan Yin, Mariappan Murugesan, Ji-Chel Bea, Mikihiko Oogane, Takafumi Fukushima, Tetsu Tanaka, Shozo Kono, Seiji Samukawa, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2167-2171　2007/04

DOI： 10.1143/JJAP.46.2167 　

ISSN： 0021-4922

Evaluation of platinum-black stimulus electrode array for electrical stimulation of retinal cells in retinal prosthesis system Peer-reviewed

Taiichiro Watanabe, Risato Kobayashi, Ken Komiya, Takafumi Fukushima, Hiroshi Tomita, Eriko Sugano, Hiroyuki Kurino, Tetsu Tanaka, Makoto Tamai, Mitsumasa Koyanagi

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　46　(4B)　2785-2791　2007/04

DOI： 10.1143/JJAP.46.2785 　

ISSN： 0021-4922

Highly Parallel Processing SystemUsing 3-Dimensional LSI Invited

T. Tanaka, T. Fukushima, M. Koyanagi

International 3D-System Integration Conference 2007　2007/03

New three-dimensional integration technology to achieve a super chip Peer-reviewed

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka

ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings　318-321　2007

DOI： 10.1109/ICSICT.2006.306217 　

A passive telemetry interface system with closed-loop power control function for body-implanted applications Peer-reviewed

Koji Kiyoyama, Yoshito Tanaka, Masahiro Onoda, Tetsu Tanaka, Mitsumasa Koyanagi

2007 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE　37-+　2007

Self-assembly process for chip-to-wafer three-dimensional integration Peer-reviewed

T. Fulcushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS　836-+　2007

DOI： 10.1109/ECTC.2007.373895 　

ISSN： 0569-5503

Magnetic characteristics of FePt nanodots formed by a self-assembled nanodot deposition method Peer-reviewed

C. K. Yin, H. Choi, J. C. Bea, M. Murugesan, J. H. Yoo, T. Fukushima, Y. Murakami, T. Tanaka, D. Shindo, M. Miyao, M. Koyanagi

2007 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2007, Technical Proceedings　4　401-404　2007

Evaluation of Electrical Stimulus Current Applied to Retinal Cells for Retinal Prosthesis

T. Watanabe, K. Motonami, T. Fukushima, H. Kurino, T. Tanaka, M. Koyanag

Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　585-600　2007/01

Development of Low Power 3D Integration Technology using SOI Wafer for Retinal Prosthesis Chip

Y. Yamada, J. Deguchi, T. Watanabe, T. Fukushima, T. Tanaka, M. Koyanagi

Proceedings of the 9th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　613-622　2007/01

New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique Peer-reviewed

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada, Takayuki Konno, Jun Liang, Keiichi Sasaki, Kiyoshi Inamura, Tetsu Tanaka, Mitsumasa Koyanagi

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2　985-988　2007

DOI： 10.1109/IEDM.2007.4419119 　

ISSN： 2380-9248

High performance polynorbornene optical waveguide for Opto-Electric interconnections Peer-reviewed

M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

6TH INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, PROCEEDINGS 2007　193-+　2007

DOI： 10.1109/POLYTR.2007.4339166 　

Fully implantable retinal prosthesis chip with photodetector and stimulus current generator Peer-reviewed

T. Tanaka, K. Sato, K. Komiya, T. Kobayashi, T. Watanabe, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2　1015-+　2007

DOI： 10.1109/IEDM.2007.4419127 　

Novel Retinal Prosthesis with Three-dimensionally Stacked LSI and Evaluation of Electrically Evoked Potential

T. Tanaka, T. Watanabe, H. Kikuchi, J. Deguchi, K. Motonami, T. Fukushima, H. Tomita, H. Kurino, M. Tamai, M. Koyanagi

Proceedings of the 8th International Symposium of Future Medical Engineering Based on Bio-nanotechnology　33-36　2006/12

Three-dimensional integration technology based on wafer bonding with vertical buried interconnections Peer-reviewed

Mitsumasa Koyanagi, Tomonori Nakamura, Yuusuke Yamada, Hirokazu Kikuchi, Takafumi Fukushima, Tetsu Tanaka, Hiroyuki Kurino

IEEE TRANSACTIONS ON ELECTRON DEVICES　53　(11)　2799-2808　2006/11

DOI： 10.1109/TED.2006.884079 　

ISSN： 0018-9383

eISSN： 1557-9646

Super-Chip Integration Based on Chip-to-Wafer 3D Integration Technology Invited

T.Tanaka, T.Fukushima, M.Koyanagi

The 5th International Symposium on Microelectronics and Packaging　2006/10

Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration Peer-reviewed

H. Kikuchi, Y. Yamada, A. M. Ali, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　490-491　2006/09

Low Power Spin-Transfer MRAM Writing Scheme with Selective World Line Bootstrap Peer-reviewed

T. Sugimura, T. Sakaguchi, D. Amano, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　602-603　2006/09

Novel Opto-Electro Printed Circuit Board with Polynorbornene Optical Waveguide Peer-reviewed

M. Fujiwara, Y. Shirato, H. Owari, K. Watanabe, M. Matsuyama, K. Takahama, T. Mori, K. Miyao, K. Choki, T. Fukushima, T. Tanaka, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　840-841　2006/09

Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis by Using Platinum-Black (Pt-b) Stimulus Electrode Array Peer-reviewed

T. Watanabe, K. Komiya, T. Kobayashi, R. Kobayashi, T. Fukushima, H. Tomita, E. Sugano, M. Sato, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　890-891　2006/09

Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem Peer-reviewed

R. Kobayashi, T. Watanabe, K. Komiya, T. Fukushima, K. Sakamoto, H. Kurino, T. Tanaka, N. Katayama, H. Mushiake, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　898-899　2006/09

New Magnetic Nano-Dot Memory with FePt Nano-Dots Peer-reviewed

C. K. Yin, J. C. Bea, M. Murugesan, M. Oogane, T. Fukushima, T. Tanaka, K. Natori, M. Miyao, M. Koyanagi

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials　2006　994-995　2006/09

Magnetic properties of FePt nanodots formed by a self-assembled nanodot deposition method Peer-reviewed

C. K. Yin, T. Fukushima, T. Tanaka, M. Koyanagi, J. C. Bea, H. Choi, M. Nishijima, M. Miyao

APPLIED PHYSICS LETTERS　89　(6)　063109-1-063109-3　2006/08

DOI： 10.1063/1.2335588 　

ISSN： 0003-6951

A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory Peer-reviewed

E Yoshida, T Tanaka

IEEE TRANSACTIONS ON ELECTRON DEVICES　53　(4)　692-697　2006/04

DOI： 10.1109/TED.870283 　

ISSN： 0018-9383

Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology Peer-reviewed

T. Fukushima, Y. Yamada, H. Kikuchi, T. Tanaka, M. Koyanagi

Proceedings of International Conference on Electronics Packaging　220-224　2006/04

Semiconductor-on-Low-K Substrate Technology

Tetsu Tanaka, Yusuke Yamada, Mungi Park, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings - Electrochemical Society　PV 2006-03　297-301　2006

New non-volatile memory with magnetic nano-dots

Mitsumasa Koyanagi, J. C. Bea, C. K. Yin, Takafumi Fukushima, Tetsu Tanaka

ECS Transactions　2　(1)　209-215　2006

ISSN： 1938-5862 1938-6737

Research and development of transistor structure in nano-scale region Peer-reviewed

M. Koyanagi, Y. Yamada, M. Park, T. Fukushima, T. Tanaka

2006 INTERNATIONAL WORKSHOP ON NANO CMOS, PROCEEDINGS　34-37　2006

Development of new three-dimensional integration technology for retinal prosthesis Peer-reviewed

Yusuke Yamada, Jun Deguchi, Taiichiro Watanabe, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　613-+　2006

DOI： 10.1142/9781860948800_0067 　

Novel retinal prosthesis system with three dimensionally stacked LSI chip Peer-reviewed

T. Watanabe, H. Kikuchi, T. Fukushima, H. Tomita, E. Sugano, H. Kurino, T. Tanaka, M. Tamai, M. Koyanagi

ESSDERC 2006: PROCEEDINGS OF THE 36TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE　327-+　2006

DOI： 10.1109/ESSDER.2006.307704 　

ISSN： 1930-8876

Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips

Hircrazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　385-+　2006

Biologically inspired vision chip fabricated using 3-dimensional integration technology

Hiroyuki Kurino, Yoshihiro Nakagawa, Tomonori Nakamura, Yusuke Yamada, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　261-+　2006

Development of low-power retinal prosthesis with photodetectors and stimulus current generators

Taiichiro Watanabe, Jun Deguchi, Takafumi Fukushinia, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　321-+　2006

Neuromorphic analog circuits for three-dimensionally stacked vision chip

Jun Liang, Yoshihiro Nakagawa, Jun Deguchi, Jeoung-Chill Shim, Takafumi Fukushima, Hiroyuki Kurino, Tetsu Tanaka, Mitsumasa Koyanagi

FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS　455-+　2006

New Transistor Structure for Nano-Scale Range Invited

T.Tanaka, M.Park, H.Oh, Y.Yamada, H.Choi, T.Fukushima, M.Koyanagi

10th Photonics and Semiconductor Device Reliability Workshop　2005/12/01

A study of highly scalable DG-FinDRAM Peer-reviewed

E Yoshida, Miyashita, I, T Tanaka

IEEE ELECTRON DEVICE LETTERS　26　(9)　655-657　2005/09

DOI： 10.1109/LED.2005.853666 　

ISSN： 0741-3106

45-nm node CMOS integration with a novel STI structure and full-NCS/Cu interlayers for low-operation-power (LOP) applications Peer-reviewed

M Okuno, K Okabe, T Sakuma, K Suzuki, T Miyashita, T Yao, H Morioka, M Terahara, Y Kojima, H Watatani, K Sugimoto, T Watanabe, Y Hayami, T Mon, T Kubo, Y Iba, Sugiura, I, H Fukutome, Y Morisaki, H Minakata, K Ikeda, S Kishii, N Shimizu, T Tanaka, S Asai, M Nakaishi, S Fukuyama, A Tsukune, M Yamabe, Hanyuu, I, M Miyajima, M Kase, K Watanabe, S Satoh, T Sugii

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST　57-60　2005

Scalability study on a capacitorless 1T-DRAM: From single-gate PD-SOI to double-gate FinDRAM Invited Peer-reviewed

T Tanaka, E Yoshida, T Miyashita

IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST　919-922　2004

Highly reliable dynamic random access memory technology for application specific memory with dual nitrogen concentration gate oxynitrides using selective nitrogen implantation Peer-reviewed

T Sugizaki, A Murakoshi, R Katsumata, M Kojima, T Tanaka, T Nakanishi, Y Nara

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS　42　(4B)　1870-1873　2003/04

DOI： 10.1143/JJAP.42.1870 　

ISSN： 0021-4922

Process and device technologies for high-performance 0.13 mu m FCRAM Peer-reviewed

Y Nara, S Nakamura, T Tanaka, K Hashimoto, D Matsunaga

FUJITSU SCIENTIFIC & TECHNICAL JOURNAL　39　(1)　62-71　2003

ISSN： 0016-2523

A design of a capacitorless 1T-DRAM cell using gate-induced drain leakage (GIDL) current for low-power and high-speed embedded memory Peer-reviewed

E Yoshida, T Tanaka

2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST　913-916　2003

A 65 nm CMOS technology with a high-performance and low-leakage transistor, a 0.55 mu m(2) 6T-SRAM cell and robust hybrid-ULK/Cu interconnects for mobile multimedia applications Peer-reviewed

S Nakai, M Kojima, N Misawa, M Miyajima, S Asai, S Inagaki, Y Iba, T Ohba, M Kase, H Kitada, S Satoh, N Shimizu, Sugiura, I, F Sugimoto, Y Setta, T Tanaka, N Tamura, M Nakaishi, Y Nakata, J Nakahira, N Nishikawa, A Hasegawa, S Fukuyama, K Fujita, K Hosaka, N Horiguchi, H Matsuyama, T Minami, M Minamizawa, H Morioka, E Yano, A Yamaguchi, K Watanabe, T Nakamura, T Sugii

2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST　285-288　2003

Suppression of SiN-induced boron penetration by using SiH-free silicon nitride films formed by tetrachlorosilane and ammonia Peer-reviewed

M Tanaka, S Saida, Mizushima, I, F Inoue, M Kojima, T Tanaka, T Nakanishi, K Suguro, Y Tsunashima

IEEE TRANSACTIONS ON ELECTRON DEVICES　49　(9)　1526-1531　2002/09

DOI： 10.1109/TED.2002.802630 　

ISSN： 0018-9383

Impact of Thermal Budget Reduction on MOSFET Performance to Achieve High-speed and High-density DRAM-based System LSI Peer-reviewed

E. Yoshida, T. Miyashita, H. Nitta, M. Tanaka, K. Ishii, Y. Akasaka, P. H. Chou, K. Hashimoto, Y. Kohyama, T. Tanaka, Y. Nara

Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials　732-733　2002/09

Highly Reliable DRAM Technology for ASM with Dual Nitrogen Concentration Gate Oxynitrides using Selective Nitrogen Implantation Peer-reviewed

T. Sugizaki, A. Murakoshi, T. Tanaka, R. Katsumata, T. Nakanishi, Y. Nara

Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials　736-737　2002/09

Realization of 0.1 um buried-channel PMOSFETs by device restructuring using tilted well implantation technology Peer-reviewed

T. Tanaka, Y. Momiyama, K. Goto, Y. Sambonsugi, M. Deura, T. Sugii

Symposium on VLSI Technology, Digest of Technical Papers　109-110　1999/06

High frequency characteristics of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage Peer-reviewed

T Tanaka, Y Momiyama, T Sugii

IEICE TRANSACTIONS ON ELECTRONICS　E82C　(3)　538-543　1999/03

ISSN： 0916-8524

eISSN： 1745-1353

Ultra low energy boron implantation using cluster ions for decananometer MOSFETs Peer-reviewed

T Sugii, K Goto, T Tanaka, J Matsuo, Yamada, I

APPLICATION OF ACCELERATORS IN RESEARCH AND INDUSTRY, PTS 1 AND 2　475　383-386　1999

ISSN： 0094-243X

Channel engineering using B10H14 ion implantation for low Vth and high SCE immunity of buried-channel PMOSFETs in 4-Gbit DRAMs and beyond Peer-reviewed

T. Tanaka, H. Ogawa, K. Goto, K. Itabashi, T. Yamazaki, J. Matsuo, T. Sugii, I. Yamada

Symposium on VLSI Technology, Digest of Technical Papers　88-89　1998/06

A study of ultra shallow junction and tilted channel implantation for high performance 0.1 mu m pMOSFETs Peer-reviewed

K Goto, M Kase, K Momiyama, H Kurata, T Tanaka, M Deura, Y Sanbonsugi, T Sugii

INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST　631-634　1998

Fmax enhancement of dynamic threshold-voltage MOSFET (DTMOS) under ultra-low supply voltage Peer-reviewed

T Tanaka, Y Momiyama, T Sugii

INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST　423-426　1997

A high performance 50nm PMOSFET using decaborane (B10H14) ion implantation and 2-step activation annealing process Peer-reviewed

K Goto, J Matsuo, Y Tada, T Tanaka, Y Momiyama, T Sugii, Yamada, I

INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST　471-474　1997

A comparative study of advanced MOSFET concepts Peer-reviewed

CH Wann, K Noda, T Tanaka, M Yoshida, CM Hu

IEEE TRANSACTIONS ON ELECTRON DEVICES　43　(10)　1742-1753　1996/10

DOI： 10.1109/16.536820 　

ISSN： 0018-9383

eISSN： 1557-9646

New Method of Extracting Inversion Layer Thickness and Charge Profile and Its Impact on Scaled MOSFETs Peer-reviewed

T. Tanaka, T. Sugii, C. Hu

Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials　10-12　1996/08

Advanced SOI devices using CMP and wafer bonding Peer-reviewed

H. Horie, S. Nakamura, Y. Nara, K. Suzuki, T. Tanaka, A. Ito, Y. Arimoto, N. Sasaki

Extended Abstracts of the 1996 International Conference on Solid State Devices and Materials　1996　473-475　1996/08

A comparative study of advanced MOSFET structures Peer-reviewed

CH Wann, R Tu, B Yu, CM Hu, K Noda, T Tanaka, M Yoshida, K Hui

1996 SYMPOSIUM ON VLSI TECHNOLOGY　32-33　1996

HIGH-SPEED AND LOW-POWER N(+)-P(+) DOUBLE-GATE SOI CMOS Peer-reviewed

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, T SUGII

IEICE TRANSACTIONS ON ELECTRONICS　E78C　(4)　360-367　1995/04

ISSN： 0916-8524

eISSN： 1745-1353

15ps cryogenic operation of 0.19-mu m-L(G)n+-p+ double-gate SOI CMOS Peer-reviewed

T Sugii, T Tanaka, H Horie, K Suzuki

MICROELECTRONIC DEVICE AND MULTILEVEL INTERCONNECTION TECHNOLOGY　2636　74-82　1995

ULTRAFAST OPERATION OF 5TH-ADJUSTED P(+)-N(+) DOUBLE-GATE SOI MOSFETS Peer-reviewed

T TANAKA, K SUZUKI, H HORIE, T SUGII

IEEE ELECTRON DEVICE LETTERS　15　(10)　386-388　1994/10

DOI： 10.1109/55.320976 　

ISSN： 0741-3106

SOURCE DRAIN CONTACT RESISTANCE OF SILICIDED THIN-FILM SOI MOSFETS Peer-reviewed

K SUZUKI, T TANAKA, Y TOSAKA, T SUGII, S ANDOH

IEEE TRANSACTIONS ON ELECTRON DEVICES　41　(6)　1007-1012　1994/06

DOI： 10.1109/16.293314 　

ISSN： 0018-9383

eISSN： 1557-9646

Predicted Propagation Delay Time of Double-Gate SOI MOSFETs Based on a Scaling Theory Peer-reviewed

K. Suzuki, Y. Tosaka, T. Tanaka, T. Sugii

International Conference on Advanced Microelectronic Device and Processing　599-602　1994/03

ANALYTICAL SURFACE-POTENTIAL EXPRESSION FOR THIN-FILM DOUBLE-GATE SOI MOSFETS Peer-reviewed

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO, T ITOH

SOLID-STATE ELECTRONICS　37　(2)　327-332　1994/02

DOI： 10.1016/0038-1101(94)90085-X 　

ISSN： 0038-1101

eISSN： 1879-2405

ULTRAFAST LOW-POWER OPERATION OF P+-N+ DOUBLE-GATE SOI MOSFETS Peer-reviewed

T TANAKA, K SUZUKI, H HORIE, T SUGII

1994 SYMPOSIUM ON VLSI TECHNOLOGY　11-13　1994

SCALING THEORY FOR DOUBLE-GATE SOI MOSFETS Peer-reviewed

K SUZUKI, T TANAKA, Y TOSAKA, H HORIE, Y ARIMOTO

IEEE TRANSACTIONS ON ELECTRON DEVICES　40　(12)　2326-2329　1993/12

DOI： 10.1109/16.249482 　

ISSN： 0018-9383

eISSN： 1557-9646

ANALYTICAL MODELS FOR SYMMETRICAL THIN-FILM DOUBLE-GATE SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR-FIELD-EFFECT-TRANSISTORS Peer-reviewed

K SUZUKI, S SATOH, T TANAKA, S ANDO

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS　32　(11A)　4916-4922　1993/11

ISSN： 0021-4922

2.Analytical Surface Potential Expression For Double-gate SOI MOSFETs Peer-reviewed

K. Suzuki, T. Tanaka, H. Horie, Y. Arimoto, T. Itoh

International Workshop on VLSI Process and Device Modeling Technical Digest　150-151　1993/05

Fabrication of double-gate thin-film SOI MOSFETs using wafer bonding and polishing Peer-reviewed

H. Horie, S. Ando, T. Tanaka, M. Imai, Y. Arimoto, S. Hijiya

Extended Abstracts of the 1991 International Conference on Solid State Devices　165-167　1991/08

P+ polysilicon gate P-MOSFETs using BCl implantation Peer-reviewed

K. Oikawa, S. Ando, N. Ando, H. Horie, Y. Toda, T. Tanaka, S. Hijiya

Technical Digest - International Electron Devices Meeting, IEDM　1991-　79-82　1991

DOI： 10.1109/IEDM.1991.235419 　

ISSN： 0163-1918

Analysis of p+ poly Si double-gate thin-film SOI MOSFETs Peer-reviewed

Tetsu Tanaka, Hirpshi Horie, Satmhi Ando, Shinpei Hijiya

Technical Digest - International Electron Devices Meeting, IEDM　1991-　683-686　1991

DOI： 10.1109/IEDM.1991.235330 　

ISSN： 0163-1918

U-GROOVED SIT CMOS TECHNOLOGY WITH 3 FJ AND 49 PS (7 MW, 350 FJ) OPERATION Peer-reviewed

J NISHIZAWA, N TAKEDA, S SUZUKI, T SUZUKI, T TANAKA

IEEE TRANSACTIONS ON ELECTRON DEVICES　37　(8)　1877-1883　1990/08

DOI： 10.1109/16.57139 　

ISSN： 0018-9383

eISSN： 1557-9646