Details of the Researcher
Ph.D. in Engineering (Tohoku University)
日本材料学会
2023/04 - Present
応用物理学会
Japan society of mechanical engineers
Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Machine materials and mechanics /
Outstanding Technical Paper Award of International Conference on Electronic Packaging
2013/03 エレクトロニクス実装学会
Best Paper Award of ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
2011/07 ASME
ASME INTERNATIONAL InterPACK ’09 Best Poster
2009/07 ASME
International Conference on Electronics Packaging Outstanding Technical Paper Award
2009/04 Japan Institute of Electronics Packaging
Outstanding Paper Award of Packageing Material and Process Track
2007/07 ASME
応用物理学会講演奨励賞
1997/03 応用物理学会
Highly Sensitive Metal Ion Detection Using Tetraphenylporphyrin-Functionalized Graphene Field-Effect Transistors
Tuerdi, G., Zhang, Q., Bao, L., Zhang, X., Suzuki, K., Miura, H., Zhang, Z., Fu, W.
ACS Applied Electronic Materials 8 (1) 2026
ISSN： 2637-6113
Polymorph-Specific Electronic Transduction in WO3 during Molecular Sensing
D{'}Andria, M., Yin, M., Neuhauser, S., Mavrantzas, V.G., Chen, Y., Suzuki, K., G{\"u}ntner, A.T.
Advanced Materials 2026
ISSN： 0935-9648 1521-4095
Single Cu Atom Sites on Co3O4 Activate Interfacial Oxygen for Enhanced Reactivity and Selective Gas Sensing at Low Temperature
Shin, H., D{'}Andria, M., Yin, M., Ko, J., Suzuki, K., Kim, D.-H., Krumeich, F., G{\"u}ntner, A.T.
Small 2026
ISSN： 1613-6810 1613-6829
Controlling NO2 adsorption on defective graphene through strain: A DFT study
Meng Yin, Xiangyu Qiao, Ying Chen, Lei Wang, Hideo Miura, Ken Suzuki
Surfaces and Interfaces 73 107542-107542 2025/09
Publisher: Elsevier BVDOI： 10.1016/j.surfin.2025.107542
ISSN： 2468-0230
Anharmonic properties of Prussian blue analogues MIIPtIV(CN)6 (MII = Cd, Fe, Zn)
Wang, G., Yao, Z.-H., Suzuki, K., Chen, Y., Wang, L.
Dalton Transactions 54 (31) 2025
DOI： 10.1039/d5dt01119a
ISSN： 1477-9226 1477-9234
Strain-modulated adsorption of gas molecule on graphene: First-principles calculations
Meng Yin, Xiangyu Qiao, Lei Wang, Hideo Miura, Ken Suzuki
Diamond and Related Materials 142 2024/02
DOI： 10.1016/j.diamond.2024.110822
ISSN： 0925-9635
Stress-Induced Acceleration of the Growth of δ-Phase Precipitates in Ni-Based Superalloy GH4169 (IN718) and Its Effect on the Acceleration of Intergranular Cracking Under Creep Loading at Elevated Temperature
Ayumi Nakayama, Run Zi Wang, Ken Suzuki, Hideo Miura
Minerals, Metals and Materials Series 369-378 2024
DOI： 10.1007/978-3-031-63937-1_35
ISSN： 2367-1181
eISSN： 2367-1696
Creep damage evolution by cavity nucleation and growth considering the cavity closure under cyclic loading conditions
Le Xu, Lv Yi Cheng, Kai Shang Li, Ken Suzuki, Hideo Miura, Run Zi Wang
Fatigue and Fracture of Engineering Materials and Structures 2024
DOI： 10.1111/ffe.14389
ISSN： 8756-758X
eISSN： 1460-2695
The uniaxial zero thermal expansion and zero linear compressibility in distorted Prussian blue analogue RbCuCo(CN)<inf>6</inf>
Lei Wang, Ya Ning Sun, Xian Deng Wei, Meng Yin, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang
Physical Chemistry Chemical Physics 25 (48) 32845-32852 2023/11/21
DOI： 10.1039/d3cp04563c
ISSN： 1463-9076
Geometric discontinuity effect on creep-fatigue behaviors in a nickel-based superalloy hole structure considering ratcheting deformation
Lv Yi Cheng, Run Zi Wang, Kai Shang Li, Hai Long Guo, Le Xu, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu
International Journal of Fatigue 175 2023/10
DOI： 10.1016/j.ijfatigue.2023.107798
ISSN： 0142-1123
Microstructural evolutions and life evaluation of non-proportional creep-fatigue considering loading path and holding position effects
Le Xu, Run Zi Wang, Yu Chen Wang, Lei He, Takamoto Itoh, Ken Suzuki, Hideo Miura, Xian Cheng Zhang
Materials Characterization 204 2023/10
DOI： 10.1016/j.matchar.2023.113209
ISSN： 1044-5803
Acceleration mechanism of the degradation of the lifetime of Ni-based superalloys under creep-fatigue loading at elevated temperatures
Yifan Luo, Yukako Takahashi, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
Fatigue and Fracture of Engineering Materials and Structures 46 (8) 3043-3059 2023/08
DOI： 10.1111/ffe.14013
ISSN： 8756-758X
eISSN： 1460-2695
Oxidation-involved life prediction and damage assessment under generalized creep-fatigue loading conditions based on engineering damage mechanics
Run Zi Wang, Xian Cheng Zhang, Hang Hang Gu, Kai Shang Li, Jian Feng Wen, Hideo Miura, Ken Suzuki, Shan Tung Tu
Journal of Materials Research and Technology 23 114-130 2023/03/01
DOI： 10.1016/j.jmrt.2022.12.094
ISSN： 2238-7854
Control of the Adsorption Behavior of Gas Molecule on Graphene by Strain: First-Principles Calculations for Development of Multi-Gas Selective Sensors
Meng Yin, Xiangyu Qiao, Ken Suzuki, Hideo Miura, Lei Wang
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 241-244 2023
DOI： 10.23919/SISPAD57422.2023.10319538
IMPROVEMENT OF SENSITIVITY AND SELECTIVITY OF GRAPHENE-BASED GAS SENSOR BY STRAIN
Xiangyu Qiao, Meng Yin, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 4 2023
SENSITIVITY IMPROVEMENT OF GRAPHENE-BASED GAS SENSORS BY DIRECT GROWTH OF CARBON NANOTUBES ON THE GRAPHENE
Ken Suzuki, Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 4 2023
Evaluation of fatigue and creep-fatigue damage levels on the basis of engineering damage mechanics approach
Li Sun, Xian Cheng Zhang, Run Zi Wang, Xiao Wei Wang, Shan Tung Tu, Ken Suzuki, Hideo Miura
International Journal of Fatigue 166 2023/01
DOI： 10.1016/j.ijfatigue.2022.107277
ISSN： 0142-1123
Strain-Induced Change of Gas Adsorption Properties of Graphene and its Application to a Gas Sensor
Xiangyu Qiao, Meng Yin, Ken Suzuki, Hideo Miura
2023 International Conference on Electronics Packaging, ICEP 2023 161-162 2023
DOI： 10.23919/ICEP58572.2023.10129780
Penta-graphene and phagraphene: thermal expansion, linear compressibility, and Poisson’s ratio
Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang
Journal of Physics Condensed Matter 34 (50) 2022/12/14
ISSN： 0953-8984
eISSN： 1361-648X
Tunable uniaxial, area, and volume negative thermal expansion in quartz-like and diamond-like metal–organic frameworks Peer-reviewed
Lei Wang, Ying Chen, Hideo Miura, Ken Suzuki, Cong Wang
RSC Advances, 12 (34) 21770-21779 2022/08
DOI： 10.1039/d2ra03292a
eISSN： 2046-2069
Evaluation of fracture properties of annealed Fe–Si–B–Cr amorphous alloys using micro-tensile tests and blanking machinability
Chieko Kuji, Masayoshi Mizutani, Keita Shimada, Ken Suzuki, Hideo Miura, Tsunemoto Kuriyagawa
Materials Science and Engineering: A 848 143483-143483 2022/07
Publisher: Elsevier BVDOI： 10.1016/j.msea.2022.143483
ISSN： 0921-5093
Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures
Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura
2022 International Conference on Electronics Packaging, ICEP 2022 81-82 2022
DOI： 10.23919/ICEP55381.2022.9795457
Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature
Shogo Tezuka, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022
PREDICTION OF THE GENERATION OF INTERGRANULAR CRACKING IN STAINLESS STEELS UNDER CREEP LOADING AT ELEVATED TEMPERATURES
Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022
STRAIN-INDUCED CHANGE OF ADSORPTION BEHAVIOUR OF GAS MOLECULES ON GRAPHENE ANALYZED BY DENSITY FUNCTIONAL METHOD
Meng Yin, Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki, Lei Wang
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022
IMPROVEMENT OF THE SENSITIVITY AND SELECTIVITY OF GAS MOLECULES OF GRAPHENE-BASE GAS SENSOR WITH CARBON NANOTUBES UNDER THE APPLICATION OF STRAIN
Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022
CREEP-FATIGUE RELIABILITY ANALYSIS INTEGRATED WITH SURROGATE MODELLING: APPLICATION ON INDUSTRIAL CASE STUDIES
Run Zi Wang, Ken Suzuki, Hideo Miura, Xian Cheng Zhang, Shan Tung Tu
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2022
Stability and Thermodynamics Properties of CrFeNiCoMn/Pd High Entropy Alloys from First Principles
Nguyen Dung Tran, Arkapol Saengdeejing, Ken Suzuki, Hideo Miura, Ying Chen
Journal of Phase Equilibria and Diffusion 42 (5) 606-616 2021/10
DOI： 10.1007/s11669-021-00900-1
ISSN： 1547-7037
eISSN： 1863-7345
Theoretical study on strain-controllable gradient Schottky barrier of dumbbell-shape graphene nanoribbon for highly sensitive strain sensors
Qinqiang Zhang, Ken Suzuki, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2021-September 171-174 2021/09/27
DOI： 10.1109/SISPAD54002.2021.9592548
Development of highly sensitive strain sensor using area-arrayed graphene nanoribbons
Ken Suzuki, Ryohei Nakagawa, Qinqiang Zhang, Hideo Miura
Nanomaterials 11 (7) 2021/07
DOI： 10.3390/nano11071701
eISSN： 2079-4991
Electronic band-engineering of a dumbbell-shaped graphene nanoribbon by the application of uniaxial tensile strain
Jowesh Avisheik Goundar, Qinqiang Zhang, Ken Suzuki, Hideo Miura
2021 International Conference on Electronics Packaging, ICEP 2021 147-148 2021/05/12
DOI： 10.23919/ICEP51988.2021.9451931
First-principles calculation on the uniaxial-strain-induced change of the adsorption behavior of gas molecules on graphene
Meng YIN, Qinqiang ZHANG, Xiangyu QIAO, Ken SUZUKI, Hideo MIURA
The Proceedings of The Computational Mechanics Conference 2021.34 012-012 2021
Publisher: Japan Society of Mechanical EngineersDOI： 10.1299/jsmecmd.2021.34.012
eISSN： 2424-2799
CREEP-FATIGUE DAMAGE OF HEAT-RESISTANT ALLOYS CAUSED BY THE LOCAL LATTICE MISMATCH-INDUCED ACCELERATION OF THE GENERATION AND ACCUMULATION OF DISLOCATIONS AND VACANCIES
Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
DETACHABLE FINE BUMP CONNECTION USING MULTI-WALLED CARBON-NANOTUBE BUNDLES FOR 3D SEMICONDUCTOR MODULES
Masasuke Kobayashi, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
EFFECT OF TENSILE STRAIN ON ELECTRON TRANSPORT PROPERTIES OF DUMBBELL-SHAPE GRAPHENE NANORIBBONS WITH METALLIC-SEMICONDUCTING INTERFACES
Ken Suzuki, Qinqiang Zhang, Xiangyu Qiao
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
ACCELERATION MECHANISM OF INTERGRANULAR CRACKING OF SUS361L UNDER CREEP-FATIGUE LOADING AT ELEVATED TEMPERATURES
Yukako Takahashi, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
IMPROVEMENT IN PHOTOSENSITIVITY OF DUMBBELL-SHAPED GRAPHENE NANORIBBON STRUCTURES BY USING ASYMMETRIC METALLIZATION TECHNIQUE
Jowesh Avisheik Goundar, Qiao Xiangyu, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
MOLECULAR DYNAMICS ANALYSIS OF THE ACCELERATION OF THE DEGRADATION OF THE STRENGTH OF A GRAIN BOUNDARY UNDER CREEP-FATIGUE LOADS
Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2021
Stability and structural properties of vacancy-ordered and -disordered ZrCx
Theresa Davey, Ken Suzuki, Hideo Miura, Ying Chen
RSC Advances 11 (52) 32573-32589 2021
Publisher: Royal Society of Chemistry (RSC)DOI： 10.1039/d1ra06362f
eISSN： 2046-2069
A first-principles study on the strain-induced localized electronic properties of dumbbell-shape graphene nanoribbon for highly sensitive strain sensors
Qinqiang Zhang, Ken Suzuki, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2020-September 379-382 2020/09/23
DOI： 10.23919/SISPAD49475.2020.9241686
A quasi in-situ study on the deformation mechanism in a 2.2Cr heat resistant steel
L. Cheng, Y. L. Chen, X. F. Gu, W. Yu, Q. W. Cai, K. Suzuki, H. Miura, R. D.K. Misra
Materials Science and Engineering A 788 2020/06/24
DOI： 10.1016/j.msea.2020.139557
ISSN： 0921-5093
Initial Intergranular Cracking of Ni-Base Superalloys Due to the Degradation of the Crystallinity of Grain Boundaries Under Creep-Fatigue Loading
Wataru Suzuki, Yifan Luo, Kenta Ishihara, Kens Suzuki, Hideo Miura
Structural Integrity 16 325-331 2020
DOI： 10.1007/978-3-030-47883-4_58
ISSN： 2522-560X
eISSN： 2522-5618
Theoretical study of heterojunction-like electronic properties between a semiconductive graphene nanoribbon and a metallic graphene for highly sensitive strain sensors
Qinqiang Zhang, Xiangyu Qiao, Masasuke Kobayashi, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 13 2020
Non-destructive evaluation of the degradation of NI-base superalloy in the air by reflectance spectrum analysis
Shin Kasama, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2020
Crystallinity dependence of grain and grain boundary strength of a bicrystal structure of copper
Ken Suzuki, Yiqing Fan, Yifan Luo
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 13 2020
Development of a strain-controlled graphene-based highly sensitive gas sensor
Xiangyu Qiao, Qinqiang Zhang, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 3 2020
Molecular dynamics analysis of the acceleration of intergranular cracking of Ni-base superalloy caused by accumulation of vacancies and dislocations around grain boundaries
Ryo Kikuchi, Shujiro Suzuki, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 12 2020
Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections
Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura
IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 2019/10
DOI： 10.1109/3DIC48104.2019.9058897
Theoretical study of the edge effect of dumbbellshape graphene nanoribbon with a dual electronic properties by first-principle calculations
Qinqiang Zhang, Takuya Kudo, Jowesh Gounder, Ying Chen, Ken Suzuki, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019-September 2019/09
DOI： 10.1109/SISPAD.2019.8870398
Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections
Ryota Mizuno, Yutaro Nakoshi, Ken Suzuki, Hideo Miura
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 2019/03/05
DOI： 10.1109/EMAP.2018.8660838
Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons
Takuya Kudo, Zhi Wang, Ken Suzuki, Hideo Miura
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 2019/03/05
DOI： 10.1109/EMAP.2018.8660828
Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon
Qinqiang Zhang, Ken Suzuki, Hideo Miura
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging 2019/03/05
DOI： 10.1109/EMAP.2018.8660806
A theoretical study of the effect of strain on the electronic structure of dumbbell-shape graphene nanoribbons
Qinqiang Zhang, Takuya Kudo, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 161-164 2019/01/24
DOI： 10.1109/IMPACT.2018.8625809
ISSN： 2150-5934
eISSN： 2150-5942
Variation of the strength and fracture mode of a grain and a grain boundary in polycrystalline copper thin films
Guoxiong Zheng, Yifan Luo, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 119-122 2019/01/24
DOI： 10.1109/IMPACT.2018.8625739
ISSN： 2150-5934
eISSN： 2150-5942
Development of 2D-graphene-based highly sensitive flexible strain sensor using fine columnar concentration structures
Zhi Wang, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2018-October 157-160 2019/01/24
DOI： 10.1109/IMPACT.2018.8625746
ISSN： 2150-5934
eISSN： 2150-5942
Strain and photovoltaic sensitivities of dumbbell-shape GnR-base sensors
Jowesh Avisheik Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019
Change of the effective strength of grain boundaries in Alloy 617 under creep-fatigue loadings at 800°C
Wataru Suzuki, Kenta Ishihara, Ryo Kikuchi, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2019
First principle analysis of the effect of strain on electronic transport properties of dumbbell-shape graphene nanoribbons
Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019
Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors
Ryota Mizuno, Genta Nakauchi, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2019
Grain boundary cracking of nickel-based alloy 625 under creep loadings at elevated temperatures
Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 2019
Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading
Wataru Suzuki, Akari Sawase, Ken Suzuki, Hideo Miura
Structural Integrity 5 227-232 2019
DOI： 10.1007/978-3-319-91989-8_49
ISSN： 2522-560X
eISSN： 2522-5618
Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging
Yutaro Nakoshi, Ken Suzuki, Hideo Miura
Japanese Journal of Applied Physics 58 (SB) 2019
ISSN： 0021-4922
eISSN： 1347-4065
Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films
Ken Suzuki, Fan Yiqing, Yifan Luo, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2018-September 88-91 2018/11/28
DOI： 10.1109/SISPAD.2018.8551672
Effect of tungsten on microstructures of annealed electrodeposited Ni-W alloy and its corrosion resistance Peer-reviewed
Lv Jinlong, Wang Zhuqing, Liang Tongxiang, Ken Suzuki, Miura Hideo
Surface and Coatings Technology 337 516-524 2018/03/15
DOI： 10.1016/j.surfcoat.2018.01.070
ISSN： 0257-8972
Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test Peer-reviewed
Guoxiong Zheng, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 179-182 2018/01/12
DOI： 10.1109/IMPACT.2017.8255902
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes Peer-reviewed
Ryusaku Osada, Kanji Yumoto, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 218-221 2018/01/12
DOI： 10.1109/IMPACT.2017.8255896
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Graphene nano-ribbon-base highly sensitive pressure sensor using area-arrayed pillar structure Peer-reviewed
Zhi Wang, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 46-49 2018/01/12
DOI： 10.1109/IMPACT.2017.8255901
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Relationship between mechanical properties and micro texture of electroplated gold thin films Peer-reviewed
Yutaro Nakoshi, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 58-61 2018/01/12
DOI： 10.1109/IMPACT.2017.8255898
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices Peer-reviewed
Ryota Mizuno, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 62-65 2018/01/12
DOI： 10.1109/IMPACT.2017.8255899
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Development of high-quality graphene nano-ribbon fabrication process for high sensitivity strain sensor Peer-reviewed
Ryohei Nakagawa, Ken Suzuki, Hideo Miura
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2017- 214-217 2018/01/12
DOI： 10.1109/IMPACT.2017.8255897
ISSN： 2150-5942 2150-5934
eISSN： 2150-5942
Disappearance of martensitic strengthened-micro-texture in modified 9Cr-1Mo steel caused by stress-induced acceleration of atomic diffusion at elevated temperatures
Taichi Shinozaki, Ken Suzuki, Hideo Miura
Key Engineering Materials 774 KEM 31-35 2018
DOI： 10.4028/www.scientific.net/KEM.774.31
ISSN： 1013-9826
eISSN： 1662-9795
Theoretical study of electronic band structure of dumbbellshape graphene nanoribbons for highly-sensitive strain sensors
Qinqiang Zhang, Takuya Kudo, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018
Area-arrayed graphene nano-ribbon-base strain sensor
Ryohei Nakagawa, Zhi Wang, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018
Photosensitivity of monolayer graphene-base field effect transistor
Jowesh Avisheik Goundar, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018
Development of a flexible tactile sensor using area-arrayed bundle structures of multi-walled carbon nanotubes
Ryusaku Osada, Ken Suzuki
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 2018
Comparison of corrosion resistance of electrodeposited pure Ni and nanocrystalline Ni-Fe alloy in borate buffer solution Peer-reviewed
Lv Jinlong, Meng Yang, Ken Suzuki, Hideo Miura, Yubo Zhang
MATERIALS CHEMISTRY AND PHYSICS 202 15-21 2017/12
DOI： 10.1016/j.matchemphys.2017.09.005
ISSN： 0254-0584
eISSN： 1879-3312
Comparing different microstructures of CoS formed on bare Ni foam and Ni foam coated graphene and their supercapacitors performance Peer-reviewed
Lv Jinlong, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS 529 57-63 2017/09
DOI： 10.1016/j.colsurfa.2017.05.074
ISSN： 0927-7757
eISSN： 1873-4359
Improving hydrogen evolution reaction for MoS2 hollow spheres Peer-reviewed
Lv Jinlong, Guo Wenli, Liang Tongxiang, Suzuki Ken, Miura Hideo
JOURNAL OF ELECTROANALYTICAL CHEMISTRY 799 304-307 2017/08
DOI： 10.1016/j.jelechem.2017.06.024
ISSN： 1572-6657
eISSN： 1873-2569
The effect of graphene coated nickel foam on the microstructures of NiO and their supercapacitor performance Peer-reviewed
Lv Jinlong, Zhuqing Wang, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura
JOURNAL OF ELECTROANALYTICAL CHEMISTRY 799 595-601 2017/08
DOI： 10.1016/j.jelechem.2017.07.013
ISSN： 1572-6657
eISSN： 1873-2569
Performance comparison of NiCo2O4 and NiCo2S4 formed on Ni foam for supercapacitor Peer-reviewed
Lv Jinlong, Liang Tongxiang, Yang Meng, Suzuki Ken, Miura Hideo
COMPOSITES PART B-ENGINEERING 123 28-33 2017/08
DOI： 10.1016/j.compositesb.2017.05.021
ISSN： 1359-8368
eISSN： 1879-1069
The effect of reduced graphene oxide on MoS2 for the hydrogen evolution reaction in acidic solution Peer-reviewed
Lv Jinlong, Yang Meng, Liang Tongxiang, Ken Suzuki, Hideo Miura
CHEMICAL PHYSICS LETTERS 678 212-215 2017/06
DOI： 10.1016/j.cplett.2017.04.072
ISSN： 0009-2614
eISSN： 1873-4448
Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections Peer-reviewed
Takeru Kato, Ken Suzuki, Hideo Miura
JOURNAL OF ELECTRONIC PACKAGING 139 (2) 2017/06
DOI： 10.1115/1.4036442
ISSN： 1043-7398
eISSN： 1528-9044
Fabrication of 3D graphene foam for a highly conducting electrode Peer-reviewed
Lv Jinlong, Yang Meng, Ken Suzuki, Hideo Miura
MATERIALS LETTERS 196 369-372 2017/06
DOI： 10.1016/j.matlet.2017.03.079
ISSN： 0167-577X
eISSN： 1873-4979
Investigation of microstructures of ZnCo2O4 on bare Ni foam and Ni foam coated with graphene and their supercapacitors performance Peer-reviewed
Jinlong Lv, Tongxiang Liang, Meng Yang, Suzuki Ken, Miura Hideo
JOURNAL OF ENERGY CHEMISTRY 26 (3) 330-335 2017/05
DOI： 10.1016/j.jechem.2017.04.010
ISSN： 2095-4956
Synthesis of CoMoO4@RGO nanocomposites as high-performance supercapacitor electrodes Peer-reviewed
Lv Jinlong, Yang Meng, Ken Suzuki, Hideo Miura
MICROPOROUS AND MESOPOROUS MATERIALS 242 264-270 2017/04
DOI： 10.1016/j.micromeso.2017.01.034
ISSN： 1387-1811
eISSN： 1873-3093
The plume-like Ni3S2 supercapacitor electrodes formed on nickel foam by catalysis of thermal reduced graphene oxide Peer-reviewed
Lv Jinlong, Liang Tongxiang, Yang Meng, Ken Suzuki, Hideo Miura
JOURNAL OF ELECTROANALYTICAL CHEMISTRY 786 8-13 2017/02
DOI： 10.1016/j.jelechem.2017.01.004
ISSN： 1572-6657
eISSN： 1873-2569
Enhancement of band gap and evolution of in-gap states in hydrogen-adsorbed monolayer graphene on SiC(0001)
Sugawara, K., Suzuki, K., Sato, M., Sato, T., Takahashi, T.
Carbon 124 2017
DOI： 10.1016/j.carbon.2017.09.024
ISSN： 0008-6223
Atomic scale degradation of the initial strengthened micro texture of heat-resistant alloys under creep and fatigue loadings
Takuya Murakoshi, Taichi Shinozaki, Ken Suzuki, Hideo Miura
ICF 2017 - 14th International Conference on Fracture 1 409-411 2017
Degradation of the strength of grains and grain boundaries of Ni-base superalloy under creep and creep-fatigue loadings Peer-reviewed
Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki, Hideo Miura
Key Engineering Materials 754 31-34 2017
Publisher: Trans Tech Publications LtdDOI： 10.4028/www.scientific.net/KEM.754.31
ISSN： 1013-9826
Mechanical stress monitoring sensor for 3-d module during manufacturing and operation Peer-reviewed
Koki Isobe, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70323 2017
Creep-damage-induced deterioration of the strength of ni-base superalloy due to the change of its microstructure Peer-reviewed
Hayato Sakamoto, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70317 2017
Largely deformable and highly sensitive strain sensor using carbon nanomaterials Peer-reviewed
Kanji Yumoto, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70388 2017
Evaluation of damage evolution in nickel-base heat-resistant alloy under creep-fatigue loading conditions Peer-reviewed
Ken Suzuki, Takuya Murakoshi, Hiroki Sasaki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-72139 2017
Crystallinity-induced variation of the yield strength of electroplated copper thin films Peer-reviewed
Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70302 2017
CRYSTALLINITY CONTROL OF ELECTROPLATED INTERCONNECTIONS FOR IMPROVING THEIR STABILITY AND LIFETIME Peer-reviewed
Jiatong Liu, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017
CRYSTALLINITY-INDUCED DEGRADATION OF THE LIFETIME OF ADVANCED INTERCONNECTIONS Peer-reviewed
Takeru Kato, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017
Stress-induced acceleration of the change of microstructure of ni-base superalloy CM247LC Peer-reviewed
Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70314 2017
MICROSCOPIC ANALYSIS OF THE INITIATION OF HIGH-TEMPERATURE DAMAGE OF NI-BASED HEAT-RESISTANT ALLOY Peer-reviewed
Takuya Murakoshi, Ken Suzuki, Isamu Nonaka, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017
ATOMIC DIFFUSION INDUCED DAMAGE OF NI-BASE SUPER ALLOY AT ELEVATED TEMPERATURE Peer-reviewed
Motoki Takahashi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017
Stress-induced change of the microstructure and strength of modified 9Cr-1Mo steel under fatigue and creep loadings at elevated temperatures Peer-reviewed
Taichi Shinozaki, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 9 IMECE2017-70494 2017
Enhancing the corrosion resistance of the 2205 duplex stainless steel bipolar plates in PEMFCs environment by surface enriched molybdenum Peer-reviewed
Lv Jinlong, Wang Zhuqing, Liang Tongxiang, Suzuki Ken, Miura Hideo
RESULTS IN PHYSICS 7 3459-3464 2017
DOI： 10.1016/j.rinp.2017.09.001
ISSN： 2211-3797
VARIATION OF THE STRENGTH OF GRAINS AND GRAIN BOUNDARIES CAUSED BY THE FLUCTUATION OF THEIR CRYSTALLINITY Peer-reviewed
Takahiro Nakanishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 9 2017
HIGHLY-SENSITIVE GRAPHENE NANO-RIBBON-BASE STRAIN SENSOR Peer-reviewed
Shinichirou Sasaki, Meng Yang, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 10 2017
Measurement of the strength of a grain boundary in electroplated copper thin-film interconnections by using micro tensile-test Peer-reviewed
T. Shinozaki, T Nakanishi, K Suzuki, H Miura
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2016- 2016/11/28
Publisher: Institute of Electrical and Electronics Engineers Inc.DOI： 10.1109/IEMT.2016.7761963
ISSN： 1089-8190
Effects of uniaxial compressive strain on the electronic-transport properties of zigzag carbon nanotubes Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
NANO RESEARCH 9 (5) 1267-1275 2016/05
DOI： 10.1007/s12274-016-1022-0
ISSN： 1998-0124
eISSN： 1998-0000
Electronic properties and strain sensitivity of CVD-grown graphene with acetylene Peer-reviewed
Meng Yang, Shinichirou Sasaki, Masato Ohnishi, Ken Suzuki, Hideo Miura
JAPANESE JOURNAL OF APPLIED PHYSICS 55 (4) 2016/04
ISSN： 0021-4922
eISSN： 1347-4065
Control of the nucleation and quality of graphene grown by low-pressure chemical vapor deposition with acetylene Peer-reviewed
Meng Yang, Shinichirou Sasaki, Ken Suzuki, Hideo Miura
APPLIED SURFACE SCIENCE 366 219-226 2016/03
DOI： 10.1016/j.apsusc.2016.01.089
ISSN： 0169-4332
eISSN： 1873-5584
Minimization of Residual Stress in TSV Interconnections by Controlling Their Crystallinity Peer-reviewed
Jiatong Liu, Takeru Kato, Ken Suzuki, Hideo Miura
2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) 58-63 2016
DOI： 10.1109/ITHERM.2016.7517528
ISSN： 1087-9870
HIGHLY SENSITIVE PRESSURE SENSOR USING TWO-DIMENSIONALLY ALIGNED CARBON NANOTUBE BUNDLES Peer-reviewed
Takuya Nozaki, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 10 2016
CHARACTERIZATION OF THE ELECTRONIC PROPERTIES AND STRAIN SENSITIVITY OF GRAPHENE FORMED BY C2H2 CHEMICAL VAPOR DEPOSITION Peer-reviewed
Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 10 2016
Effect of the crystallinity of a grain boundary on the self-diffusion of copper in thin-film interconnections Peer-reviewed
Hayato Sakamoto, Takeru Kato, Ken Suzuki, Hideo Miura
2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE 2016
ISSN： 1089-8190
Development of MWCNT-based Strain Sensor Using Flexible Substrate Peer-reviewed
Kanji Yumoto, Ken Suzuki, Hideo Miura
2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE 2016
ISSN： 1089-8190
Initial Degradation Process of Heat-resistant Materials Based on the Change of Crystallinity of Grains and Grain Boundaries Peer-reviewed
Takuya Murakoshi, Taichi Shinozaki, Ken Suzuki, Hideo Miura
21ST EUROPEAN CONFERENCE ON FRACTURE, (ECF21) 2 1383-1390 2016
DOI： 10.1016/j.prostr.2016.06.176
ISSN： 2452-3216
CRYSTALLINITY DEGRADATION CAUSED BY ALLOYING ELEMENTS DIFFUSION DURING CREEP OF NI-BASE SUPERALLOY Peer-reviewed
Ken Suzuki, Takuya Murakoshi, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL. 14 2016
ELUCIDATION OF THE HIGH CYCLE FATIGUE DAMAGE MECHANISM OF MODIFIED 9CR-1MO STEEL AT ELEVATED TEMPERATURE Peer-reviewed
Takuya Murakoshi, Motoyuki Ochi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2015, VOL 9 2016
Highly-sensitive graphene nano-ribbon-base strain sensor Peer-reviewed
Shinichirou Sasaki, Yang Meng, Ken Suzuki, Hideo Miura
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE) 10 IMECE2017-70318 2016
Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections Peer-reviewed
Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
JOURNAL OF ELECTRONIC PACKAGING 137 (3) 2015/09
DOI： 10.1115/1.4029931
ISSN： 1043-7398
eISSN： 1528-9044
Quantitative evaluation of orbital hybridization in carbon nanotubes under radial deformation using pi-orbital axis vector Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
AIP ADVANCES 5 (4) 2015/04
DOI： 10.1063/1.4918676
ISSN： 2158-3226
IMPROVEMENT OF THERMAL CONDUCTIVITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTIONS BY CONTROLLING THEIR MICRO TEXTURE Peer-reviewed
Pornvitoo Rittinon, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015
IMPROVEMENT OF THERMAL CONDUCTIVITY OF ELECTROPLATED COPPER INTERCONNECTIONS BY CONTROLLING THEIR CRYSTALLINITY Peer-reviewed
Masaru Gotoh, Ken Suzuki, Hideo Miura
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2 2015
EFFECT OF THREE DIMENSIONAL STRAIN ON THE ELECTRONIC PROPERTIES OF GRAPHENE NANORIBBONS Peer-reviewed
Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3 2015
IMPROVEMENT OF THE LONG-TERM RELIABILITY OF INTERCONNECTION BY CONTROLLING THE CRYSTALLINITY OF GRAIN BOUNDARIES Peer-reviewed
Takahiro Nakanishi, Ken Suzuki, Hideo Miura
INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2 2015
HIGHLY SENSITIVE TWO DIMENSIONAL TACTILE SENSOR USING MULTI-WALLED CARBON NANOTUBE Peer-reviewed
Takuya Nozaki, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015
NANOTEXTURE CHANGE CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION DURING CREEP OF NI-BASE SUPERALLOY Peer-reviewed
Ken Suzuki, Motoyuki Ochi, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 9 2015
IMPROVEMENT OF THE LONG-TERM RELIABILITY OF TSV INTERCONNECTIONS USED IN THREE-DIMENSIONAL STACKED MODULES Peer-reviewed
Hideo Miura, Ken Suzuki
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015
CHANGE IN SPATIAL DISTRIBUTION OF STATE DENSITIES OF CARBON NANOTUBES UNDER ANISOTROPIC STRAIN FIELD Peer-reviewed
Masato Ohnishi, Yang Meng, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015
HIGH CYCLE FATIGUE STRENGTH OF MODIFIED 9CR-1MO STEEL AT ELEVATED TEMPERATURES Peer-reviewed
Motoyuki Ochi, Ken Suzuki, Isamu Nonaka, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 9 2015
Change in Electronic Properties of Carbon Nanotubes Caused by Local Distortion under Axial Compressive Strain Peer-reviewed
Ken Suzuki, Masato Ohnishi, Hideo Miura
2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 88-91 2015
DOI： 10.1109/SISPAD.2015.7292265
ISSN： 1946-1569
Thermal Stability of Electroplated Copper Thin-Film Interconnections Peer-reviewed
Pornvitoo Rittinon, Ken Suzuki, Hideo Miura
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015
ISSN： 2164-0157
Variation of Thermal Stress in TSV Structures Caused by Crystallinity of Electroplated Copper Interconnections Peer-reviewed
Jiatong Liu, Ken Suzuki, Hideo Miura
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015) 2015
ISSN： 2164-0157
THE EFFECT OF STRAIN ON THE ELECTRONIC PROPERTIES OF GRAPHENE NANORIBBONS Peer-reviewed
Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10 2015
Long-range topological correlations of real polycrystalline grains in two dimensions Peer-reviewed
Hao Wang, Guoquan Liu, Ying Chen, Arkapol Saengdeejing, Hideo Miura, Ken Suzuki
MATERIALS CHARACTERIZATION 97 178-182 2014/11
DOI： 10.1016/j.matchar.2014.09.017
ISSN： 1044-5803
eISSN： 1873-4189
Measurement of the local residual stress between fine metallic bumps in 3D flip chip structures Peer-reviewed
Kota Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, Hideo Miura
International Journal of Materials and Structural Integrity 8 (1-3) 21-31 2014/09/01
Publisher: Inderscience Enterprises Ltd.DOI： 10.1504/IJMSI.2014.064770
ISSN： 1745-0063 1745-0055
Quality Control of Grain Boundaries in Copper Thin Films Used for 3D Interconnections Peer-reviewed
Takahiro Nakanishi, Ken Suzuki, Hideo Miura
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 88-91 2014
Micro Texture Control for Highly Reliable Copper Fine Bumps for 3D Integration Peer-reviewed
Masaru Gotoh, Ken Suzuki, Hideo Miura
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 53-56 2014
Improvement of the Crystallinity of Electroplated Copper Thin Films for Highly Reliable 3D Interconnections Peer-reviewed
Chuanhong Fan, Osamu Asai, Ryosuke Furuya, Ken Suzuki, Hideo Miura
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1885-1890 2014
DOI： 10.1109/ECTC.2014.6897558
ISSN： 0569-5503
IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS Peer-reviewed
Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 2014
EFFECT OF THE CRYSTALLINITY ON THE LONG-TERM RELIABILITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTIONS Peer-reviewed
Takeru Kato, Ken Suzuki, Hideo Miura
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 359-362 2014
HIGHLY SENSITIVE 2D STRAIN SENSOR USING CARBON NANOTUBE Peer-reviewed
Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014
EVALUATION OF THE CRYSTALLOGRAPHIC QUALITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTION EMBEDDED IN A SI SUBSTRATE Peer-reviewed
Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014
Spatial Distribution of State Densities Dominating Strain Sensitivity of Carbon Nanotubes Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
2014 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD) 165-168 2014
DOI： 10.1109/SISPAD.2014.6931589
ISSN： 1946-1569
Quantitative Evaluation of the Quality of Grains and Grain Boundaries in Copper Thin Films used for 3D Interconnections Peer-reviewed
Takuya Murakoshi, Ken Suzuki, Hideo Miura
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) 69-72 2014
EFFECT OF ANISOTROPIC STRAIN FIELD ON THE ELECTRONIC CONDUCTANCE OF CARBON NANOTUBES Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 2014
EFFECT OF ALLOYING ELEMENTS ON CREEP AND FATIGUE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION Peer-reviewed
Ken Suzuki, Tomohiro Sano, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 9 2014
IMPROVEMENT OF THE RELIABILITY OF THIN-FILM INTERCONNECTIONS BASED ON THE CONTROL OF THE CRYSTALLINITY OF THE THIN FILMS Peer-reviewed
Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 2014
HIGHLY SENSITIVE 2D STRAIN SENSOR USING CARBON NANOTUBE Peer-reviewed
Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73156) 1-6 2014
IMPROVEMENT OF THE RELIABILITY OF THIN-FILM INTERCONNECTIONS BASED ON THE CONTROL OF THE CRYSTALLINITY OF THE THIN FILMS Peer-reviewed
Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73149) 1-7 2014
EFFECT OF THE LATTICE MISMATCH BETWEEN COPPER THIN-FILM INTERCONNECTION AND BASE MATERIAL ON THE CRYSTALLINITY OF THE INTERCONNECTION Peer-reviewed
Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73147) 1-6 2014
EVALUATION OF THE CRYSTALLOGRAPHIC QUALITY OF ELECTROPLATED COPPER THIN-FILM INTERCONNECTION EMBEDDED IN A SI SUBSTRATE Peer-reviewed
Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2013, VOL 1 (IPACK2013-73148) 1-7 2014
EFFECT OF ALLOYING ELEMENTS ON CREEP AND FATIGUE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY STRAIN-INDUCED ANISOTROPIC DIFFUSION Peer-reviewed
Ken Suzuki, Tomohiro Sano, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 9 (IMECE2013-64314) 1-6 2014
EFFECT OF ANISOTROPIC STRAIN FIELD ON THE ELECTRONIC CONDUCTANCE OF CARBON NANOTUBES Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 (IMECE2013-64487) 1-5 2014
IMPROVEMENT OF MECHANICAL RELIABILITY OF 3D ELECTRONIC PACKAGING BY CONTROLLING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS Peer-reviewed
Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2013, VOL 10 (IMECE2013-65539) 1-6 2014
Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for Through-Silicon Vias Peer-reviewed
Ken Suzuki, Naokazu Murata, Naoki Saito, Ryosuke Furuya, Osamu Asai, Hideo Miura
JAPANESE JOURNAL OF APPLIED PHYSICS 52 (4) 2013/04
ISSN： 0021-4922
Change of the electronic conductivity of graphene nanoribbons and carbon nanotubes caused by a local deformation Peer-reviewed
Masato Ohnishi, Ken Suzuki, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 131-134 2013
DOI： 10.1109/SISPAD.2013.6650592
Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration Peer-reviewed
Ken Suzuki, Hideo Miura, Osamu Asai, Ryosuke Furuya, Jaeuk Sung, Naokazu Murata
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 264-267 2013
DOI： 10.1109/SISPAD.2013.6650625
MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING Peer-reviewed
Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B 995-1000 2013
Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films Peer-reviewed
Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura
Proceedings - Electronic Components and Technology Conference 635-640 2013
DOI： 10.1109/ECTC.2013.6575640
ISSN： 0569-5503
ANISOTROPIC STRAIN-FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES Peer-reviewed
Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B 749-754 2013
ANISOTROPIC STRAIN-FIELD-INDUCED CHANGE OF THE ELECTRONIC CONDUCTIVITY OF GRAPHENE SHEETS AND CARBON NANOTUBES Peer-reviewed
Masato Ohnishi, Hiroshi Kawakami, Yusuke Suzuki, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B IMECE2012-87347 749-754 2013
MICRO-TEXTURE DEPENDENCE OF THE STRENGTH OF FINE METALLIC BUMPS USED FOR ELECTRONIC PACKAGING Peer-reviewed
Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B IMECE2012-87342 995-1000 2013
First-principles study on the dilute Si in bcc Fe: Electronic and elastic properties up to 12.5 at.%Si Peer-reviewed
Arkapol Saengdeejing, Ying Chen, Ken Suzuki, Hideo Miura, Tetsuo Mohri
Computational Materials Science 70 100-106 2013
DOI： 10.1016/j.commatsci.2012.12.028
ISSN： 0927-0256
Effect of the Local Strain Distribution on the Electronic Conductivity of Carbon Nanotubes Peer-reviewed
Masato OHNISHI, Hiroshi KAWAKAMI, Ken SUZUKI, Hideo MIURA
Journal of Computational Science and Technology 7 (2) 231-238 2013
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jcst.7.231
ISSN： 1881-6894
Influence of Oxygen Composition and Carbon Impurity on Electronic Reliability of HfO2 Thin Films Peer-reviewed
Ken SUZUKI, Hideo MIURA
Journal of Computer Chemistry, Japan 12 (1) 52-60 2013
Publisher: Society of Computer Chemistry, JapanISSN： 1347-1767
Micro-texture Dependence of the Strength of Electroplated Copper Thin Film Used for Advanced 3D Electric Packages Peer-reviewed
遠藤史明, 古屋亮輔, 鈴木研, 三浦英生
電子情報通信学会論文誌Ｃ J96-C (11) 400-408 2013
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 1345-2827
The effect of chemical composition and heat treatment conditions on stacking fault energy for Fe-Cr-Ni austenitic stainless steel Peer-reviewed
Toshio Yonezawa, Ken Suzuki, Suguru Ooki, Atsushi Hashimoto
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 44 (13) 5884-5896 2013
DOI： 10.1007/s11661-013-1943-0
ISSN： 1073-5623
Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps Peer-reviewed
Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
JOURNAL OF ELECTRONIC PACKAGING 134 (2) 021006-1-021006-6 2012/06
DOI： 10.1115/1.4006142
ISSN： 1043-7398
Change of the electronic conductivity of cnts and graphene sheets caused by a three-dimensional strain field
Masato Ohnishi, Ken Suzuki, Hideo Miura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 86-89 2012
Publisher: Institute of Electrical and Electronics Engineers Inc.
Stress-induced migration of electroplated copper thin film interconnections depending on thermal history
Ken Suzuki, Hideo Miura, Osamu Asai, Naoki Saito, Naokazu Murata
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 396-399 2012
Publisher: Institute of Electrical and Electronics Engineers Inc.
NANOSTRUCTURE DEPENDENCE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBES AND GRAPHENE SHEETS Peer-reviewed
Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 449-+ 2012
MINIMIZATION OF THE LOCAL RESIDUAL STRESS IN 3D FLIP CHIP STRUCTURES BY OPTIMIZING THE MECHANICAL PROPERTIES OF ELECTROPLATED MATERIALS AND THE ALIGNMENT STRUCTURE OF TSVS AND FINE BUMPS Peer-reviewed
Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 19-25 2012
In-line Monitoring of the Change of Residual Stress in Nano-Scale Transistors during Their Thin-Film Processing and Packaging Peer-reviewed
Hironori Tago, Ken Suzuki, Hideo Miura
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012
ISSN： 2151-7231
Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection Peer-reviewed
Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 467-+ 2012
STRESS-INDUCED AND ELECTRO-MIGRATION OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS USED FOR 3D INTEGRATION Peer-reviewed
Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2 685-690 2012
CHANGE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBE AND GRAPHENE SHEETS CAUSED BY A THREE-DIMENSIONAL STRAIN FIELD Peer-reviewed
Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 457-462 2012
Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films Peer-reviewed
Osamu Asai, Naokazu Murata, Ken Suzuki, Hideo Miura
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012
ISSN： 2151-7231
TWO-DIMENSIONAL STRAIN-DISTRIBUTION SENSOR USING CARBON NANOTUBE-DISPERSED RESIN Peer-reviewed
Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 381-386 2012
Effect of the Lattice Mismatch between Copper Thin-film Interconnection and Base Material on the Crystallinity of the Interconnection Peer-reviewed
Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012
ISSN： 2151-7231
NON-CONTACT AND REMOTE MEASUREMENT METHOD OF THE CHANGE OF THE ELECTRICAL CONDUCTIVITY OF CARBON NANOTUBES-DISPERSED RESIN UNDER STRAIN Peer-reviewed
Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1 703-708 2012
Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnections Embedded in TSV Structures Peer-reviewed
Ryosuke Furuya, Ken Suzuki, Hideo Miura
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012
ISSN： 2151-7231
HIGH TEMPERATURE DAMAGES OF NI-BASE-SUPERALLOY CAUSED BY THE CHANGE OF NANOTEXTURE DUE TO STRAIN-INDUCED ANISOTROPIC DIFFUSION Peer-reviewed
Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION (IMECE 2010), VOL 9 73-79 2012
HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS Peer-reviewed
Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 4, PTS A AND B 1649-1655 2012
EFFECT OF CRYSTALLOGRAPHIC QUALITY OF GRAIN BOUNDARIES ON BOTH MECHANICAL AND ELECTRICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS Peer-reviewed
Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 2 677-684 2012
Highly Sensitive Strain Sensor Using Carbon Nanotube Peer-reviewed
Hiroshi Kawakami, Ken Suzuki, Hideo Miura
14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012) 2012
ISSN： 2151-7231
Quantum Chemical Molecular Dynamics Study of Oxidation Process on Fe-Cr Alloy Surfaces in High Temperature Water Peer-reviewed
Ken Suzuki, Hideo Miura
NANOTECHNOLOGY 2012, VOL 2: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONAL 641-644 2012
Micro Texture Dependence of Both the Mechanical and Electrical Properties of Electroplated Copper Thin Films Used for Interconnection Peer-reviewed
Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 IMECE2010-37279 467-+ 2012
HIGH TEMPERATURE DAMAGES OF NI-BASE-SUPERALLOY CAUSED BY THE CHANGE OF NANOTEXTURE DUE TO STRAIN-INDUCED ANISOTROPIC DIFFUSION Peer-reviewed
Yamato Sasaki, Hiroyuki Itoh, Naokazu Murata, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION (IMECE 2010), VOL 9 IMECE2010-37284 73-79 2012
NANOSTRUCTURE DEPENDENCE OF THE ELECTRONIC CONDUCTIVITY OF CARBON NANOTUBES AND GRAPHENE SHEETS Peer-reviewed
Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4 IMECE2010-37277 449-+ 2012
HIGH TEMPERATURE DAMAGE OF NI-BASE SUPERALLOY CAUSED BY THE CHANGE OF MICROTEXTURE DUE TO THE STRAIN-INDUCED ANISOTROPIC DIFFUSION OF COMPONENT ELEMENTS Peer-reviewed
Hideo Miura, Ken Suzuki, Yamato Sasaki, Tomohiro Sano, Naokazu Murata
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 4, PTS A AND B IMECE2011-62411 1649-1655 2012
Two-dimensional strain distribution sensor using carbon nanotubes Peer-reviewed
Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A 78 (789) 689-693 2012
ISSN： 0387-5008
Dominant Factors of the Stress-Induced Migration in Electroplated Copper Thin-Films Interconnections Peer-reviewed
齋藤直樹, 村田直一, 玉川欣治, 鈴木 研, 三浦英生
電子情報通信学会論文誌C J95-C (11) 351-357 2012
QUANTITATIVE EVALUATION OF THE CRYSTALLINITY OF GRAIN BOUNDARIES IN POLYCRYSTALLINE MATERIALS Peer-reviewed
Naokazu Murata, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 8 IMECE2012-87426 389-395 2012
EFFECT OF DOPANT ELEMENT ON THE STRENGTH AND RELIABILITY OF NI-BASE SUPERALLOY AT HIGH TEMPERATURES Peer-reviewed
Tomohiro Sano, Ken Suzuki, Hideo Miura
INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 8 IMECE2012-87341 215-220 2012
Evaluation of the Crystallinity of Grain Boundaries of Electronic Copper Thin Films for Highly Reliable Interconnections Peer-reviewed
Naoki Saito, Naoakzu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1153-1158 2012
DOI： 10.1109/ECTC.2012.6248981
Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections Peer-reviewed
Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proceedings of ASME InterPACK2011 IPACK2011-52048 1-8 2011/07/06
Ionic Conductivity in Uniaxial Micro Strain/Stress Fields of Yttria-Stabilized Zirconia Peer-reviewed
Kazuhisa Sato, Ken Suzuki, Ryo Narumi, Keiji Yashiro, Toshiyuki Hashida, Junichiro Mizusaki
JAPANESE JOURNAL OF APPLIED PHYSICS 50 (5) 055803-1-055803-5 2011/05
ISSN： 0021-4922
Stress-induced Migration of the Electroplated Copper Thin Film Interconnection Peer-reviewed
Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
International Conference on Electronics Packaging 871-874 2011/04/13
Monitoring Method of Residual Stress in a Substrate During Thin Film Processing Peer-reviewed
Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura
International Conference on Electronics Packaging 853-856 2011/04/13
Strain-Induced Change of Electronic Conductivity of Carbon Nanotubes
SUZUKI Yusuke, OHNISHI Masato, SUZUKI Ken, MIURA Hideo
Transactions of the Japan Society of Mechanical Engineers Series B 77 (777) 769-773 2011
Publisher: The Japan Society of Mechanical EngineersISSN： 0387-5008
Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections Peer-reviewed
Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 2011
DOI： 10.1109/3DIC.2012.6262997
Evaluation of the change of the residual stress in nano-scale transistors during the deposition and fine patterning processes of thin films Peer-reviewed
Kota Nakahira, Hironori Tago, Hiroki Kishi, Ken Suzuki, Hideo Miura, Masaki Yoshimaru, Ken-Ichiro Tatsuuma
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 1-6 2011
DOI： 10.1109/ESIME.2011.5765760
Mechanical and electrical reliability of copper interconnections for 3DIC Peer-reviewed
Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 154-159 2011
DOI： 10.1109/3DIC.2012.6262998
Micro Texture Dependence of the Mechanical and Electrical Reliability of Electroplated Copper Thin Film Interconnections Peer-reviewed
Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura
2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2119-2125 2011
DOI： 10.1109/ECTC.2011.5898811
ISSN： 0569-5503
Minimization of the local residual stress in 3D flip chip structures by optimizing the mechanical properties of electroplated materials and the alignment structure of TSVs and fine bumps Peer-reviewed
Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 19-25 2011
Two-dimensional strain-distribution sensor using carbon nanotube-dispersed resin Peer-reviewed
Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 381-386 2011
Change of the electronic conductivity of carbon nanotube and graphene sheets caused by a three-dimensional strain field Peer-reviewed
Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 457-462 2011
Non-contact and remote measurement method of the change of the electrical conductivity of carbon nanotubes-dispersed resin under strain Peer-reviewed
Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 1 703-708 2011
MEASUREMENT OF THE LOCAL RESIDUAL STRESS BETWEEN FINE METALLIC BUMPS IN 3D FLIP CHIP STRUCTURES Peer-reviewed
Kohta Nakahira, Hironori Tago, Takuya Sasaki, Ken Suzuki, Hideo Miura
12th International Conference on Electronics Materials and Packaging 137-142 2010/10/25
REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER Peer-reviewed
Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, Hideo Miura
12th International Conference on Electronics Materials and Packaging 131-136 2010/10/25
NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS Peer-reviewed
Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
12th International Conference on Electronics Materials and Packaging 117-123 2010/10/25
Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both Mechanical and Electrical Properties of the Jointed Structures Peer-reviewed
Seongcheol Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura
Transactions of The Japan Institute of Electronics Packaging 2 (1) 91-97 2010/04/23
Publisher: The Japan Institute of Electronics PackagingDOI： 10.5104/jiepeng.2.91
ISSN： 1883-3365
Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors Peer-reviewed
Ken Suzuki, Yoichi Takeda, Hideo Miura
Journal of Solid Mechanics and Materials Engineering 4 (11) 1644-1653 2010/04/01
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jmmp.4.1644
ISSN： 1880-9871
Quantum chemical molecular dynamics simulation of oxidation process on clean metal surface in high temperature water
Ken Suzuki, Hideo Miura
Materials Research Society Symposium Proceedings 1263 25-30 2010
ISSN： 0272-9172
Mechanical and electrical properties of electroplated copper thin films used for thin film interconnection
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Materials Research Society Symposium Proceedings 1249 271-276 2010
ISSN： 0272-9172
J0601-3-2 Underfill material dependence of the local residual stress of fli-chip on area-arrayed fine bump
Nakahira Kota, Murata Naokazu, Suzuki Ken, Miura Hideo
The proceedings of the JSME annual meeting 2010 265-266 2010
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2010.7.0_265
J0601-3-1 Micro structure dependence of the strength and reliability of electroplated copper thin films used for thin film interconnections
MURATA Naokazu, SUZUKI Ken, MIURA Hideo, TAMAKAWA Kinji
The proceedings of the JSME annual meeting 2010 263-264 2010
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2010.7.0_263
Remote non-contact strain sensor using carbon nanotube-dispersed resin Peer-reviewed
Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings 2010
DOI： 10.1109/IMPACT.2010.5699465
REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE-DISPERSED RESIN Peer-reviewed
Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 569-574 2010
DOI： 10.1115/InterPACK2009-89146
MICRO TEXTURE DEPENDENCE OF MECHANICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILMS USED FOR THIN FILM INTERCONNECTION Peer-reviewed
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 353-359 2010
DOI： 10.1115/InterPACK2009-89079
IN-LINE EVALUTION METHOD OF THE INTRINSIC STRESS OF THIN FILMS USED FOR TRANSISTOR STRUCTURES Peer-reviewed
Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 239-245 2010
DOI： 10.1115/InterPACK2009-89145
REMOTE STRAIN MEASUREMENT BY MULTI-WALLED CARBON NANOTUBE-DISPERSED RESIN Peer-reviewed
Katsuya Osaki, Hideki Fuji, Masato Onishi, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 569-574 2010
IN-LINE EVALUTION METHOD OF THE INTRINSIC STRESS OF THIN FILMS USED FOR TRANSISTOR STRUCTURES Peer-reviewed
Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 239-245 2010
Creep and fatigue damages of Ni-base- superalloy caused by strain-induced anisotropic diffusion of component elements Peer-reviewed
Hideo Miura, Ken Suzuki, Hiroyuki Ito, Tatsuya Inoue
ADVANCES IN FRACTURE AND DAMAGE MECHANICS VIII 417-418 261-+ 2010
DOI： 10.4028/www.scientific.net/KEM.417-418.261
ISSN： 1013-9826
Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures Peer-reviewed
Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura
Proc. of ICEP 2010 345-348 2010
MICRO TEXTURE DEPENDENCE OF MECHANICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILMS USED FOR THIN FILM INTERCONNECTION Peer-reviewed
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1 353-359 2010
Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures Peer-reviewed
Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 1-6 2010
DOI： 10.1109/ESIME.2010.5464598
Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures Peer-reviewed
Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1951-1956 2010
DOI： 10.1109/ECTC.2010.5490684
ISSN： 0569-5503
Improvement of the Interface Integrity between a High-k Dielectric Film and a Metal Gate Electrode by Controlling Point Defects and Residual Stress Peer-reviewed
Ken Suzuki, Tatsuya Inoue, Hideo Miura
SISPAD 2010 - 15TH INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 213-216 2010
DOI： 10.1109/SISPAD.2010.5604526
ISSN： 1946-1569
Stress-induced migration of electroplated copper thin films used for 3D integration Peer-reviewed
Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings IPACK2011-52058 1-6 2010
DOI： 10.1109/IMPACT.2010.5699464
Effect of copper-tin intermetallic compound on reliability of fine bump joint structures Peer-reviewed
Seongchoel Jeong, Naokazu Murata, Yuki Sato, Ken Suzuki, Hideo Miura
Zairyo/Journal of the Society of Materials Science, Japan 58 (10) 827-832 2009/10
DOI： 10.2472/jsms.58.827
ISSN： 0514-5163
Quantum Chemical Molecular Dynamics Study of Degradation Mechanism of Interface Integrity between a HfO2 Thin Film and a Metal Gate Electrode Peer-reviewed
Tatusya Inoue, Ken Suzuki, Hideo Miura
Proceedings of International Conference on Simulation of Semiconductor Processes and Devices, 2009 198-201 2009/09
DOI： 10.1109/SISPAD.2009.5290215
Effect of Y2O3 addition on the conductivity and elastic modulus of (CeO2)(1-x)(YO1.5)(x) Peer-reviewed
Kazuhisa Sato, Ken Suzuki, Keiji Yashiro, Tatsuya Kawada, Hiroo Yugami, Toshiyuki Hashida, Alan Atkinson, Junichiro Mizusaki
SOLID STATE IONICS 180 (20-22) 1220-1225 2009/08
DOI： 10.1016/j.ssi.2009.06.003
ISSN： 0167-2738
eISSN： 1872-7689
Early stage SCC initiation analysis of fcc Fe-Cr-Ni ternary alloy at 288 °C: A quantum chemical molecular dynamics approach Peer-reviewed
Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji
Corrosion Science 51 (4) 908-913 2009/04
DOI： 10.1016/j.corsci.2009.01.005
ISSN： 0010-938X
Nondestructive evaluation of creep and fatigue damages in nickel-base superalloys using a scanning blue laser microscope Peer-reviewed
Hideo Miura, Kuniaki Akahoshi, Ken Suzuki
NDT & E INTERNATIONAL 42 (3) 188-192 2009/04
DOI： 10.1016/j.ndteint.2008.09.008
ISSN： 0963-8695
Early stage SCC initiation analysis of fcc Fe-Cr-Ni ternary alloy at 288 °C: A quantum chemical molecular dynamics approach Peer-reviewed
Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji
Corrosion Science 51 (4) 908-913 2009/04
DOI： 10.1016/j.corsci.2009.01.005
ISSN： 0010-938X
Fatigue Strength of Electroplated Copper Thin Films under Uni-Axial Stress Peer-reviewed
Naokazu MURATA, Kinji TAMAKAWA, Ken SUZUKI, Hideo MIURA
Journal of Solid Mechanics and Materials Engineering 3 498-506 2009/03
DOI： 10.1299/jmmp.3.498
Creep Damage Process of Ni-Base Superalloy Caused by Stress-Induced Anisotropic Atomic Diffusion Peer-reviewed
Ken SUZUKI, Hiroyuki ITO, Tatsuya INOUE, Hideo MIURA
Journal of Solid Mechanics and Materials Engineering 3 (3) 487-497 2009/03
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jmmp.3.487
ISSN： 1880-9871
Density functional study of atomic oxygen and water molecule adsorption on chromium substituted Ni surface Peer-reviewed
N. K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji
Molecular Simulation 2009
Conductivity variation of yttria-stabilized zirconia under stress Peer-reviewed
T. Izumi, R. Narumi, K. Sato, K. Suzuki, K. Yashiro, T. Hashida, J. Mizusaki
ECS Transactions 16 125-132 2009
DOI： 10.1149/1.3242227
Quantum Chemical Molecular Dynamics Study of Degradation Mechanism of Interface Integrity between a HfO(2) Thin Film and a Metal Gate Electrode Peer-reviewed
Tatsuya Inoue, Ken Suzuki, Hideo Miura
2009 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 198-201 2009
ISSN： 1946-1569
MULTI-SCALE MEASUREMENT OF THE CHANGE OF THE RESIDUAL STRESS IN A SILICON CHIP DURING MANUFACTURING FROM THIN-FILM PROCESSING TO PACKAGING Peer-reviewed
Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE 259-262 2009
ISSN： 2150-5934
Effect of Micro-Texture of Electroplated Copper Thin-Films on Their Mechanical and Electrical Reliability Peer-reviewed
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE 385-388 2009
ISSN： 2150-5934
A quantum chemical molecular dynamics study of the strain effect on oxygen diffusion in fcc Fe (111) and Fe-Cr (111) surfaces at 288°C Peer-reviewed
N. K. Das, T. Shoji, K. Suzuki, Y. Takeda
12th International Conference on Fracture 2009, ICF-12 8 6061-6068 2009
Microtexture Dependence of Mechanical Properties of Electroplated Copper Thin films Used for Thin Film Interconnections Peer-reviewed
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
ASME Proc. of InterPACK 2009,(IPACK2009-89079) 2009
Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both Mechanical and Electrical Properties of the Jointed Structures Invited Peer-reviewed
Seongcheol Jeong, Ken Suzuki, Hideo Miura
International Conference on Electronic Packaging, (15B2) 2 (1) 91-97 2009
Publisher: The Japan Institute of Electronics PackagingDOI： 10.5104/jiepeng.2.91
ISSN： 1883-3365
DEGRADATION OF INTERFACE INTEGRITY BETWEEN A HIGH-K DIELECTRIC THIN FILM AND A GATE ELECTRODE DUE TO EXCESS OXYGEN IN THE FILM Peer-reviewed
Hideo Miura, Ken Suzuki, Yuta Ito, Seiji Samukawa, Tomonori Kubota, Toru Ikoma, Hideki Yoshikawa, Shigenori Ueda, Yoshiyuki Yamashita, Keisuke Kobayashi
2009 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, VOLS 1 AND 2 376-+ 2009
DOI： 10.1109/IRPS.2009.5173282
Strain Dependence of Dielectric Properties and Reliability of High-k Thin Films Peer-reviewed
K. Suzuki, K. Imasaki, Y. Ito, H. Miura
2009 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 59-62 2009
DOI： 10.1109/SISPAD.2009.5290250
ISSN： 1946-1569
Quantum chemical molecular dynamics study of strain effect on metal and oxide interface interaction at high temperature
N.K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji
EUROCORR 2008, September 7-11 2008, Edinburgh, Scotland (1226) 2008/09
Effect of interface characteristics of W/HfO2 on electronic reliability : Quantum chemical molecular dynamics study Peer-reviewed
Ken Suzuki, Tatsuya Inoue, Hideo Miura
Proceedings of 2008 International Conference on Simulation of Semiconductor Processes and Devices 357-360 2008/09
DOI： 10.1109/SISPAD.2008.4648311
Quantum chemical molecular dynamics study of stress corrosion cracking behavior for fcc Fe and Fe-Cr surfaces Peer-reviewed
Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji
Corrosion Science 50 (6) 1701-1706 2008/06
DOI： 10.1016/j.corsci.2008.01.032
ISSN： 0010-938X
1213 The influence of trace additive element on mechanical strength property of Ni-base superalloy at high temperature
Inoue Tatsuya, Suzuki Ken, Miura Hideo
The proceedings of the JSME annual meeting 2008 167-168 2008
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2008.1.0_167
1212 Analysis of deformation behavior of multi-walled CNT under compressive strain
OOSAKI Katsuya, SUZUKI Ken, MIURA Hideo
The proceedings of the JSME annual meeting 2008 165-166 2008
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2008.1.0_165
1201 Effect of heat treatment on fatigue strength of electroplated copper thin films
MURATA Naokazu, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
The proceedings of the JSME annual meeting 2008 143-144 2008
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2008.1.0_143
Fatigue strength of electroplated copper thin films under uni-axial stress Peer-reviewed
Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
2008 EMAP CONFERENCE PROCEEDINGS 41-44 2008
DOI： 10.1109/EMAP.2008.4784224
Effect of Interface Characteristics of W/HfO2 +/- x on Electronic Reliability: Quantum Chemical Molecular Dynamics Study Peer-reviewed
Ken Suzuki, Tatsuya Inoue, Hideo Miura
SISPAD: 2008 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 357-360 2008
DOI： 10.1109/SISPAD.2008.4648311
Fe(111) AND Fe-Cr(111) SURFACE H2O INTERACTION AT DIFFERENT TEMPERATURES BY QUANTUM CHEMICAL MOLECULAR DYNAMICS Peer-reviewed
Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji
Proceedings of JSCE Materials and Environments 2008 A302 105-108 2008
Stress corrosion cracking analysis of Fe (111) and Fe-Cr (111) surface at different temperatures by quantum chemical molecular dynamics Peer-reviewed
N. K. Das, K. Suzuki, Y. Takeda, K. Ogawa, T. Shoji
16th Pacific Basin Nuclear Conference P16P1100 2008
Theoretical design of SCC resistant Ni-base alloy by a computational chemistry approach Peer-reviewed
Nishith Kumar Das, Ken Suzuki, Yoichi Takeda, Kazuhiro Ogawa, Tetsuo Shoji
International Conference on Advances in Nuclear Power Plants, ICAPP 2008 4 2175-2182 2008
Multiscale modeling approach to stress corrosion cracking Peer-reviewed
Ismail Tirtom, Nishith Kumar Das, Ken Suzuki, Kazuhiro Ogawa, Tetsuo Shoji
International Conference on Advances in Nuclear Power Plants, ICAPP 2008 4 2081-2089 2008
Degradation of reliability of high-k gate dielectrics caused by point defects and residual stress Peer-reviewed
Hideo Miura, Ken Suzuki, Toru Ikoma, Seiji Samukawa, Hideki Yoshikawa, Shigenori Ueda, Yoshiyuki Yamashita, Keisuke Kobayashi
2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL 713-+ 2008
DOI： 10.1109/RELPHY.2008.4559002
ISSN： 1541-7026
1923 Mechanical reliability evaluation of a laser chip used for optical transmission systems
KITAMURA Atsushi, Suzuki Ken, MIURA Hideo
The proceedings of the JSME annual meeting 2007 211-212 2007
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2007.7.0_211
2425 Analytical study of degradation mechanism of Ni-based superalloy caused by stress dependent anisotropic diffusion
Ito Hiroyuki, Suzuki Ken, Miura Hideo
The proceedings of the JSME annual meeting 2007 423-424 2007
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2007.1.0_423
Effect of packaging stress in a laser chip on its radiation spectrum Peer-reviewed
Atsushi Kitamura, Ken Suzuki, Hideo Miura
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 687-692 2007
Quantum chemical molecular dynamics analysis of the effect of oxygen vacancies and strain on dielectric characteristic of HfO2-x films Invited Peer-reviewed
Y. Ito, K. Suzuki, H. Mura
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 150-153 2007
DOI： 10.1109/SISPAD.2006.282860
Fluctuation mechanism of mechanical properties of electroplated-copper thin films used for three dimensional electronic modules Peer-reviewed
Hideo Miura, Ken Suzuki, Kinji Tamakawa
EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS 177-+ 2007
Degradation mechanism of dielectric properties of HfO2-x due to interaction of oxygen composition and strain Invited Peer-reviewed
K. Suzuki, Y. Ito, H. Ito, H. Miura
2007 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS 42-+ 2007
Micro texture-induced variation of mechanical properties of electroplated copper thin films Peer-reviewed
Muneyuki Otani, Kazuhiko Sakutani, Kinji Tamakawa, Ken Suzuki, Hideo Miura
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2 735-741 2007
Influence of oxygen composition and carbon impurity on electronic reliability of HfO2 Peer-reviewed
K. Suzuki, Y. Ito, H. Miura
SISPAD 2007: SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES 2007 165-168 2007
Influence of intrinsic defects and strain on electronic reliability of gate oxide films
Ken Suzuki, Yuta Ito, Hideo Miura
Materials Research Society Symposium Proceedings 917 82-87 2006
Publisher: Materials Research SocietyISSN： 0272-9172
P55 Analytical study of change of nanostructure of Ni-based superalloy caused by stress dependent anisotropic diffusion
ITO Hiroyuki, SUZUKI Ken, MIURA Hideo
Proceedings of the 1992 Annual Meeting of JSME/MMD 2006 629-630 2006
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmezairiki.2006.0_629
P78 Basic study of Non-Contact Strain Measurement Using CNT-Dispersed Resin
FUJI Hideki, SUZUKI Ken, MIURA Hideo
Proceedings of the 1992 Annual Meeting of JSME/MMD 2006 669-670 2006
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmezairiki.2006.0_669
P12 Effect of Residual Stress in Thin Films on Transmission Characteristics of a Laser Beam Through an Thin-Film Optical Wave-Guide
KITAMURA Atsushi, Suzuki Ken, MIURA Hideo
Proceedings of the 1992 Annual Meeting of JSME/MMD 2006 543-544 2006
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmezairiki.2006.0_543
3961 Quantum Chemical Molecular Dynamics Study on Mechanisms of Stress Corrosion Cracking
Suzuki Ken, Ito Hiroyuki, Miura Hideo
The proceedings of the JSME annual meeting 2006 917-918 2006
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2006.1.0_917
Fracture Properties of Ceria-based Ceramics at High Temperature Peer-reviewed
Kazuhisa Sato, Ken Suzuki, Toshiyuki Hashida, Junichiro Mizusaki
Proceedings of the 16th Symposium on Functionally Graded Materials (FGM2004) 139-143 2005/03
1816 Basic study of stress-induced migration by quantum chemical molecular dynamics analysis
ITO Hiroyuki, SUZUKI Ken, MIURA Hideo
The proceedings of the JSME annual meeting 2005 229-230 2005
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2005.6.0_229
1815 Effect of strain and oxygen vacancies on the band gap of thin films with high-k
ITO Yuta, SUZUKI Ken, MIURA Hideo
The proceedings of the JSME annual meeting 2005 227-228 2005
Publisher: The Japan Society of Mechanical EngineersDOI： 10.1299/jsmemecjo.2005.6.0_227
Evaluation of Elastic Property of (CeO2) 1-x (YO1.5) x Ceramics Peer-reviewed
Kazuhisa Sato, Toshiyuki Hashida, Ken Suzuki, Hiroo Yugami, Tatsuya Kawada, Junichiro Mizusaki
Journal of the Japan Society of Powder and Powder Metallurgy 52 (11) 840-844 2005
Publisher: Japan Society of Powder and Powder MetallurgyDOI： 10.2497/jjspm.52.840
ISSN： 0532-8799
Influence of oxygen vacancies and strain on electronic reliability of SiO2-x films Peer-reviewed
K Suzuki, Y Ito, H Miura, T Shoji
Semiconductor Defect Engineering-Materials, Synthetic Structures and Devices 864 77-82 2005
ISSN： 0272-9172
Quantum chemical molecular dynamics analysis of the effect of intrinsic defects and strain on dielectric characteristic of gate oxide films Peer-reviewed
K Suzuki, Y Ito, H Miura
SISPAD: 2005 International Conference on Simulation of Semiconductor Processes and Devices 327-330 2005
Electronic structure of the electrode/electrolyte interface: large-scale tight-binding quantum chemical simulation Peer-reviewed
Y Makino, T Kusagaya, K Suzuki, A Endou, M Kubo, P Selvam, H Ota, F Yonekawa, N Yamazaki, A Miyamoto
SOLID STATE IONICS 175 (1-4) 847-850 2004/11
DOI： 10.1016/j.ssi.2004.09.053
ISSN： 0167-2738
Computational Chemistry Study of Accelerated Oxidation Mechanism of IGSCC of Structural Materials in LWR Environments and Theoretical Design of SCC Resistant Alloys Peer-reviewed
K. Suzuki, Y. Takeda, Z. Lu, T. Shoji
Proceeding of International Congress on Advances in Nuclear Power Plants 2004
Monte Carlo simulation of hydrogen absorption in palladium and palladium-silver alloys Peer-reviewed
KA Hitoshi, T Nakayama, Y Kobayashi, K Suzuki, M Takahashi, S Takami, M Kubo, N Itoh, P Selvam, A Miyamoto
CATALYSIS TODAY 82 (1-4) 233-240 2003/07
DOI： 10.1016/S0920-5861(03)00237-2
ISSN： 0920-5861
Materials design of perovskite-based oxygen ion conductor by molecular dynamics method Peer-reviewed
Y Yamamura, C Ihara, S Kawasaki, H Sakai, K Suzuki, S Takami, M Kubo, A Miyamoto
SOLID STATE IONICS 160 (1-2) 93-101 2003/05
DOI： 10.1016/S0167-2738(03)00154-1
ISSN： 0167-2738
eISSN： 1872-7689
Computational chemistry study on the dynamics of lubricant molecules under shear conditions Peer-reviewed
D Kamei, H Zhou, K Suzuki, K Konno, S Takami, M Kubo, A Miyamoto
TRIBOLOGY INTERNATIONAL 36 (4-6) 297-303 2003/04
DOI： 10.1016/S0301-679X(02)00201-3
ISSN： 0301-679X
高速化量子分子動力学法による電極・電解液界面反応の検討
牧野 裕介, 草谷 友規, 鈴木 研, 遠藤 明, 久保 百司, 今村 詮, 太田 洋邦, 米川 文広, 山崎 信幸, 宮本 明
化学工学会 研究発表講演要旨集 2003 65-65 2003
Publisher: 公益社団法人 化学工学会DOI： 10.11491/scej.2003f.0.65.0
Tight-binding quantum chemical molecular dynamics study of cathode materials for lithium secondary battery Peer-reviewed
K Suzuki, Y Kuroiwa, S Takami, M Kubo, A Miyamoto, A Imamura
SOLID STATE IONICS 152 273-277 2002/12
DOI： 10.1016/S0167-2738(02)00310-7
ISSN： 0167-2738
Development and application of nonequilibrium simulation program for ion diffusion in battery Peer-reviewed
CH Jung, H Morito, Y Kobayashi, K Suzuki, S Takami, M Kubo, A Miyamoto
SOLID STATE IONICS 152 279-284 2002/12
DOI： 10.1016/S0167-2738(02)00312-0
ISSN： 0167-2738
Combinatorial computational chemistry approach to the design of cathode materials for a lithium secondary battery Peer-reviewed
K Suzuki, Y Kuroiwa, S Takami, M Kubo, A Miyamoto
APPLIED SURFACE SCIENCE 189 (3-4) 313-318 2002/04
DOI： 10.1016/S0169-4332(01)01009-1
ISSN： 0169-4332
The fate of a cluster colliding onto a substrate - Dissipation of translational kinetic energy Peer-reviewed
S Takami, K Suzuki, M Kubo, A Miyamoto
JOURNAL OF NANOPARTICLE RESEARCH 3 (2-3) 213-218 2001/06
ISSN： 1388-0764
Atomistic Crystal Growth Simulation of Metal Oxide Materials Peer-reviewed
M. Kubo, H. Kurokawa, Y. Inaba, K. Suzuki, S. Takami, A. Miyamoto, M. Kawasaki, M. Yoshimoto, H. Koinuma
Transactions of the Materials Research Society of Japan 26 989-992 2001
Interaction between SiO2 surface and Au clusters studied by computational chemistry Peer-reviewed
S Takami, K Yajima, K Suzuki, A Endou, M Kubo, A Miyamoto
KAGAKU KOGAKU RONBUNSHU 26 (6) 770-775 2000/11
DOI： 10.1252/kakoronbunshu.26.770
ISSN： 0386-216X
Structural properties of LixMn2O4 as investigated by molecular dynamics and density functional theory Peer-reviewed
K Suzuki, Y Oumi, S Takami, M Kubo, A Miyamoto, M Kikuchi, N Yamazaki, M Mita
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 39 (7B) 4318-4322 2000/07
DOI： 10.1143/JJAP.39.4318
ISSN： 0021-4922
Molecular dynamics simulations of adhesional forces via hydrocarbon films Peer-reviewed
H Tamura, Z Hui, Y Inaba, K Suzuki, S Takami, M Kubo, A Miyamoto
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 39 (7B) 4425-4426 2000/07
DOI： 10.1143/JJAP.39.4425
ISSN： 0021-4922
Molecular dynamics simulation of enhanced oxygen ion diffusion in strained yttria-stabilized zirconia Peer-reviewed
K Suzuki, M Kubo, Y Oumi, R Miura, H Takaba, A Fahmi, A Chatterjee, K Teraishi, A Miyamoto
APPLIED PHYSICS LETTERS 73 (11) 1502-1504 1998/09
DOI： 10.1063/1.122186
ISSN： 0003-6951
Molecular dynamics simulations on oxygen ion diffusion in strained YSZ/CeO(2) superlattice Peer-reviewed
K Suzuki, A Endou, R Miura, Y Oumi, H Takaba, M Kubo, A Chatterjee, A Fahmi, A Miyamoto
APPLIED SURFACE SCIENCE 130 545-548 1998/06
DOI： 10.1016/S0169-4332(98)00112-3
ISSN： 0169-4332
120 Investigation of the Dominant Factor of Degradation of Ni-based Super Alloy Considering the Change of Atomic Configuration
TAKAHASHI Motoki, SUZUKI Ken, MIURA Hideo
2016 (51) 37-38 2016
Publisher: The Japan Society of Mechanical Engineers
119 Damage Mechanism of Heat-Resistant Material Caused by the Change of Its Micro Texture Under Mechanical Loading at High Temperature
Murakoshi Takuya, Suzuki Ken, Miura Hideo
2016 (51) 35-36 2016
Publisher: The Japan Society of Mechanical Engineers
144 Development of the Measurement method of the Strength of a Grain Boundary
NAKANISHI Takahiro, ICHIKAWA Yuji, SUZUKI Ken, MIURA Hideo
2016 (51) 85-86 2016
Publisher: The Japan Society of Mechanical Engineers
136 Clarification and Control of the Multiple factors for the Long-term Reliability of the Sub-micro-size Copper Thin-film Interconnections
KATO Takeru, SUZUKI Ken, MIURA Hideo
2016 (51) 69-70 2016
Publisher: The Japan Society of Mechanical Engineers
138 Effect of the Crystallinity of Underlayer Material on Microtexture of electroplated Copper thin Film
LIU Jiatong, SUZUKI Ken, MIURA Hideo
2016 (51) 73-74 2016
Publisher: The Japan Society of Mechanical Engineers
143 Control of the Wide Variation of Mechanical Properties of Electroplated Copper Thin Films Used for Advance Semiconductor Devices
Gotoh Masaru, Suzuki Ken, Miura Hideo
2016 (51) 83-84 2016
Publisher: The Japan Society of Mechanical Engineers
137 Development and evaluation of flexible strain sensor using graphene
SASAKI Shinichiro, YANG Meng, SUZUKI Ken, MIURA Hideo
2016 (51) 71-72 2016
Publisher: The Japan Society of Mechanical Engineers
PS0017-263 Proposal of modified normalized S-N curves considering the change of micro texture
Murakoshi Takuya, SUZUKI Ken, MIURA Hideo
2015 "PS0017-263-1"-"PS0017-263-2" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
PS0021-294 Controlling Method of the Microtexure of Copper Thin-Film
LIU Jiatong, SUZUKI Ken, MIURA Hideo
2015 "PS0021-294-1"-"PS0021-294-3" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
OS1405-340 Buckling Deformation and Change of Electronic Characteristics of Multi-Wall Carbon Nanotubes
SUZUKI Ken, MIURA Hideo
2015 "OS1405-340-1"-"OS1405-340-2" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
OS1429-361 Damage Evaluation of Ni-base Superalloy under High Temperature Creep
SUZUKI Ken, MURAKOSHI Takuya, MIURA Hideo
2015 "OS1429-361-1"-"OS1429-361-2" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
PS0018-264 Development and evaluation of graphene strain sensor using flexible substrate
SASAKI Shinichiro, SUZUKI Ken, MIURA Hideo
2015 "PS0018-264-1"-"PS0018-264-3" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
PS0019-272 Microstructure Dependence of Long-Term Reliability of Thin-Film Interconnections
Kato Takeru, SUZUKI Ken, MIURA Hideo
2015 "PS0019-272-1"-"PS0019-272-3" 2015/11/21
Publisher: The Japan Society of Mechanical Engineers
237 The effect of three-dimensional strain fields on the electronic conductivity of graphene nano-ribbons
Yang Meng, Ohnishi Masato, Suzuki Ken, Miura Hideo
The Computational Mechanics Conference 2015 (28) "237-1"-"237-2" 2015/10/10
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
262 Change in electronic conductivity of carbon nanotubes caused by buckling deformation
Suzuki Ken, Ohnishi Masato, Miura Hideo
The Computational Mechanics Conference 2015 (28) "262-1"-"262-2" 2015/10/10
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
OS12-4 Control of Mechanical Properties of Micro Electroplated Copper Interconnections(Mechanical properties of nano- and micro-materials-1,OS12 Mechanical properties of nano- and micro-materials,MICRO AND NANO MECHANICS)
Gotoh Masaru, Suzuki Ken, Miura Hideo
Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2015 (14) 186-186 2015/10/04
Publisher: The Japan Society of Mechanical Engineers
OS12-9 Development of Measurement Method of the Strength of a Grain Boundary(Mechanical properties of nano- and micro-materials-3,OS12 Mechanical properties of nano- and micro-materials,MICRO AND NANO MECHANICS)
Nakanishi Takahiro, Kato Takeru, Ichikawa Yuji, Suzuki Ken, Miura Hideo
Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2015 (14) 191-191 2015/10/04
Publisher: The Japan Society of Mechanical Engineers
OS8-32 Fatigue Strength of Mod. 9Cr-1Mo Steel at Elevated Temperatures(CFRP,OS8 Fatigue and fracture mechanics,STRENGTH OF MATERIALS)
Ochi Motoyuki, Suzuki Ken, Miura Hideo
Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2015 (14) 142-142 2015/10/04
Publisher: The Japan Society of Mechanical Engineers
108 Damage evaluation of Ni-base Superalloy under High Temperature Creep
Hagiwara Shuuhei, Suzuki Ken, Miura Hideo
2015 (51) "108-1"-"108-2" 2015/09/26
Publisher: The Japan Society of Mechanical Engineers
105 Development of a strain sensor using MWCNTs on a flexible substrate
Yumoto Kanji, Suzuki Ken, Miura Hideo
2015 (51) "105-1"-"105-2" 2015/09/26
Publisher: The Japan Society of Mechanical Engineers
109 Analysis of the Initial Fatigue Damage of Modified 9Cr-1Mo Steel at Elevated Temperatures
SHINOZAKI Taichi, SUZUKI Ken, MIURA Hideo
2015 (51) "109-1"-"109-2" 2015/09/26
Publisher: The Japan Society of Mechanical Engineers
107 Visualization of grain boundary diffusion by using the scanning probe microscopy
Sakamoto Hayato, Suzuki Ken, Miura Hideo
2015 (51) "107-1"-"107-2" 2015/09/26
Publisher: The Japan Society of Mechanical Engineers
104 Development of Strain Sensor for The Measurement of Residual Stress in 3D Chips
ISOBE Koki, SUZUKI Ken, MIURA Hideo
2015 (51) "104-1"-"104-2" 2015/09/26
Publisher: The Japan Society of Mechanical Engineers
Effect of Microtexture in Electroplated Copper Thin-Film Interconnections on Their Migration Resistance
SUZUKI Ken, KATO Takeru, MIURA Hideo
Technical report of IEICE. SDM 114 (469) 33-38 2015/03/02
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 0913-5685
Microtexture dependence of stress-induced migration of copper thin film interconnections
Suzuki Ken, Miura Hideo
The Computational Mechanics Conference 2014 (27) 100-101 2014/11/22
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
Change in Electronic Conductivity of Carbon Nanotubes Under Radial Strain
Ohnishi Masato, Suzuki Ken, Miura Hideo
The Computational Mechanics Conference 2014 (27) 102-103 2014/11/22
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
323 Effect of Base Material on the Crystallinity of Electroplated Copper Thin Films
Liu Jiatong, Suzuki Ken, Miura Hideo
2014 (50) 69-70 2014/09/05
Publisher: The Japan Society of Mechanical Engineers
314 Highly Reliable Interface Structure of Electroplated Copper Thin-Film Interconnections
Kato Takeru, Suzuki Ken, Miura Hideo
2014 (50) 63-64 2014/09/05
Publisher: The Japan Society of Mechanical Engineers
322 Strain Dependence of Electronics Conductivity Graphene Thin Films
SASAKI Shinichiro, SUZUKI Ken, MIURA Hideo
2014 (50) 67-68 2014/09/05
Publisher: The Japan Society of Mechanical Engineers
321 Atomic Scale Analysis of the Initial Fatigue Damage of Modified 9Cr-1Mo Steel at Elevated Temperatures
MURAKOSHI Takuya, SUZUKI Ken, NONAKA Isamu, MIURA Hideo
2014 (50) 65-66 2014/09/05
Publisher: The Japan Society of Mechanical Engineers
PS10 Measurement of the Degradation Process of the Strength at Grain Boundaries in Thin-Film Copper Interconnections
NAKANISHI Takahiro, SUZUKI Ken, MIURA Hideo
2014 "PS10-1"-"PS10-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
PS15 Two-Dimensional Pressure Distribution Sensor Using Carbon Nanotubes
NOZAKI Takuya, SUZUKI Ken, MIURA Hideo
2014 "PS15-1"-"PS15-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
PS08 Fatigue Strength and Initial Damage of Modified 9Cr-1Mo Steel at Elevated Temperatures
OCHI Motoyuki, SUZUKI Ken, NONAKA Isamu, MIURA Hideo
2014 "PS08-1"-"PS08-3" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
PS09 Microtexture Dependence of the Thermal Conductivity of Copper Thin-Film Interconnections
Rittinon Pornvitoo, Suzuki Ken, Miura Hideo
2014 "PS09-1"-"PS09-3" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
PS11 Variation of the Mechanical Properties of Electroplated Copper Interconnections
GOTOH Masaru, SUZUKI Ken, MIURA Hideo
2014 "PS11-1"-"PS11-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
OS1109 Effect of the Quality of Grain Boundaries on their Strength
MIURA Hideo, SUZUKI Ken, MURATA Naokazu
2014 "OS1109-1"-"OS1109-3" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
OS1110 Clarification of Dominant Factors of Stress-Induced Migration in Electroplated Copper Thin-Film Interconnections
SUZUKI Ken, MIURA Hideo
2014 "OS1110-1"-"OS1110-3" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
OS0205 Strain Dependence of Electronic Properties of Carbon Nanotubes
OHNISHI Masato, YANG Meng, SUZUKI Ken, MIURA Hideo
2014 "OS0205-1"-"OS0205-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
OS0204 Change of the Electronic Properties of Graphene Under Strain
YANG Meng, OHNISHI Masato, SUZUKI Ken, MIURA Hideo
2014 "OS0204-1"-"OS0204-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
OS0208 Clarification of Dominant Factors of Stress-Induced Migration in Electroplated Copper Thin-Film Interconnections
SUZUKI Ken, OCHI Motoyuki, MIURA Hideo
2014 "OS0208-1"-"OS0208-2" 2014/07/19
Publisher: The Japan Society of Mechanical Engineers
145 Clarification of the dominant factors of stress-induced migration in through silicon via (TSV) interconnections used for three-dimensional electronic packaging
Furuya Ryosuke, Suzuki Ken, Miura Hideo
2014 (49) 91-92 2014
Publisher: The Japan Society of Mechanical Engineers
102 Improvement of the Sensitivity of a Strain Sensor Using Carbon Nanotubes
Nozaki Takuya, Suzuki Ken, Miura Hideo
2014 (49) 5-6 2014
Publisher: The Japan Society of Mechanical Engineers
101 Crystallinity of Electroplated Copper Thin Film Interconnections and Their Local Joule Heating
Rittinon Pornvitoo, Suzuki Ken, Miura Hideo
2014 (49) 3-4 2014
Publisher: The Japan Society of Mechanical Engineers
146 Visualization of the degradation process of electroplated copper thin-film interconnections caused by electromigration, and improvement of their reliability
Asai Osamu, Suzuki Ken, Miura Hideo
2014 (49) 93-94 2014
Publisher: The Japan Society of Mechanical Engineers
164 Explication of the dominant factors of the strength of the cold-sprayed copper coating
Watanabe Yusuke, Ichikawa Yuji, Suzuki Ken, Miura Hideo
2014 (49) 125-126 2014
Publisher: The Japan Society of Mechanical Engineers
122 Dominant mechanism of the fatigue damage of Modified 9Cr-lMo Steel at Elevated Temperatures
Ochi Motoyuki, Suzuki Ken, Nonaka Isamu, Miura Hideo
2014 (49) 45-46 2014
Publisher: The Japan Society of Mechanical Engineers
137 Explication of the Dominant Factors of the Crystallinity of Grain Boundaries in Polycrystalline Thin Films
Fan Chuanhong, Suzuki Ken, Miura Hideo
2014 (49) 75-76 2014
Publisher: The Japan Society of Mechanical Engineers
141 Development of two-dimensional strain sensor using carbon nanotube
Kawakami Hiroshi, Suzuki Ken, Miura Hideo
2014 (49) 83-84 2014
Publisher: The Japan Society of Mechanical Engineers
1505 Molecular dynamics study on stress-induced grain boundary diffusion of electroplated copper thin films
SUZUKI Ken, ASAI Osamu, FAN Chuanhong, FURUYA Ryosuke, MIURA Hideo
The Computational Mechanics Conference 2013 (26) "1505-1"-"1505-2" 2013/11/02
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
OS1813 Development of a Two-dimensional Pressure Sensor Using Carbon Nanotube
KAWAKAMI Hiroshi, SUZUKI Ken, MIURA Hideo
2013 "OS1813-1"-"OS1813-3" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1002 Strain-induced Change of Electronic Conductivity of Graphene Sheets
YANG Meng, OHNISHI Masato, SUZUKI Ken, MIURA Hideo
2013 "OS1002-1"-"OS1002-3" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1205 Quantitative Evaluation of Crystallinity of Grain Boundaries
Fan Chuanhong, Suzuki Ken, Miura Hideo
2013 "OS1205-1"-"OS1205-3" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1214 Improvement of Long-term Reliability of Through Silicon Via Structures for 3D Electronic Modules
FURUYA Ryosuke, SUZUKI Ken, MIURA Hideo
2013 "OS1214-1"-"OS1214-2" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1001 Effect of 3D-Strain Field on Electronic Conductivity of Carbon Nanotubes
OHNISHI Masato, SUZUKI Ken, MIURA Hideo
2013 "OS1001-1"-"OS1001-2" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS0919 Electroplating Temperature Dependence of Recrystallization of Copper Thin Films
TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2013 "OS0919-1"-"OS0919-2" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1204 Degradation Process of Electroplated Copper Thin Films Caused by Grain Boundary Diffusion
ASAl Osamu, SUZUKI Ken, MIURA Hideo
2013 "OS1204-1"-"OS1204-3" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
OS1008 Clarification of the dominant factors of the strain-induced anisotropic atomic diffusion around heterogeneous interfaces of stacked structures
SUZUKI Ken, TAKAHASHI Motoki, OCHI Motoyuki, MIURA Hideo
2013 "OS1008-1"-"OS1008-3" 2013/10/12
Publisher: The Japan Society of Mechanical Engineers
108 Dominant Factors of Fatigue Strength of Modified 9Cr-1Mo Steel at Elevated Temperatures
TAKAHASHI Motoki, SUZUKI Ken, NONAKA Isamu, MIURA Hideo
2013 (49) 15-16 2013/09/20
Publisher: The Japan Society of Mechanical Engineers
109 Residual stress around Through Silicon Via structures used for three-dimensional electronic modules
NAKANISHI Takahiro, SUZUKI Ken, MIURA Hideo
2013 (49) 17-18 2013/09/20
Publisher: The Japan Society of Mechanical Engineers
107 Effect of crystallinity of electroplated copper thin-film interconnections on their heat transfer characteristics
SUZUKI Ken, MIURA Hideo
2013 (49) 13-14 2013/09/20
Publisher: The Japan Society of Mechanical Engineers
110 Anisotropic mechanical properties of electroplated copper thin- film interconnections used for advanced semiconductor devices
GOTO Masaru, SUZUKI Ken, MIURA Hideo
2013 (49) 19-20 2013/09/20
Publisher: The Japan Society of Mechanical Engineers
162 Two-dimensional Strain Distribution Sensor Using Carbon Nanotubes
Kawakami Hiroshi, Suzuki Ken, Miura Hideo
2013 (48) 126-127 2013/03/15
Publisher: The Japan Society of Mechanical Engineers
172 Development of the Residual Stress Monitoring Method During Manufacturing Process of 3D Electronic Packages
Tago Hironori, Suzuki Ken, Miura Hideo
2013 (48) 146-147 2013/03/15
Publisher: The Japan Society of Mechanical Engineers
171 Micro-texture dependence of strength of fine metallic bumps used for electronic packaging
Endo Fumiaki, Suzuki Ken, Miura Hideo, Murata Naokazu
2013 (48) 144-145 2013/03/15
Publisher: The Japan Society of Mechanical Engineers
173 Clarification of dominant factors of the strain-induced anisotropic atomic diffusion around the various interface
Sano Tomohiro, Suzuki Ken, Miura Hideo
2013 (48) 148-149 2013/03/15
Publisher: The Japan Society of Mechanical Engineers
121 Electroplating Condition Dependence of Micro Texture of Electroplated Copper Thin Films
Tamakawa Kinji, Suzuki Ken, Miura Hideo
2013 (48) 44-45 2013/03/15
Publisher: The Japan Society of Mechanical Engineers
Effect of a Three-dimensional Strain Field on the Electronic Band Structure of Carbon Nanotubes and Graphene Sheets
SUZUKI Ken, OHNISHI masato, MIURA Hideo
Technical report of IEICE. SDM 112 (290) 59-61 2012/11/08
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 0913-5685
205 Effect of the local strain distribution on the electronic conductivity of carbon nanotubes
Ohnishi Masato, Kawakami Hiroshi, Suzuki Ken, Miura Hideo
The Computational Mechanics Conference 2012 (25) 129-130 2012/10/06
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
119 Strain Dependence of the Electronic Conductivity of Carbon Nanotubes
NOZAKI Takuya, KAWAKAMI Hiroshi, SUZUKI Ken, MIURA Hideo
2012 (48) 42-43 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
116 Degradation Process of Copper Thin-film Interconnections Caused by Stress induced Migration
SUNG Jaeuk, MURATA Naokazu, SUZUKI Ken, MIURA Hideo
2012 (48) 36-37 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
117 Observation of the Change of the Crystallinity of Nickel-base Superalloy under Creep Loading
OCHI Motoyuki, MURATA Naokazu, SUZUKI Ken, MIURA Hideo
2012 (48) 38-39 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
OS1312 Visualization of the degradation process of the crystallinity of thin-film interconnections in semiconductor devices
Fan Chuanhong, Suzuki Ken, Miura Hideo
2012 "OS1312-1"-"OS1312-2" 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
OS1311 Quantitative characterization of crystallinity of grain boundaries in nano-scale and its application to the strength evaluation of polycrystalline thin films
MURATA Naokazu, SAITO Naoki, SUZUKI Ken, MIURA Hideo
2012 "OS1311-1"-"OS1311-2" 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
PS19 Clarification of the dominant factors of the strain-induced anisotropic atomic diffusion around the various interfaces
SANO Tomohiro, SUZUKI Ken, MIURA Hideo
2012 "PS19-1"-"PS19-3" 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
PS18 Development of a monitoring method of residual stress in a silicon chip in a 3D stacked structure during its fabrication process
TAGO Hironori, FURUYA Ryosuke, SUZUKI Ken, MIURA Hideo
2012 "PS18-1"-"PS18-3" 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
OS2116 Evaluation of accumulative damage under random load by a stress measurement method using electroplated thin copper films
TAMAKAWA Kinji, MURATA Naokazu, SUZUKI Ken, MIURA Hideo
2012 "OS2116-1"-"OS2116-2" 2012/09/22
Publisher: The Japan Society of Mechanical Engineers
J032022 Quantitative Evaluation of the Crystallinity of Grain Boundaries in Nano-scale and its Application to the Control of Material Properties
MURATA Naokazu, SUZUKI Ken, MIURA Hideo
Mechanical Engineering Congress, Japan 2012 "J032022-1"-"J032022-4" 2012/09/09
Publisher: The Japan Society of Mechanical Engineers
J061024 Evaluation of the strength and reliability of through silicon via (TSV) interconnections used for three-dimensional electronic packaging
FURUYA Ryosuke, SUZUKI Ken, MIURA Hideo
Mechanical Engineering Congress, Japan 2012 "J061024-1"-"J061024-4" 2012/09/09
Publisher: The Japan Society of Mechanical Engineers
J061031 Reliability design of thin-film interconnections in semiconductor devices based on the evaluation of nano-scale crystallinity of the thin films
Asai Osamu, Murata Naokazu, Suzuki Ken, Miura Hideo
Mechanical Engineering Congress, Japan 2012 "J061031-1"-"J061031-4" 2012/09/09
Publisher: The Japan Society of Mechanical Engineers
152 Fluctuation of the accuracy of stress measurement using electroplated copper films caused by environmental factors
Tamakawa Kinji, Suzuki Ken, Miura Hideo
2012 (47) 110-111 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
150 On-line monitoring of residual stress during thin-film processing of transistors
Tago Hironori, Nakahira Kota, Suzuki Ken, Miura Hideo
2012 (47) 106-107 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
151 Micro-texture dependence of strength of fine metallic bumps used for electronic packaging
Endo Fumiaki, Murata Naokazu, Suzuki Ken, Miura Hideo
2012 (47) 108-109 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
230 Highly reliable structural design of three-dimensionally stacked semiconductor packages and modules
Nakahira Kota, Suzuki Ken, Miura Hideo
2012 (47) 266-267 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
225 Effect of the distribution of local strain on the electronic characteristics of carbon nanotubes
Ohnishi Masato, Suzuki Ken, Miura Hideo
2012 (47) 256-257 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
228 Improvement of the quality and reliability of electroplated copper thin-film interconnections by controling their micro-scale crystallinity
Saito Naoki, Suzuki Ken, Miura Hideo
2012 (47) 262-263 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
227 Remote noncontact strain measurement using electro-magnetic waves
Ohashi Yusuke, Suzuki Ken, MIURA Hideo
2012 (47) 260-261 2012/03/13
Publisher: The Japan Society of Mechanical Engineers
OS20-1-3 Stress-induced anisotropic diffusion of component elements in the stacked thin-film multi-layer structures
Sano Tomohiro, Murata Naokazu, Suzuki Ken, Miura Hideo
Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2011 (10) "OS20-1-3-1" 2011/09/19
Publisher: The Japan Society of Mechanical Engineers
OS20-1-4 A Novel Method for Evaluating the crystallinity of Grain Boundaries in Polycrystalline Materials
Murata Naokazu, Suzuki Ken, Miura Hideo
Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2011 (10) "OS20-1-4-1" 2011/09/19
Publisher: The Japan Society of Mechanical Engineers
J031052 Measurement of the change of the residual stress in nano-scale transistors
TAGO Hironori, NAKAHIRA Kota, SUZUKI Ken, MIURA Hideo
Mechanical Engineering Congress, Japan 2011 "J031052-1"-"J031052-3" 2011/09/11
Publisher: The Japan Society of Mechanical Engineers
J031051 Minimization of the residual stress of three-dimensionally flip chip packaging structures
NAKAHIRA Kota, TAGO Hironori, ENDO Fumiaki, SUZUKI Ken, MIURA Hideo
Mechanical Engineering Congress, Japan 2011 "J031051-1"-"J031051-3" 2011/09/11
Publisher: The Japan Society of Mechanical Engineers
OS1611 Strain-Induced Anisotropic Diffusion and Change of Micro Texture around Interfaces of Stacked Thin Film Structures
SANO Tomohiro, SASAKI Yamato, SUZUKI Ken, MIURA Hideo
2011 "OS1611-1"-"OS1611-2" 2011/07/16
Publisher: The Japan Society of Mechanical Engineers
OS1612 Relationship between the Strength and the Crystallographic Quality of Grain Boundaries in Polycrystalline Thin Film Materials
MURATA Naokazu, SAITO Naoki, SUZUKI Ken, MIURA Hideo
2011 "OS1612-1"-"OS1612-2" 2011/07/16
Publisher: The Japan Society of Mechanical Engineers
OS0303 Remote Strain Measurement Using Carbon Nanotube
OHASHI Yusuke, SUZUKI Yusuke, OHNISHI Masato, SUZUKI Ken, MIURA Hideo
2011 "OS0303-1"-"OS0303-3" 2011/07/16
Publisher: The Japan Society of Mechanical Engineers
OS1509 Atomic Scale Analysis of Degradation Mechanism of Ni-base Superalloy at High Temperatures
Suzuki Ken, Sano Tomohiro, Sasaki Yamato, Miura Hideo
2011 "OS1509-1"-"OS1509-2" 2011/07/16
Publisher: The Japan Society of Mechanical Engineers
OS2403 3D Semiconductor Assembly Structure with Low-Residual Stress Controlled by Mechanical Properties of Electroplated Cu Bumps
ENDO Fumiaki, NAKAHIRA Kota, SUZUKI Ken, MIURA Hideo
2011 "OS2403-1"-"OS2403-2" 2011/07/16
Publisher: The Japan Society of Mechanical Engineers
193 Heat Resistance Improvement of Ni-base Superalloy Considering the Control of High Temperature Damage of Nano-Texture of the Alloy
Sasaki Yamato, Suzuki Ken, Miura Hideo
2011 (46) 188-189 2011/03/15
Publisher: The Japan Society of Mechanical Engineers
115 Microtexture Change in Electroplated Copper Thin Films under Random Loads
Tamakawa Kinji, Murata Naokazu, Suzuki Ken, Miura Hideo
2011 (46) 34-35 2011/03/15
Publisher: The Japan Society of Mechanical Engineers
PS12 Measurement of Fine patterning-induced sfress of thin films by embedded strain gauges
NAKAHIRA Kota, KISHI Hiroki, SUZUKI Ken, MIURA Hideo
2010 31-32 2010/10/09
Publisher: The Japan Society of Mechanical Engineers
1503 Variation of the Strength of Electroplated Copper Thin Film Due to the Quality of its Gram Boundaries
MURATA Naokazu, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2010 79-81 2010/10/09
Publisher: The Japan Society of Mechanical Engineers
1509 Change of microtexture of nickel-base superalloy caused by stress-induced anisotropic diffusion of element atoms
Sasaki Yamato, Suzuki Ken, Miura Hideo
2010 94-95 2010/10/09
Publisher: The Japan Society of Mechanical Engineers
107 Thermal history dependence of the mechanical properties of electroplated copper thin films
Endo Fumiaki, Murata Naokazu, Suzuki Ken, Miura Hideo
2010 (46) 13-14 2010/09/24
Publisher: The Japan Society of Mechanical Engineers
109 Atomic Scale Analysis for Improving the heat resistance of Ni-base superalloy
Sano Tomohiro, Sasaki Yamato, Suzuki Ken, Miura Hideo
2010 (46) 17-18 2010/09/24
Publisher: The Japan Society of Mechanical Engineers
108 Measurement of the change of the residual stress in nano-scale transistors
Tago Hironori, Nakahira Kohta, Suzuki Ken, Miura Hideo
2010 (46) 15-16 2010/09/24
Publisher: The Japan Society of Mechanical Engineers
1704 Non-contact measure method of change of the electrical conductivity characteristics of carbon nanotubes
Ohashi Yusuke, Suzuki Ken, Miura Hideo
The Computational Mechanics Conference 2010 (23) 443-444 2010/09/23
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
1703 Strain-induced change of electronic conductivity of graphene sheets
OHNISHI Masato, SUZUKI Ken, MIURA Hideo
The Computational Mechanics Conference 2010 (23) 441-442 2010/09/23
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
1112 Molecular dynamics analysis of strain-induced anisotropic diffusion around solid interfaces
SUZUKI Ken, MIURA Hideo
The Computational Mechanics Conference 2010 (23) 143-144 2010/09/23
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
114 Effect of local strain on the electronic conductivity of carbon nanotubes
OHSAKI Katsuya, SUZUKI Ken, MIURA Hideo
2010 (45) 30-31 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
116 Development of in-line evaluation measurement method of the change of the residual stress in nano-scale transistor structures during manufacturing.
KISHI Hiroki, SUZUKI Ken, MIURA Hideo
2010 (45) 34-35 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
134 Effect of grain boundaries on fatigue strength of electroplated copper thin films.
MURATA Naokazu, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2010 (45) 70-71 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
130 The stress-induced anisotropic diffusion between dissimilar materials.
Sasaki Yamato, Murata Naokazu, Suzuki Ken, Miura Hideo
2010 (45) 62-63 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
135 Measurement of the Amplitude of the Cyclic Surface Strain Using Electroplated Copper Thin Films
TAMAKAWA Kinji, ASAKAWA Yukihiro, SUZUKI Ken, MIURA Hideo
2010 (45) 72-73 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
115 Dominant factors of the integrity of the interface between high-k dielectric and metallic thin films
INOUE Tatsuya, SUZUKI Ken, MIURA Hideo
2010 (45) 32-33 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
143 Degradation Mechanisms of Protection Properties of Oxide Films Formed on Stainless Steel in High Temperature Water: Quantum Chemical Molecular Dynamics Study
SUZUKI Ken, SASAKI Yamato, MIURA Hideo
2010 (45) 86-87 2010/03/12
Publisher: The Japan Society of Mechanical Engineers
1215 Strain-induced change of electronic conductivity of carbon nanotubes
SUZUKI Yusuke, SUZUKI Ken, MIURA Hideo
10 (9) 612-613 2010
Publisher: The Japan Society of Mechanical Engineers
Atomic Scale Analysis of the Degradation Mechanism of the Integrity High-k/Metal-gate Interface Caused by the Interaction between Point-Defects and Residual Strain around the Interface
SUZUKI Ken, ITO Yuta, INOUE Tatsuya, MIURA Hideo, YOSHIKAWA Hideki, KOBAYASHI Keisuke, SAMUKAWA Seiji
Technical report of IEICE. SDM 109 (278) 79-84 2009/11/05
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 0913-5685
101 Measurement of local deformation and residual stress in electronic modules
Nakahira Kohta, Kishi Hiroki, Suzuki Ken, Miura Hideo
2009 (45) 1-2 2009/09/26
Publisher: The Japan Society of Mechanical Engineers
104 Degradation mechanism of Ni-base superalloy at high temperatures and improvement of its strength
Sasaki Yamato, Murata Naokazu, Suzuki Ken, Miura Hideo
2009 (45) 7-8 2009/09/26
Publisher: The Japan Society of Mechanical Engineers
111 Remote measurement of dynamic strain using a laser chip
Ohashi Yusuke, Kaisumi Aya, Suzuki Ken, Miura Hideo
2009 (45) 21-22 2009/09/26
Publisher: The Japan Society of Mechanical Engineers
102 Measurement of large deformation using multi-walled carbon nanotube-dispersed rubber
Suzuki Yusuke, Ohnishi Masato, Suzuki Ken, Miura Hideo
2009 (45) 3-4 2009/09/26
Publisher: The Japan Society of Mechanical Engineers
103 Micro texture dependence of electromigration resistance of electroplated copper thin films
Saito Naoki, Murata Naokazu, Suzuki Ken, Miura Hideo
2009 (45) 5-6 2009/09/26
Publisher: The Japan Society of Mechanical Engineers
114 Development of a multi-scale measurement method of local strain distribution in semiconductor devises
SASAKI Takuya, UETA Nobuki, SUZUKI Ken, MIURA Hideo
2009 (44) 26-27 2009/03/13
Publisher: The Japan Society of Mechanical Engineers
113 Dependence of mechanical properties on the nanoscale texture of electroplated copper thin films
MURATA Naokazu, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2009 (44) 24-25 2009/03/13
Publisher: The Japan Society of Mechanical Engineers
405 Basic Study of Remote Strain Measurement Using Laser Beam
Kaisumi Aya, Suzuki Ken, Miura Hideo
2008 (44) 113-114 2008/09/27
Publisher: The Japan Society of Mechanical Engineers
111 Basic Study of Stress-Induced Anisotropic Atomic Diffusion Near Solid Interface
Sasaki Yamato, Murata Naokazu, Suzuki Ken, Miura Hideo
2008 (44) 21-22 2008/09/27
Publisher: The Japan Society of Mechanical Engineers
110 Large Strain Measurement Using Multi-Walled Carbon Nanotube-Dispersed Rubber
Ohnishi Masato, Ohsaki Katsuya, Suzuki Ken, Miura Hideo
2008 (44) 19-20 2008/09/27
Publisher: The Japan Society of Mechanical Engineers
112 Effect of Micro Structure of Electroplated Copper Thin Films on Electromigration
Kimura Motonori, Jeong Seongcheol, Suzuki Ken, Miura Hideo
2008 (44) 23-24 2008/09/27
Publisher: The Japan Society of Mechanical Engineers
OS0409 Molecular simulation of a Ni/Ni_3Al interface
YAMADA Mitsuru, OKABE Tomonaga, SUZUKI Ken
2008 "OS0409-1"-"OS0409-2" 2008/09/16
Publisher: The Japan Society of Mechanical Engineers
OS0620 Effect of grain boundary characteristics on fatigue strength properties of electroplated copper thin films
MURATA Naokazu, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2008 "OS0620-1"-"OS0620-2" 2008/09/16
Publisher: The Japan Society of Mechanical Engineers
OS0604 Influence of trace additive element on stress induced anisotropic atomic diffusion in Ni-base superalloy
SUZUKI Ken, ITO Hiroyuki, INOUE Tatsuya, MIURA Hideo
2008 "OS0604-1"-"OS0604-2" 2008/09/16
Publisher: The Japan Society of Mechanical Engineers
OS0116 Feasibility study of application of multi-walled CNT-dispersed resin to strain sensors
OOSAKI Katsuya, OONISI Masato, SUZUKI Ken, MIURA Hideo
2008 "OS0116-1"-"OS0116-2" 2008/09/16
Publisher: The Japan Society of Mechanical Engineers
OS1201 Form dependence analysis of deformation characteristics of carbon nanostructures
INOUE Tatsuya, KISHI Hiroki, OSAKI Katsuya, Honda Takashi, SUZUKI Ken, MIURA Hideo
2008 "OS1201-1"-"OS1201-2" 2008/09/16
Publisher: The Japan Society of Mechanical Engineers
OS1202 圧縮負荷環境におけるカーボンナノチューブ変形特性に及ぼすカイラリティの影響(ナノ・マイクロからの視点からの変形と破壊の力学(1),オーガナイズドセッション)
岸 宏樹, 本多 崇, 井上 達也, 大崎 克也, 鈴木 研, 三浦 英生
M&M材料力学カンファレンス 2008 "OS1202-1"-"OS1202-2" 2008/09/16
Publisher: 一般社団法人日本機械学会
103 Deterioration mechanism of signal transmission quality in an optical module caused by packaging-induced stress
KITAMURA Atsushi, Suzuki Ken, MIURA Hideo
2008 (43) 7-8 2008/03/15
Publisher: The Japan Society of Mechanical Engineers
143 Mechanical properties of intermetallic compounds formed at the interface between lead-free solder and an electroplated copper thin film
JEONG SC, SUZUKI Ken, MIURA Hideo
2008 (43) 87-88 2008/03/15
Publisher: The Japan Society of Mechanical Engineers
107 High temperature damage of Ni-base superalloy based on stress induced anisotropic atomic diffusion
Ito Hiroyuki, Suzuki Ken, Miura Hideo
2008 (43) 15-16 2008/03/15
Publisher: The Japan Society of Mechanical Engineers
113 Micro texture dependence of characteristics of electroplated Cu-thin-films for interconnections
OTANI Muneyuki, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2008 (43) 27-28 2008/03/15
Publisher: The Japan Society of Mechanical Engineers
503 Strain dependence of dielectric properties of high-k thin films used for semiconductor devices
Inoue Tatsuya, SUZUKI Ken, MIURA Hideo
2007 (43) 127-128 2007/09/29
Publisher: The Japan Society of Mechanical Engineers
201 Strain dependence of dielectric properties of high-k thin films used for semiconductor devices
Imasaki Kazuto, SUZUKI Ken, MIURA Hideo
2007 (43) 31-32 2007/09/29
Publisher: The Japan Society of Mechanical Engineers
202 Strain dependence of electrical resistivity of multi-walled CNT-dispersed resin
Ohsaki Katsuya, SUZUKI Ken, MIURA Hideo
2007 (43) 33-34 2007/09/29
Publisher: The Japan Society of Mechanical Engineers
203 Mechanical properties of intermetallic compounds formed at the interface between lead-free solder and electroplated copper thin film
JEONG SC, SUZUKI Ken, MIURA Hideo
2007 (43) 35-36 2007/09/29
Publisher: The Japan Society of Mechanical Engineers
188 Explication of Damage Mechanism of Ni-base superalloy at high temperatures
AKAHOSHI Kuniaki, MIURA Hideo, Suzuki Ken
2007 (42) 173-174 2007/03/13
Publisher: The Japan Society of Mechanical Engineers
197 Measurement method of non-contact strain measurement using carbon-nanotube-dispersed resin
FUJI Hideki, SUZUKI Ken, MIURA Hideo
2007 (42) 191-192 2007/03/13
Publisher: The Japan Society of Mechanical Engineers
196 Effect of Defects and Strain on Insulating Properties of HfO_2 Films Used for Nano-scale Semiconductor Devices
ITO Yuta, SUZUKI Ken, MIURA Hideo
2007 (42) 189-190 2007/03/13
Publisher: The Japan Society of Mechanical Engineers
101 Basic Study of Spatial Distribution of Mechanical Properties in Electroplated Copper Thin Films
SASAKI Takuya, TAMAKAWA Kinji, SUZUKI Ken, MIURA Hideo
2006 (42) 1-2 2006/09/30
Publisher: The Japan Society of Mechanical Engineers
Effect of Residual Stress in Thin Films on the Radiation Spectrum of a Semiconductor Laser
MIURA Hideo, KAWAUCHI Taira, SUZUKI Ken, SASAKI Minoru
2006 662-663 2006/09/13
122 Effect of Defects and Strain on the Band Gap of HfO_2 and ZrO_2 Films analyzed by Ouantum Chemical Molecular Dynamics
ITO Yuta, SUZUKI Ken, MIURA Hideo
2006 (41) 49-50 2006/03/14
Publisher: The Japan Society of Mechanical Engineers
519 Basic study of application of multi-wall-carbon-nanotubes dispersed in a resin to strain sensors
FUJI Hideki, SUZUKI Ken, MIURA Hideo
2006 (41) 229-230 2006/03/14
Publisher: The Japan Society of Mechanical Engineers
1403 Quantum chemical molecular dynamics study of effect of defects and strain on band gap of HfO_2 films
ITO Yuta, SUZUKI Ken, MIURA Hideo
The Computational Mechanics Conference 2005 (18) 259-260 2005/11/17
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
611 Basic Study of a Measurement Method of a Two-dimensional Strain Distribution Using Carbon-Nano-Tube Dispersed Resin
FUJI Hideki, SUZUKI Ken, MIURA Hideo
2005 (41) 241-242 2005/09/09
Publisher: The Japan Society of Mechanical Engineers
214 Prediction of Elastic Modulus of Ceria based Ceramic Composites for SOFCs by Molecular Dynamics
SATO Kazuhisa, SUZUKI Ken, HASHIDA Toshiyuki, YUGAMI Hiroo, KAWADA Tatsuya, MIZUSAKI Junichiro
2005 (40) 78-79 2005/03/15
Publisher: The Japan Society of Mechanical Engineers
トランジスタ用ナノ絶縁膜耐圧特性に及ぼす薄膜残留応力の影響
三浦英生, 鈴木研, 庄子哲雄
日本学術会議材料研究連合講演会講演論文集 48th 352-353 2004/10/20
Quantum chemical molecular dynamics analysis of the structural properties and dielectric characteristic of SiO_<2-x>films
SUZUKI Ken, ITO Yuta, MIURA Hideo, SHOJI Tetsuo
The Proceedings of The Computational Mechanics Conference 2004 (0) 31-32 2004
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
Influence of oxygen vacancies and strain on electronic reliability of Si0_<2-x> films
ITO Yuta, SUZUKI Ken, MIURA Hideo, SHOJI Tetsuo
The Proceedings of The Computational Mechanics Conference 2004 (0) 807-808 2004
Publisher: The Japan Society of Mechanical EngineersISSN： 1348-026X
鉄新生面の化学反応ダイナミックスに関する計算化学的検討
鈴木研, 庄子哲雄, 宮本明
材料と環境講演集 2003 395-396 2003/05/15
電極/電解液界面の大規模シミュレーションを可能とする高速化量子分子動力学法の開発
鈴木 研, 宮内 政幸, 牧野 裕介, 中山 拓, 草谷 友規, 高見 誠一, 久保 百司, 今村 詮, 宮本 明
日本コンピュータ化学会年会講演予稿集 2002 (1) 1O04 2002/07/03
光励起反応ダイナミクスの解明を可能とする高速化量子分子動力学プログラムの開発
草谷 友規, 呂 晨, 鈴木 愛, 鈴木 研, 高見 誠一, 久保 百司, 今村 詮, 宮本 明
日本コンピュータ化学会年会講演予稿集 2002 (1) 2P21 2002/07/03
高速化量子分子動力学プログラムの開発 (特集 計算科学技術の活用)
鈴木 研, 高見 誠一, 久保 百司
化学工業 53 (4) 274-280 2002/04
Publisher: 化学工業社ISSN： 0451-2014
コンビナトリアル計算化学
鈴木 研, 高見誠一, 久保百司, 宮本 明
有機合成化学協会誌 60 (5) 488-489 2002
Publisher: 社団法人 有機合成化学協会DOI： 10.5059/yukigoseikyokaishi.60.488
ISSN： 0037-9980
高速化量子分子動力学法による核生成、成長のシミュレーション
高見誠一, 横須賀俊之, 草谷友規, 鈴木 研, 久保百司, 宮本 明
粉体工学会誌 39 (6) 459-463 2002
Publisher: 粉体工学会ISSN： 0386-6157
コンビナトリアル計算化学
鈴木 研, 高見誠一, 久保百司, 宮本 明
工業材料 50 118-119 2002
Publisher: 日刊工業新聞社
高速化量子分子動力学プログラムの開発
鈴木 研, 高見誠一, 久保百司, 宮本 明
化学工業 53 274-280 2002
Publisher: 社団法人 化学工学会ISSN： 1343-9936
Accelerated Quantum Molecular Dynamics Studies on Silicon Plasma Oxidation Process
KUROKAWA Hotoshi, SASATA Katsumi, TOKOSUKA Toshiyuki, SUZUKI Ken, TAKAMI Seiichi, KUBO Momoji, MIYAMOTO Akira, IMAMURA Akira
Technical report of IEICE. SDM 101 (350) 65-67 2001/10/09
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 0913-5685
Development of Accelerated Quantum Chemical Calculation Program and Its Application to Silicon-based Materials
TAKAMI Seiichi, YOKOSUKA ToshiYuki, KUROKAWA Hitoshi, KUSAGAYA Tomonori, SUZUKI Ken, KUBO Momoji, MIYAMORO Akira, IMAMURA Akira
Technical report of IEICE. SDM 101 (350) 61-63 2001/10/09
Publisher: The Institute of Electronics, Information and Communication EngineersISSN： 0913-5685
Crystal Growth Simulation on Electronics Materials
KUBO Momoji, YOKOSUKA Toshiyuki, KUROKAWA Hitoshi, KUSAGAYA Tomonori, SUZUKI Ken, TAKAMI Seiichi, MIYAMOTO Akira, IMAMURA Akira
Technical report of IEICE. SDM 101 (350) 73-74 2001/10/09
Publisher: The Institute of Electronics, Information and Communication Engineers
高速化量子分子動力学法の開発と大規模触媒系への応用
久保 百司, 草谷 友規, 黒川 仁, 安藤 美奈子, 鈴木 研, 高見 誠一, 宮本 明, 今村 詮
触媒 43 (6) 373-375 2001/09/10
Publisher: 触媒学会ISSN： 0559-8958
コンビナトリアル計算化学
鈴木 研, 高見誠一, 久保百司, 宮本 明
機能材料 21 (1) 63-69 2001
Publisher: シーエムシー出版ISSN： 0286-4835
分子シミュレーションの応用
黒川 仁, 谷島健二, 鈴木 研, 高見誠一, 久保百司, 宮本 明
ケミカルエンジニヤリング 46 (3) 43-48 2001
Publisher: 化学工業社ISSN： 0387-1037
コンピュータシミュレーションによる触媒材料設計
安藤美奈子, 鈴木 研, 高見誠一, 久保百司, 宮本 明
セラミックデータブック 29 39-42 2001
Publisher: 工業製品技術協会
化学電池材料の分子設計
鈴木 研, 高見誠一, 久保百司, 宮本 明
ケミカルエンジニヤリング 46 436-442 2001
Publisher: 化学工業社
材料開発の世界を切り開く計算化学とその最新の成果
鈴木 研, 高見誠一, 久保百司, 宮本 明
工業材料 50 (7) 89-93 2001
Publisher: 日刊工業新聞社ISSN： 0452-2834
コンビナトリアルケミストリー－計算化学的手法との接点
鈴木 研, 高見誠一, 久保百司, 宮本 明
ペトロテック 24 (10) 801-805 2001
Publisher: 社団法人石油学会ISSN： 0386-2763
計算化学による材料設計の新展開
鈴木 研, 高見誠一, 久保百司, 宮本 明
JCPE Newsletter 10 (4) 3-11 1999
Publisher: Japan Chemistry ProgramExchange
自動車用電気二重層キャパシタとリチウムイオン二次電池の高エネルギー密度化・高出力化技術
久保百司, 鈴木 研, 坪井秀行, 古山通久, 宮本 明
技術情報協会 2005/03
コンビナトリアルサイエンスの新展開
鈴木 研, 高見誠一, 久保百司, 宮本 明
シーエムシー出版 2002/03
次世代パワーデバイス用樹脂/金属界面の劣化機構解明と高信頼化技術の創出
鈴木 研
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 基盤研究(B)
Institution: 東北大学
2026/04/01 - 2029/03/31
Strain-Controlled Graphene-Nanoribbon-Base Biochemical Sensors with High Selectivity and Sensitivity
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Fund for the Promotion of Joint International Research (Fostering Joint International Research (B))
Institution: Tohoku University
2020/10/27 - 2023/03/31
ひずみ制御によるグラフェンナノリボン電子構造設計手法の構築と多機能センサへの応用
鈴木 研
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 基盤研究(B)
Institution: 東北大学
2020/04/01 - 2023/03/31
Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials
Miura Hideo
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Scientific Research (S)
Institution: Tohoku University
2016/05/31 - 2021/03/31
Solid phase film formation of polymer/ceramic compound particles by hetero-structure control and comprehensive analysis of film formation mechanisms
OGAWA Kazuhiro
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Scientific Research (A)
Institution: Tohoku University
2017/04/01 - 2020/03/31
Degradation Analysis of Engineering Materials in Air Using White Light and Precise Optical Filter
MIURA HIDEO, Suzuki Ken, Murakoshi Takuya, Shinozaki Taichi, Sakamoto Hayato, Suzuki Wataru, Sawase Akari, Kasama Shin, Cheng Lei, Cai Qingwu
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Research (Exploratory)
Institution: Tohoku University
2017/06/30 - 2019/03/31
Elucidation of mechanical, electrical and chemical factor interaction mechanism in all solid state battery and its application
SATO Kazuhisa
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Scientific Research (B)
Institution: Tohoku University
2016/04/01 - 2019/03/31
原子配列の秩序性変化に着目した材料の高温初期損傷評価システムの開発
三浦 英生, 鈴木 研
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 基盤研究(A)
Institution: 東北大学
2016/04/01 - 2017/03/31
Development of visualization technologies for battery security society
Hashida Toshiyuki, SATO Kazuhisa, SUZUKI Ken, FUKUI Ken-ichi
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Exploratory Research
Institution: Tohoku University
2015/04/01 - 2017/03/31
Development and Evaluation of Multi-Functional Thin-Film Devices Using Graphene Nanoribbon Under Three-Dimensional Strain Field
Miura Hideo, Suzuki Ken, Ohnishi Masato, Yang Meng, Sasaki Shin-ichiro
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Exploratory Research
Institution: Tohoku University
2015/04/01 - 2017/03/31
Fabrication of low-elastic modulus micro bumps by controlling crystallographic orientation
Suzuki Ken
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Exploratory Research
Institution: Tohoku University
2014/04/01 - 2016/03/31
Quantitative Evaluation of the Crystallinity of Grain Boundaries in Nano Scale
MIURA Hideo, SUZUKI Ken
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Exploratory Research
Institution: Tohoku University
2012/04/01 - 2014/03/31
Remote dynamic-strain-distribution measurement system using a nano-scale texture-controlled thin film
MIURA Hideo, SUZUKI Ken
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Scientific Research (A)
Institution: Tohoku University
2009 - 2012
Interface integrity based on the control of strain-induced anisotropic diffusion
MIURA Hideo, SUZUKI Ken
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Challenging Exploratory Research
Institution: Tohoku University
2010 - 2011
Materials designfor energy systems based on interface integrity
SUZUKI Ken
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Young Scientists (A)
Institution: Tohoku University
2007 - 2009
応力腐食割れ解析用量子分子動力学シミュレータの開発とき裂進展メカニズムの解明
鈴木 研
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 萌芽研究
Institution: 東北大学
2005 - 2005
複合環境下における破壊機構の微視的解明と破壊予知・制御に関する計算化学的研究
鈴木 研
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 特別研究員奨励費
Institution: 東北大学
2002 - 2003
計算科学を援用したコールドスプレー法による火力発電用高温部材の革新的補修技術の開発
多変量時空間ゆらぎ制御による高信頼合金設計技術に関する研究
