Details of the Researcher

PHOTO

Yukio Suzuki
Section
Micro System Integration Center
Job title
Associate Professor
Degree

  • 博士（工学）（東北大学）

Research History 4

  • 2022/10 - Present
    Tohoku University　Micro System Integration Center　Associate Professor

  • 2019/04 - 2022/09
    Tohoku University　Micro System Integration Center

  • 2016/04 - 2019/03
    Tohoku University　Micro System Integration Center

  • 2012/04 - 2016/03
    東北大学　マイクロシステム融合研究開発センター

Education 2

  • Tohoku University　Graduate School, Division of Engineering　バイオロボディクス

    - 2016/03/25

  • Science University of Tokyo　Faculty of Science　物理学科

    - 1993/03/20

Committee Memberships 8

  • 電気学会 第41回「センサ・マイクロマシンと応用システム」　論文委員

    2024/02 - 2024/11

  • 電気学会 第40回「センサ・マイクロマシンと応用システム」　論文委員

    2023/02 - 2023/12

  • 電気学会 第39回「センサ・マイクロマシンと応用システム」　論文委員 主査

    2022/02 - 2022/12

  • 電気学会 第38回センサ・マイクロマシンと応用システムシンポジウム　論文委員 副査

    2021/02 - 2021/12

  • 電気学会 第38回センサ・マイクロマシンと応用システムシンポジウム　実行委員

    2021/01 - 2021/12

  • 電気学会 第37回センサ・マイクロマシンと応用システムシンポジウム　論文委員

    2020/05 - 2021/01

  • 電気学会 第37回センサ・マイクロマシンと応用システムシンポジウム　実行委員

    2020/01 - 2020/12

  • IEEE　NEMS2024, Technical Program Committee

    2024 -

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Professional Memberships 3

  • 日本機械学会

    2019 - Present

  • IEEJ

  • IEEE

Research Interests 4

  • MEMS process integration technology

  • Wafer-level vacuum packaging

  • Integrated MEMS

  • Piezo-electric actuator MEMS

Research Areas 1

  • Nanotechnology/Materials / Nano/micro-systems / MEMS integration, Wafer-level packaging, PZT actuator

Awards 8

  1. 第40回「センサ・マイクロマシンと応用システム」シンポジウム 優秀技術論文賞

    2023/11　電気学会　シリコンマイグレーションシール（SMS）ウェハレベルパッケージング技術によるMEMS 振動子の1 Pascal 真空封止

  2. Outstanding poster award

    2022/11　IEEJ

  3. 第37回「センサ・マイクロマシンと応用システム」シンポジウム 最優秀技術論文賞(1/184件）

    2020/11　電気学会　深紫外LED向けシリコンパッケージング技術(Si-PKG)の開発

  4. 第36回「センサ・マイクロマシンと応用システム」シンポジウムにて優秀ポスター賞

    2019/11　電気学会　深紫外 LED 向けシリコンパッケージング技術の開発

  5. 第36回「センサ・マイクロマシンと応用システム」シンポジウム 優秀ポスター賞

    2019/11　電気学会　シリコンマイグレーションシール(SMS)ウェハレベル真空パッケージング技

  6. 第35回「センサ・マイクロマシンと応用システム」シンポジウム 優秀ポスター賞

    2018/11　電気学会　レーザー消去された 0.13 μm CMOS-LSI マルチプロジェクトウェハへの TSV 加工

  7. 第33回「センサ・マイクロマシンと応用システム」シンポジウム 優秀技術論文賞

    2016/10/26　電気学会 センサ・マイクロマシン部門　3件受賞 / 236件発表中

  8. 第８回集積化MEMSシンポジウム 優秀論文賞

    2016/10/24　応用物理学会 集積化MEMS技術研究会　2件受賞/57発表

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Papers 39

  1. Vacuum-Sealed MEMS Resonators Based on Silicon Migration Sealing and Hydrogen Diffusion Peer-reviewed

    Tianjiao Gong, Muhammad Jehanzeb Khan, Yukio Suzuki, Takashiro Tsukamoto, Shuji Tanaka

    Journal of Microelectromechanical Systems　33　(3)　369-375　2024/06

    Publisher: Institute of Electrical and Electronics Engineers (IEEE)

    DOI： 10.1109/jmems.2024.3382768 　

    ISSN： 1057-7157

    eISSN： 1941-0158

  2. Mechanical Quality Factor Evaluation of Damping Film Materials for Polymer/PZT Composite MEMS Actuator Peer-reviewed

    Xuchen Wang, Yukio Suzuki, Chung-Min Li, Shuji Tanaka

    Journal of Microelectromechanical Systems　1-9　2024

    Publisher: Institute of Electrical and Electronics Engineers (IEEE)

    DOI： 10.1109/jmems.2024.3436865 　

    ISSN： 1057-7157

    eISSN： 1941-0158

  3. Characterization of plasma-activated, thermally-annealed Si-SiO2 direct bond strength for vapor HF etching Peer-reviewed

    Tianjiao Gong, Yukio Suzuki, Karla Hiller, Shuji Tanaka

    Sensors and Actuators A: Physical　363　114691-114691　2023/12

    Publisher: Elsevier BV

    DOI： 10.1016/j.sna.2023.114691 　

    ISSN： 0924-4247

  4. Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal Peer-reviewed

    Tianjiao Gong, Yukio Suzuki, Muhammad Jehanzeb Khan, Karla Hiller, Shuji Tanaka

    Journal of Microelectromechanical Systems　2023

    DOI： 10.1109/JMEMS.2023.3281854 　

    ISSN： 1057-7157

    eISSN： 1941-0158

  5. DUV-LED packaging using high density TSV in silicon cavity and laser-glass-frit-bonded UV transmitting glass cap Peer-reviewed

    Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Tianjiao Gong, Shuji Tanaka

    Sensors and Actuators A: Physical　Volume 344　113700　2022/09

    DOI： 10.1016/j.sna.2022.113700 　

  6. Membrane-supported lSI with integrated heater and temperature monitor for on-site annealing-recovery from 20 kGy gamma ray irradiation damage Peer-reviewed

    Tianjiao Gong, Yukio Suzuki, Akinori Takeyama, Takeshi Ohshima, Shuji Tanaka

    Sensors and Actuators A: Physical　343　2022/08/16

    DOI： 10.1016/j.sna.2022.113677 　

    ISSN： 0924-4247

  7. PZT MEMS Speaker Integrated with Silicon-Parylene Composite Corrugated Diaphragm

    Yuki Hirano, Yukio Suzuki, Norihito Fujita, Chung Min Li, Hirofumi Chiba, Shuji Tanaka

    Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)　2022-January　255-258　2022

    DOI： 10.1109/MEMS51670.2022.9699539 　

    ISSN： 1084-6999

  8. Development of silicon wafer packaging technology for deep UV LED Peer-reviewed

    Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Mitsuyasu Kumagai, Takaaki Koyama, Shuji Tanaka

    Electrical Engineering in Japan　214　(1)　62-68　2021/03

    Publisher: Wiley

    DOI： 10.1002/eej.23298 　

    ISSN： 0424-7760

    eISSN： 1520-6416

  9. Silicon migration seal wafer‐level vacuum encapsulation Peer-reviewed

    Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Yoshiaki Kanamori, Shuji Tanaka

    Electronics and Communications in Japan　104　(1)　120-125　2020/11/16

    Publisher: Wiley

    DOI： 10.1002/ecj.12283 　

    ISSN： 1942-9533

    eISSN： 1942-9541

  10. 3-axis tactile sensor using quad-seesaw-electrodestructure on platform LSI with through silicon vias Peer-reviewed

    Y. Hata, Y. Suzuki, M. Muroyam, T. Nakayama, Y. Nonomura, R. Chand, H. Hirano, Y. Omura, M. Fujiyoshi, S. Tanaka

    Sensors and Actuators A　273　30-41　2018/03

    DOI： 10.1016/j.sna.2018.02.013 　

    ISSN： 0924-4247

  11. 300 mu m DEEP THROUGH SILICON VIA IN LASER-ABLATED CMOS MULTI-PROJECT WAFER FOR COST-EFFECTIVE DEVELOPMENT OF INTEGRATED MEMS

    Yukio Suzuki, Hideyuki Fukushi, Masanori Muroyama, Yoshiyuki Hata, Takahiro Nakayama, Rakesh Chand, Hideki Hirano, Yutaka Nonomura, Hirofumi Funabashi, Shuji Tanaka

    30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017)　744-748　2017

    DOI： 10.1109/MEMSYS.2017.7863515 　

    ISSN： 1084-6999

  12. Free-standing subwavelength grid infrared cut filter of 90 mm diameter for LPP EUV light source Peer-reviewed

    Yukio Suzuki, Kentaro Totsu, Masaaki Moriyama, Masayoshi Esashi, Shuji Tanaka

    SENSORS AND ACTUATORS A-PHYSICAL　231　59-64　2015/07

    DOI： 10.1016/j.sna.2014.07.006 　

    ISSN： 0924-4247

  13. FREE-STANDING SUBWAVELENGTH GRID INFRARED REJECTION FILTER OF 90 MM DIAMETER FOR LPP EUV LIGHT SOURCE

    Yukio Suzuki, Kentaro Totsu, Masaaki Moriyama, Masayoshi Esashi, Shuji Tanaka

    2014 IEEE 27TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)　482-485　2014

    DOI： 10.1109/MEMSYS.2014.6765682 　

  14. A HIGH ASPECT RATIO MEMS PROCESS WITH SURFACE MICROMACHINED

    A. Geisberger, S. Schroeder, J. Dixon, Y. Suzuki, J. Makwana, S. Qureshi

    Proc. Transducer 2013, Barcelona, SPAIN　18-21　2013/06/21

    DOI： 10.1109/Transducers.2013.6626690 　

  15. Low-stress epitaxial polysilicon process for micromirror devices Peer-reviewed

    Yukio Suzuki, Kentaro Totsu, Hiraku Watanabe, Masaaki Moriyama, Masayoshi Esashi, Shuji Tanaka

    IEEJ Transactions on Sensors and Micromachines　133　(6)　7-228　2013

    DOI： 10.1541/ieejsmas.133.223 　

    ISSN： 1341-8939 1347-5525

  16. Investigation on liquid medium integration for piezoelectric MEMS tunable liquid lenses Peer-reviewed

    Zhengnan Tang, Andrea Vergara, Taiyu Okatani, Yukio Suzuki, Shuji Tanaka

    Sensors and Actuators A: Physical　377　115732-115732　2024/10

    Publisher: Elsevier BV

    DOI： 10.1016/j.sna.2024.115732 　

    ISSN： 0924-4247

  17. Mechanical Quality Factor Evaluation of Polymer Materials using PZT/Polymer Integrated Piezoelectric Actuator

    Xuchen Wang, Chung-Min Li, Yukio Suzuki, Shuji Tanaka

    2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)　1-4　2024/05/02

    Publisher: IEEE

    DOI： 10.1109/nems60219.2024.10639927 　

  18. SINGLE PASCAL VACUUM SEALING OF MEMS RESONATOR BY SILICON MIGRATION WAFER-LEVEL PACKAGING WITIOUT GETTER

    Yukio Suzuki, Muhammad Jehanzeb Khan, Munehiro Honda, Hidetoshi Miyashita, Tianjiao Gong, Takashiro Tsukamoto, Shuji Tanaka

    Proceeding of Transducers 2023, Kyoto　1539-1542　2023/06

  19. ULTRATHICK LOW-STRESS POLY-SILICON FILM FOR MEMS PREPARED BY LPCVD PROCESS

    Gen Shikida, Hideharu Itatani, Toshio Kudo, Shuntaro Machida, Yukio Suzuki, Shuji Tanaka, Manabu Izumi

    Proceeding of Transducers 2023, Kyoto　1504-1507　2023/06

  20. PZT MEMS TUNABLE LIQUID LENS WITH INTEGRATED PIEZORESISTIVE POSITION SENSOR

    Zhengnan Tang, Leo Soda, Taiyu Okatani, Andrea Vergara, Yukio Suzuki, Shuji Tanaka

    Proceeding of Transducers 2023, Kyoto　835-838　2023/06

  21. Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion

    Muhammad Jehanzeb Khan, Yukio Suzuki, Tianjiao Gong, Takashiro Tsukamoto, Shuji Tanaka

    Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)　2023-January　661-664　2023

    DOI： 10.1109/MEMS49605.2023.10052449 　

    ISSN： 1084-6999

  22. Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal

    Tianjiao Gong, Yukio Suzuki, Muhammad J. Khan, Karla Hiller, Shuji Tanaka

    Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)　2023-January　602-605　2023

    DOI： 10.1109/MEMS49605.2023.10052275 　

    ISSN： 1084-6999

  23. Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing for Wafer-Level Packaging for Mems

    Hirotaka Suzuki, Yukio Suzuki, Yoshiaki Kanamori, Shuji Tanaka

    Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)　2022-January　565-568　2022

    DOI： 10.1109/MEMS51670.2022.9699602 　

    ISSN： 1084-6999

  24. High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

    Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Tianjiao Gong, Shuji Tanaka

    2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)　2021/06/20

    Publisher: IEEE

    DOI： 10.1109/transducers50396.2021.9495422 　

  25. Membrane-Heater-Integrated LSI for On-Site Annealing-Recovery from 20 KGY Gamma Ray Irradiation Damage

    Tianjiao Gong, Yukio Suzuki, Akinori Takeyama, Takeshi Ohshima, Shuji Tanaka

    2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)　2021/01/25

    Publisher: IEEE

    DOI： 10.1109/mems51782.2021.9375332 　

  26. Silicon Migration Seal for Wafer-Level Vacuum Encapsulation

    Yukio Suzuki, Victor Dupuit, Toshiya Kojima, Hirotaka Suzuki, Shuji Tanaka

    2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)　2020/01

    Publisher: IEEE

    DOI： 10.1109/mems46641.2020.9056414 　

  27. Ultracompact Silicon Wafer Packaging of Deep UV LED with Excellent Cooling Performance and Light Utilization Efficiency

    Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Mitsuyasu Kumagai, Takaaki Koyama, Shuji Tanaka

    2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)　2020/01

    Publisher: IEEE

    DOI： 10.1109/mems46641.2020.9056370 　

  28. Deep through silicon via in laser-ablated CMOS multi-project wafer for surface-mountable integrated MEMS

    Yukio Suzuki, Hideki Hirano, Masanori Muroyama, Shuji Tanaka

    Smart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019　177-180　2019

    Publisher: VDE Verlag GmbH

  29. Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough Peer-reviewed

    Masaaki Moriyama, Yukio Suzuki, Kentaro Totsu, Hideki Hirano, Shuji Tanaka

    ELECTRICAL ENGINEERING IN JAPAN　206　(2)　44-53　2019/01

    DOI： 10.1002/eej.23193 　

    ISSN： 0424-7760

    eISSN： 1520-6416

  30. Metal-Bonding-Based Hermetic Wafer-Level MEMS Packaging Technology Using In-Plane Feedthrough:—Hermeticity and High Frequency Characteristics of Thick Gold Film Feedthrough— Peer-reviewed

    Moriyama Masaaki, Suzuki Yukio, Totsu Kentaro, Hirano Hideki, Tanaka Shuji

    IEEJ Transactions on Sensors and Micromachines　138　(10)　485-494　2018/10

    Publisher: 一般社団法人 電気学会

    ISSN： 1341-8939

    More details Close

    Au-Au-bonding-based wafer-level vacuum packaging technology using in-plane feedthrough of thick Au signal lines was developed for RF MEMS. Compared with conventional technology based on glass frit bonding, the developed technology is advantageous in terms of smaller width of sealing frames, lower process temperature and smaller amount of degas. To guarantee the hermetic sealing, the adhesion between the thick Au lines and a SiO<i><sub>x</sub></i> dielectric frame is improved by an Al<sub>2</sub>O<sub>3</sub> interlayer by ALD (Atomic Layer Deposition). The steps of the dielectric frame above the thick Au lines are absorbed by an electroplated Au seal ring planarized by fly cutting. The thermocompression bonding of the Au seal rings of 20∼100 µm width was done at 300ºC. A cavity pressure of about 500 Pa or lower was measured by "zero balance method" using Si diaphragms. Vacuum sealing was maintained for more than 19 months, and the leak rate is less than 8×10<sup>-16</sup> Pa m<sup>3</sup>/s. The isolation of open signal lines was measured up to 10 GHz for different designs of the sealing ring and SiO<i><sub>x</sub></i> dielectric frame. The influence of the in-plane feed through to the isolation is as low as 2∼3 dB, if the width of the sealing ring is 20 µm and the thickness of SiO<i><sub>x</sub></i> dielectric frame is larger than 10 µm. The developed wafer-level packaging technology is ready for applications to an RF MEMS switch.</p>

  31. Isolation Characteristics of In-plane Feedthrough across Au/SiOx Seal Ring for Wafer-level RF MEMS Packaging

    M. Moriyama, Y. Suzuki, K. Totsu, H. Hirano, S, Tanaka

    Proc. APCOT 2018　24-27　2018/06

  32. Accelerating MEMS Development by Open Collaboration at Hands-On-Access Fab, Tohoku University Peer-reviewed

    Totsu Kentaro, Moriyama Masaaki, Suzuki Yukio, Esashi Masayoshi

    SENSORS AND MATERIALS　30　(4)　701-711　2018

    DOI： 10.18494/SAM.2018.1804 　

    ISSN： 0914-4935

  33. Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure

    Yoshiyuki Hata, Yukio Suzuki, Masanori Muroyama, Takahiro Nakayama, Yutaka Nonomura, Rakesh Chand, Hideki Hirano, Yoshiteru Omura, Motohiro Fujiyoshi, Shuji Tanaka

    TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems　500-503　2017/07/26

    Publisher: Institute of Electrical and Electronics Engineers Inc.

    DOI： 10.1109/TRANSDUCERS.2017.7994095 　

  34. A wafer-level MEMS-LSI integration platform using fly-cut bonding metals customizable for diverse applications

    Hideki Hirano, Yukio Suzuki, Chand Rakesh, Shuji Tanaka

    Smart Systems Integration 2017　151-158　2017/03/08

  35. Tohoku MEMS Integration and Packaging Platform in Tohoku University

    Yukio Suzuki, Masaaki Moriyama, Kentaro Totsu, Shuji Tanaka

    2nd French-Japanese Workshop on Micro & Nanotechnology　2016/11

  36. ナノテクノロジープラットフォームを活用した研究・技術開発の新展開~ベンチャー,中小から大企業まで~東北大学マイクロシステム融合研究開発センター

    戸津健太郎, 森山雅昭, 鈴木裕輝夫

    工業材料　63　(4)　52-54　2015/04

    Publisher:

    ISSN： 0452-2834

  37. 東北大学試作コインランドリ～MEMS の試作開発から製品化に至る一貫した支援拠点～

    2014/05

  38. Hands-on access Fab in Tohoku University Invited

    Yukio Suzuki, Masaaki Moriyama, Kentaro Totsu, Masayoshi Esashi

    International Workshop on Innovation and Commercialization of Micro & Nanotechnology　2014

  39. 試作コインランドリにおけるプロセス開発と試作支援 (特集 マイクロシステム融合研究開発)

    戸津 健太郎, 森山 雅昭, 鈴木 裕輝夫

    金属　83　(9)　757-764　2013/09

    Publisher: アグネ技術センター

    ISSN： 0368-6337

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Misc. 5

  1. MEMS wafer-level packaging Invited

    Kinzoku　第95巻　(4)　41-47　2025/04

  2. MEMS－ウェハレベルパッケージ，－LSI集積化 Invited

    金属　87　(12)　1027-1032　2017/05

  3. MEMS技術の微細パターンニングへの応用 Invited

    鈴木裕輝夫

    半導体微細パターニング　363-370　2017

  4. 試作コインランドリにおけるプロセス開発と試作支援

    戸津 健太郎, 森山 雅昭, 鈴木 裕輝夫, 小野 崇人, 吉田 慎哉, 江刺 正喜

    金属　83　(9)　13-20　2013/09/01

    Publisher: アグネ技術センター

    ISSN： 0368-6337

  5. Hands-on-access fabrication facility for MEMS Development and production Peer-reviewed

    Kentaro Totsu, Masaaki Moriyama, Yukio Suzuki, Takahito Ono, Shinya Yoshida, Masayoshi Esashi

    Proceedings of the International Display Workshops　2　1405-1408　2013

    ISSN： 1883-2490

Presentations 38

  1. マイクロアクチュエータ、圧電薄膜プロセスと応用、集積化MEMS技術 Invited

    鈴木裕輝夫

    「第21回MEMS集中講義」　2024/08

  2. Silicon Migration Seal (SMS) Wafer-Level Packaging Technologies for Resonator MEMS Invited

    Yukio Suzuki

    The 11th Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT2024))　2024/06/24

  3. シリコンマイグレーションシール（SMS)ウェハレベル高真空封止技術 Invited

    鈴木裕輝夫

    第 71 回応用物理学会春季学術講演会シンポジウム 「IoT 市場拡大に資する半導体産業の進展とコア技術とは？」　2024/03/24

  4. Microactuator Invited

    Yukio Suzuki

    2023/08/09

  5. 集積化MEMS、マイクロアクチュエータ、圧電薄膜プロセスと応用 Invited

    「第20回MEMS集中講義」　2022/08/08

  6. Advances in Wafer-Level Integration of MEMS, Vacuum Sealing, and Optoelectronic Packaging Invited

    YUKIO SUZUKI

    the 28th ​​International Conference on Smart Sensors (ICSS 2025)　2025/06/23

  7. 感光性ポリマー/PZT アクチュエータによるダンピング特性と 変位の向上

    Xuchen Wang, Li Chung-min, Yukio Suzuki, ShujiTanaka

    第14回マイクロ・ナノ工学シンポジウム, 7P2-PN-46　2023/11/07

  8. MEMS Varifocal Liquid Lens with PZT Thin Film Actuators and Piezoresistive Sensors

    2023/11

  9. Evaluating the Mechanical Quality Factor (𝑄𝑚) of Polymer Materials by Using PZT/polymer Integrated Piezoelectric Actuator

    Xuchen Wang, Li Chung-min, Yukio Suzuki, Shuji Tanaka

    2023/10/31

  10. Development of single wafer hydrogen lamp annealing furnace for silicon migration sealing: base pressure and residual gas

    2023/10/31

  11. PDMS patterning using Novolac positive resist as etch mask

    2023/10/31

  12. Development of piezoelectric MEMS speaker integrating PZT thin film actuator and Si-Parylene diaphragm

    2023/10/31

  13. Study on the effects of bonding conditions and thermal oxidation treatment on direct bonding quality

    2022/11/14

  14. Impact of Hydrogen (H2) and Nitrogen (N2) annealing on highly doped silicon structure

    2022/11/14

  15. SMSウェハレベル真空封止技術のためのサブミクロンリリースホールを介したベーパーHF犠牲層エッチングの研究

    ゴン ティアンジャオ, 鈴木 裕輝夫, 田中 秀治

    第39回「センサ・マイクロマシンと応用システム」シンポジウム　2022/11

  16. Au-Au bonding at low temperature for wafer level hermetic sealing

    2021/11

  17. The Study of Vapor HF Scarified SiO2 Layer Etching through Sub-micro Holes of 0.4 um Diameter

    2021/11

  18. Process Optimization to Improve Vacuuming Level in Silicon Migration Sealing (SMS)

    2021/11

  19. Si-パリレン振動板と高耐圧PZT薄膜アクチュエータ を集積化した圧電MEMSスピーカー

    平野 悠紀, 鈴木 裕輝夫, 田中 秀治

    第12回 マイクロ・ナノ工学シンポジウム, MN3-09P2-1　2021/11

  20. Crystal Orientation Dependence of Static Torsional Fracture Strength Variation of Microscale Single Crystal Silicon Specimens

    2021/11

  21. Optimization Development of Release Hole Geometry for Silicon Migration Seal (SMS) Lower Temperature

    2021/11

  22. Encapsulation Process Technology for Wafer Wafer-Level Vacuum Packaging Using Silicon Migration Effect and its wiring structure

    2020/10/26

  23. Membrane-Heater-Integrated LSI for On-site Annealing-Recovery from Gamma Ray Irradiation Damage

    Tianjiao Gong, Yukio Suzuki, Akinori Takeyama, Takeshi Ohshima, Shuji Tanaka

    2020/10

  24. Development of Silicon Wafer Packaging Technology for Deep UV LED

    2020/10

  25. Implementation of an Event-Driven Integrated Tactile Sensor on Five-Fingered Robot Hand for Grasping Motion Evaluation

    2020/10

  26. Membrane-Heater-Integrated LSI for On-site Recovery from Gamma Ray Irradiation Damage

    Tianjiao Gong, Yukio Suzuki, Shuji Tanaka

    2019/11/19

  27. Development of Silicon Wafer Packaging Technology for Deep UV LED

    2019/11/19

  28. Silicon Migration Seal Wafer Level Vacuum Encapsulation

    2019/11/19

  29. Screening of Process Factors for Silicon Torsional Bar by Static Pure Torsion Destructive Test

    2019/10

  30. Fabrication of Deep TSV in Laser-Erased 0.13 μm CMOS-LSI Multi-project Wafer for Surface Mountable Integrated Tactile Sensor

    2018/10/31

  31. Fabrication of Deep Annular TSV in Laser-Erased LSI Multi-project Wafer for Surface Mountable Integrated MEMS Invited

    Yukio Suzuki

    2017/03/07

  32. Tohoku MEMS Integration and Packaging Platform in Tohoku University Invited

    Yukio Suzuki

    2nd French-Japanese Workshop on Micro & Nanotechnology (2016)　2016/12

  33. 表面実装型集積化MEMSのためのレーザー消去CMOS-LSIマルチプロジェクトウェハへの深いTSVの作製

    鈴木裕輝夫, 福士秀幸, 室山真徳, 畑良幸, 中山貴裕, 平野栄樹, 野々村裕, 田中秀治

    第33回「センサ・マイクロマシンと応用システム」シンポジウム　2016/10/24

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    優秀技術論文賞

  34. 厚いAu膜の面内高周波フィードスルーを用いたAu-Au接合気密

    森山 雅昭, 鈴木 裕輝夫, 熊野 勝文, 戸津 健太郎, 平野 栄樹, 田中 秀治

    第８回集積化MEMSシンポジウム　2016/10/24

  35. Au-Au Bonding based Hermetic MEMS Packaging using In-Plane RF Feedthrough of Thick Au Film

    森山 雅昭, 鈴木 裕輝夫, 熊野 勝文, 戸津 健太郎, 平野 栄樹, 田中 秀治

    「センサ・マイクロマシンと応用システム」シンポジウム論文集 電気学会センサ・マイクロマシン部門 [編]　2016/10/02

  36. EUVリソグラフィー光源のためのグリット型波長選択フィルターの作製と評価結果

    戸津 健太郎, 森山 雅昭, 江刺 正喜, 田中 秀治

    第31回「センサ・マイクロマシンと応用システム」シンポジウム　2014/10/20

  37. Hands-on-access fabrication facility for MEMS Development and production

    Kentaro Totsu, Masaaki Moriyama, Yukio Suzuki, Takahito Ono, Shinya Yoshida, Masayoshi Esashi

    Proceedings of the International Display Workshops　2013

  38. Low-Stress Epitaxial Polysilicon Process for Micromirror Devices

    Yukio Suzuki, Kentaro Totsu, Hiraku Watanabe, Masaaki Moriyama, Masayoshi Esashi, Shuji Takana

    第29回「センサ・マイクロマシンと応用システム」シンポジウム　2012/10/22

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