Details of the Researcher

PHOTO

Junichi Koike
Section
New Industry Creation Hatchery Center
Job title
Specially Appointed Professor(Research)
Degree
  • Ph.D.(アメリカ合衆国ノースウエスタン大学)

Education 3

  • Northwestern Graduate School, Division of Engineering Materials Science and Engineering

    - 1989/05/30

  • Tokyo Institute of Technology 理工学研究科 金属工学専攻

    - 1985/08/15

  • Tokyo Institute of Technology Faculty of Engineering 金属工学科

    - 1983/03/31

Committee Memberships 4

  • 日本金属学会 分科会 幹事

    2000/03 - Present

  • 日本金属学会 分科会 幹事

    2000/03 - Present

  • 日本金属学会 評議員

    2006/03 - 2010/03

  • 日本金属学会 評議員

    2006/03 - 2010/03

Professional Memberships 4

  • 日本鉄鋼協会

  • アメリカ材料学会(Materials Research Society)

  • 応用物理学会

  • 日本金属学会

Research Interests 4

  • magnesium alloys

  • thin film electrode

  • FPC

  • interconnect

Research Areas 2

  • Nanotechnology/Materials / Structural and functional materials / Microstructure control of thin films

  • Nanotechnology/Materials / Metallic materials / Mechanical properties of thin films

Awards 18

  1. 谷川・ハリス賞

    2021/03 日本金属学会

  2. 第15回本多フロンティア賞

    2018/05 公益財団法人本多記念会

  3. 第24回 日本金属学会増本量賞

    2018/03 日本金属学会

  4. 科学技術賞

    2013/04 平成25年度科学技術分野 文部科学大臣表彰

  5. Outstanding Symposium Paper

    2008/07/17 Materials Research Society MRSシンポジウムにおける優秀論文

  6. IDW '07 Best paper award

    2007/12/07 International Display Workshop 2007

  7. Best paper award for young scientist

    2007/12 日本金属学会

  8. 応用物理学会講演奨励賞

    2007/12 応用物理学会

  9. ASMA Best Poster Award

    2007/10/03 2nd Asian Syposium on Magnesium Alloys

  10. 第4回STARC共同研究賞

    2006/09/07 半導体理工学研究センター

  11. IITC2005 Lerme Best Paper Award

    2006/06/05 International Interconnect Technology Conference

  12. 日本金属学会論文賞

    2004/09/28 日本金属学会

  13. 応用物理学会講演論文奨励賞

    2003/09 応用物理学会

  14. Highly Contributed Paper Award

    2003/01 International Conference on Platform Science and Technology of Advanced Magnesium Alloys 2003

  15. PSTAMポスター賞

    2003/01 International Conference on Platform Science and Technology of Advanced Magnesium Alloys 2003

  16. 日本金属学会功績賞

    2001/03/28 日本金属学会

  17. 原田研究奨励賞

    1996/06 金属研究助成会

  18. トーキン科学技術振興財団 研究奨励賞

    1994/10 トーキン科学技術振興財団

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Papers 285

  1. Low-Temperature Oxidation-Sintering Behaviors of Cu Fine Particles

    Nobuaki Takeuchi, Daisuke Ando, Koike Junichi, Yuji Sutou

    Materials Transactions 64 (4) 931-938 2023

    DOI: 10.2320/matertrans.MT-M2022219  

    ISSN: 1345-9678

  2. Low Temperature Oxidation-Sintering Behaviors of Cu Fine Particles

    Takeuchi Nobuaki, Ando Daisuke, Koike Junichi, Sutou Yuji

    Journal of the Japan Institute of Metals and Materials 86 (11) 224-231 2022/11/01

    Publisher: The Japan Institute of Metals and Materials

    DOI: 10.2320/jinstmet.j2022020  

    ISSN: 0021-4876

    eISSN: 1880-6880 2433-7501

    More details Close

    Cu fine-particle paste is a promising material to form a low-cost interconnect for flexible electronics devices. It has been reported that Cu particles can be sintered at low temperature (well below the half of the melting point) through two-step heat treatment processes of oxidation and reduction. However, the mechanism of the low temperature sintering is not clear yet. In this study, we investigated the oxidation sintering process of Cu fine particles by thermal gravimetric analysis (TGA) in the temperature range of 200-300℃, X-ray diffraction (XRD), and microstructural observation. It was found from TGA that the oxidation process was initially rate-controlled by surface reaction and then by Cu diffusion at grain boundaries of Cu2O. Transmission electron microscopy observation revealed the formation of a core (Cu)-shell (Cu2O) structure during the oxidation process. The adjacent Cu2O shells were bonded to each other resulting in a cross-linked structure. The subsequent reduction process led to the formation of a porous structure by oxygen removal, but the cross-linked structure was maintained, which would make the low-temperature sintered Cu body as robust as solidified solder and sintered Ag paste.

  3. Potential of low-resistivity Cu<inf>2</inf>Mg for highly scaled interconnects and its challenges

    Linghan Chen, Qian Chen, Daisuke Ando, Yuji Sutou, Momoji Kubo, Junichi Koike

    Applied Surface Science 537 2021/01/30

    DOI: 10.1016/j.apsusc.2020.148035  

    ISSN: 0169-4332

  4. Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials

    Linghan Chen, Sushant Kumar, Masataka Yahagi, Daisuke Ando, Yuji Sutou, Daniel Gall, Ravishankar Sundararaman, Junichi Koike

    Journal of Applied Physics 129 (3) 2021/01/21

    DOI: 10.1063/5.0026837  

    ISSN: 0021-8979

    eISSN: 1089-7550

  5. Possibility of Cu2Mg for Liner-Barrier Free Interconnects

    Linghan Chen, Daisuke Ando, Yuji Sutou, Masataka Yahagi, Junichi Koike

    2020 IEEE International Interconnect Technology Conference (IITC) 2020/10/05

    Publisher: IEEE

    DOI: 10.1109/iitc47697.2020.9515588  

  6. Liner- and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status Peer-reviewed

    Chen, L, Ando, D, Sutou, Y, Yokogawa, S, Koike, J

    Applied Surface Science 497 143810 2019/12

  7. Zn-Fe めっき層の組成および組織制御による改質に向けたスパッタリング成膜による検証 Peer-reviewed

    Uchiyama, A, Kawasaki, K, Sutou, Y, Ando, D, Koike, J

    鉄と鋼 105 (7) 724-732 2019/07

  8. Ordering of the bcc Phase in a Mg-Sc Binary Alloy by Aging Treatment Peer-reviewed

    Ogawa, Y, Sutou, Y, Ando, D, Koike, J, Somekawa, H

    Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 50 (7) 3044-3047 2019/07

    DOI: 10.1007/s11661-019-05260-7  

    ISSN: 1073-5623

    eISSN: 1543-1940

  9. Room temperature superelasticity in a lightweight shape memory Mg alloy Peer-reviewed

    Yamagishi, K, Ogawa, Y, Ando, D, Sutou, Y, Koike, J

    Scripta Materialia 168 114-118 2019/07

  10. CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices Peer-reviewed

    Chen, L, Ando, D, Sutou, Y, Koike, J

    Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics 37 (3) 031215 2019/05

  11. Improvement of powdering resistance of Zn-Fe galvannealed coating by controlling of its composition and microstructure: Verification with sputtering method

    Aimi Uchiyama, Kohei Kawasaki, Yuji Sutou, Daisuke Ando, Junichi Koike

    Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan 105 (7) 724-732 2019

    DOI: 10.2355/tetsutohagane.TETSU-2018-164  

    ISSN: 0021-1575

  12. Electrical transport mechanism of the amorphous phase in Cr2Ge2Te6 phase change material Peer-reviewed

    Hatayama, S, Sutou, Y, Ando, D, Koike, J, Kobayashi, K

    Journal of Physics D: Applied Physics 52 (10) 2019

    DOI: 10.1088/1361-6463/aafa94  

    ISSN: 0022-3727

    eISSN: 1361-6463

  13. Aging precipitation kinetics of Mg-Sc alloy with bcc+hcp two-phase Peer-reviewed

    Yukiko Ogawa, Yuji Sutou, Daisuke Ando, Junichi Koike

    Journal of Alloys and Compounds 747 854-860 2018/05/30

    Publisher: Elsevier Ltd

    DOI: 10.1016/j.jallcom.2018.03.064  

    ISSN: 0925-8388

  14. Contact resistance change memory using N-doped Cr2Ge2Te6 phase-change material showing non-bulk resistance change Peer-reviewed

    Y. Shuang, Y. Sutou, S. Hatayama, S. Shindo, Y. H. Song, D. Ando, J. Koike

    Applied Physics Letters 112 (18) 2018/04/30

    Publisher: American Institute of Physics Inc.

    DOI: 10.1063/1.5029327  

    ISSN: 0003-6951

  15. Co and CoTix for contact plug and barrier layer in integrated circuits Peer-reviewed

    Maryamsadat Hosseini, Daisuke Ando, Yuji Sutou, Junichi Koike

    Microelectronic Engineering 189 78-84 2018/04/05

    Publisher: Elsevier B.V.

    DOI: 10.1016/j.mee.2017.12.017  

    ISSN: 0167-9317

  16. Martensitic Transformation in a beta-Type Mg-Sc Alloy Peer-reviewed

    Ogawa Yukiko, Ando Daisuke, Sutou Yuji, Somekawa Hidetoshi, Koike Junichi

    SHAPE MEMORY AND SUPERELASTICITY 4 (1) 167-173 2018/03

    DOI: 10.1007/s40830-017-0143-y  

    ISSN: 2199-384X

    eISSN: 2199-3858

  17. Inverse Resistance Change Cr<inf>2</inf>Ge<inf>2</inf>Te<inf>6</inf>-Based PCRAM Enabling Ultralow-Energy Amorphization Peer-reviewed

    Shogo Hatayama, Yuji Sutou, Satoshi Shindo, Yuta Saito, Yun Heub Song, Daisuke Ando, Junichi Koike

    ACS Applied Materials and Interfaces 10 (3) 2725-2734 2018/01/24

    DOI: 10.1021/acsami.7b16755  

    ISSN: 1944-8244

    eISSN: 1944-8252

  18. Material innovation for MOL, BEOL, and 3D integration Peer-reviewed

    J. Koike, M. Hosseini, H. T. Hai, D. Ando, Y. Sutou

    Technical Digest - International Electron Devices Meeting, IEDM 32.3.1-32.3.4 2018/01/23

    Publisher: Institute of Electrical and Electronics Engineers Inc.

    DOI: 10.1109/IEDM.2017.8268485  

    ISSN: 0163-1918

  19. Optical and electrical properties of i-MnTe thin films deposited using RF magnetron sputtering Peer-reviewed

    Mori, S, Sutou, Y, Ando, D, Koike, J

    Materials Transactions 59 (9) 1506-1512 2018

    DOI: 10.2320/matertrans.M2018086  

    ISSN: 1345-9678

  20. New Contact Metallization Scheme for FinFET and beyond Peer-reviewed

    Koike, J, Hosseini, M, Ando, D, Sutou, Y

    2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings 169-171 2018

    DOI: 10.1109/EDTM.2018.8421448  

  21. Crystallization mechanism and kinetics of Cr2Ge2Te6 phase change material Peer-reviewed

    Hatayama, S, Sutou, Y, Ando, D, Koike, J

    MRS Communications 8 (3) 1167-1172 2018

    DOI: 10.1557/mrc.2018.176  

    ISSN: 2159-6859

    eISSN: 2159-6867

  22. NiAl as a potential material for liner- and barrier-free interconnect in ultrasmall technology node Peer-reviewed

    Chen, L, Ando, D, Sutou, Y, Gall, D, Koike, J

    Applied Physics Letters 113 (18) 2018

    DOI: 10.1063/1.5049620  

    ISSN: 0003-6951

  23. Amorphous CoTix as a liner/diffusion barrier material for advanced copper metallization Peer-reviewed

    Maryamsadat Hosseini, Junichi Koike

    JOURNAL OF ALLOYS AND COMPOUNDS 721 134-142 2017/10

    DOI: 10.1016/jjallcom.2017.05335  

    ISSN: 0925-8388

    eISSN: 1873-4669

  24. Molybdenum oxide-base phase change resistive switching material Peer-reviewed

    Yukiko Ogawa, Satoshi Shindo, Yuji Sutou, Junichi Koike

    APPLIED PHYSICS LETTERS 111 (16) 2017/10

    DOI: 10.1063/1.5000410  

    ISSN: 0003-6951

    eISSN: 1077-3118

  25. Feasibility study of Cu paste printing technique to fill deep via holes for low cost 3D TSV applications Peer-reviewed

    Hoang Tri Hai, Kang-Wook Lee, Daisuke Ando, Yuji Sutou, Mitsumasa Koyanagi, Junichi Koike

    IITC 2017 - 2017 IEEE International Interconnect Technology Conference 2017/07/05

    Publisher: Institute of Electrical and Electronics Engineers Inc.

    DOI: 10.1109/IITC-AMC.2017.7968976  

  26. Metallurgical and electrical characterization of ultrathin CoTix liner/barrier for Cu interconnects Peer-reviewed

    Maryamsadat Hosseini, Junichi Koike

    IITC 2017 - 2017 IEEE International Interconnect Technology Conference 2017/07/05

    Publisher: Institute of Electrical and Electronics Engineers Inc.

    DOI: 10.1109/IITC-AMC.2017.7968959  

  27. Enhanced fatigue properties of cast AZ80 Mg alloy processed by cyclic torsion and low-temperature annealing Peer-reviewed

    Qinghuan Huo, Zhenyu Xiao, Xuyue Yang, Daisuke Ando, Yuji Sutou, Junichi Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 696 52-59 2017/06

    DOI: 10.1016/j.msea.2017.04.061  

    ISSN: 0921-5093

    eISSN: 1873-4936

  28. Texture randomization of hexagonal close packed phase through hexagonal close packed/body centered cubic phase transformation in Mg-Sc alloy Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    SCRIPTA MATERIALIA 128 27-31 2017/02

    DOI: 10.1016/j.scriptamat.2016.09.024  

    ISSN: 1359-6462

  29. Effect of Initial Microstructure on Stress-Strain Behavior in Mg-Sc-Zn Based Alloy with High Sc Content Peer-reviewed

    Yuta Takeuchi, Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 81 (5) 276-281 2017

    DOI: 10.2320/jinstmet.JBW201612  

    ISSN: 0021-4876

    eISSN: 1880-6880

  30. Effect of Cu Content on Hardness and Wear Properties in (Cr, Mo, Cu) N Film Peer-reviewed

    Yuta Suzuki, Yuji Sutou, Daisuke Ando, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 81 (5) 270-275 2017

    DOI: 10.2320/jinstmet.JBW201613  

    ISSN: 0021-4876

    eISSN: 1880-6880

  31. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints Peer-reviewed

    Kyoung-Ho Kim, Junichi Koike, Jeong-Won Yoon, Sehoon Yoo

    JOURNAL OF ELECTRONIC MATERIALS 45 (12) 6184-6191 2016/12

    DOI: 10.1007/s11664-016-4908-4  

    ISSN: 0361-5235

    eISSN: 1543-186X

  32. Stress-strain hysteresis and strain hardening during cyclic tensile test of Mg-0.6at%Y alloy Peer-reviewed

    Qinghuan Huo, Daisuke Ando, Yuji Sutou, Junichi Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 678 235-242 2016/12

    DOI: 10.1016/j.msea.2016.10.008  

    ISSN: 0921-5093

    eISSN: 1873-4936

  33. Phase change behaviors of Cr-Ge-Te compound thin film Peer-reviewed

    Shogo Hatayama, Satoshi Shindo, Yuji Sutou, Junichi Koike

    Proceedings of the 28th Symposium on Phase Change Oriented Science 2016・(71-72) 1 71-72 2016/11

  34. Switching behavior of GeCu2Te3 phase change memory cell Peer-reviewed

    Satoshi Shindo, Yuji Sutou, Junichi Koike, Yuta Saito, Jun-Seop An, Yun-Heub Song

    Proceedings of the 28th Symposium on Phase Change Oriented Science 2016 1 69-70 2016/11

  35. A study on phase transition behaviors of GeCu2Te3 phase change material for PCRAM application Peer-reviewed

    Y. Sutou, S. Shindo, Y. Saito, J. Koike, YH. Song

    Proceedings of the 28th Symposium on Phase Change Oriented Science 2016 1 52-55 2016/11

  36. The doping effect of V, Cr, and Ni on the crystallization behavior of GeTe amorphous film

    S. Hatayama, M. SHimoda, S. Shindo, Y. Sutou, J. Koike

    European Symposium on Phase Change and Ovonic Science proceedings 2016 1 199-200 2016/09

  37. Resisatnce contrast of GeCu2Te3 phase change memory cell

    S. Shindo, Y. Sutou, J. Koike, Y. Saito, JS. An, YH. Song

    European Symposium on Phase Change and Ovonic Science proceedings 2016 1 195-196 2016/09

  38. Determination of alpha/beta phase boundaries and mechanical characterization of Mg-Sc binary alloys (vol 670, pg 335, 2016) Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Kyosuke Yoshimi, Junichi Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 674 713-713 2016/09

    DOI: 10.1016/j.msea.2016.08.016  

    ISSN: 0921-5093

    eISSN: 1873-4936

  39. Determination of alpha/beta phase boundaries and mechanical characterization of Mg-Sc binary alloys Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Kyosuke Yoshimi, Junichi Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 670 335-341 2016/07

    DOI: 10.1016/j.msea.2016.06.028  

    ISSN: 0921-5093

    eISSN: 1873-4936

  40. A lightweight shape-memory magnesium alloy Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    SCIENCE 353 (6297) 368-370 2016/07

    DOI: 10.1126/science.aaf6524  

    ISSN: 0036-8075

    eISSN: 1095-9203

  41. Contact resistivity of amorphous and crystalline GeCu<inf>2</inf>Te<inf>3</inf> to W electrode for phase change random access memory Peer-reviewed

    S. Shindo, Y. Sutou, J. Koike, Y. Saito, Y. H. Song

    Materials Science in Semiconductor Processing 47 1-6 2016/06/01

    DOI: 10.1016/j.mssp.2016.02.006  

    ISSN: 1369-8001

  42. Internal microstructure observation of enhanced grain-boundary sliding at room temperature in AZ31 magnesium alloy Peer-reviewed

    D. Ando, Y. Sutou, J. Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 666 94-99 2016/06

    DOI: 10.1016/j.msea.2016.04.030  

    ISSN: 0921-5093

    eISSN: 1873-4936

  43. XAFS Analysis of Crystal GeCu<inf>2</inf>Te<inf>3</inf> Phase Change Material Peer-reviewed

    Kenji Kamimura, Koji Kimura, Shinya Hosokawa, Naohisa Happo, Hiroyuki Ikemoto, Yuji Sutou, Satoshi Shindo, Yuta Saito, Junichi Koike

    Zeitschrift fur Physikalische Chemie 230 (3) 433-443 2016/03/28

    DOI: 10.1515/zpch-2015-0672  

    ISSN: 0942-9352

  44. Hardness and Wear Properties of Ti-Mo-C-N Film Peer-reviewed

    Toshiaki Toyoda, Yuji Sutou, Shoko Komiyama, Daisuke Ando, Junichi Koike, Mei Wang

    MATERIALS TRANSACTIONS 57 (3) 362-367 2016/03

    DOI: 10.2320/matertrans.M2015383  

    ISSN: 1345-9678

    eISSN: 1347-5320

  45. Aging Effect of Mg-Sc Alloy with alpha plus beta Two-Phase Microstructure Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 80 (3) 171-175 2016/03

    DOI: 10.2320/jinstmet.JBW201511  

    ISSN: 0021-4876

    eISSN: 1880-6880

  46. XAFS analysis on amorphous and crystalline new phase change material GeCu<inf>2</inf>Te<inf>3</inf> Peer-reviewed

    K. Kamimura, S. Hosokawa, N. Happo, H. Ikemoto, Y. Sutou, S. Shindo, Y. Saito, J. Koike

    Journal of Optoelectronics and Advanced Materials 18 (3-4) 248-253 2016/03

    ISSN: 1454-4164

  47. The Structure of Fortune-telling Books in the Premodern Age : An Analysis of Sanzeso kokagami(Section 10,Research Reports,THE PROCEEDINGS OF THE SEVENTY-FOURTH ANNUAL CONVENTION OF THE JAPANESE ASSOCIATION FOR RELIGIOUS STUDIES)

    KOIKE Jun'ichi

    Journal of religious studies 89 358-359 2016

    Publisher: Japanese Association for Religious Studies

    DOI: 10.20716/rsjars.89.Suppl_358  

  48. Crystal Orientation Changing Behavior During Erichsen Test in Mg-Y Dilute Alloy Peer-reviewed

    Tetsu Suzuki, Daisuke Ando, Hidetoshi Somekawa, Yuji Sutou, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 80 (8) 515-520 2016

    DOI: 10.2320/jinstmet.J2016018  

    ISSN: 0021-4876

    eISSN: 1880-6880

  49. Effect of surface cleaning on contact resistivity of amorphous GeCu<inf>2</inf>Te<inf>3</inf> to a W electrode Peer-reviewed

    S. Shindo, Y. Sutou, J. Koike, Y. Saito, Y. H. Song

    MRS Advances 1 (39) 2731-2736 2016

    DOI: 10.1557/adv.2016.310  

    eISSN: 2059-8521

  50. Study on fatigue mechanism of Mg-0.6at%Y alloy by cyclic tensile test Peer-reviewed

    Huo, Q, Ando, D, Koike, J, Sutou, Y

    Magnesium Technology 2016-January 299-303 2016

    DOI: 10.1002/9781119274803.ch58  

    ISSN: 1545-4150

  51. Age-hardening of dual phase Mg-Sc alloy at 573 K Peer-reviewed

    Ogawa, Y, Ando, D, Sutou, Y, Koike, J

    Magnesium Technology 2016-January 147-149 2016

    DOI: 10.1002/9781119274803.ch29  

    ISSN: 1545-4150

  52. Aging Effect of Mg-Sc Alloy with alpha plus beta Two-Phase Microstructure Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    MATERIALS TRANSACTIONS 57 (7) 1119-1123 2016

    DOI: 10.2320/matertrans.M2016093  

    ISSN: 1345-9678

    eISSN: 1347-5320

  53. Amorphous Co-Ti alloy as a single layer barrier for Co local interconnect structure Peer-reviewed

    Maryamsadat Hosseini, Junichi Koike, Yuji Sutou, Larry Zhao, Steven Lai, Reza Arghavani

    2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC) 162-164 2016

    DOI: 10.1109/IITC-AMC.2016.7507718  

  54. Structure and Thermoelectric Properties of PbTe Films Deposited by Thermal Evaporation Method Peer-reviewed

    M. P. Nguyen, J. Froemel, S. Hatayama, Y. Sutou, J. Koike, S. Tanaka, M. Esashi, T. Gessner

    2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) 566-568 2016

    DOI: 10.1109/NANO.2016.7751384  

  55. Age-hardening effect by phase transformation of high Sc containing Mg alloy Peer-reviewed

    D. Ando, Y. Ogawa, T. Suzuki, Y. Sutou, J. Koike

    MATERIALS LETTERS 161 5-8 2015/12

    DOI: 10.1016/j.matlet.2015.06.057  

    ISSN: 0167-577X

    eISSN: 1873-4979

  56. Crysatlization behavior of Cr-Ge-Te thin films

    S. Hatayama, S. SHindo, Y. Sutou, J. Koike

    Proceedings of the 27th Symposium on Phase Change Oriented Science 65-66 2015/11/26

  57. Contact resistivity change of GeCu2Te3 to W electrode by crystallization

    S. Shindo, Y. Sutou, J. Koike, Y. Saito

    Proceedings of the 27th Symposium on Phase Change Oriented Science 67-68 2015/11/26

  58. Microstructure, hardness and wear resistance of reactive sputtered Mo-O-N films on stainless steel substrate Peer-reviewed

    Y. Sutou, S. Komiyama, M. Sonobe, D. Ando, J. Koike, M. Wang

    SURFACE & COATINGS TECHNOLOGY 280 1-7 2015/10

    DOI: 10.1016/j.surfcoat.2015.08.047  

    ISSN: 0257-8972

  59. Phase change behavior of molybdenum oxide film

    Y. Ogawa, S. Shindo, Y. Sutou, J. Koike

    European Symposium on Phase Change and Ovonic Science proceedings 107-108 2015/09

  60. Contact resistivity of GeCu2Te3 phase change material on W electrode

    S. Shindo, Y. Sutou, J. Koike, Y. Saito

    European Symposium on Phase Change and Ovonic Science proceedings 147-148 2015/09

  61. Feasibility study of multi-level PCRAM with multiple phase change layers

    Y. Sutou, Y. Saito, S. Shindo, J. Koike, J.M. Lee, Y.H. Song

    European Symposium on Phase Change and Ovonic Science proceedings 133-134 2015/09

  62. Crystallization processes of Sb<inf>100-x</inf>Zn<inf>x</inf> (0 ≤ x ≤ 70) amorphous films for use as phase change memory materials Peer-reviewed

    Yuta Saito, Masashi Sumiya, Yuji Sutou, Daisuke Ando, Junichi Koike

    AIP Advances 5 (9) 2015/09/01

    DOI: 10.1063/1.4931392  

    eISSN: 2158-3226

  63. Wear and oxidation behavior of reactive sputtered delta-(Ti,Mo)N films deposited at different nitrogen gas flow rates Peer-reviewed

    S. Komiyama, Y. Sutou, K. Oikawa, J. Koike, M. Wang, M. Sakurai

    TRIBOLOGY INTERNATIONAL 87 32-39 2015/07

    DOI: 10.1016/j.triboint.2015.02.005  

    ISSN: 0301-679X

    eISSN: 1879-2464

  64. Diffusion barrier property of MnSixOy layer formed by chemical vapor deposition for Cu advanced interconnect application Peer-reviewed

    Mai Phuong Nguyen, Yuji Sutou, Junichi Koike

    THIN SOLID FILMS 580 56-60 2015/04

    DOI: 10.1016/j.tsf.2015.03.007  

    ISSN: 0040-6090

  65. Hardness and Wear Properties of Ti-Mo-C-N Film Peer-reviewed

    Toshiaki Toyoda, Yuji Sutou, Shoko Komiyama, Daisuke Ando, Junichi Koike, Mei Wang

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 79 (4) 220-226 2015

    DOI: 10.2320/jinstmet.JBW201401  

    ISSN: 0021-4876

    eISSN: 1880-6880

  66. Precipitation hardening in Ti-Mo-N coating deposited by reactive sputtering Peer-reviewed

    Sutou, Y, Komiyama, S, Oikawa, K, Ando, D, Koike, J

    PTM 2015 - Proceedings of the International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2015 417-418 2015

  67. Recrystallization process and texture change of Mg-Y alloy rolled sheet Peer-reviewed

    Tetsu Suzuki, Daisuke Ando, Yuji Sutou, Junichi Koike

    Keikinzoku/Journal of Japan Institute of Light Metals 65 (7) 259-262 2015

    Publisher: Japan Institute of Light Metals

    DOI: 10.2464/jilm.65.259  

    ISSN: 0451-5994

  68. Significant age hardening response of BCC/HCP dual phase Mg-Sc alloys Peer-reviewed

    Ando, D, Ogawa, Y, Sutou, Y, Koike, J

    PTM 2015 - Proceedings of the International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2015 1207-1208 2015

  69. Determination of HCP/BCC boundaries and mechanical properties of dual phase alloy in binary Mg-Sc system Peer-reviewed

    Ogawa, Y, Ando, D, Sutou, Y, Koike, J

    PTM 2015 - Proceedings of the International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2015 419-420 2015

  70. Chronological change of electrical resistance in GeCu<inf>2</inf>Te<inf>3</inf> amorphous film induced by surface oxidation Peer-reviewed

    Yuta Saito, Satoshi Shindo, Yuji Sutou, Junichi Koike

    Journal of Physics D: Applied Physics 47 (47) 2014/11/26

    DOI: 10.1088/0022-3727/47/47/475302  

    ISSN: 0022-3727

    eISSN: 1361-6463

  71. Phase change characteristics in GeTe-CuTe pseudobinary alloy Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Journal of Physical Chemistry C 118 (46) 26973-26980 2014/11/20

    DOI: 10.1021/jp5066264  

    ISSN: 1932-7447

    eISSN: 1932-7455

  72. A study on phase change characteristics of (GeTe)1-xSix films

    Y. Sutou, Y. Saito, J. Koike

    Proceedings of the 26th symposium on Phase Change Oriented Science (PCOS) 1 53-56 2014/11

  73. Contact resistivity of GeCu2Te3 on metal electrode measured by CTLM Peer-reviewed

    S. Shindo, Y. Sutou, J. Koike, Y. Saito

    Proceedings of the 26th symposium on Phase Change Oriented Science (PCOS) 1 63-64 2014/11

  74. Resistive Switching Behavior in Undoped α-Fe2O3 Film with a Low Resistivity

    Yukiko Ogawa, Yuji Sutou, Daisuke Ando, Junichi Koike

    Advances in Science and Technology 95 96-99 2014/10

    Publisher: Trans Tech Publications, Ltd.

    DOI: 10.4028/www.scientific.net/ast.95.96  

    ISSN: 1662-0356

    More details Close

    <jats:p>The resistive switching behavior of a low resistive p-type α-Fe<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> thin film sandwiched between Fe bottom electrode and top electrodes of various materials (Fe, Ni and TiN) was studied by current-voltage measurements. When TiN was used for top electrode of memory cell, the reversible resistive switching behavior was observed for over 100 cycles. From impedance measurement, it was suggested that the resistive switching behavior in the TiN/p-type α-Fe<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub>/Fe device is attributed to the change of the contact resistance in the interface between TiN and α-Fe<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> layers.</jats:p>

  75. Effects of O-2 and N-2 Flow Rate on the Electrical Properties of Fe-O-N Thin Films Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    MATERIALS TRANSACTIONS 55 (10) 1606-1610 2014/10

    DOI: 10.2320/matertrans.M2014089  

    ISSN: 1345-9678

    eISSN: 1347-5320

  76. Fast crystallization in Si-doped GeTe amorphous film by surface oxidation

    Y. Sutou, Y. Saito, J. Koike

    European/ Phase Change and Ovonics Symposium 1 (1) 109-110 2014/09/07

  77. Dependence pf electrode material on resistance-temperature curves in GeCu2Te3

    S. Shindo, Y. Sutou, J. Koike, Y. Saito

    European/ Phase Change and Ovonics Symposium 1 (1) 131-132 2014/09/07

  78. Formation behavior and adhesion property of metallic Mn layer on porous SiOC by chemical vapor deposition Peer-reviewed

    Yoshiyuki Tsuchiya, Daisuke Ando, Yuji Sutou, Junichi Koike

    JAPANESE JOURNAL OF APPLIED PHYSICS 53 (5) 2014/05

    DOI: 10.7567/JJAP.53.05GA10  

    ISSN: 0021-4922

    eISSN: 1347-4065

  79. Advanced Metallization for ULSI Applications FOREWORD Peer-reviewed

    Junichi Koike

    JAPANESE JOURNAL OF APPLIED PHYSICS 53 (5) 2014/05

    DOI: 10.7567/JJAP.53.05G001  

    ISSN: 0021-4922

    eISSN: 1347-4065

  80. Reflow behavior of Cu-Mn in LSI line patterns Peer-reviewed

    Tomohiro Saito, Daisuke Ando, Yuji Sutou, Junichi Koike

    JAPANESE JOURNAL OF APPLIED PHYSICS 53 (5) 2014/05

    DOI: 10.7567/JJAP.53.05GA09  

    ISSN: 0021-4922

    eISSN: 1347-4065

  81. Multiple phase change structure for the scalable phase change random access memory array Peer-reviewed

    Jung Min Lee, Yuta Saito, Yuji Sutou, Junichi Koike, Jin Won Jung, Masashi Sahashi, Yun Heub Song

    Japanese Journal of Applied Physics 53 (4) 2014/04

    DOI: 10.7567/JJAP.53.041801  

    ISSN: 0021-4922

    eISSN: 1347-4065

  82. The role of deformation twinning in the fracture behavior and mechanism of basal textured magnesium alloys Peer-reviewed

    D. Ando, J. Koike, Y. Sutou

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 600 145-152 2014/04

    DOI: 10.1016/j.msea.2014.02.010  

    ISSN: 0921-5093

    eISSN: 1873-4936

  83. 不揮発性メモリ用Ge‐Cu‐Te系相変化材料の研究

    須藤祐司, 齊藤雄太, 齊藤雄太, 小池淳一

    まてりあ 53 (2) 45-51 2014/02/01

    Publisher: The Japan Institute of Metals and Materials

    DOI: 10.2320/materia.53.45  

    ISSN: 1340-2625

  84. Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV Peer-reviewed

    Kang-Wook Lee, Hao Wang, Ji-Cheol Bea, Mariappan Murugesan, Yuji Sutou, Takafumi Fukushima, Tetsu Tanaka, Junichi Koike, Mitsumasa Koyanagi

    IEEE ELECTRON DEVICE LETTERS 35 (1) 114-116 2014/01

    DOI: 10.1109/LED.2013.2287879  

    ISSN: 0741-3106

    eISSN: 1558-0563

  85. What can we do about barrier layer scaling to 5 nm node technology ? Peer-reviewed

    Junichi Koike

    2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers 2014

    DOI: 10.1109/VLSIT.2014.6894408  

  86. The Electrical and Optical Properties of Fe-O-N Thin Films Deposited by RF Magnetron Sputtering Peer-reviewed

    Yukiko Ogawa, Daisuke Ando, Yuji Sutou, Junichi Koike

    MATERIALS TRANSACTIONS 54 (10) 2055-2058 2013/10

    DOI: 10.2320/matertrans.M2013170  

    ISSN: 1345-9678

    eISSN: 1347-5320

  87. Oxidation behavior of Cu-Ag core-shell particles for solar cell applications Peer-reviewed

    Hoang Tri Hai, Hitoshi Takamura, Junichi Koike

    JOURNAL OF ALLOYS AND COMPOUNDS 564 71-77 2013/07

    DOI: 10.1016/j.jallcom.2013.02.048  

    ISSN: 0925-8388

  88. Simultaneous Formation of a Metallic Mn Layer and a MnOx/MnSixOy Barrier Layer by Chemical Vapor Deposition at 250 degrees C Peer-reviewed

    Atsuko Kurokawa, Yuji Sutou, Junichi Koike, Tatsufumi Hamada, Kenji Matsumoto, Hiroyuki Nagai, Kaoru Maekawa, Hiroki Kanato

    JAPANESE JOURNAL OF APPLIED PHYSICS 52 (5) 2013/05

    DOI: 10.7567/JJAP.52.05FA02  

    ISSN: 0021-4922

    eISSN: 1347-4065

  89. Investigation of a selective switching device using a phase-change material for a 3-dimensional PCRAM array Peer-reviewed

    Jung Min Lee, Yun Heub Song, Yuta Saito, Yuji Sutou, Junichi Koike

    Journal of the Korean Physical Society 62 (9) 1258-1263 2013/05

    DOI: 10.3938/jkps.62.1258  

    ISSN: 0374-4884

    eISSN: 1976-8524

  90. Optical contrast and laser-induced phase transition in GeCu <inf>2</inf>Te<inf>3</inf> thin film Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Applied Physics Letters 102 (5) 2013/02/04

    DOI: 10.1063/1.4791567  

    ISSN: 0003-6951

  91. Deformation and strength characterization of Mg alloys with rolled crystallographic textures by crystal plasticity finite element method Peer-reviewed

    Tomohiro Ishida, Shinpei Shibutani, Junji Kato, Kenjiro Terada, Takashi Kyoya, Daisuke Ando, Junichi Koike

    Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A 79 (808) 1840-1851 2013

    Publisher: Japan Society of Mechanical Engineers

    DOI: 10.1299/kikaia.79.1840  

    ISSN: 0387-5008

  92. Fourfold coordinated Te atoms in amorphous GeCu <inf>2</inf>Te <inf>3</inf> phase change material Peer-reviewed

    P. Jóvári, Y. Sutou, I. Kaban, Y. Saito, J. Koike

    Scripta Materialia 68 (2) 122-125 2013/01

    DOI: 10.1016/j.scriptamat.2012.09.028  

    ISSN: 1359-6462

  93. Structural Characterization of a Manganese Oxide Barrier Layer Formed by Chemical Vapor Deposition for Advanced Interconnects Application on SiOC Dielectric Substrates Peer-reviewed

    Nguyen Mai Phuong, Yuji Sutou, Junichi Koike

    JOURNAL OF PHYSICAL CHEMISTRY C 117 (1) 160-164 2013/01

    DOI: 10.1021/jp303241c  

    ISSN: 1932-7447

  94. Deposition behavior and substrate dependency of ALD MnOx diffusion barrier layer Peer-reviewed

    K. Matsumoto, K. Maekawa, H. Nagai, J. Koike

    Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013 2013

    DOI: 10.1109/IITC.2013.6615566  

  95. Effect of CVD Mn Oxide Layer as Cu Diffusion Barrier for TSV Peer-reviewed

    M. Murugesan, J. C. Bea, K. W. Lee, T. Fukushima, T. Tanaka, M. Koyanagi, Y. Sutou, H. Wang, J. Koike

    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) 2013

    DOI: 10.1109/3DIC.2013.6702364  

    ISSN: 2164-0157

  96. A study on phase change characteristics of Ge-Cu-Te ternary alloy thin films

    Y, Sutou, Y. Saito, J. Koike

    Proceedings of the 24th symposium on PCOS 2012 1 45-48 2012/11/29

  97. Study of GeCu2Te3 by Hard X-ray Photoelectron Spectroscopy Peer-reviewed

    K. Kobayashi, M. Kobata, Y. Saito, Y. Sutou, J. Koike

    Proceedings of the 24th symposium on PCOS 2012 1 76-84 2012/11/29

  98. Effects of Si addition on the crystallization behaviour of GeTe phase change materials Peer-reviewed

    Y. Saito, Y. Sutou, J. Koike

    Journal of Physics D: Applied Physics 45 (40) 2012/10/10

    DOI: 10.1088/0022-3727/45/40/405302  

    ISSN: 0022-3727

    eISSN: 1361-6463

  99. Alloying effects on formation of compound layer in the gaseous nitrided Fe-M binary alloys Peer-reviewed

    Fanhui Meng, Goro Miyamoto, Tadashi Furuhara, Shoko Komiyama, Yuji Sutou, Junichi Koike

    Proceedings of 20th Congress of International Federation for Heat Treatment and Surface Engineering 268-270 2012/10

  100. Improved microstructure and ohmic contact of Nb electrode on n-type 4H-SiC Peer-reviewed

    Kunhwa Jung, Yuji Sutou, Junichi Koike

    THIN SOLID FILMS 520 (23) 6922-6928 2012/09

    DOI: 10.1016/j.tsf.2012.04.004  

    ISSN: 0040-6090

  101. Crystallization behaviors and structral study of amorphous GeCu2Te3 Invited

    Y. Sutou, Y. Saito, J. Koike, P. Jovari, I. Kaban

    Proceedings of EPCOS 2012 50-55 2012/07/08

  102. Composition dependence on phase change characteristics in Ge-Cu-Te ternary phase change materials

    Y. Saito, Y. Sutou, J. Koike

    Proceedings of EPCOS2012 152-153 2012/07/08

  103. Fast crystal nucleation induced by surface oxidation in Si-doped GeTe amorphous thin film Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Applied Physics Letters 100 (23) 2012/06/04

    DOI: 10.1063/1.4726107  

    ISSN: 0003-6951

  104. Characterization of Chemically Vapor Deposited Manganese Barrier Layers Using X-ray Absorption Fine Structure Peer-reviewed

    James M. Ablett, Christopher J. Wilson, Nguyen Mai Phuong, Junichi Koike, Zsolt Tokei, George E. Sterbinsky, Joseph C. Woicik

    JAPANESE JOURNAL OF APPLIED PHYSICS 51 (5) 2012/05

    DOI: 10.1143/JJAP.51.05EB01  

    ISSN: 0021-4922

  105. Crystallization and electrical characteristics of Ge <inf>1</inf>Cu <inf>2</inf>Te <inf>3</inf> films for phase change random access memory Peer-reviewed

    Toshiya Kamada, Yuji Sutou, Masashi Sumiya, Yuta Saito, Junichi Koike

    Thin Solid Films 520 (13) 4389-4393 2012/04

    DOI: 10.1016/j.tsf.2012.02.025  

    ISSN: 0040-6090

  106. Crystallization process and thermal stability of Ge <inf>1</inf>Cu <inf>2</inf>Te <inf>3</inf> amorphous thin films for use as phase change materials Peer-reviewed

    Y. Sutou, T. Kamada, M. Sumiya, Y. Saito, J. Koike

    Acta Materialia 60 (3) 872-880 2012/02

    DOI: 10.1016/j.actamat.2011.10.048  

    ISSN: 1359-6454

  107. 六方晶金属の結晶塑性・変形双晶構成モデル Peer-reviewed

    石田 智広, 渋谷 慎兵, 加藤 準治, 寺田 賢二郎, 京谷 孝史, 安藤 大輔, 小池 淳一

    計算工学会論文集 2012 P20120014 2012

  108. A new constitutive model for crystal plasticity with deformation twinning Peer-reviewed

    Ishida, T, Shibutani, S, Kato, J, Terada, K, Kyoya, T, Ando, D, Koike, J

    Transactions of the Japan Society for Computational Engineering and Science 2012 2 2012

    eISSN: 1347-8826

  109. Crystallization behavior and resistance change in eutectic Si <inf>15</inf>Te <inf>85</inf> amorphous films Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Thin Solid Films 520 (6) 2128-2131 2012/01/01

    DOI: 10.1016/j.tsf.2011.09.012  

    ISSN: 0040-6090

  110. Interface reaction behavior between Mn and SiO2 formed by RF sputter deposition Peer-reviewed

    Byeong Taek Bae, Hideaki Nakano, Junichi Koike

    MATERIALS INTEGRATION 508 48-51 2012

    DOI: 10.4028/www.scientific.net/KEM.508.48  

    ISSN: 1013-9826

  111. The thickness-ratio effects of Ni/Nb electrode on wire bonding strength with n-type 4H-SiC Peer-reviewed

    Kunhwa Jung, Daisuke Ando, Yuji Sutou, Tetsuya Oyamada, Masamoto Tanaka, Junichi Koike

    SILICON CARBIDE AND RELATED MATERIALS 2011, PTS 1 AND 2 717-720 829-+ 2012

    DOI: 10.4028/www.scientific.net/MSF.717-720.829  

    ISSN: 0255-5476

  112. Multiresistance characteristics of PCRAM with Ge <inf>1</inf>Cu <inf>2</inf>Te <inf>3</inf> and Ge <inf>2</inf> Sb <inf>2</inf>Te <inf>5</inf> films Peer-reviewed

    Yuta Saito, Yun Heub Song, Jung Min Lee, Yuji Sutou, Junichi Koike

    IEEE Electron Device Letters 33 (10) 1399-1401 2012

    DOI: 10.1109/LED.2012.2210534  

    ISSN: 0741-3106

  113. Simultaneous formation of a metallic Mn layer and a MnOx / MnSixOy barrier layer by chemical vapor deposition at 250°C Peer-reviewed

    Kurokawa, A, Sutou, Y, Koike, J, Hamada, T, Matsumoto, K, Nagai, H, Maekawa, K, Kanato, H

    Advanced Metallization Conference (AMC) 109-117 2012

    ISSN: 1540-1766

  114. Effect of Nitrogen Content on the Microstructure and Mechanical Properties of Ti-Mo-N Coating Films Peer-reviewed

    Shoko Komiyama, Yuji Sutou, Junichi Koike

    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE 42A (11) 3310-3315 2011/11

    DOI: 10.1007/s11661-010-0522-x  

    ISSN: 1073-5623

  115. Crystallization behaviors of Si-doped GeTe phase change materials

    Y. Saito, Y. Sutou, J. Koike

    Proceedings of EPCOS 2012 197-198 2011/09/04

  116. Hard X-ray photoelectron spectroscopy of crystalline and amorphous Ge1Cu2Te3 Invited

    K. Kobayashi, M. Kobata, I. Pis, S. Ueda, Y. Sutou, Y. Saito, J. Koike

    Proceedings of EPCOS 2012 40-43 2011/09/04

  117. Effects of Adsorbed Moisture in SiO2 Substrates on the Formation of a Mn Oxide Layer by Chemical Vapor Deposition Peer-reviewed

    Nguyen Mai Phuong, Koji Neishi, Yuji Sutou, Junichi Koike

    JOURNAL OF PHYSICAL CHEMISTRY C 115 (34) 16731-16736 2011/09

    DOI: 10.1021/jp201299w  

    ISSN: 1932-7447

  118. Structural and Electronic Properties of a Mn Oxide Diffusion Barrier Layer Formed by Chemical Vapor Deposition Peer-reviewed

    Vijay Kumar Dixit, Koji Neishi, Noboru Akao, Junichi Koike

    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 11 (2) 295-302 2011/06

    DOI: 10.1109/TDMR.2011.2141671  

    ISSN: 1530-4388

    eISSN: 1558-2574

  119. P-23: The contact properties an d TFT structures of a-IGZO TFTs combined with cu-mn alloy electrodes Peer-reviewed

    Yun, P.S, Naito, M, Kumagai, R, Sutou, Y, Koike, J

    Digest of Technical Papers - SID International Symposium 42 1 1177-1180 2011

  120. Metal Reaction Doping and Ohmic Contact with Cu-Mn Electrode on Amorphous In-Ga-Zn-O Semiconductor Peer-reviewed

    P. S. Yun, J. Koike

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY 158 (10) H1034-H1040 2011

    DOI: 10.1149/1.3621723  

    ISSN: 0013-4651

    eISSN: 1945-7111

  121. The contact properties and TFT structures of a-IGZO TFTs combined with Cu-Mn alloy electrodes Peer-reviewed

    Yun, P.S, Naito, M, Kumagai, R, Sutou, Y, Koike, J

    49th Annual SID Symposium, Seminar, and Exhibition 2011, Display Week 2011 3 1177-1180 2011

  122. Roles of deformation twinning and dislocation slip in the fatigue failure mechanism of AZ31 Mg alloys Peer-reviewed

    J. Koike, N. Fujiyama, D. Ando, Y. Sutou

    SCRIPTA MATERIALIA 63 (7) 747-750 2010/10

    DOI: 10.1016/j.scriptamat.2010.03.021  

    ISSN: 1359-6462

  123. Phase change behavior of Ge1Cu2Te3 thin films

    Y. Sutou, T. Kamada, Y. Saito, M. Sumiya, J. Koike

    European Symposium on Phase Change and Ovonic Science proceedings 185-186 2010/09

  124. Crystallization processes of eutectic Si-Te and Ge-Te phase change materials

    Y. Saito, Y. Sutou, J. Koike

    European Symposium on Phase Change and Ovonic Science proceedings 183 (184) 2010/09

  125. Thin MnO barrier formation with CVD for Cu contact plug on Nickel Silicide

    K. Neishi, T. Sagawa, Y. Sutou, J. Koike

    Proceedings of Advanced Metallization Conference, 2009 3-5 2010/08/01

  126. Relationship between deformation twinning and surface step formation in AZ31 magnesium alloys Peer-reviewed

    D. Ando, J. Koike, Y. Sutou

    ACTA MATERIALIA 58 (13) 4316-4324 2010/08

    DOI: 10.1016/j.actamat.2010.03.044  

    ISSN: 1359-6454

  127. Effect of Heat Treatment on the Hardness of Ti-Mo-N Films Deposited by RF Reactive Magnetron Sputtering Peer-reviewed

    Shoko Komiyama, Yuji Sutou, Junichi Koike

    MATERIALS TRANSACTIONS 51 (8) 1467-1473 2010/08

    DOI: 10.2320/matertrans.M2010119  

    ISSN: 1345-9678

    eISSN: 1347-5320

  128. Cu alloy TFT electrodes for advanced displays

    J. Koike, K. Hirota, P. Yun, Y. Sutou

    The proceedings of AM-FPD’10 89-91 2010/07/05

  129. Effects of Water Desorption from SiO2 Substrates on the Thickness of Manganese Oxide Diffusion Barrier Layer Formed by Chemical Vapor Deposition Peer-reviewed

    Kenji Matsumoto, Koji Neishi, Hitoshi Itoh, Hidenori Miyoshi, Hiroshi Sato, Shigetoshi Hosaka, Junichi Koike

    JAPANESE JOURNAL OF APPLIED PHYSICS 49 (5) 05FA121-05FA122 2010/05

    DOI: 10.1143/JJAP.49.05FA12  

    ISSN: 0021-4922

  130. Selective Formation of a SnO2 Cap Layer, Its Growth Behavior, and Oxidation Resistance Peer-reviewed

    Yoshihito Fujii, Junichi Koike, Yuji Sutou, Zifeng Li, Koji Neishi

    JAPANESE JOURNAL OF APPLIED PHYSICS 49 (5) 05FA021-05FA024 2010/05

    DOI: 10.1143/JJAP.49.05FA02  

    ISSN: 0021-4922

  131. The Relationship between Grain boundary sliding and Grain Orientation in AZ31 Magnesium Alloys at Room Temperature Peer-reviewed

    D. Ando, Y. Sutou, J. Koike

    TMS Magnesium Technology 2010 245-247 2010/03

  132. Effect of Heat Treatment on the Hardness of Ti-Mo-N Coating Films Deposited by RF Reactive Magnetron Sputtering Peer-reviewed

    Shoko Komiyama, Yuji Sutou, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 74 (3) 135-141 2010/03

    DOI: 10.2320/jinstmet.74.135  

    ISSN: 0021-4876

    eISSN: 1880-6880

  133. Graded composition and valence states in self-forming barrier layers at Cu-Mn/SiO2 interface Peer-reviewed

    Y. Otsuka, J. Koike, H. Sako, K. Ishibashi, N. Kawasaki, S. M. Chung, I. Tanaka

    APPLIED PHYSICS LETTERS 96 (1) 2010/01

    DOI: 10.1063/1.3269602  

    ISSN: 0003-6951

  134. The Relationships between Grain Boundary Sliding and Anisotropic Dislocation Plasticity in AZ31 Magnesium Alloys at Room Temperature Peer-reviewed

    D. Ando, Y. Sutou, J. Koike

    MAGNESIUM TECHNOLOGY 2010 245-247 2010

    ISSN: 1545-4150

  135. Structural and electrical characteristics of Cu-Mn/SiOC/Si Peer-reviewed

    Chung, S.M, Koike, J, Otsuka, Y, Sako, H, Ishibashi, K, Kawasaki, N

    Advanced Metallization Conference (AMC) 242 2010

  136. Crystallization behavior of Ge<inf>1</inf>Cu<inf>2</inf>Te<inf>3</inf> amorphous film Peer-reviewed

    Y. Sutou, T. Kamada, Y. Saito, M. Sumiya, J. Koike

    Materials Research Society Symposium Proceedings 1251 7-12 2010

    DOI: 10.1557/proc-1251-h05-08  

    ISSN: 0272-9172

  137. P-33: Cu-Mn electrodes for a-Si TFT and its electrical characteristics Peer-reviewed

    Koike, J, Hirota, K, Naito, M, Yun, P, Sutou, Y

    48th Annual SID Symposium, Seminar, and Exhibition 2010, Display Week 2010 3 1343-1346 2010

  138. Electrical resistance change with crystallization in Si-Te amorphous thin films Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Materials Research Society Symposium Proceedings 1251 99-104 2010

    DOI: 10.1557/proc-1251-h06-07  

    ISSN: 0272-9172

  139. Microstructure Analysis and Electrical Properties of Cu-Mn Electrode for Back-Channel Etching a-IGZO TFT Peer-reviewed

    Pilsang Yun, Junichi Koike

    IDW'10: PROCEEDINGS OF THE 17TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3 3 1873-1876 2010

    ISSN: 1883-2490

  140. The Microstructure and Mechanical Properties of Ti-Mo-N Coating Films

    S. Komiyama, Y. Sutou, J. Koike

    Processing and Fabrication of Advanced Materials XVIII, 176th 4 2007-2016 2009/12

  141. Resistivity reduction by external oxidation of Cu-Mn alloy films for semiconductor interconnect application Peer-reviewed

    J. Iijima, Y. Fujii, K. Neishi, J. Koike

    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 27 (4) 1963-1968 2009/07

    DOI: 10.1116/1.3179167  

    ISSN: 1071-1023

  142. Deformation mechanisms of magnesium alloys at ambient temperature Invited Peer-reviewed

    J. Koike

    J. Japan Inst. Light Metals 59 (5) 272-277 2009/05

  143. Chemical Vapor Deposition of Mn and Mn Oxide and their Step Coverage and Diffusion Barrier Properties on Patterned Interconnect Structures Peer-reviewed

    Kenji Matsumoto, Koji Neishi, Hitoshi Itoh, Hiroshi Sato, Shigetoshi Hosaka, Junichi Koike

    APPLIED PHYSICS EXPRESS 2 (3) 036503 2009/03

    DOI: 10.1143/APEX.2.036503  

    ISSN: 1882-0778

  144. Microstructural invetigation of twins under the fracture surface in AZ31 Mg alloys Peer-reviewed

    D. Ando, J. Koike

    2009 Magnesium Technology 537-540 2009/02

    ISSN: 1545-4150

  145. Optimization of source-drain contact process with Cu-Mn alloys

    J. Koike, M. Sano, K. Hirota, Y. Sutou, K. Neishi

    IDW '09 - Proceedings of the 16th International Display Workshops 1 275-277 2009

  146. The Role of Deformation Twin during Fracture Behavior in AZ31 Peer-reviewed

    D. Ando, J. Koike

    Magnesium, 8th International Conference on Magnesium Alloys their Applications 8 8 538-543 2009

  147. Phase Formation and Growth Kinetics of an Interface Layer in Ni/SiC Peer-reviewed

    Kenichiro Terui, Atsuko Sekiguchi, Hiroshi Yoshizaki, Junichi Koike

    SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2 600-603 631-634 2009

    DOI: 10.4028/3-908453-11-9  

    ISSN: 0255-5476

  148. Adhesion and Cu diffusion barrier properties of a MnOx barrier layer formed with thermal MOCVD Peer-reviewed

    K. Neishi, D. Vijay, S. Aki, J. Koike, K. Matsumoto, H. Sato, H. Itoh, S. Hosaka

    Proc. 2009 MRS Spring Meeting D04-10 2009

  149. Electric transport properties of Cu/MnOx/SiO2/p-Si MOS devices Peer-reviewed

    D. Vijay, K. Neishi, J. Koike

    Proc. 2009 MRS Spring Meeting D04-11 2009

  150. Effects of plasma surface treatment on the self-forming barrier process in porous SiOCH Peer-reviewed

    S-M. Chung, J. Koike, Zs. Tokei

    Proc. 2008 MRS Spring Meeting 2009

  151. Influence of moisture on the CVD formation of a MnOx barrier layer Peer-reviewed

    K. Neishi, K. Matsumoto, H. Sato, H. Itoh, S. Hosaka, J. Koike

    Advanced metallization conference 2008 307-311 2009

  152. CVD法による先端LSI-Cu配線用MnOxバリア層形成と信頼性評価

    根石浩司, V. K. Dixit, 松本賢治, 伊藤仁, 佐藤浩, 保坂重敏, 小池淳一

    LSIにおける原子輸送・応力問題第14回研究会予稿集 29-32 2009

  153. Deposition Behavior and Diffusion Barrier Property of CVD MnOx Peer-reviewed

    K. Matsumoto, K. Neishi, H. Itoh, H. Sato, S. Hosaka, J. Koike

    PROCEEDINGS OF THE 2009 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE 197-+ 2009

    DOI: 10.1109/IITC.2009.5090386  

  154. Origin of the Anomalous {10(1)over-bar2} Twinning during Tensile Deformation of Mg Alloy Sheet Peer-reviewed

    Koike J, Sato Y, Ando D

    MATERIALS TRANSACTIONS 49 (12) 2792-2800 2008/12

    DOI: 10.2320/matertrans.MRA2008283  

  155. Stress relaxation during isothermal annealing in electroplated Cu films Peer-reviewed

    Soo-Jung Hwang, Young-Chang Joo, Junichi Koike

    Thin Solid Films 516 7588-7594 2008/08

    DOI: 10.1016/j.tsf2008.03.030  

  156. Formation of a manganese oxide barrier layer with thermal chemical vapor deposition for advanced large-scale integrated interconnect structure Peer-reviewed

    Koji Neishi, Shiro Aki, Kenji Matsumoto, Hiroshi Sato, Hitoshi Itoh, Shigetoshi Hosaka, Junichi Koike

    APPLIED PHYSICS LETTERS 93 (3) 032106 2008/07

    DOI: 10.1063/1.2963984  

    ISSN: 0003-6951

  157. Evaluation of interface adhesion strength in Cu/(Ta-x% n, Ta/TaN)/SiO2/Si by nanoscratch test Peer-reviewed

    Atsuko Sekiguchi, Junichi Kolke

    JAPANESE JOURNAL OF APPLIED PHYSICS 47 (2) 1042-1049 2008/02

    DOI: 10.1143/JJAP.47.1042  

    ISSN: 0021-4922

  158. MnO<inf>x</inf>self-forming process for TFT electrode application

    J. Koike, M. Sano, K. Hirota, K. Neishi, Y. Sutou

    IDW '08 - Proceedings of the 15th International Display Workshops 1 103-104 2008

  159. Formation of Mn oxide with thermal CVD and its diffusion barrier property between Cu and SiO2 Peer-reviewed

    K. Neishi, S. Aki, J. Iijima, J. Koike

    Proc. 2008 MRS Spring Meeting 2008

  160. Possibilities and problems of self-forming barrier process for advanced LSI metallization Peer-reviewed

    J. Koike, J. Iijima, K. Neishi

    ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007) 23 3-9 2008

    ISSN: 0886-7860

  161. Finite element method analysis of nanoscratch test for the evaluation of interface adhesion strength in Cu thin films on si substrate Peer-reviewed

    Atsuko Sekiguchi, Junichi Koike

    JAPANESE JOURNAL OF APPLIED PHYSICS 47 (1) 249-256 2008/01

    DOI: 10.1143/JJAP.47.249  

    ISSN: 0021-4922

  162. Relationship between deformation-induced surface relief and double twinning AZ31 magnesium alloy Peer-reviewed

    Daisuke Ando, Junichi Koike

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 71 (9) 684-687 2007/09

    DOI: 10.2320/jinstmet.71.684  

    ISSN: 0021-4876

    eISSN: 1880-6880

  163. Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn/SiO2 interface Peer-reviewed

    J. Koike, M. Haneda, J. Iijima, Y. Otsuka, H. Sako, K. Neishi

    JOURNAL OF APPLIED PHYSICS 102 (4) 043527 2007/08

    DOI: 10.1063/1.2773699  

    ISSN: 0021-8979

  164. Growth behavior of self-formed barrier at Cu-Mn/SiO2 interface at 250-450 degrees C Peer-reviewed

    M. Haneda, J. Iijima, J. Koike

    APPLIED PHYSICS LETTERS 90 (25) 252107 2007/06

    DOI: 10.1063/1.2750402  

    ISSN: 0003-6951

  165. The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films Peer-reviewed

    T. Miyamura, J. Koike

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 445 620-624 2007/02

    DOI: 10.1016/j.msea.2006.09.097  

    ISSN: 0921-5093

  166. Possibility of Cu-Mn alloy for TFT gate electrodes Peer-reviewed

    J. Koike, K. Neishi, J. Iijima, Y. Sutou

    IDW '07: PROCEEDINGS OF THE 14TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3 2037-2040 2007

  167. Highly reliable copper dual-damascene interconnects with self-formed MnSixOy barrier layer Peer-reviewed

    Takamasa Usui, Hayato Nasu, Shingo Takahashi, Noriyoshi Shimizu, T. Nishikawa, Masaki Yoshimaru, Hideki Shibata, Makoto Wada, Junichi Koike

    IEEE TRANSACTIONS ON ELECTRON DEVICES 53 (10) 2492-2499 2006/10

    DOI: 10.1109/TED.2006.882046  

    ISSN: 0018-9383

  168. Self-formed barrier with Cu-Mn alloy metallization and its effects on reliability Peer-reviewed

    J. Koike, M. Wada, T. Usui, H. Nasu, S. Takahashi, N. Shimizu, M. Yoshimaru, H. Shibata

    AIP Conference Proceedings 817 43-51 2006/02/07

    DOI: 10.1063/1.2173530  

    ISSN: 0094-243X 1551-7616

  169. Cu alloy metallization for self-forming barrier process Peer-reviewed

    J. Koike, M. Haneda, J. Iijima, M. Wada

    PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE 161-+ 2006

  170. Growth behavior of self-formed barrier using Cu-Mn alloys at 350 to 600 degrees C Peer-reviewed

    J. Iijima, M. Haneda, J. Koike

    PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE 155-+ 2006

  171. Enhanced deformation mechanisms by anisotropic plasticity in polycrystalline Mg alloys at room temperature Invited Peer-reviewed

    J Koike

    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE 36A (7) 1689-1696 2005/07

    ISSN: 1073-5623

  172. Self-forming diffusion barrier layer in Cu-Mn alloy metallization Peer-reviewed

    J Koike, M Wada

    APPLIED PHYSICS LETTERS 87 (4) No. 041911 2005/07

    DOI: 10.1063/1.1993759  

    ISSN: 0003-6951

  173. Geometrical c-Titerion for the activation of prismatic slip in AZ61 Mg alloy sheets deformed at room temperature Peer-reviewed

    J Koike, R Ohyama

    ACTA MATERIALIA 53 (7) 1963-1972 2005/04

    DOI: 10.1016/j.actamat.2005.01.008  

    ISSN: 1359-6454

  174. Evolution of stress-induced surface damage and stress-relaxation of electroplated Cu films at elevated temperatures Peer-reviewed

    SJ Hwang, J Koike, YC Joo

    PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 475-479 3641-3646 2005

    ISSN: 0255-5476

  175. Newly developed heat resistant magnesium alloy by Thixomolding (R) Peer-reviewed

    T Tsukeda, K Saito, M Suzuki, J Koike, K Maruyama

    MAGNESIUM - SCIENCE, TECHNOLOGY AND APPLICATIONS 488-489 287-290 2005

    ISSN: 0255-5476

  176. Effects of zinc on creep strength and deformation substructures in Mg-Y alloy Invited Peer-reviewed

    M Suzuki, T Kimura, J Koike, K Maruyama

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 387 706-709 2004/12

    DOI: 10.1016/j.msea.2003.12.071  

    ISSN: 0921-5093

  177. Stress relaxation during isothermal annealing at elevated temperatures in electroplated Cu films Peer-reviewed

    SJ Hwang, YC Joo, J Koike

    THIN FILMS-STRESSES AND MECHANICAL PROPERTIES X 795 205-210 2004

    ISSN: 0272-9172

  178. Texture dependence of elongation anisotropy in an AZ61 magnesium alloy sheet Peer-reviewed

    R Ohyama, J Koike, M Suzuki, K Maruyama

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 68 (1) 27-33 2004/01

    DOI: 10.2320/jinstmet.68.27  

    ISSN: 0021-4876

    eISSN: 1880-6880

  179. Dislocation plasticity and complementary deformation mechanisms in polycrystalline Mg alloys Peer-reviewed

    J Koike

    DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2 449-4 665-668 2004

    ISSN: 0255-5476

  180. Microstructures of Second Phase on Grain Boundary in Mg-Al-Ca Based Thixomolded^【○!R】Alloy

    SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, TSUKEDA Tadayoshi, SAITO Ken

    Materia Japan 42 (12) 867-867 2003/12/20

    Publisher: The Japan Institute of Metals and Materials

    DOI: 10.2320/materia.42.867  

    ISSN: 1340-2625

  181. Microstructural influences on stress migration in electroplated Cu metallization Peer-reviewed

    A Sekiguchi, J Koike, K Maruyama

    APPLIED PHYSICS LETTERS 83 (10) 1962-1964 2003/09

    DOI: 10.1063/1.1609238  

    ISSN: 0003-6951

  182. The activity of non-basal slip systems and dynamic recovery at room temperature in fine-grained AZ31B magnesium alloys Peer-reviewed

    J Koike, T Kobayashi, T Mukai, H Watanabe, M Suzuki, K Maruyama, K Higashi

    ACTA MATERIALIA 51 (7) 2055-2065 2003/04

    DOI: 10.1016/S1359-6454(03)00005-3  

    ISSN: 1359-6454

  183. Grain size dependence of active slip systems in an AZ31 magnesium alloy Peer-reviewed

    T Kobayashi, J Koike, Y Yoshida, S Kamado, M Suzuki, K Maruyama, Y Kojima

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 67 (4) 149-152 2003/04

    DOI: 10.2320/jinstmet1952.67.4_149  

    ISSN: 0021-4876

    eISSN: 1880-6880

  184. Effects of inhomogeneous strain on room-temperature recrystallization in copper thin films Peer-reviewed

    M Wada, J Koike, K Maruyama

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 67 (4) 169-172 2003/04

    DOI: 10.2320/jinstmet1952.67.4_169  

    ISSN: 0021-4876

    eISSN: 1880-6880

  185. Grain-boundary sliding in AZ31 magnesium alloys at room temperature to 523 K Peer-reviewed

    J Koike, R Ohyama, T Kobayashi, M Suzuki, K Maruyama

    MATERIALS TRANSACTIONS 44 (4) 445-451 2003/04

    DOI: 10.2320/matertrans.44.445  

    ISSN: 1345-9678

    eISSN: 1347-5320

  186. Strengthening effect of Zn in heat resistant Mg-Y-Zn solid solution alloys Peer-reviewed

    M Suzuki, T Kimura, J Koike, K Maruyama

    SCRIPTA MATERIALIA 48 (8) 997-1002 2003/04

    DOI: 10.1016/S1359-6462(02)00590-0  

    ISSN: 1359-6462

  187. Hall-Petch parameters for tension and compression in cast Mg Peer-reviewed

    P Andersson, CH Caceres, J Koike

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 123-128 2003

    ISSN: 0255-5476

  188. Effects of zinc on creep behavior and deformation substructures of Mg-Y alloy Peer-reviewed

    M Suzuki, T Kimura, J Koike, K Maruyama

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 473-478 2003

    ISSN: 0255-5476

  189. Anomalous activity of nonbasal dislocations in AZ31 Mg alloys at room temperature Peer-reviewed

    T Kobayashi, J Koike, T Mukai, M Suzuki, H Watanabe, K Maruyama, K Higashi

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 231-236 2003

    ISSN: 0255-5476

  190. Enhanced grain-boundary sliding at room temperature in AZ31 magnesium alloy Peer-reviewed

    R Ohyama, J Koike, T Kobayashi, M Suzuki, K Maruyama

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 237-241 2003

    ISSN: 0255-5476

  191. New deformation mechanisms in fine-grain Mg alloys Peer-reviewed

    J Koike

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 189-194 2003

    ISSN: 0255-5476

  192. Texture development of AZ31 magnesium alloy during ECAE processing Peer-reviewed

    Y Yoshida, L Cisar, S Kamado, JI Koike, Y Kojima

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 533-538 2003

    ISSN: 0255-5476

  193. Magnesium research trend in Japan Peer-reviewed

    S Kamado, J Koike, K Kondoh, Y Kawamura

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 21-33 2003

    ISSN: 0255-5476

  194. Newly developed heat resistant magnesium alloy by thixomolding Peer-reviewed

    T Tsukeda, R Uchida, M Suzuki, J Koike, K Maruyama

    MAGNESIUM ALLOYS 2003, PTS 1 AND 2 419-4 439-444 2003

    ISSN: 0255-5476

  195. Creep behavior and deformation substructure of Mg-Y alloys containing dilute content of zinc Peer-reviewed

    M Suzuki, T Kimura, J Koike, K Maruyama

    THERMEC'2003, PTS 1-5 426-4 593-598 2003

    ISSN: 0255-5476

  196. Self-annealing process and its effects on heat-treated texture in electroplated Cu thin films Peer-reviewed

    M. Wada, J. Koike, K. Maruyama

    Journal of Applied Physics submitted 2003

  197. The correlation of adhesion strength with barrier structure in Cu metallization Peer-reviewed

    A Sekiguchi, J Koike, K Ueoka, J Ye, H Okamura, N Otsuka, S Ogawa, K Maruyama

    MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2003 766 477-482 2003

    ISSN: 0272-9172

  198. Epitaxial growth of SrRuO3 thin film electrode on Si by pulsed laser deposition Peer-reviewed

    T Higuchi, YX Chen, J Koike, S Iwashita, M Ishida, T Shimoda

    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS 41 (11B) 6867-6872 2002/11

    DOI: 10.1143/JJAP.41.6867  

    ISSN: 0021-4922

  199. Microstructure of epitaxial SrRuO3 filMS OD Si(001) substrates Peer-reviewed

    YX Chen, J Koike, T Higuchi, S Iwashita, M Ishida, Shimoda, I

    PHILOSOPHICAL MAGAZINE B-PHYSICS OF CONDENSED MATTER STATISTICAL MECHANICS ELECTRONIC OPTICAL AND MAGNETIC PROPERTIES 82 (16) 1731-1748 2002/11

    DOI: 10.1080/1364281021000050070  

    ISSN: 0141-8637

  200. Effects of crystallographic texture on stress-migration resistance in copper thin films Peer-reviewed

    J Koike, M Wada, M Sanada, K Maruyama

    APPLIED PHYSICS LETTERS 81 (6) 1017-1019 2002/08

    DOI: 10.1063/1.1498495  

    ISSN: 0003-6951

  201. Formation of slit-like voids at trench corners of damascene Cu interconnects Peer-reviewed

    A Sekiguchi, J Koike, K Maruyama

    MATERIALS TRANSACTIONS 43 (7) 1633-1637 2002/07

    DOI: 10.2320/matertrans.43.1633  

    ISSN: 1345-9678

    eISSN: 1347-5320

  202. Fabrication of pseudocubic SrRuO3 (100) epitaxial thin films on Si by pulsed laser deposition Peer-reviewed

    T Higuchi, YX Chen, J Koike, S Iwashita, M Ishida, T Shimoda

    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS 41 (4B) L481-L483 2002/04

    DOI: 10.1143/JJAP.41.L481  

    ISSN: 0021-4922

  203. Novel hexagonal structure of ultra-high strength magnesium-based alloys Peer-reviewed

    A Inoue, M Matsushita, Y Kawamura, K Amiya, K Hayashi, J Koike

    MATERIALS TRANSACTIONS 43 (3) 580-584 2002/03

    DOI: 10.2320/matertrans.43.580  

    ISSN: 1345-9678

    eISSN: 1347-5320

  204. A relationship between film texture and stress-voiding tendency in copper thin films Peer-reviewed

    J Koike, A Sekiguchi, M Wada, K Maruyama

    STRESS-INDUCED PHENOMENA IN METALLIZATION 612 169-176 2002

    ISSN: 0094-243X

  205. Microstructural investigation of pulsed-laser-deposited SrRuO3 films on Si with SrO buffer layers Peer-reviewed

    YX Chen, J Koike, T Higuchi, S Iwashita, M Ishida, T Shimoda

    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS 40 (12A) L1305-L1307 2001/12

    DOI: 10.1143/JJAP.40.L1305  

    ISSN: 0021-4922

  206. Processing and characterization of hydroxyapatite coatings on titanium produced by magnetron sputtering Peer-reviewed

    TG Nieh, AF Jankowski, J Koike

    JOURNAL OF MATERIALS RESEARCH 16 (11) 3238-3245 2001/11

    DOI: 10.1557/JMR.2001.0446  

    ISSN: 0884-2914

    eISSN: 2044-5326

  207. Effect of microstructure on fracture characteristics of Ti-6Al-2Sn-2Zr-2Mo-2Cr-Si Peer-reviewed

    M Niinomi, KI Fukunaga, Gunawarman, G Tono, J Koike, D Eylon, S Fujishiro

    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE 32 (11) 2795-2804 2001/11

    DOI: 10.1007/s11661-001-1030-9  

    ISSN: 1073-5623

  208. Void formation by thermal stress concentration at twin interfaces in Cu thin films Peer-reviewed

    A Sekiguchi, J Koike, S Kamiya, M Saka, K Maruyama

    APPLIED PHYSICS LETTERS 79 (9) 1264-1266 2001/08

    DOI: 10.1063/1.1399021  

    ISSN: 0003-6951

  209. Novel hexagonal structure and ultrahigh strength of magnesium solid solution in the Mg-Zn-Y system Peer-reviewed

    A Inoue, Y Kawamura, M Matsushita, K Hayashi, J Koike

    JOURNAL OF MATERIALS RESEARCH 16 (7) 1894-1900 2001/07

    DOI: 10.1557/JMR.2001.0260  

    ISSN: 0884-2914

  210. Effect of microstructure on fracture characteristics of Ti-6Al-2Sn-2Mo-2Zr-2Cr-Si alloy Peer-reviewed

    M Niinomi, K Fukunaga, G Tono, J Koike, D Eylon, S Fujishiro

    TETSU TO HAGANE-JOURNAL OF THE IRON AND STEEL INSTITUTE OF JAPAN 87 (1) 55-62 2001/01

    DOI: 10.2355/tetsutohagane1955.87.1_55  

    ISSN: 0021-1575

  211. A large depression of the b transus temperature by mechanical deformation in two-phase Ti alloys Peer-reviewed

    J. Koike, Y. Shimoyama, K. Maruyama

    Proc. of the 2nd Int. Symp. on Desiging, Processing and Properties of Advanced Eng. Mater. 256-258 2001

  212. A new class of stress-induced phase transformation and its effects on superplasticity in two-phase titanium alloys Peer-reviewed

    J Koike, T Okamura, Y Fujinaga, K Maruyama

    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II in print 2047-2050 2001

  213. Strength and ductility of Mg alloys Peer-reviewed

    J Koike

    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II 1179-1182 2001

  214. Strengthening mechanisms of creep resistant tempered martensitic steel Peer-reviewed

    K Maruyama, K Sawada, J Koike

    ISIJ INTERNATIONAL 41 (6) 641-653 2001

    DOI: 10.2355/isijinternational.41.641  

    ISSN: 0915-1559

  215. A new class of stress-induced phase transformation and its effects on superplasticity in two-phase titanium alloys Peer-reviewed

    J Koike, T Okamura, Y Fujinaga, K Maruyama

    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II 2047-2050 2001

  216. Development of rapidly solidified powder metallurgy magnesium alloys with excellent yield strength above 600 MPa Peer-reviewed

    Y Kawamura, K Hayashi, J Koike, A Inoue

    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II 1171-1174 2001

  217. Effects of initial microstructure on creep behavior of precipitation-hardened Mg-Y alloys at 530K Peer-reviewed

    M Suzuki, T Kimura, H Sato, J Koike, K Maruyama, H Oikawa

    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II 1163-1166 2001

  218. Effects of the liquid phase on tensile elongation of Al-Bi alloy Peer-reviewed

    J Koike, K Miki, H Takahashi, K Maruyama

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 285 (1-2) 158-164 2000/06

    DOI: 10.1016/S0921-5093(00)00641-9  

    ISSN: 0921-5093

  219. Stress-induced phase transformation during superplastic deformation in two-phase Ti-Al-Fe alloy Peer-reviewed

    J Koike, Y Shimoyama, Ohnuma, I, T Okamura, R Kainuma, K Ishida, K Maruyama

    ACTA MATERIALIA 48 (9) 2059-2069 2000/05

    DOI: 10.1016/S1359-6454(00)00049-5  

    ISSN: 1359-6454

  220. Microstructural and morphological changes during thermal cycling of Cu thin films Peer-reviewed

    A Sekiguchi, J Koike, K Maruyama

    JOURNAL OF THE JAPAN INSTITUTE OF METALS 64 (5) 379-382 2000/05

    DOI: 10.2320/jinstmet1952.64.5_379  

    ISSN: 0021-4876

    eISSN: 1880-6880

  221. Effects of yttrium on creep behavior and deformation substructures of magnesium Peer-reviewed

    M Suzuki, R Inoue, M Sugihara, H Sato, J Koike, K Maruyama, H Oikawa

    MAGNESIUM ALLOYS 2000 350-3 151-156 2000

    ISSN: 0255-5476

  222. Mechanical properties of rapidly solidified Mg-Zn alloys Peer-reviewed

    J Koike, Y Kawamura, K Hayashi, M Suzuki, K Maruyama, A Inoue

    MAGNESIUM ALLOYS 2000 350-3 105-110 2000

    ISSN: 0255-5476

  223. Structure and mechanical properties of rapidly solidified Mg-X alloys Peer-reviewed

    K Hayashi, Y Kawamura, J Koike, K Higashi, A Inoue

    MAGNESIUM ALLOYS 2000 350-3 117-122 2000

    ISSN: 0255-5476

  224. High strength nanocrystalline Mg-Al-Ca alloys produced by rapidly solidified powder metallurgy processing Peer-reviewed

    Y Kawamura, K Hayashi, J Koike, A Kato, A Inoue, T Masumoto

    MAGNESIUM ALLOYS 2000 350-3 111-116 2000

    ISSN: 0255-5476

  225. Mechanical properties and microstructure of heat-resistant Mg-Al-Ca alloys formed by thixomolding Peer-reviewed

    T Tsukeda, A Maehara, K Saito, M Suzuki, J Koike, K Maruyama, H Kubo

    MAGNESIUM TECHNOLOGY 2000 395-402 2000

  226. Effects of alloying elements on the creep resistance of thixomolded Mg-Al-Ca-X (X=S, Zn, Mn, Ba, Sr) Peer-reviewed

    T. Tsukeda, R. Uchida, K. Saito, M. Suzuki, J. Koike, K. Maruyama, H. Kubo

    DGM 47-52 2000

  227. Creep behavior and deformation substructures of thixomolded Mg-Al-Ca alloys Peer-reviewed

    M. Suzuki, J. Koike, K. Maruyama, T. Tsukeda, K. Saito, H. Kubo

    DGM 699-704 2000

  228. Study of primary creep in Ti-6-22-22S alloys Peer-reviewed

    J Koike, K Maruyama

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 263 (2) 155-159 1999/05

    ISSN: 0921-5093

  229. Effects of grain-boundary liquid phase on high strain rate superplasticity Peer-reviewed

    Junichi Koike

    Keikinzoku/Journal of Japan Institute of Light Metals 49 (8) 373-377 1999

    Publisher: Japan Institute of Light Metals

    DOI: 10.2464/jilm.49.373  

    ISSN: 0451-5994

  230. Fatigue of bi-lamellar microstructures Peer-reviewed

    G Schroeder, J Albrecht, G Lutjering, J Koike, KD Folkers, C Liesner

    FATIGUE BEHAVIOR OF TITANIUM ALLOYS 31-38 1999

  231. Superplasticity assisted by stress-induced phase transformation in Ti-5.5Al-1Fe alloy Peer-reviewed

    J Koike, Y Shimoyama, T Okamura, K Maruyama

    TOWARDS INNOVATION IN SUPERPLASTICITY II 304-3 183-188 1999

    ISSN: 0255-5476

  232. Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon Peer-reviewed

    J Koike, S Utsunomiya, Y Shimoyama, K Maruyama, H Oikawa

    JOURNAL OF MATERIALS RESEARCH 13 (11) 3256-3264 1998/11

    DOI: 10.1557/JMR.1998.0442  

    ISSN: 0884-2914

  233. Characterization of superplasticity in Ti-5.5Al-1Fe alloys Peer-reviewed

    J Koike, Y Shimoyama, H Fujii, K Maruyama

    SCRIPTA MATERIALIA 39 (8) 1009-1014 1998/09

    DOI: 10.1016/S1359-6462(98)00286-3  

    ISSN: 1359-6462

  234. Effects of the liquid phase on the high-temperature tensile ductility: from embrittlement to superplasticity Peer-reviewed

    J Koike, K Miki, K Maruyama, H Oikawa

    PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES 78 (3) 599-614 1998/09

    DOI: 10.1080/014186198253408  

    ISSN: 0141-8610

  235. The Nb-U (niobium-uranium) system Peer-reviewed

    J Koike, ME Kassner, RE Tate, RS Rosen

    JOURNAL OF PHASE EQUILIBRIA 19 (3) 253-260 1998/06

    ISSN: 1054-9714

  236. Amorphization of NiTi Alloy by Cold Rolling

    KOIKE Junichi

    Materia Japan 37 (5) 373-373 1998/05/20

    Publisher: The Japan Institute of Metals and Materials

    DOI: 10.2320/materia.37.373  

    ISSN: 1340-2625

  237. Thermal cycling fatigue in aluminum-alloy thin films on silicon substrate Peer-reviewed

    J Koike, S Utsunomiya, K Maruyama

    THIN-FILMS - STRESSES AND MECHANICAL PROPERTIES VII 505 319-324 1998

    ISSN: 0272-9172

  238. Enhancement of tensile elongation in polycrystalline aluminum containing liquid bismuth Peer-reviewed

    J. Koike, K. Miki, K. Maruyama, T. Ohide, H. Oikawa

    Superplastic Materials 177-184 1998

  239. Effects of surface oxide layer on thermal cycling in aluminum alloy thin films deposited on silicon substrates Peer-reviewed

    S Utsunomiya, J Koike, K Maruyama

    STRESS INDUCED PHENOMENA IN METALLIZATION - FOURTH INTERNATIONAL WORKSHOP (418) 283-288 1998

    ISSN: 0094-243X

  240. Effects of grain boundary amorphous phase on high-temperature ductility in alumina polycrystals Peer-reviewed

    J Koike, H Oikawa, S Wakiya, T Takeda, K Maruyama

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 234 529-532 1997/08

    DOI: 10.1016/S0921-5093(97)00286-4  

    ISSN: 0921-5093

  241. Influence of liquid-phase inclusion on high-temperature deformation behavior in Al-Bi alloys Peer-reviewed

    J Koike, K Miki, K Maruyama, H Oikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 234 525-528 1997/08

    ISSN: 0921-5093

  242. Examination of deformation mechanism maps in 2.25Cr-1Mo steel by creep tests at strain rates of 10(-11) to 10(-6) s(-1) Peer-reviewed

    K Maruyama, K Sawada, J Koike, H Sato, K Yagi

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 224 (1-2) 166-172 1997/03

    ISSN: 0921-5093

  243. High temperature deformation characteristics of sintered alumina having amorphous grain boundaries Peer-reviewed

    J Koike, K Maruyama, H Oikawa

    TOWARDS INNOVATION IN SUPERPLASTICITY I 233-2 351-358 1997

    ISSN: 0255-5476

  244. Microstructure and superplasticity in Al-Mg alloy composites reinforced with silicon nitride particles Peer-reviewed

    J. Koike

    Materials Science Forum 243-245 277-285 1997

  245. Improvement of omega method for creep life prediction Peer-reviewed

    K Maruyama, Nonaka, I, K Sawada, H Sato, J Koike, H Umaki

    ISIJ INTERNATIONAL 37 (4) 419-423 1997

    DOI: 10.2355/isijinternational.37.419  

    ISSN: 0915-1559

  246. Mechanical properties and microstructure of centrifugally compacted alumina and hot-isostatically-pressed alumina Peer-reviewed

    J Koike, S Tashima, S Wakiya, K Maruyama, H Oikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 220 (1-2) 26-34 1996/12

    DOI: 10.1016/S0921-5093(96)10439-1  

    ISSN: 0921-5093

  247. Testing Methods of the Strength of Thin Films

    KOIKE Jun-ichi

    Bulletin of the Japan Institute of Metals 35 (10) 1126-1132 1996/10/20

    Publisher: The Japan Institute of Metals and Materials

    DOI: 10.2320/materia.35.1126  

    ISSN: 1340-2625

  248. High temperature strength of alpha Ti-Al alloys with a locally ordered structure Peer-reviewed

    J Koike, K Egashira, K Maruyama, H Oikawa

    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 213 (1-2) 98-102 1996/08

    DOI: 10.1016/0921-5093(96)10227-6  

    ISSN: 0921-5093

  249. Formation Of Si_3N_4 during the Direct Nitridation of Si Single Crystal

    SHlNMI Akio, KOIKE Jun-ichi, KIMURA Shoichi, MARUYAMA Kouichi, OIKAWA Hiroshi

    Journal of the Ceramic Society of Japan 104 (1211) 662-667 1996/07/01

    Publisher: The Ceramic Society of Japan

    DOI: 10.2109/jcersj.104.662  

    ISSN: 1882-1022

    More details Close

    Single crystal Si was nitrided in a fluidized-bed reactor. The volume fraction of the α/β phases and the nitridation process were studied by X-ray diffraction and electron microscopy. No difference in the α/β ratio and the nitridation rate were found between pure Si single crystal and commercial Si powder including impurities. This indicates that the α/β ratio is not affected by the impurity content. Microstructural observation revealed the internal fracture of Si to several-micron pieces and the formation of Si_3N_4 needles in the early stage of nitridation. Pores were also observed in the fractured Si pieces and the size increased with the progress of nitridation. Aggregation of Si_3N_4 in a band shape and a group of dislocations, forming small angle boundaries, were also observed in the Si piece. The fracture of the Si single crystal appears to be caused by segregation of nitrogen along dislocations, introduced during fluidization, and subsequent formation of Si_3N_4.

  250. Formation of Si3N4 during the direct nitridation of Si single crystal Peer-reviewed

    A Shinmi, J Koike, S Kimura, K Maruyama, H Oikawa

    JOURNAL OF THE CERAMIC SOCIETY OF JAPAN 104 (7) 662-667 1996/07

    DOI: 10.2109/jcersj.104.662  

    ISSN: 1882-0743

    eISSN: 1348-6535

  251. Formation of Si3N4 during the direct nitridation of Si single crystal Peer-reviewed

    A Shinmi, J Koike, S Kimura, K Maruyama, H Oikawa

    JOURNAL OF THE CERAMIC SOCIETY OF JAPAN 104 (7) 662-667 1996/07

    DOI: 10.2109/jcersj.104.662  

    ISSN: 1882-0743

    eISSN: 1348-6535

  252. Structural and residual stress changes in Mo/a-Si multilayer thin films with annealing Peer-reviewed

    ME Kassner, FJ Weber, J Koike, RS Rosen

    JOURNAL OF MATERIALS SCIENCE 31 (9) 2291-2299 1996/05

    DOI: 10.1007/BF01152937  

    ISSN: 0022-2461

    eISSN: 1573-4803

  253. Anomalous high temperature strengthening in concentrated alpha titanium-aluminum alloys Peer-reviewed

    J Koike, H Oikawa

    SCRIPTA MATERIALIA 34 (5) 797-801 1996/03

    DOI: 10.1016/1359-6462(95)00574-9  

    ISSN: 1359-6462

  254. Mechanism of nitridation of silicon powder in a fluidized-bed reactor Peer-reviewed

    J Koike, S Kimura

    JOURNAL OF THE AMERICAN CERAMIC SOCIETY 79 (2) 365-370 1996/02

    DOI: 10.1111/j.1151-2916.1996.tb08130.x  

    ISSN: 0002-7820

  255. Influence of composition on creep of alpha-two Ti3Al polycrystals Peer-reviewed

    K. Maruyama, J. Koike, H. Oikawa

    Proc. of the 8th World Conference on Titanium 348-355 1996

  256. High temperature deformation characteristics of sintered alumina having amorphous grain boundaries Peer-reviewed

    J. Koike, S. Tashima, S. Wakiya, K. Maruyama, O. Oikawa

    Materials Science and Engineering A A220 26-34 1996

  257. IN-SITU OBSERVATION OF PARTIAL MELTING IN SUPERPLASTIC ALUMINUM-ALLOY COMPOSITES AT HIGH-TEMPERATURES Peer-reviewed

    J KOIKE, M MABUCHI, K HIGASHI

    ACTA METALLURGICA ET MATERIALIA 43 (1) 199-206 1995/01

    DOI: 10.1016/0956-7151(95)90275-9  

    ISSN: 0956-7151

  258. PARTIAL MELTING AND SEGREGATION BEHAVIOR IN A SUPERPLASTIC SI3N4/AL-MG ALLOY COMPOSITE Peer-reviewed

    J KOIKE, M MABUCHI, K HIGASHI

    JOURNAL OF MATERIALS RESEARCH 10 (1) 133-138 1995/01

    DOI: 10.1557/JMR.1995.0133  

    ISSN: 0884-2914

  259. DIMENSIONAL CHANGES IN HIGHLY ORIENTED PYROLYTIC-GRAPHITE DUE TO ELECTRON-IRRADIATION Peer-reviewed

    J KOIKE, DF PEDRAZA

    JOURNAL OF MATERIALS RESEARCH 9 (7) 1899-1907 1994/07

    DOI: 10.1557/JMR.1994.1899  

    ISSN: 0884-2914

  260. DIMENSIONAL CHANGES IN GRADE H-451 NUCLEAR GRAPHITE DUE TO ELECTRON-IRRADIATION Peer-reviewed

    DF PEDRAZA, J KOIKE

    CARBON 32 (4) 727-734 1994

    DOI: 10.1016/0008-6223(94)90095-7  

    ISSN: 0008-6223

  261. PROCESSING AND DEVELOPMENT OF SUPERPLASTIC METAL MATRIX COMPOSITES Peer-reviewed

    M MABUCHI, J KOIKE, H IWASAKI, K HIGASHI, TG LANGDON

    SUPERPLASTICITY IN ADVANCED MATERIALS - ICSAM-94 170- 503-512 1994

    ISSN: 0255-5476

  262. ELASTIC INSTABILITY OF CRYSTALS CAUSED BY STATIC ATOM DISPLACEMENT - A MECHANISM FOR SOLID-STATE AMORPHIZATION Peer-reviewed

    J KOIKE

    PHYSICAL REVIEW B 47 (13) 7700-7704 1993/04

    DOI: 10.1103/PhysRevB.47.7700  

    ISSN: 0163-1829

  263. TENSILE BEHAVIOR OF COLD-ROLLED NITI HAVING AN AMORPHOUS-CRYSTALLINE COMPOSITE MICROSTRUCTURE Peer-reviewed

    J KOIKE, HW SIZEK

    MECHANICAL PROPERTIES AND DEFORMATION BEHAVIOR OF MATERIALS HAVING ULTRA-FINE MICROSTRUCTURES 233 323-328 1993

  264. STRUCTURAL-CHANGE OF GRAPHITE DURING ELECTRON-IRRADIATION Peer-reviewed

    J KOIKE, DF PEDRAZA

    BEAM SOLID INTERACTIONS : FUNDAMENTALS AND APPLICATIONS 279 67-72 1993

    ISSN: 0272-9172

  265. STRUCTURAL-CHANGES INDUCED BY ELECTRON-IRRADIATION IN GRAPHITE Peer-reviewed

    J KOIKE, DF PEDRAZA

    INTERNATIONAL CONFERENCE ON BEAM PROCESSING OF ADVANCED MATERIALS 519-536 1993

  266. KINETICS OF INTERLAYER GROWTH AND CHANGES IN RESIDUAL ELASTIC STRAIN DURING ANNEALING OF MO/SI MULTILAYERS Peer-reviewed

    RS ROSEN, DG STEARNS, ME KASSNER, JI KOIKE, Y CHENG, SP VERNON

    NANOSTRUCTURED MATERIALS 3 (1-6) 195-202 1993

    ISSN: 0965-9773

  267. DISPLACEMENT THRESHOLD ENERGY FOR TYPE-IIA DIAMOND Peer-reviewed

    J KOIKE, DM PARKIN, TE MITCHELL

    APPLIED PHYSICS LETTERS 60 (12) 1450-1452 1992/03

    DOI: 10.1063/1.107267  

    ISSN: 0003-6951

  268. FORMATION OF DEFECT CLUSTERS IN ELECTRON-IRRADIATED DIAMOND AT 16-K AND 87-K Peer-reviewed

    J KOIKE, TE MITCHELL, DM PARKIN

    APPLIED PHYSICS LETTERS 59 (20) 2515-2517 1991/11

    DOI: 10.1063/1.105938  

    ISSN: 0003-6951

  269. CORRELATION BETWEEN THE ELASTIC SHEAR INSTABILITY MECHANISM AND EMPIRICAL CRITERIA FOR IRRADIATION-INDUCED AMORPHIZATION Peer-reviewed

    J KOIKE, PR OKAMOTO, LE REHN, M MESHII

    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS 59 471-474 1991/07

    ISSN: 0168-583X

  270. NUCLEATION AND GROWTH OF A BCC FE PHASE DEPOSITED ON A SINGLE-CRYSTAL (001) CU FILM Peer-reviewed

    J KOIKE

    SCRIPTA METALLURGICA ET MATERIALIA 25 (3) 663-668 1991/03

    DOI: 10.1016/0956-716X(91)90111-D  

    ISSN: 0956-716X

  271. AMORPHOUS PHASE FORMATION IN NITI DURING COLD-ROLLING Peer-reviewed

    J KOIKE, DM PARKIN, M NASTASI

    ALLOY PHASE STABILITY AND DESIGN 186 161-167 1991

  272. MICROSTRUCTURAL EVOLUTION OF FE GROWN ON A (001)CU FILM AND ITS IMPLICATION TO THE ELASTIC ANOMALY IN METALLIC SUPERLATTICES Peer-reviewed

    J KOIKE, M NASTASI

    EVOLUTION OF THIN-FILM AND SURFACE MICROSTRUCTURE 202 13-18 1991

  273. THE ROLE OF SHEAR INSTABILITY IN AMORPHIZATION OF COLD-ROLLED NITI Peer-reviewed

    J KOIKE, DM PARKIN, M NASTASI

    PHILOSOPHICAL MAGAZINE LETTERS 62 (4) 257-264 1990/10

    DOI: 10.1080/09500839008215132  

    ISSN: 0950-0839

  274. AMORPHIZATIONIN ZR3AI IRRADIATED WITH 1-MEVE- AND KR+ Peer-reviewed

    J KOIKE, PR OKAMOTO, LE REHN, M MESHII

    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE 21 (7) 1799-1808 1990/07

    DOI: 10.1007/BF02647225  

    ISSN: 0360-2133

  275. CRYSTAL-TO-AMORPHOUS TRANSFORMATION OF NITI INDUCED BY COLD-ROLLING Peer-reviewed

    J KOIKE, DM PARKIN, M NASTASI

    JOURNAL OF MATERIALS RESEARCH 5 (7) 1414-1418 1990/07

    DOI: 10.1557/JMR.1990.1414  

    ISSN: 0884-2914

    eISSN: 2044-5326

  276. IRRADIATION-INDUCED AMORPHIZATION AND ELASTIC SHEAR INSTABILITY IN INTERMETALLIC COMPOUNDS Peer-reviewed

    J KOIKE, PR OKAMOTO, LE REHN, R BHADRA, MH GRIMSDITCH, M MESHII

    BEAM-SOLID INTERACTIONS : PHYSICAL PHENOMENA 157 777-782 1990

  277. AMORPHIZATION OF GE/AL OR SI/AL BILAYER SPECIMENS INDUCED BY 1 MEV ELECTRON-IRRADIATION AT 10-K Peer-reviewed

    XW LIN, J KOIKE, DN SEIDMAN, PR OKAMOTO

    PHILOSOPHICAL MAGAZINE LETTERS 60 (5) 233-240 1989/11

    DOI: 10.1080/09500838908206463  

    ISSN: 0950-0839

  278. THE DOSE, TEMPERATURE, AND PROJECTILE-MASS DEPENDENCE FOR IRRADIATION-INDUCED AMORPHIZATION OF CUTI Peer-reviewed

    J KOIKE, PR OKAMOTO, LE REHN, M MESHII

    JOURNAL OF MATERIALS RESEARCH 4 (5) 1143-1150 1989/09

    DOI: 10.1557/JMR.1989.1143  

    ISSN: 0884-2914

  279. The effect of simultaneous electron and Kr+ irradiation on amorphization of CuTi Peer-reviewed

    J. Koike, P. R. Okamoto, L. E. Rehn, M. Meshii

    Materials Research Society Symposium Proceedings 128 339-344 1989

  280. Amorphization of Zr3Al by hydrogenation and subsequent electron irradiation Peer-reviewed

    W. J. Meng, J. Koike, P.R. Okamoto, L.E.Rehn

    Materials Research Society Symposium Proceedings 128 345-350 1989

  281. EFFECT OF PROJECTILE MASS ON AMORPHIZATION OF CUTI Peer-reviewed

    J KOIKE, PR OKAMOTO, M MESHII

    JOURNAL OF NON-CRYSTALLINE SOLIDS 106 (1-3) 230-235 1988/12

    DOI: 10.1016/0022-3093(88)90265-7  

    ISSN: 0022-3093

  282. ELECTRON-IRRADIATION INDUCED AMORPHIZATION IN YBA2CU3O7 AND GDBA2CU3O7 SUPERCONDUCTORS Peer-reviewed

    M NASTASI, DM PARKIN, TG ZOCCO, J KOIKE, PR OKAMOTO

    APPLIED PHYSICS LETTERS 53 (14) 1326-1328 1988/10

    DOI: 10.1063/1.100451  

    ISSN: 0003-6951

  283. The projectile mass dependence of the amorphization process and the critical temperature in the ion irradiated CuTi Peer-reviewed

    J. Koike, P. R. Okamoto, M. Meshii

    Materials Research Society Symposium Proceedings 100 57-62 1988

  284. Temperature dependence of amorphization above 10K in the CuTi intermetallic compound under electron irradiation Peer-reviewed

    J. Koike, D. E. Luzzi, M. Meshii, P.R. Okamoto

    Materials Research Society Symposium Proceedings 74 425-430 1987

  285. MASSIVE AND MARTENSITE TRANSFORMATIONS IN SN-CD ALLOYS Peer-reviewed

    J KOIKE, Y KOYAMA, O NITTONO

    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS 27 (4) 254-259 1986/04

    DOI: 10.2320/matertrans1960.27.254  

    ISSN: 0021-4434

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Misc. 149

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    日本金属学会講演大会(Web) 172nd 2023

  2. Effect of an oxide layer at Co/Si interface on Schottky barrier height and contact resistivity

    119 (239) 35-38 2019/10/23

    Publisher: 電子情報通信学会

    ISSN: 0913-5685

  3. 異なるLPSO相量を有するMg-Zn-Gd系合金圧延材の機械特性と組織の関係

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    応用物理学会春季学術講演会講演予稿集(CD-ROM) 66th 2019

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    日本金属学会講演概要(CD-ROM) 164th 2019

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    金属 88 (8) 2018

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    日本金属学会講演概要(CD-ROM) 162nd 2018

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  20. 逆抵抗変化Cr2Ge2Te6相変化材料の結晶化メカニズム

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    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 79th 2018

  21. 超軽量形状記憶マグネシウム合金の開発

    須藤 祐司, 小川由 希子, 安藤 大輔, 小池 淳一

    47 (2) 2017/02

  22. Mg-Sc基合金における時効硬化挙動

    安藤大輔, 竹内悠太, 須藤祐司, 小川由希子, 小池淳一

    軽金属学会大会講演概要 133rd 2017

    ISSN: 1882-6083

  23. bcc/hcp相変態を利用したhcp単相Mg-Sc合金の集合組織制御

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 160th 2017

    ISSN: 2433-3093

  24. α-MnTe薄膜の光学および電気的特性

    森竣祐, 須藤祐司, 安藤大輔, 小池淳一

    日本金属学会講演概要(CD-ROM) 161st 2017

    ISSN: 2433-3093

  25. Fe-Mn-Al-C系高抵抗合金の比抵抗およびその温度係数に及ぼす熱処理の影響

    飯塚将俊, 須藤祐司, 安藤大輔, 小池淳一, 石田清仁

    日本金属学会講演概要(CD-ROM) 161st 2017

    ISSN: 2433-3093

  26. Mg-Sc合金の時効析出過程

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一, 染川英俊

    日本金属学会講演概要(CD-ROM) 161st 2017

    ISSN: 2433-3093

  27. Cr-Mo-Cu-N被膜の機械的性質および膜組織に及ぼす基板加熱の影響

    鈴木優太, 須藤祐司, 安藤大輔, 小池淳一

    日本金属学会講演概要(CD-ROM) 161st 2017

    ISSN: 2433-3093

  28. Mg-Sc合金へのZn添加がマルテンサイト変態温度並びに形状記憶特性に与える影響

    竹内悠太, 小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 161st 2017

    ISSN: 2433-3093

  29. 亜酸化銅の形成による銅ペーストの低温焼成

    城戸光一, 斎藤友大, ホアン チハイ, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 160th 2017

    ISSN: 2433-3093

  30. Mg-Y合金における球形圧子を用いたナノインデンテーション応答

    安藤大輔, 須藤祐司, 小池淳一, POOLE Warren

    日本金属学会講演概要(CD-ROM) 160th 2017

    ISSN: 2433-3093

  31. LSI多層配線の単層拡散バリア層としての非晶質コバルト合金の特性

    HOSSEINI Maryamsadat, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 64th 2017

    ISSN: 2436-7613

  32. LSI配線におけるZn添加によるCu/SiO2間の相互拡散バリア性評価

    城戸光一, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 78th 2017

    ISSN: 2758-4704

  33. Cu配線を用いたSi太陽電池におけるTa酸化物バリア層の特性評価

    青山悠生, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 78th 2017

    ISSN: 2758-4704

  34. 青色レーザーを用いたCu電極とSi太陽電池基板間のコンタクト形成

    雑賀真晃, 安藤大輔, 須藤祐司, 小池淳一, 坂本隼規, 諏訪雅也, 東條公資, 山蔭康弘

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 64th 2017

    ISSN: 2436-7613

  35. 青色レーザーを用いたCu電極とSi太陽電池基板間のコンタクト形成

    雑賀真晃, 安藤大輔, 須藤祐司, 小池淳一, 坂本隼規, 諏訪雅也, 東條公資, 山蔭康弘

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 78th 2017

    ISSN: 2436-7613

  36. Mg-Y希薄合金におけるエリクセン試験中の結晶配向変化挙動

    鈴木哲, 安藤大輔, 染川英俊, 須藤祐司, 小池淳一

    日本金属学会誌 80 (8) 2016

    ISSN: 0021-4876

  37. Mg-Sc合金の機械的・機能的性質に及ぼす組織の影響

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 158th 2016

    ISSN: 2433-3093

  38. Cr-Mo-N被膜の硬度および耐摩耗性に及ぼすCu添加の影響

    鈴木優太, 小池淳一, 須藤祐司, 安藤大輔

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  39. BCC+HCP二相組織を有するMg-Sc-Zn合金の機械的性質

    竹内悠太, 小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  40. Cu合金を用いた超微細配線へのダイナミックリフロー挙動

    齋藤友大, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  41. bcc型Mg-Sc合金における超弾性効果の発現

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  42. 超微細LSI配線におけるアモルファスCo-Hf合金の拡散バリア層としての可能性

    小出紘之, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  43. Ti-V-C-N膜の硬さおよび摩耗特性

    澁谷臨, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  44. LSI多層配線におけるCuリフロー挙動の拡散クリープ機構による考察

    佐藤宏太郎, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  45. プライマー層を用いたCu/AlN接合界面の密着強度改善

    佐藤宏太郎, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 2016

    ISSN: 2436-7613

  46. CVD法によるMnOx拡散バリア層の形成に伴うポーラスSiOCHへのMn拡散

    小出紘之, WANG Hao, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 2016

    ISSN: 2436-7613

  47. Cu配線を用いたシリコン太陽電池における作製プロセスの最適化

    青山悠生, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 2016

    ISSN: 2758-4704

  48. 並列抵抗変化によるシリコン太陽電池PID挙動の解析

    小野寺幸貴, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 2016

    ISSN: 2758-4704

  49. 青色レーザーによるSiN反射防止膜除去とCu電極太陽電池セルの電気特性

    雑賀真晃, 安藤大輔, 須藤祐司, 小池淳一, 坂本隼規, 諏訪雅也, 東條公資, 山蔭康弘

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 77th 2016

    ISSN: 2436-7613

  50. Cr-Ge-Te化合物薄膜の相変化挙動

    畑山祥吾, 進藤怜史, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 63rd 2016

  51. Ge-Te薄膜の相変化挙動に及ぼすCr添加の影響

    畑山祥吾, 進藤怜史, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  52. W電極/GeCu2Te3相変化材料間のコンタクト抵抗

    進藤怜史, 須藤祐司, 安藤大輔, 小池淳一, 齊藤雄太

    日本金属学会講演概要(CD-ROM) 159th 2016

    ISSN: 2433-3093

  53. Mg-Y合金圧延材の再結晶過程と集合組織変化

    鈴木哲, 安藤大輔, 須藤祐司, 小池淳一

    軽金属 65 (7) 2015

    ISSN: 0451-5994

  54. Mg-Y希薄合金の一軸引張試験における変形・破壊挙動の調査

    安藤大輔, 鈴木哲, HUO Qinghuan, 小川由希子, 小池淳一

    軽金属学会大会講演概要 128th 2015

    ISSN: 1882-6083

  55. Mg-Y希薄合金の一軸および二軸引張変形による集合組織変化

    鈴木哲, 安藤大輔, 小川由希子, 染川英俊, 須藤祐司, 小池淳一

    軽金属学会大会講演概要 128th 2015

    ISSN: 1882-6083

  56. Mg-Sc合金の時効硬化挙動

    小川由希子, 安藤大輔, 鈴木哲, 須藤祐司, 小池淳一

    軽金属学会大会講演概要 128th 2015

    ISSN: 1882-6083

  57. bcc+hcp二相組織を有するMg-Sc合金の時効硬化挙動

    小川由希子, 安藤大輔, 鈴木哲, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 156th 2015

    ISSN: 2433-3093

  58. 時効硬化したMg-Sc合金の機械的特性

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 157th 2015

    ISSN: 2433-3093

  59. 双晶を考慮した六方晶の結晶塑性モデルによるMgY合金成形限界解析

    村松眞由, 寺田賢二郎, 安藤大輔, 小池淳一

    日本金属学会講演概要(CD-ROM) 157th 2015

    ISSN: 2433-3093

  60. Mg-Y希薄合金押出材における変形双晶形成機構の初期結晶配向依存性

    鈴木哲, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 157th 2015

    ISSN: 2433-3093

  61. Mo含有硬質被膜のH/E*と摩擦摩耗の関係

    豊田智亮, 市村康, 小宮山翔子, 小宮山翔子, 安藤大輔, 須藤祐司, 小池淳一, 王び

    日本金属学会講演概要(CD-ROM) 157th 2015

    ISSN: 2433-3093

  62. Mg-Y希薄合金のエリクセン試験による組織変化観察

    鈴木哲, 安藤大輔, 小川由希子, 染川英俊, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 156th 2015

    ISSN: 2433-3093

  63. Y極希薄添加Mg合金押出材の室温引張変形挙動

    安藤大輔, 鈴木哲, 小川由希子, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 156th 2015

    ISSN: 2433-3093

  64. c-Si太陽電池電極向けスクリーン印刷用銅ペーストの特性評価

    大坪賢明, 櫻井孝之, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 2015

    ISSN: 2758-4704

  65. Cr-Ge-Te薄膜の相変化挙動

    畑山祥吾, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 2015

  66. W電極上のGeCu2Te3の相変態に伴う界面接触抵抗変化

    進藤怜史, 須藤祐司, 小池淳一, 齊藤雄太

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 2015

  67. GeTe-CuTe擬二元系薄膜の相変化挙動

    須藤祐司, 齊藤雄太, 進藤怜史, 小池淳一

    応用物理学会秋季学術講演会講演予稿集(CD-ROM) 76th 2015

  68. BCC/HCP二相組織を有するMg-Sc合金の機械強度と組織

    安藤大輔, 鈴木哲, 須藤祐司, 小池淳一

    軽金属学会大会講演概要 126th 2014

    ISSN: 1882-6083

  69. Mg-0.6at.%Y合金における熱間圧延及び静的再結晶による組織変化の観察

    鈴木哲, 安藤大輔, 須藤祐司, 小池淳一

    軽金属学会大会講演概要 126th 2014

    ISSN: 1882-6083

  70. 結晶塑性FEMとMulti Phase Field法を用いたMgY合金の連成解析

    寺田賢二郎, 石田智広, 安藤大輔, 小池淳一

    日本金属学会講演概要(CD-ROM) 154th 2014

    ISSN: 2433-3093

  71. Mo-O-N系薄膜の内部組織および摩擦摩耗特性

    須藤祐司, 小宮山翔子, 小宮山翔子, 安藤大輔, 小池淳一, WANG Mei

    日本金属学会講演概要(CD-ROM) 155th 2014

    ISSN: 2433-3093

  72. Mg-Y合金の室温変形による動的再結晶組織形成過程の観察

    安藤大輔, 鈴木哲, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 154th 2014

    ISSN: 2433-3093

  73. Ti-Mo-C-N膜の硬さおよび摩擦摩耗特性

    豊田智亮, 小宮山翔子, 小宮山翔子, 安藤大輔, 須藤祐司, 小池淳一, WANG Mei

    日本金属学会講演概要(CD-ROM) 155th 2014

    ISSN: 2433-3093

  74. Mg-Sc合金におけるhcp+bcc二相領域の決定および二相合金の機械的性質

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 155th 2014

    ISSN: 2433-3093

  75. BCC/HCP二相Mg-Sc合金の時効硬化挙動

    安藤大輔, 小川由希子, 鈴木哲, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 155th 2014

    ISSN: 2433-3093

  76. Cu/Si界面のMn酸化物拡散バリア層の特性評価

    田辺成俊, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 155th 2014

    ISSN: 2433-3093

  77. 種々の酸素流量で成膜した二元系Fe-O薄膜の電気的特性

    小川由希子, 須藤祐司, 安藤大輔, 小池淳一

    応用物理学会春季学術講演会講演予稿集(CD-ROM) 61st 2014

    ISSN: 2436-7613

  78. Deformation and Strength Characterization of Mg Alloys with Rolled Crystallographic Textures by Crystal Plasticity Finite Element Method

    石田智広, 渋谷慎兵, 加藤準治, 寺田賢二郎, 京谷孝史, 安藤大輔, 小池淳一

    日本機械学会論文集 A編(Web) 79 (808) 2013

    ISSN: 1884-8338

  79. Yを極微量添加したMg合金の室温圧縮変形による再結晶組織形成過程の観察

    安藤大輔, 須藤祐司, 小池淳一, 染川英俊, 向井敏司

    日本金属学会講演概要(CD-ROM) 152nd 2013

    ISSN: 2433-3093

  80. RFマグネトロンスパッタにより成膜したFe-O-N薄膜の電気的特性評価

    小川由希子, 小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 153rd 2013

    ISSN: 2433-3093

  81. 湿式処理によるCu/Si界面の拡散バリア層の形成

    田辺成俊, 田辺成俊, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 153rd 2013

    ISSN: 2433-3093

  82. 新規銅ペーストと界面層を用いた単結晶Si太陽電池の特性

    金政植, 金政植, HAI Hoang Tri, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 153rd 2013

    ISSN: 2433-3093

  83. Mo-B-N系スパッタ薄膜の耐摩耗性

    羽根川智, 羽根川智, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 153rd 2013

    ISSN: 2433-3093

  84. n型4H-SiCにおけるワイヤボンドCu/Nb電極の反応挙動および密着性

    亀田和也, 亀田和也, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 152nd 2013

    ISSN: 2433-3093

  85. SUS304に成膜したTi-Mo-N膜の二相分離による硬度上昇

    小宮山翔子, 小宮山翔子, 須藤祐司, 小池淳一, 及川勝成

    日本金属学会講演概要(CD-ROM) 152nd 2013

    ISSN: 2433-3093

  86. Ti-Mo-N膜の摩耗特性に及ぼす窒素濃度依存性に関する熱力学的な検討

    須藤祐司, 小宮山翔子, 小宮山翔子, 小池淳一, 及川勝成

    日本金属学会講演概要(CD-ROM) 152nd 2013

    ISSN: 2433-3093

  87. Electronic Structure of the Novel Phase-Change Material GeCu2Te3

    KOBAYASHI K, KOBATA M, SKELTON J, ELLIOTT S, SAITO Y, SUTOU Y, KOIKE J

    Proc Symp Phase Chang Oriented Sci 25th 48-51 2013

  88. Feasibility study of Ge2Sb2Te5/GeCu2Te3 memory cell with multi-level resistance

    SHINDO S, SAITO Y, SUTOU Y, KOIKE J, LEE J. M, SONG Y. H

    Proc Symp Phase Chang Oriented Sci 25th 75-76 2013

  89. Phase transition characteristics of GeCu2Te3 thin film

    SUTOU Y, SAITO Y, KOIKE J

    Proc Symp Phase Chang Oriented Sci 25th 41-44 2013

  90. OS0317 Deformation twinning model of HCP metals and its application to finite crystal plasticity FEM

    ISHIDA Tomohiro, SHIBUTANI Shinpei, KATO Junji, TERADA Kenjiro, KYOYA Takashi, ANDO Daisuke, KOIKE Junichi

    2012 "OS0317-1"-"OS0317-3" 2012/09/22

    Publisher: The Japan Society of Mechanical Engineers

    More details Close

    A thermodynamics-based constitutive model, which accounts for both crystallographic slip and deformation twinning, is developed for a single crystal of hcp metals within the framework of finite crystal plasticity. While the volume fractions of stress-free twin deformations are introduced as internal variables, the free-energy involves the bulk energy of separate phases and the surface energy at twin interfaces, which are introduced as functions of the internal variables, in addition to the standard hardening-related energy in crystal plasticity framework. After the formulation is described in detail, a series of numerical examples is presented to verify the performance of the proposed model in predicting the deformation twinning, the successive deformation process and the twinning-induced stress responses. The results are studied with reference to the theoretical consequences and the experimental results reported in the literature.

  91. OS0316 The relationships between the amounts of localized deformation and deformation twin type

    ANDO Daisuke, SUTOU Yuji, KOIKE Junichi, ISHIDA Tomohiro, SIBUTANI Sinpei, KATO Jungi, TERADA Kenzirou, KYOYA Takashi

    2012 "OS0316-1"-"OS0316-3" 2012/09/22

    Publisher: The Japan Society of Mechanical Engineers

    More details Close

    In this study, the origin of amounts of localized strain in basal textured Magnesium alloy sheets was investigated. First, grid patterns were drawn on a top surface of sample by Focus Ion Beam system. And then, a distribution of crystal orientation from same area was observed by SEM/EBSD. From these methods, the relationship between the localized strain and crystal orientation was revealed. In generally, the amounts of strains are dependent on the crystal orientation, which means the facility of slip deformation. However, my results show that localized strain is dependent on the existence or absence of twins and twin types, and but not on the Schmid factor of basal slip. And I suggest that {1012} type has the roll of strain accommodation to satisfy the strain compatibility with neighbor grain in primary deformation stage and continue to cancel the strain of slip during deformation. So the grain with {10-12} type slightly deformed. On the other hand, {10-11} type has the roll of accommodation strain component to conform to externally applied stress. But {10-11} twin easily generate double twin. And the grain with double twin localized severely deformed and formed surface steps or cracks.

  92. 結晶塑性FEMによるマグネシウム合金の強度発現機構の解明

    石田智広, 渋谷慎兵, 加藤準治, 寺田賢二郎, 京谷孝史, 安藤大輔, 小池淳一

    計算工学講演会論文集(CD-ROM) 17 2012

    ISSN: 1342-145X

  93. アミディネート前駆体を用いたCVD法によるMnOxの形成

    黒川温子, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会学術講演会講演予稿集(CD-ROM) 73rd 2012

  94. 反応性スパッタリングにより形成したFe-O-N系薄膜の電気的特性

    小川由希子, 安藤大輔, 須藤祐司, 小池淳一

    応用物理学会学術講演会講演予稿集(CD-ROM) 73rd 2012

  95. 反応性スパッタにより作製したN-doped Cu2O半導体薄膜の電気・光学特性評価

    土屋慶幸, 土屋慶幸, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 151st 2012

    ISSN: 2433-3093

  96. AZ31マグネシウム合金における疲労破壊の粒径依存性

    安藤大輔, 藤山直人, 須藤祐司, 小池淳一

    日本金属学会講演概要 148th 2011

    ISSN: 1342-5730

  97. AZ31マグネシウム合金における片振引張疲労破壊の粒径依存性

    安藤大輔, 須藤祐司, 小池淳一

    軽金属学会大会講演概要 121st 2011

    ISSN: 1882-6083

  98. AZ31マグネシウム合金における変形双晶界面構造観察

    安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 149th 2011

    ISSN: 2433-3093

  99. アミディネート前駆体を用いたMn酸化物の化学気相成長

    黒川温子, PHUONG N.M., 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 149th 2011

    ISSN: 2433-3093

  100. Cu-Mn合金の電気抵抗率に及ぼす熱処理時の酸素圧と温度の影響

    安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 149th 2011

    ISSN: 2433-3093

  101. (GeTe)100-xSix相変化材料の電気抵抗変化及び相変化挙動

    齊藤雄太, 隅谷真志, 須藤祐司, 小池淳一

    応用物理学関係連合講演会講演予稿集(CD-ROM) 58th 2011

  102. GeCu2Te3の電気特性とその相変化挙動

    隅谷真志, 鎌田俊哉, 齊藤雄太, 須藤祐司, 小池淳一

    日本金属学会講演概要(CD-ROM) 149th 2011

    ISSN: 2433-3093

  103. Ge-Cu-Te films for phase change random access memory

    SUTOU Y, SAITO Y, KAMADA T, SUMIYA M, KOIKE J

    Proc Symp Phse Chang Opt Inf Storage 23rd 27-29 2011

  104. マグネシウム合金の変形・破壊機構における転位と双晶の役割

    安藤 大輔, 小池 淳一, 須藤 祐司

    金属 2010/11

  105. AZ31マグネシウム合金における室温粒界すべりの断面観察

    安藤大輔, 安藤大輔, 藤山直人, 藤山直人, 須藤祐司, 小池淳一

    日本金属学会講演概要 146th 2010

    ISSN: 1342-5730

  106. Ge1Cu2Te3薄膜の相変化挙動

    須藤祐司, 鎌田俊哉, 齊藤雄太, 隅谷真志, 小池淳一

    応用物理学会学術講演会講演予稿集(CD-ROM) 71st 2010

  107. Si-TeおよびGe-Te共晶型相変化材料の結晶化過程

    齊藤雄太, 鎌田俊哉, 隅谷真志, 須藤祐司, 小池淳一

    応用物理学会学術講演会講演予稿集(CD-ROM) 71st 2010

  108. GeTe相変化メモリ材料の結晶化挙動に及ぼすSi添加の影響

    齊藤雄太, 隅谷真志, 鎌田俊哉, 須藤祐司, 小池淳一

    日本金属学会講演概要 147th 2010

    ISSN: 1342-5730

  109. Ge-Cu-Teアモルファス薄膜の相変化過程に及ぼすSi添加の影響

    隅谷真志, 鎌田俊哉, 齊藤雄太, 須藤祐司, 小池淳一

    日本金属学会講演概要 147th 2010

    ISSN: 1342-5730

  110. Phase change behavior of Ge1Cu2Te3 thin films

    KAMADA TOSHIYA, SAITO YUTA, SUMIYA MASASHI, SUTOU YUJI, KOIKE JUNICHI

    Proc Symp Phse Chang Opt Inf Storage 22nd 21-23 2010

  111. Analysis of dielectric constant of a self-forming barrier layer with Cu-Mn alloy on TEOS-SiO(2)

    S. -M. Chung, J. Koike

    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 27 (5) L28-L31 2009/09

    DOI: 10.1116/1.3224884  

    ISSN: 1071-1023

  112. AZ31マグネシウム合金の二重双晶形成機構とシュミット因子の関係

    安藤大輔, 小池淳一

    日本金属学会講演概要 145th 2009

    ISSN: 1342-5730

  113. AZ31マグネシウム合金の疲労限と変形双晶の関係

    藤山直人, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要 145th 2009

    ISSN: 1342-5730

  114. AZ31マグネシウム合金における二重双晶によるクラック形成過程の観察

    安藤大輔, 藤山直人, 須藤祐司, 小池淳一

    日本金属学会講演概要 144th 2009

    ISSN: 1342-5730

  115. アモルファスGe100-xTex薄膜の昇温過程における電気抵抗及び構造変化

    齊藤雄太, 鎌田俊哉, 須藤祐司, 小池淳一

    日本金属学会講演概要 144th 2009

    ISSN: 1342-5730

  116. アモルファスSi100-xTex薄膜の昇温過程における電気抵抗及び構造変化

    齊藤雄太, 鎌田俊哉, 須藤祐司, 小池淳一

    日本金属学会講演概要 145th 2009

    ISSN: 1342-5730

  117. Ge-Cu-Te三元合金薄膜の相変化挙動

    鎌田俊哉, 齊藤雄太, 須藤祐司, 小池淳一

    日本金属学会講演概要 145th 2009

    ISSN: 1342-5730

  118. Electrical resistance and structural changes on crystallization process of amorphous Ge-Te thin films Peer-reviewed

    Yuta Saito, Yuji Sutou, Junichi Koike

    Materials Research Society Symposium Proceedings 1160 143-148 2009

    ISSN: 0272-9172

  119. AZ31マグネシウム合金の破断面の組織学的形態と内部双晶タイプの関係

    安藤大輔, 安藤大輔, 小池淳一

    日本金属学会講演概要 142nd 2008

    ISSN: 1342-5730

  120. 微小ひずみ領域におけるAZ31マグネシウム合金の変形挙動

    藤山直人, 安藤大輔, 須藤祐司, 小池淳一

    日本金属学会講演概要 143rd 2008

    ISSN: 1342-5730

  121. {1011}-{1012}二重双晶のシュミット因子と表面起伏の関係

    安藤大輔, 藤山直人, 須藤祐司, 小池淳一

    日本金属学会講演概要 143rd 2008

    ISSN: 1342-5730

  122. マグネシウム合金における破壊起点となる双晶タイプ

    安藤大輔, 小池淳一

    軽金属学会大会講演概要 115th 2008

    ISSN: 1882-6083

  123. マグネシウム合金における変形双晶の重要性

    小池淳一, 安藤大輔

    軽金属学会大会講演概要 115th 2008

    ISSN: 1882-6083

  124. アモルファスGeTe薄膜の結晶化過程における電気抵抗及び構造変化

    齊藤雄太, 須藤祐司, 小池淳一

    日本金属学会講演概要 143rd 2008

    ISSN: 1342-5730

  125. Grain-size effects on the formation of deformation twins in AZ31 Magnisium alloys

    ANDO Daisuke, KOIKE Junichi

    113 253-254 2007/10/10

  126. Role of interface adhesion strength in interconnetion reliability

    J. Koike, R. Kainuma, A. Seiguchi, J. Iijima, K. Neishi

    Surface Science 28 (2) 67-71 2007/02

    DOI: 10.1380/jsssj.28.67  

  127. AZ31マグネシウム合金における結晶粒径と変形・破壊挙動の関係

    安藤大輔, 安藤大輔, 小池淳一

    日本金属学会講演概要 141st 2007

    ISSN: 1342-5730

  128. AZ31マグネシウム合金の破壊源としての二重双晶の形成過程

    安藤大輔, 佐藤優典, 小池淳一

    日本金属学会講演概要 140th 2007

    ISSN: 1342-5730

  129. マグネシウム合金における底面すべりと{10<span style=text-decoration:overline>1</span>2}変形双晶の関係

    佐藤優典, 安藤大輔, 小池淳一

    日本金属学会講演概要 140th 2007

    ISSN: 1342-5730

  130. マグネシウム合金の転位すべり・変形双晶に着目した変形機構の粒径依存性

    小池淳一, 安藤大輔, 佐藤優典

    日本金属学会講演概要 141st 2007

    ISSN: 1342-5730

  131. AZ31マグネシウム合金における変形誘起表面起伏と変形双晶の関係

    安藤大輔, 小池淳一

    日本金属学会講演概要 139th 2006

    ISSN: 1342-5730

  132. Creep strength and microstructural stability of Mg-Al-Ca based Thixomolded【○!R】 alloys

    SUZUKI Mayumi, TSUKEDA Tadayoshi, KOIKE Jun-ichi, MARUYAMA Kouichi

    106 159-160 2004/05/18

  133. Microscopic mechanisms of plastic deformation in polycrystalline magnesium alloys

    Junichi Koike, Takeo Miyamura

    Keikinzoku/Journal of Japan Institute of Light Metals 54 (11) 460-464 2004

    Publisher: Japan Institute of Light Metals

    DOI: 10.2464/jilm.54.460  

    ISSN: 0451-5994

  134. Effects of second phase along grain boundary on creep strength in thixomolded【○!R】 Mg-Al-Ca Based Alloys

    SUZUKI Mayumi, MATSUMOTO Takuma, TSUKEDA Tadayoshi, KOIKE Jun-ichi, MARUYAMA Kouichi, KUBO Hiroshi

    104 241-242 2003/04/20

  135. Deformation Mechanisms of Fine-Grained Mg Alloys

    KOIKE Junichi, SUZUKI Mayumi, MARUYAMA Kouichi, KOBAYASHI Takayuki, OHYAMA Rei

    103 27-28 2002/10/16

  136. Effects of structural factor on creep strength of thixomolded Mg-Al-Ca Based Alloys

    SUZUKI Mayumi, MATSUMOTO Takuma, TSUKEDA Tadayoshi, KOIKE Jun-ichi, MARUYAMA Kouichi, KUBO Hiroshi

    102 315-316 2002/04/17

  137. Effect of alloying elements on creep properties of the thixomolded Mg-Al-Ca based alloy

    TSUKEDA Tadayoshi, UCHIDA Ryouhei, SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, KUBO Hiroshi

    101 327-328 2001/10/01

  138. Strengthening by second phase on grain boundaries of Thixomolded Mg-Al-Ca Based Alloys

    SUZUKI Mayumi, MATSUMOTO Takuma, TSUKEDA Tadayoshi, KOIKE Jun-ichi, MARUYAMA Kouichi, KUBO Hiroshi

    101 329-330 2001/10/01

  139. Corrosion resistance and fluidity of thixomolded Mg-Al-Ca based alloys.

    UCHIDA Ryouhei, TSUKEDA Tadayoshi, SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, KUBO Hiroshi

    101 325-326 2001/10/01

  140. Creep behavior of the thixomolded Mg-Al-Ca based alloy

    TSUKEDA Tadayoshi, UCHIDA Ryouhei, SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, KUBO Hiroshi

    100 279-280 2001/04/17

  141. Effects of the Second Phase along grainboundary on Creep Behavior of Thixomolded Mg-Al-Ca Based Alloys

    SUZUKI Mayumi, MATSUMOTO Takuma, TSUKEDA Tadayosi, KOIKE Jun-ichi, MARUYAMA Koichi, KUBO Hiroshi

    100 281-282 2001/04/17

  142. Effects of Precipitated Intermetallics on Fracture Characteristics of Ti6Al-2Sn-2Zr-2Mo-2Cr-Si

    M. Niinomi, K. Fukunaga, G. Tono, J. Koike, D. Eylon, S. Fujishiro

    Proc. LiMAT2001; International Conference on Light Materials for Transportation Systems, 6-9, May 2001, Pusan Korea, Vol.I (Invited paper). 111-118 2001

  143. High Strength Mg-Al-Ca Alloys Produced by Rapidly Solidified Powder Metallurgy

    KAWAMURA Yoshihito, HAYASHI Kentaro, KOIKE Junichi, INOUE Akihisa

    99 299-300 2000/10/16

  144. High Temperature Deformation Behavior and Dislocation Substructures of Mg-Al-Ca Thixomolded Alloys

    SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, TSUKEDA Tadayoshi, SAITO Ken, KUBO Hiroshi

    99 35-36 2000/10/16

  145. High Temperature Deformation and Threshold Behavior in Thin Films Restrained by Substrates

    KOIKE Junichi

    39 (5) 438-442 2000/05/20

    Publisher: 日本金属学会

    ISSN: 1340-2625

  146. Deformation Substructures of Thixomolded Mg-Al-Ca Alloys

    SUZUKI Mayumi, KOIKE Junichi, MARUYAMA Kouichi, TSUKEDA Tadayoshi, SAITO Ken, KUBO Hiroshi

    98 19-20 2000/04/15

  147. Mg合金の高温クリープ挙動におけるイットリウム添加の影響

    鈴木真由美, 小池淳一, 丸山公一, 佐藤裕之, 及川洪

    日本学術会議材料研究連合講演会講演論文集 43rd 1999

  148. Keypoints for a conference presentation in English

    KOIKE Junichi

    48 (1) 60-63 1998/01/30

    Publisher: 軽金属学会

    ISSN: 0451-5994

  149. High temperature deformation and creep

    MARUYAMA Kouichi, KOIKE Jun-ichi

    46 (6) 307-315 1996/06/30

    Publisher: 軽金属学会

    ISSN: 0451-5994

Show all ︎Show first 5

Presentations 38

  1. Possibility of Cu-Mn alloy for TFT gate electrode International-presentation

    International Display Workshop 2007 2007/12/05

  2. Deformaton and fracture mechanisms of Mg alloys International-presentation

    Asian Forum on Light Metals and Exhibition 2007/12/03

  3. Possibility and problems of self-forming barrier process for advanced LSI metallization International-presentation

    J. Koike, J. Iijima, K. Neishi

    Advanced Metallization Conference 2007/10/09

  4. Role of twinning on deformation mechanisms of Mg alloys International-presentation

    2nd Asian Syposium on Magnesium Alloys 2007/10/01

  5. Role of twinning on deformation mechanisms of Mg alloys International-presentation

    J. Koike, D. Ando, Y. Sato, T. Miyamura

    Workshop on advanced magnesium alloys and their applications 2007/08/01

  6. Self-forming barrier process as a key technology for future technoogy node International-presentation

    M. Haneda, J. Iijima, M. Wada, K. Neishi

    Materials for Advanced Metallization 2007/03/04

  7. Impact of Mg alloys for structural application International-presentation

    International Symposium on Magnesium Technology in the Global Age 2006/10/01

  8. Cu合金配線を用いた45nm世代のバリア層自己形成プロセス

    電気化学会 半導体・集積回路技術第70回シンポジウム 2006/07/06

  9. 多層配線におけるバリア層の新展開

    Semi Forum Japan 2006 2006/06/13

  10. Cu alloy metallization for self-forming barrier process International-presentation

    J. Iijima, M. Haneda, M. Wada

    International Interconnect Technology Conference 2006/06/05

  11. Cu alloy metallization for self-forming barrier process International-presentation

    Materials Research Society Syposium 2006/04/17

  12. Cu microstcture impact on reliability International-presentation

    International Reliability Pysics Symposium 2006/03/26

  13. Cu/ILD界面バリア層の材料科学

    応用物理学会 2006/03

  14. Deformation mechanisms and their grain-size dependence in magnesium alloys International-presentation

    Workshop on fine grained materials: opportunities and challenges 2005/11

  15. Self-forming barrier process with Mn addition in Cu metallization International-presentation

    Advanced metallization conference 2005/10

  16. Self-forming barrier with Cu alloy metallization and its effects on reliability International-presentation

    International workshop on stress-induced phenomenoa in metallization 2005/09

  17. Quantitative evaluation of interface adhesion strength in multilayer films by nanoscratch test International-presentation

    2005 MRS Spring Meeting 2005/04

  18. Texture-related reliability problems of Cu thin films for semiconductor applications International-presentation

    TMS Spring Meeting 2005/03

  19. Texture and grain-size dependence on deformation mechanisms in Mg alloys International-presentation

    Int. Conf. on Magnesium-Science, Technology and Applications 2004/09/20

  20. Role of twinning on the deformation and failure of hot-rolled AZ31 magnesium alloy International-presentation

    Int. Conf. on Magnesium-Science, Technology and Applications 2004/09/20

  21. Interface Adhesion and Phase Formation in Cu Interconnect International-presentation

    Solid State Devices and Materials, Tokyo 2004/09/15

  22. Plastic anisotropy and its effects on mechanical parameters in Mg alloys at RT International-presentation

    2004 TMS Spring Meeting 2004/03/15

  23. Reliability of Cu/barrier structure in nanometer interconnect lines International-presentation

    2004 TMS Spring Meeting, Charlotte 2004/03/15

  24. Dislocation Plasticity and Complementary Deformation Mechanisms in Polycrystalline Mg Alloys International-presentation

    3rd Int. Symp. on Designing, Processing and Properties of Advanced Engineering Materials 2003/11/05

  25. Relationship between film texture and reliability of Cu interconnects International-presentation

    2003 TMS Spring Meeting 2003/03/03

  26. Strength and Denctility of Mg Alloys International-presentation

    4th Pac. Rim Int. Conf. on Advanced Materials and Processing 2001/12/11

  27. Stress-induced voiding and texture control in Cu thin films International-presentation

    International Workshop in Stress-Induced Phenomena in Metallization Metallization 2001/07/25

  28. Stress-induced a to b phase transformation in two-phase Ti alloys International-presentation

    2nd International Symposium on Designing, Processing, and Properties of Advanced Eng. Mater. 2000/10/20

  29. Relationship between high-strain-rate superplasticity and interface microstructure in aluminum alloy composites International-presentation

    Microscopy and Microanalysis '99 1999/08/01

  30. Deformation and Failure of Metallic Thin Films Caused by Thermal Stress International-presentation

    Mechanical Properties of Films, Coatings and Interfacial Materials 1999/06/27

  31. Microstructure, Physical and Mechanical Properties, Primary creep resistance of Ti-6-22-22S alloy International-presentation

    The 9th World Conference on Titanium 1999/06/07

  32. Study of primary creep of Ti-6-22-22S alloys International-presentation

    Xi'an International Titanium Conference 1998/09

  33. Microstructure and Superplasticity in Al-Mg Alloy Composites Reinforced with Silicon Nitride Particles International-presentation

    International Conference on Superplasticity of Advanced Materials 1997/01/29

  34. Structural Changes induced by Electron Irradiation International-presentation

    International Conference on Beam Processing of Advanced Materials 1993/08/01

    More details Close

    (プロシーディング) Proc. of Int'l Conf. of Beam Processing ofAdvanced Mater. TMS 1993 519 536

  35. Electron-Beam Interaction and Defect Production in Diamond International-presentation

    International Workshop on Electron Beam Assisted Processes 1993/01/13

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    (プロシーディング) Proc. of the Int'l Workshop on Electron Beam Assited Processes 1993 44 52

  36. Beam-Solid Interactions International-presentation

    Materials Research Society Fall Meeting 1992/11/30

  37. Tensile Behavior of Cold Rolled NiTi having an amorphous-crystalline microstructure International-presentation

    NATO Advanced Institute 1992/06/28

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    (プロシーディング) Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures Kluwer Academic Publishers 1993 323 328

  38. Irradiation-induced amorphization as a result of Elastic Instability International-presentation

    Materials Research Society Fall Meeting 1991/12/02

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Research Projects 30

  1. Improvement of contact resistivity and mechanical reliability for metal/SiC interface for power device application Competitive

    System: The Other Research Programs

    2005/04 - Present

  2. Development of hybrid transparent electrode materials for flexible devices Competitive

    System: The Other Research Programs

    2003/04 - Present

  3. Evaluation and improvement of interface adhesion strength of flexible printed circuit materials Competitive

    System: The Other Research Programs

    2002/04 - Present

  4. Development of highly reliable interconnect material for advanced semiconductor devices Competitive

    2000/04 - Present

  5. Evaluation of interface adhesion strength in nanometer scale Competitive

    System: The Other Research Programs

    2000/04 - Present

  6. Deformation mechanism of magnesium alloys Competitive

    System: The Other Research Programs

    2000/04 - Present

  7. Investigation of fundamental properties of intermetallic compounds for novel interconnection materials

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (A)

    Institution: Tohoku University

    2021/04/05 - 2025/03/31

  8. Depinning of Fermi Level by Interface Structure Control

    Koike Junichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (A)

    Institution: Tohoku University

    2018/04/01 - 2021/03/31

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    We found that Co-Ti can decrease the growth rate of Co monosilicide (CoSi) that had an epitaxial relation with Si. By overlaying SiO2, SBH could be decreased from 0.7 to 0.3 eV. When TiO2 or TiNbO2 was used in place of SiO2, their small band offset could bring about a low SBH of 0.3 eV consistently. However, apparent contact resistivity remained high because of their high resistance. We also investigated the contact property of n-GaN. The growth of epitaxial Ga2O3 oxide on GaN could reduce DIGS, while the insulating property of the oxide could reduce MIGS, which brought about a very low SBH of 0.1 eV and three-orders lower contact resistivity than the samples without the oxide.

  9. Mg-Sc based alloy with high strength and functionality using BCC/HCP phase transformation

    Ando Daisuke, KOIKE Junichi, SUTOU Yuji, OGAWA Yukiko, TAKEUCHI Yuta

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Young Scientists (A)

    Institution: Tohoku University

    2015/04/01 - 2018/03/31

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    I focused novel Mg-Sc alloys with high strength and functionality using phase transformation. This study mainly shows Mg-Sc alloy exhibits Martensitic transformation from BCC phase to orthorhombic phase and the transformation produces super-elasticity and shape memory effects for the first time in the world. This result disproved Mg alloys can not exhibit Martensitic transformation because the hardness of Magnesium is too low. Furthermore, it indicates some possibility to use the Mg-Sc alloy for aerospace and medical application such as self expanding frames of solar panel and biodegradable implant material.

  10. A study of contact resistance between phase change material and electrode for next generation PCRAM

    Sutou Yuji, KOIKE Junichi, ANDO Daisuke, KOBAYASHI Keisuke, SONG Yun-Heub, SHINDO Satoshi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    2015/04/01 - 2018/03/31

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    With the scaling down of PCRAM cells, contact resistance between phase change material (PCM) and an electrode becomes a dominant factor in determining the memory cell resistance. In this study, we investigated the contact resistivity of PCM to a metal electrode. Then, we discussed the effect of the contact resistivity on the performance of the memory cell. We found that an amorphous Cu2GeTe3 (CGT)/W contact shows schottky conduction, i.e., a CGT/W is dominated by interface conduction. Moreover, we found new PCM, Cr2Ge2Te6 (CrGT) with a high thermal stability in amorphous state. The CrGT showed inverse resistance change upon phase change (Ramo<Rcry). Although the resistivity change of the CrGT was only one order of magnitude, the contact resistivity change was found to reach two orders of magnitude upon phase change. I was also found that the CrGT memory cell achieves more than an 85% reduction in total operation energy compared with a conventional GST memory cell.

  11. Formation behavior and mechanism of advanced LSI interconnections by dynamic nano-reflow method

    Koike Junichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (A)

    Institution: Tohoku University

    2015/04/01 - 2018/03/31

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    Performance of LSI devices has been continuously improved by shrinking device components. Recent devices encounter a problem of forming very narrow multilayer interconnections. In this project, we found the conditions to form 15 nm wide interconnections (M2 lines and vias) by a dynamic nano-reflow method of depositing Cu alloy at elevated temperatures. With this method, an alloying element was segregated at Cu/insulator interface and enhanced the wettability of the deposited metals. We also found that controlling parameters are surface curvature gradient in the initial deposition stage and thermal stress gradient during heating and cooling. The effects of each driving force are nearly the same magnitude. Based on the obtained results, we could simulate reflow behavior.

  12. Development of multi-level PCRAM showing four-resistance-level

    SUTOU YUJI, ANDO Daisuke, KOIKE Junichi, SAITO Yuta, SHINDO Satoshi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Challenging Exploratory Research

    Institution: Tohoku University

    2015/04/01 - 2017/03/31

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    Phase change random access memory called PCRAM has attracted much attention as next generation nonvolatile memory because of its simple operation principle and production cost. PCRAM is operated by way of Joule heating to induce phase change between high resistance reset amorphous state and low resistance set crystalline state of phase change material. In this study, we proposed multi-level PCRAM showing four-resistance-level which can store 2 bit data. We investigated the composition dependence of Cu-Ge-Te film showing two-step crystallization process. Based on the results, we found that 23.4Cu-28.8Ge-47.8Te(CuGT)/GeTe(GT) stack-layered memory cell can exhibits four-resistance-level, i.e., [amo.CuGT+amo.GT], [amo.CuGT*cry.GT], [cry1.CuGT+cry.GT] and [cry2.CuGT+cry.GT]. These results indicate that Cu-Ge-Te/GeTe layered structure is expected to be multi-level PCRAM.

  13. Damping property of Mg-Sc alloys using a hybrid model of dislocation and twin

    ANDO DAISUKE, KOIKE JUNICHI, SUTO YUJI

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Challenging Exploratory Research

    Institution: Tohoku University

    2015/04/01 - 2017/03/31

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    We proposed a novel damping material with hybrid model of dislocation type and twin type using Mg-Sc alloys which can do Martensitic transformation. In this research period, we tried to clear the composition dependence on Martensitic transformation, the damping properties of HCP and BCC phase, and the optimized microstructure with good damping in Mg-Sc binary alloy. The Martensitic temperature strongly depends on the Sc composition. Furthermore, the martensitic temperature is ambient temperature in Mg-18.6at%Sc. However, the bcc phase is too soft to occur Martensitic transformation without dislocation. Therefore, we would like to propose third element addition for solid solute strengthening of BCC phase. The BCC phase can transform to HCP without variant selection. Therefore, we can make single hcp alloy with random crystal orientation.

  14. Fast phase change speed induced by surface oxidation of phase change material

    SUTOU Yuji, KOIKE Junichi, ANDO Daisuke

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Challenging Exploratory Research

    Institution: Tohoku University

    2013/04/01 - 2015/03/31

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    Phase change random access memory (PCRAM) has attracted much attention as a new class of non-volatile memory because of its low production cost and high scalability. Now, Ge-Sb-Te material is used for PCRAM because of its fast phase change speed and good repeatability. However, the Ge-Sb-Te shows low crystallization temperature (Tc) and consequently insufficient high temperature data retention. Meanwhile, a material with a high Tc shows a slow phase change speed. Therefore, an idea to realize a material with high Tc and fast crystallization speed is desired. In this study, we investigated the effect of preferential surface oxidation on crystallization speed in GeTe-Si phase change material. It was found that the crystallization starting time of the surface-oxidized film by O2 plasma-treatment was about 20% faster than that of a non-oxidized film. This fast crystal nucleation was suggested to be due to the formation of inhomogeneous nucleation sites at the film surface.

  15. Principles for the development of a diffusion barrier layer to overcome the process limitations of multi-layer interconnects for semiconductor devices

    KOIKE Junichi, SUTOU Yuji, NEISHI Koji, ANDO Daisuke

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (S)

    Institution: Tohoku University

    2010/04/01 - 2015/03/31

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    Multilayer interconnection for semiconductors requires the decrease of a barrier layer thickness as thin as possible. This research has focused on the self-formation of the barrier layer and was aimed at understanding the formation mechanism so as to go beyond process limitation with novel materials and processes. The formation mechanism was found to be electric-field induced diffusion. The field strength was dependent on alloying elements, which led to the difference in the formation mechanism. In order to provide solutions to futuristic narrow lines, we developed a chemical vapor deposition method to form an ultrathin barrier layer and a sputter reflow method to fill very narrow lines with copper alloys.

  16. A study on phase change characteristics of Ge-Cu-Te alloy film for PCRAM

    SUTOU Yuji, KOIKE Junichi, KOBAYASHI Keisuke

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    2011/04/01 - 2014/03/31

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    Phase change random access memory (PCRAM) has attracted much attention as a new class of non-volatile memories because of its low production cost and high scalability. PCRAM is operated by way of Joule heating to induce phase transition between high resistance amorphous (reset state) and low resistance crystalline (set state) phases of a phase change material (PCM). In this study, we proposed a new PCM, Ge-Cu-Te compounds, with high crystallization temperature and low melting point, and investigated their phase change behaviors and memory characteristics. We found that the GeCu2Te3 compound shows unique phase change characteristics, such as volume expansion by crystallization and reflectance increase by amorphization. Moreover, it was also found that the GeCu2Te3 compound shows a fast phase change speed. Therefore, the GCT film is strongly expected as a phase change material for PCRAM with low energy consumption, high data retention and fast writing speed.

  17. Experimental study of micro-cracking in Mg alloys based on the deformation response under dynamic loading

    MUKAI Toshiji, SOMEKAWA Hidetoshi, KOIKE Jyunichi, SINGH Alok, WATANABE Hiroyuki

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    2009 - 2011

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    A double-shear specimen was designed by FEM simulation based on experimental data of uniaxial tension and compression under dynamic loading. The double-shear specimen was machined from pure magnesium and Mg-Y alloy extrusions having four kinds of shear plane against the extruded direction. As a result, shear stress and shear displacement at crack initiation strongly depended on the sampling direction. The enhanced ductility and toughness was attributed to weakened anisotropy by adding the yttrium solute. It was found that the frequency of micro-crack initiation depended on the basal plane distribution. The trend in the toughness enhancement was similar to the fact that weakened basal texture led to toughness enhancement in high strength Mg alloys having fine-grained structure.

  18. 電界促進効果による超薄膜拡散バリア層の形成機構

    小池 淳一

    Offer Organization: 日本学術振興会

    System: 科学研究費助成事業

    Category: 基盤研究(A)

    Institution: 東北大学

    2010 - 2010

  19. Role of Deformation twinning on the deformation and fracture of magnesium alloys

    KOIKE Junichi, NEISHI Koji, YAMAZAKI Yoshihiro

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    2006 - 2008

  20. Upper Limit of Strengthening and Its Improvement in Nano-lamellar Materials

    MARUYAMA Kouichi, KOIKE Jun-ichi, SUZUKI Mayumi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: TOHOKU UNIVERSITY

    2003 - 2004

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    TiAl alloys are the most promising light material for high temperature structural applications. The alloys take a lamellar structure consisting of α_2Ti_3Al and γ TiAl phases, and their strength increases with decreasing lamellar thickness. However there is an upper limit in the strengthening. In this study the causes of the upper limit were examined and it was proposed how to improve the upper limit. 1.Misfit dislocations on α_2/γ lamellar boundaries disappear when lamellar thickness λ is reduced below 50nm, resulting in loss of boundary resistance to dislocation motion. Therefore, the yield stress vs. 1/√<λ> curve deviates from the Hall-Petch relation and yield stress has an upper limit at fine λ. 2.The upper limit of yield stress can be improved if we can introduce the misfit dislocations to α_2/γ lamellae less than 50nm thickness. Lattice misfit determines the lower limit of lamellar thickness for the introduction of misfit dislocations, and a lattice misfit larger than 1.5% is required to improve the upper limit. 3.Coarsening and sphoroidization of lamellae are the major microstructural degradation that cause loss of deformation resistance. The degradation is driven by the interfacial energy and is faster in finer lamellar structure. The degradation proceeds by the migration of lamellar boundaries, and can be retarded by reducing the mobility of lamellar boundaries. 4.TiAl alloys contain four types of lamellar boundaries, and the α_2/γ boundaries have the lowest mobility. It was confirmed that a material having a high density of α_2/γ boundaries shows better creep deformation resistance due to its improved microstructure stability.

  21. Void Formation Mechanisms in Cu Interconnect for Ultra Fast ULSI Application

    KOIKE Junichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    2001 - 2003

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    Cu thin films have been used for an interconnect material for advanced semiconductor devices. Void formation during thermal processing has been known to cause interconnect failure. This work has focused on understanding the void formation mechanism in Cu/Ta/SiO_2/Si multilayer samples. SEM and TEM observation indicated that voids were formed in a strongly <111> textured film but not in a ramdom texture film. It was also found that the voids were formed at corners of twins and at intersections between twins with other twins or with grain boundaries. In order to understand the role of twins, stress distribution was simulated using a three dimensional finite element method (FEM) computer code. Localized crystallographic information of actual samples was analyzed with electron diffraction and was, incorporated in the FEM simulation. The results indicated that a large elastic anisotropy of Cu gave rise to stress concentration at twin corners and intersections that acted as a driving force for void formation. Orientation analysis of twin planes indicated that the <111> texture film contained incoherent {322} twins.having a high energy, while the random textured film contained coherent {111} twins having a low energy. The former twin of the {322} type was found to be subject voiding. under stress concentration. When the film thickness and the initial texture are controlled, <100> oriented giant grains could be formed. Since the twins were absent in this film, no void was formed during thermal processing In damascene lines, slit-like voids were formed at the shoulder of the trench opening. Stress simulation indicated that shear stress concentration caused the void formation by partial delamination at the Cu/Ta interface. These results suggested that the improvement of adhesion strength at the Cu/Ta interface is important for the device reliability.

  22. Improvement of Mechanical Properties in Mg Alloys by Optimum Microstructure Control

    KOIKE Junichi, MARUYAMA Kouichi, SUZUKI Mayumi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research on Priority Areas

    Institution: Tohoku University

    1999 - 2002

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    Deformation mechanisms of Mg alloys at room temperature and elevated temperature were investigated. Deformation at RT was found to occur not only by basal dislocation slip but also by nonbasal dislocation slip. The activation of the nonbasal slip was attributed to the emergence of incompatibility stress to satisfy a strain continuity condition at grain boundaries. Since these dislocation are of the a type, additional mechanisms were necessary to induce strain in the c direction. For fine-grain alloys of less than 10 μm in diameter, the additional mechanism was found to be grain : boundary sliding that contributed to as much as 8% of total strain. For course-grain alloys of more than 50 μm in diameter, the additional mechanism was twinning. The observed twins were all of { 1012 } type regardless of the geometrical relationship between the tension axis and the c axis. This was attributed to the twin formation by stress concentration as a result of anisotropic dislocation activity. With regard to deformation mechanisms at elevated temperatures, creep deformation and microstructure ob servation were performed in Mg-Y alloys. A rate-controlling mechanism was dislocation climb of the a type. A significant improvement in creep resistance was observed by dilute addition of Zn. This was attributed to the formation of stable stacking faults segregated with Zn and Y. The Zn addition appeared to reduce the stacking fault energy and stabilize extended dislocation configuration, which in turn hampered dislocation climb and improved creep resistance.

  23. Quantitative Analysis of Strengthening Mechanism of Titanium Aluminide by Means of Microstructural Stabilization

    MARUYAMA Kouichi, SUZUKI Mayumi, KOIKE Jun-ichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    1999 - 2001

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    Lamellar TiAl alloys consisting of α_2Ti_3Al and γTiAl phases are promising candidates of structural materials for high temperature applications. However, their lamellar boundaries are not so stable, and migrate during high temperature deformation, resulting in the transformation to equiaxed grain structure (spheroidization). The equiaxed grain structure is inferior in creep resistance to the lamellar structure. In this research it was studied how to stabilize the lamellar structure and to keep its fine lamellar spacing. The results are summarized as follow: 1. Stabilization by heat treatment: The spheroidization takes place more significantly in a fine lamellar structure formed at lower temperature, and the fine lamellar material often shows poorer creep resistance than a coarse lamellar material. When the lamellar structures are stabilized by annealing, the boundary migration is retarded and the fine lamellar material shows the good creep resistance inherent to the fine lamellar structure. 2. Stabilization by alloying: Addition of W to TiAl alloys slows down the lamellar migration during creep deformation. This result in the creep resistance of the W added material better than the one without W. 3. Control of boundary character: The lamellar structure contains four types of boundaries: α_2/γ, true twin, pseudo twin and rotational fault boundaries. Their stability during high temperature exposure decreases in the following order: α_2/γ > true twin > pseudo twin > rotational fault. The pseudo twin and rotational fault boundaries readily migrate and form an equiaxed grain structure. A low Al alloy containing a high fraction of α_2 phase has a higher density of α_2/γ boundaries. The densities of α_2/γ and true twin boundaries increase with rising annealing temperature. These are ways to make a stable lamellar structure and improve creep resistance of fully lamellar TiAl alloys.

  24. Development of Nondestructive Assessment Methodology for Residual Life of Martensitic Heat Resistant Steel

    MARUYAMA Kouichi, NONAKA Osamu, KOIKE Jun-ichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B).

    Institution: TOHOKU UNIVERSITY

    1998 - 2000

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    High Cr ferritic heat resistant steel is widely applied to the thick section components of power plants to be used in creep regime. In this research, nondestructive residual life assessment of such high Cr steel with tempered martensitic lath structure was examined, and the results are summarized as follows : 1.There are four factors that may control creep deformation and fracture of the high Cr ferritic heat resistant steels. They are dislocation(lath)structure, precipitates on grain- and sub-boundaries, fine particles within subgrains, and solute atoms such as W and Mo.Among these factors, the lath structure in the most important obstacle that determines yield stress of the steel. Its recovery is closely related to the progress of creep deformation and the subsequent failure. Therefore, this recovery of lath structure should be taken as the measure of life assessment. 2.As a result of the recovery of martensitic lath structure, lath width increases with increasing creep strain. The relative increase in lath width Δλ/Δλ^* is linearly related to creep strain. Δλ is the change in lath width from the original value, and Δλ^* is the value of Δλ at rupture. The coefficient of linear relation does not change with creep condition or alloy composition. 3.Based on the linear relation between lath width and creep strain, we can evaluate creep strain of a component of engineering plants. Creep curve under any creep condition can readily predict with the aid of creep database. Residual life can be assessed from the estimated creep strain and the creep curve predicated. 4.The residual life assessment based on the measurement of lath width is applicable to rotor steel tempered at low temperature. However, in boiler steel(such as HCM12A)tempered at higher temperature, brittle fracture takes place by the coalescence of grain boundary cavities. Life assessment based on cavity growth should be employed in this case.

  25. Synthesis of high-strength ceramics by centrifugal casting and microwave sinterieng and evaluation of mechanical properties

    KOIKE Jun-ichi, SAJI Tasaburou, TASHIMA Shunzo

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    1997 - 1998

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    A12O3 and Si_3 N_4 were synthesized by microwave sintering. Its properties were investigated and advantages and disadvantages of microwave sintering were evaluated. Major obtained results were the following. In both ceramics, relative density was higher with microwave sintering than with conventional sintering. It was also found that by microwave sintering, the onset temperature for sintering was lowered by 50゚C and the sintering rate was increased. Since microwave sintering could decrease the activation energy for diffusion by 40%, these improvemens were due to the enhanced diffusion under microwave conditions. We also found that there was no direct correlation between the sintered density and the green density. This was contradictory to the results in the case of conventional sintereing. Observation of microwave-sintered Al2O3 and Si_3N_4 by a scanning electron microscope revealed the absence of pores having a diameter of less than 2 mum. This indicated that small pores of less than 2 mum were vanished during microwave sintering. Therefore, the final density was found to be determined not by the green density but by the amount of the small pores. A possible reason for the disappearance of the small pores is that the surface energy is increased under the microwave and that the small pores having a large surface/volume ratio would shrink and disappear. The reduction of the small pores during performing becomes a key to further improve the final density and associated mechanical properties

  26. Microstructural Design of Two Phase Titanium Aluminides for High Temperature Applications

    MARUYAMA Kouichi, SATO Hiroyuki, KOIKE Jun-ichi, OIKAWA Hiroshi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: TOHOKU UNIVERSITY

    1996 - 1998

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    TiAl alloys consists of gammaTiAl and alpha_2Ti_3Al phases, and are considered to be a candidate for high temperature structural applications. A further improvement of their high temperature mechanical properties is required for their engineering applications, For the improvement, it is important to know how to optimize their microstructure. In this research, the correlation between the microstructures and high temperature mechanical properties were studied, and the following results were obtained. 1. Creep strength of TiAl alloys is independent of grain size for grain sizes greater then 100mum. In the grain size range smaller than 100mum, their creep strength may decrease with decreasing grain size. 2. Creep strength of TiAl alloys is insensitive to the volume fraction of constituent phases, in other words, aluminum concentration. 3. Creep strength of fully lamellar TiAl alloys is improved by the refinement of their lamellar spacing. At low stresses, however, the high creep strength of fine lamellar microstructure disappears due to the significant degradation of the fine lamellar microstructure. Dynamic recrystallization and discontinuous coarsening of lamellar microstructure during creep are responsible for the degradation, and the consequent weakening of the fine lamellar microstructure. 4. The lamellar microstructure can be stabilized by annealing at a high temperature. The stabilization treatment prevent the microstructural degradation during creep, and the strengthening by lamellar refinement becomes effective even at low stresses. 5. Creep strength of PST crystals, having only one lamellar colony, depends strongly on the angle between the stress axis and the lamellar plates. The hard oriented crystal, whose lamellar plates are aligned parallel or perpendicular to the stress axis, provides substantially higher creep strength than randomly oriented polycrystalline TiAl alloys. The soft oriented crystal, having an intermediate angle of stress axis to the lamellar plates, shows similar creep strength to the polycrystals. This result suggests that creep strength of polycrystalline TiAl alloys can be improved by the control of their texture.

  27. 金属薄膜における巨大弾性ひずみと弾性定数の異常

    小池 淳一

    Offer Organization: 日本学術振興会

    System: 科学研究費助成事業

    Category: 萌芽的研究

    Institution: 東北大学

    1997 - 1997

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    シリコン基板上にモリブデン薄膜を成膜し、弾性的性質を示すパラメーターを定量的に測定し、薄膜における巨大なひずみ量と弾性定数以上の関連性および原因を明らかにする。薄膜はヘリコンスパッター装置を用いて、成膜条件を変化させて成膜された。薄膜におけるひずみはX線回折法によって測定した。X線回折の結果をsin^2θ法によって解析することによって、薄膜の成長方向および界面方向のひずみを測定した。また、応力は基板曲率測定法によって、弾性定数はナノインデンターならびに基板曲率法によって測定された。弾性定数の結果は測定法の依存性についても考慮した。 X線回折の結果、薄膜の成長方向は引張の、界面方向には圧縮のひずみが存在した。応力も同様であった。圧縮のひずみ、応力ともに、アルゴン流量、ターゲット出力、基板温度が低いほど増加する傾向がみられた。実験条件の範囲内で得られたひずみ、応力の最大値はそれぞれ0.6%、1700MPaにもなった。これらの値はバルク材に比べて数倍大きい値であり、基板の拘束をうけた薄膜特有の現象が観察された。これらの試料においてナノインデンターを用いて弾性定数の測定を行った結果、巨大なひずみが観測されたにもかかわらず、弾性定数はひずみ依存性を示さず、バルクの弾性定数とほぼ同じ値を示した。ところが、基板曲率法によって熱膨張の弾性変形領域から算出した弾性定数は、ひずみ依存性を示し、バルク材より30%ほど大きい値を示した。 弾性定数の異常は、曲率測定法では観察されたが、ナノインデンテーションでは観察されなかった。この原因として、ナノインデンテーションの弾性変形が3次元的であり、薄膜の成長方向における引張ひずみと界面方向における圧縮ひずみの影響が相殺されて、バルクと同じ値を示したものと思われる。これに対して、基板曲率法は界面方向の弾性定数を測定するため、巨大圧縮ひずみの影響を反映した弾性定数の異常が観察された。異常の原因は弾性非調和効果で説明される。

  28. 固溶強化に基づく多元系合金の高温長時間強度の改善

    佐藤 裕之, 及川 洪, 丸山 公一, 佐藤 裕之, 小池 淳一

    Offer Organization: 日本学術振興会

    System: 科学研究費助成事業

    Category: 基盤研究(A)

    Institution: 東北大学

    1995 - 1997

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    最終年度は前年度までに蓄積した実験結果を基に,多元系固溶強化合金の高温長時間強度特性を評価した。単一では寸法効果による強化への寄与が小さいと期待される第三元素は,他の溶質元素が存在する場合に長時間強度に影響を与え,その効果は合金系および変形条件に依存することが実験的に明らかにされた。拡散係数の大きく異なる溶質を含むアルファ鉄-ベリリウム-マンガン合金では二元系合金の合金型クリープ挙動の出現する応力域の下限で強化が認められるが,高応力域ではひずみ速度への影響は小さい。アルミニウム-マグネシウム基固溶体では,第三元素は合金型挙動が現れる応力範囲でもひずみ速度に影響を与え,また合金型クリープ挙動が出現する応力範囲も変化させる。合金型クリープ挙動から純金属型クリープ挙動への遷移応力は溶質原子と転位の相互作用の強さを反映し,第三元素の効果は寸法差の大きい溶質原子と転位間のみかけの相互作用の変化として理解される。置換型溶質だけを含む多元系固溶体でも侵入型・置換型両溶質を含む固溶体で現れる挙動(IS効果)と類似の挙動が出現することは転位と溶質間の相互作用だけでなく異種溶質間の相互作用が長時間強度特性に影響を与えることを示し,この効果を利用した高温強度特性改善の可能性が示唆される。多元系合金における総合的な転位-溶質間相互作用の評価は強度特性に関する情報の蓄積が必要で,更に実験結果が蓄積されることが望ましい。

  29. Anomalous high-temperature strengthening in alpha Ti-Al solid-solution alloys

    KOIKE Jun-ichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (B)

    Institution: Tohoku University

    1995 - 1997

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    Tensile tests were performed in Ti- (7-13) at.%Al alloys. Temperature dependence and strain-rate dependence on deformation behavior were investigated. The possibility of the strength anomaly athigh temperatures was examined and its reason was discussed, based on the obtained results and the reported results for alloys with low Al concentrations. In the case of low-aluminum alloys containing less than 5mol%Al, the stress-strain rate relationship showed transition of the stress exponent from 3.5 to 4.6. The concentration dependence of flow stress was found to agree with theroreticaly predicted behavior by an ordinarly solid-solution herdening theory. In the case of concentrated alloys containing more than 5%Al, no transition was observed and the stress exponent was found to be a constant value of 3.5. The concentration dependence of flow stress was more than twice as large as the theoretically predicted calues, indicating the anomalous high-temperature strengthening in concentrated alpha Ti-Al solid-solution alloys. Structural analysis by X-day diffraction and transmission electron microscopy suggested the presence of a short-range ordered (SRO) structure. The possibility of the SRO formation was investigated by Monte Carlo calculation. It was found that the SRO structure became noticeable for a concetration of more than 5 mol%. The SRO tedency was also found to increase with increasing the aluminum concentration. Since the presence of the ordered structure increases flow stress, the anomalous strengthening in the Ti-Al alloy was found to be caused by the formation of the SRO structure.

  30. Study of Elastic Anharmonicity in Mo Thin Films

    KOIKE Jun-ichi

    Offer Organization: Japan Society for the Promotion of Science

    System: Grants-in-Aid for Scientific Research

    Category: Grant-in-Aid for Scientific Research (C)

    Institution: Tohoku University

    1995 - 1996

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    Thin films have a larger residual stress than their bulk materials. The purpose of this project was to investigate a possible difference in the elastic moduli in thin films from the view poin of elastic anharmonicity. Experimentally, Mo thin films were sputter deposited on silicon substrates. The elastic properties of Mo thin films were studied for various deposition conditions. Deposition parameters included substrate temperature and a target power. Residual stress was measured by a laser curvature-measuring system. Residual strain was measured by a X-ray diffractometer. Elastic modulus and hardness were measured by a nano-indentation tester. The major obtained results were the following : (1)Mo thin films were under a compressive stress state for all deposition conditions. Residual stress were found to decrease with increasing substrate temperature and a target power. This tendency was attributed to the temperature dependence of the surface diffusivity and to the target power dependence of the kinetic energy of the deposited atoms. (2)Compressive stress and strain were found to be in a range of 0.4-1.2 GPa and 0.2-0.6%, respectively. The observed residual stress was twice as much as that of the bulk value of 0.4-0.6GPa. On the other hand, hardness and Young's modulus did not show any dependence on the deposition conditions and were approximately the same as the bulk values. These results indicate that residual stress and strain in thin films can be substantially affected by the deposition conditions and may take larger values than the bulk. In contrast, in the observed range of stress and strain, elastic anharmonicity can be neglected.

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