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博士(工学)(東京大学)
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修士(工学)(東京大学)
Details of the Researcher
Research History 4
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2022/08 - PresentTohoku University Department of Electronic Engineering, Graduate School of Engineering Assistant Professor
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2021/10 - 2022/07The University of Tokyo System Design Lab, School of Engineering Project Researcher
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2020/08 - 2022/07The University of Tokyo Institute of Industrial Science Collaborative Researcher
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2020/04 - 2022/07Meisei University Collaborative Research Center Senior Researcher
Education 3
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The University of Tokyo The Graduate School of Engineering Department of Precision Engineering
2017/04 - 2020/03
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The University of Tokyo The Graduate School of Engineering Department of Precision Engineering
2015/04 - 2017/03
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The University of Tokyo The Faculty of Engineering Department of Precision Engineering
2011/04 - 2015/04
Committee Memberships 6
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一般社団法人 電子実装工学研究所 (IMSI) 接合界面創成技術研究会 幹事
2024/06 - Present
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International Conference on Electronics Packaging (ICEP) 論文副委員長
2023/09 - Present
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IEEE EPS Symposium Japan (ICSJ) 運営委員
2023/01 - Present
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第41回「センサ・マイクロマシンと応用システム」シンポジウム運営委員 幹事
2024/01 - 2024/12
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電気学会 第40回「センサ・マイクロマシンと応用システム」シンポジウム運営委員 副幹事
2023/03 - 2023/12
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International Conference on Electronics Packaging (ICEP) 2023 論文委員
2022/08 - 2023/06
Professional Memberships 4
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IEEE EPS
2023/01 - Present
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The Institute of Electrical Engineers of Japan
2023/01 - Present
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エレクトロニクス実装学会
2021/03 - Present
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精密工学会
2021/03 - Present
Research Interests 2
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low temperature bonding
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wafer bonding
Research Areas 1
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Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment /
Awards 7
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ポスターアワード
2025/03 第34回マイクロエレクトロニクスシンポジウム(MES2024) Au薄膜の転写とコイニングにより作製した平坦な Auマイクロバンプアレイ
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優秀ポスター発表賞ファイナリスト
2024/11 電気学会センサ・マイクロマシン部門 第41回「センサ・マイクロマシンと応用システム」シンポジウム 無機ポリマーを用いた水中でのSi基板間の接着
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Poster Award of ICEP 2024
2024/04 The Japan Institute of Electronics Packaging Investigation of Plasma Gases for Polysilazane Conversion into SiO2 for Wafer Bonding
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IEEE EPS Japan Chapter Young Award of ICEP 2024
2024/04 IEEE Electronics Packaging Society Japan Chapter Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature
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若手優秀研究賞
2024/03 東北大学電気・情報系
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Best Presentation Award
2021/10 The Organizing Committee of 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Quantification of Wafer Bond Strength of Silicon Nitride under Controlled Atmosphere
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Outstanding Student Paper Award
2016/10 The Electrochemical Society Modified Surface Activated Bonding Using Si Intermediate Layer for Bonding and Debonding of Glass Substrates
Papers 56
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Room temperature wafer bonding through conversion of polysilazane into SiO2 Peer-reviewed
Kai Takeuchi, Tadatomo Suga, Eiji Higurashi
Scientific Reports 14 (1) 2024/01
DOI: 10.1038/s41598-024-51800-6
eISSN: 2045-2322
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Room temperature bonding of Au assisted by self-assembled monolayer Peer-reviewed
Kai Takeuchi, Junsha Wang, Beomjoon Kim, Tadatomo Suga, Eiji Higurashi
Applied Physics Letters 122 (5) 051603-051603 2023/01/30
Publisher: AIP PublishingDOI: 10.1063/5.0128187
ISSN: 0003-6951
eISSN: 1077-3118
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Quantification of wafer bond strength under controlled atmospheres Peer-reviewed
Kai Takeuchi, Tadatomo Suga
JAPANESE JOURNAL OF APPLIED PHYSICS 61 (SF) 2022/06
DOI: 10.35848/1347-4065/ac5e49
ISSN: 0021-4922
eISSN: 1347-4065
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Microfluidic chip connected to porous microneedle array for continuous ISF sampling Peer-reviewed
Kai Takeuchi, Nobuyuki Takama, Kirti Sharma, Oliver Paul, Patrick Ruther, Tadatomo Suga, Beomjoon Kim
DRUG DELIVERY AND TRANSLATIONAL RESEARCH 12 (2) 435-443 2022/02
DOI: 10.1007/s13346-021-01050-0
ISSN: 2190-393X
eISSN: 2190-3948
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Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass Peer-reviewed
Kai Takeuchi, Fengwen Mu, Akira Yamauchi, Tadatomo Suga
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 10 (5) 2021/05
ISSN: 2162-8769
eISSN: 2162-8777
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Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer Peer-reviewed
Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto, Tadatomo Suga
ADVANCED MATERIALS INTERFACES 8 (5) 2021/03
ISSN: 2196-7350
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Flexible and porous microneedles of PDMS for continuous glucose monitoring Peer-reviewed
Kai Takeuchi, Nobuyuki Takama, Rie Kinoshita, Teru Okitsu, Beomjoon Kim
BIOMEDICAL MICRODEVICES 22 (4) 2020/11
DOI: 10.1007/s10544-020-00532-1
ISSN: 1387-2176
eISSN: 1572-8781
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Microfluidic chip to interface porous microneedles for ISF collection Peer-reviewed
Kai Takeuchi, Nobuyuki Takama, Beomjoon Kim, Kirti Sharma, Oliver Paul, Patrick Ruther
BIOMEDICAL MICRODEVICES 21 (1) 2019/03
DOI: 10.1007/s10544-019-0370-4
ISSN: 1387-2176
eISSN: 1572-8781
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Low pressure Au–Au bonding using flat-topped micro-bump Au arrays fabricated by Au film transfer and coining methods Peer-reviewed
Shintaro Goto, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Eiji Higurashi
Japanese Journal of Applied Physics 64 (5) 05SP08-05SP08 2025/05/01
Publisher: IOP PublishingDOI: 10.35848/1347-4065/adcc3a
ISSN: 0021-4922
eISSN: 1347-4065
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Wafer Bonding of GaAs and SiC via Thin Au Film at Room Temperature Peer-reviewed
Kai Takeuchi, Eiji Higurashi
Micromachines 2025/04/07
DOI: 10.3390/mi16040439
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Room temperature bonding of Au plating through surface smoothing using polyimide template stripping Peer-reviewed
Kai Takeuchi, Shogo Koseki, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi
Sensors and Actuators A: Physical 383 116211-116211 2025/03
Publisher: Elsevier BVDOI: 10.1016/j.sna.2025.116211
ISSN: 0924-4247
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Room temperature wafer bonding via polysilazane for vacuum sealing bonding Peer-reviewed
Kai Takeuchi, Eiji Higurashi
Japanese Journal of Applied Physics 2025/02/12
Publisher: IOP PublishingDOI: 10.35848/1347-4065/adb4fb
ISSN: 0021-4922
eISSN: 1347-4065
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Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane
Nemoto Daiki, Kai Takeuchi, Eiji Higurashi
2024 International 3D Systems Integration Conference, 3DIC 2024 2024
DOI: 10.1109/3DIC63395.2024.10830136
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Formation of Au Hollow Micro-Bump Arrays for Low Temperature Au-Au Bonding
Shintaro Goto, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Eiji Higurashi
13th IEEE CPMT Symposium Japan: Innovation of Packaging Technology for Advanced Heterogeneous Integration, ICSJ 2024 150-151 2024
DOI: 10.1109/ICSJ62869.2024.10804723
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Adhesion between Si Substrates in Liquid Water Using Inorganic Polymer
Daiki Nemoto, Kai Takeuchi, Eiji Higurashi
13th IEEE CPMT Symposium Japan: Innovation of Packaging Technology for Advanced Heterogeneous Integration, ICSJ 2024 168-169 2024
DOI: 10.1109/ICSJ62869.2024.10804705
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Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding
Mika Ogino, Kai Takeuchi, Eiji Higurashi
13th IEEE CPMT Symposium Japan: Innovation of Packaging Technology for Advanced Heterogeneous Integration, ICSJ 2024 166-167 2024
DOI: 10.1109/ICSJ62869.2024.10804698
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Perhydropolysilazane as an Adhesion Layer for Vacuum Sealing Wafer Bonding
Kai Takeuchi, Daiki Nemoto, Eiji Higurashi
2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024 2024
DOI: 10.1109/LTB-3D64053.2024.10774106
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Template Stripping Process Combined With Polyimide and SiO<inf>2</inf>/Si Templates for Obtaining Smooth Au Surfaces
Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Takahiro Tsuda, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi
2024 International Conference on Electronics Packaging, ICEP 2024 129-130 2024
DOI: 10.23919/ICEP61562.2024.10535611
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Investigation of Plasma Gases for Polysilazane Conversion into SiO<inf>2</inf> for Wafer Bonding
Daiki Nemoto, Kai Takeuchi, Eiji Higurashi
2024 International Conference on Electronics Packaging, ICEP 2024 289-290 2024
DOI: 10.23919/ICEP61562.2024.10535633
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Influence of Various Plasma and UV/O<inf>3</inf>Treatments on Au Surfaces for Au-Au Surface Activated Bonding
Mika Ogino, Kai Takeuchi, Eiji Higurashi
2024 International Conference on Electronics Packaging, ICEP 2024 331-332 2024
DOI: 10.23919/ICEP61562.2024.10535697
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Formation of SiO<inf>2</inf> Bonding Interface using Perhydropolysilazane at Room Temperature
Kai Takeuchi, Daiki Nemoto, Tadatomo Suga, Eiji Higurashi
2024 International Conference on Electronics Packaging, ICEP 2024 113-114 2024
DOI: 10.23919/ICEP61562.2024.10535553
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Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding
Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, Eiji Higurashi
2024 International Conference on Electronics Packaging, ICEP 2024 117-118 2024
DOI: 10.23919/ICEP61562.2024.10535599
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Suppression of Surface Roughening of Ag Films by Capping Layer for Ag/Ag Surface Activated Bonding Peer-reviewed
Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, Eiji Higurashi
2023 IEEE CPMT Symposium Japan (ICSJ) 135-136 2023/11/15
Publisher: IEEEDOI: 10.1109/icsj59341.2023.10339608
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Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface Peer-reviewed
Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi
2023 IEEE CPMT Symposium Japan (ICSJ) 133-134 2023/11/15
Publisher: IEEEDOI: 10.1109/icsj59341.2023.10339541
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Conversion of Perhydropolysilazane into SiO2 using Plasma Treatment for Wafer Bonding Peer-reviewed
Kai Takeuchi, Daiki Nemoto, Tadatomo Suga, Eiji Higurashi
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2023/10/25
Publisher: IEEEDOI: 10.1109/impact59481.2023.10348949
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Hydrophilic Bonding of SiO2/SiO2 and Cu/Cu using Sequential Plasma Activation Peer-reviewed
Kai Takeuchi, Takeki Ninomiya, Michitaka Kubota, Masaya Kawano, Takeshi Takagi, Niwa Masaaki, Tadahiro Kuroda, Tadatomo Suga
ECS Transactions 112 (3) 95-101 2023/09/29
Publisher: The Electrochemical SocietyISSN: 1938-5862
eISSN: 1938-6737
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Protection of Activated Au Surface using Self-assembled Monolayer for Room Temperature Bonding Peer-reviewed
Kai Takeuchi, Junsha Wang, Tadatomo Suga, Beomjoon Kim, Eiji Higurashi
2023 International Conference on Electronics Packaging, ICEP 2023 173-174 2023
Publisher: IEEEDOI: 10.23919/ICEP58572.2023.10129675
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Removal of Adsorbed Water on Si Wafers for Surface Activated Bonding Peer-reviewed
Kai Takeuchi, Eiji Higurashi, Junsha Wang, Akira Yamauchi, Tadatomo Suga
2022 IEEE CPMT Symposium Japan (ICSJ) 61-64 2022/11/09
Publisher: IEEEDOI: 10.1109/icsj55786.2022.10034710
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A novel strategy for GaN-on-diamond device with a high thermal boundary conductance Peer-reviewed
Fengwen Mu, Bin Xu, Xinhua Wang, Runhua Gao, Sen Huang, Ke Wei, Kai Takeuchi, Xiaojuan Chen, Haibo Yin, Dahai Wang, Jiahan Yu, Tadatomo Suga, Junichiro Shiomi, Xinyu Liu
JOURNAL OF ALLOYS AND COMPOUNDS 905 2022/06
DOI: 10.1016/j.jallcom.2022.164076
ISSN: 0925-8388
eISSN: 1873-4669
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Polishing Diamond Substrates using Gas Cluster Ion Beam (GCIB) Irradiation for the Direct Bonding to Power Devices Peer-reviewed
Junsha Wang, Kai Takeuchi, Izumi Kataoka, Tadatomo Suga
2022 International Conference on Electronics Packaging (ICEP) 2022/05/11
Publisher: IEEEDOI: 10.23919/icep55381.2022.9795483
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Sequential Plasma Activation Bonding of Sapphire using SiO2 Intermediate Layer Peer-reviewed
Kai Takeuchi, Tadatomo Suga
2022 International Conference on Electronics Packaging (ICEP) 2022/05/11
Publisher: IEEEDOI: 10.23919/icep55381.2022.9795608
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Prolongation of the Surface Activation Effect using Self-Assembled Monolayer for Low Temperature Bonding of Au Peer-reviewed
Kai Takeuchi, Beomjoon Kim, Tadatomo Suga
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022/05
Publisher: IEEEDOI: 10.1109/ectc51906.2022.00103
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Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere Peer-reviewed
Ying Meng, Yang Xu, Runhua Gao, Xinhua Wang, Xiaojuan Chen, Sen Huang, Ke Wei, Dahai Wang, Haibo Yin, Kai Takeuchi, Tadatomo Suga, Fengwen Mu, Xinyu Liu
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 33 (5) 2582-2589 2022/02
DOI: 10.1007/s10854-021-07463-4
ISSN: 0957-4522
eISSN: 1573-482X
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Demonstration of high thermal performance GaN-on-graphite composite bonded substrate for application in III-V nitride electronics Peer-reviewed
Lei Li, Tomohiro Obata, Aozora Fukui, Kai Takeuchi, Tadatomo Suga, Atsushi Tanaka, Akio Wakejima
Applied Physics Express 14 (9) 2021/09
DOI: 10.35848/1882-0786/ac15c0
ISSN: 1882-0778
eISSN: 1882-0786
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Low temperature bonding of GaN and carbon composite via Au capping layer activated by Ar fast atom bombardment Peer-reviewed
Kai Takeuchi, Suga Tadatomo, Atsushi Tanaka, Akio Wakejima
2021 International Conference on Electronics Packaging, ICEP 2021 43-44 2021/05/12
DOI: 10.23919/ICEP51988.2021.9451955
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Low temperature bonding of Cu bump to WBG device using the surface activation method Peer-reviewed
Tadatomo Suga, Kai Takeuchi, Seongbin Shin, Nora Martinez, Yoshinari Ikeda, Akira Hirao, Motohito Hori
2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021) 35 19-20 2021
DOI: 10.11486/ejisso.35.0_17a3-02
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Effect of Sequential Plasma Activation on Al2O3 for Low Temperature Bonding of Glass Peer-reviewed
Kai Takeuchi, Tadatomo Suga
2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021) 59-60 2021
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Surface Activated Bonding of Glass Wafers using Oxide Intermediate Layer Peer-reviewed
Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto, Tadatomo Suga
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) 2024-2029 2021
DOI: 10.1109/ECTC32696.2021.00319
ISSN: 0569-5503
eISSN: 2377-5726
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Evaluation of Wafer Bond Strength under Vacuum Peer-reviewed
Kai Takeuchi, Tadatomo Suga
2021 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) 57-60 2021
DOI: 10.1109/ICSJ52620.2021.9648866
ISSN: 2373-5449
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Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication Peer-reviewed
Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto, Beomjoon Kim, Tadatomo Suga
ECS Meeting Abstracts MA2020-02 (22) 1631-1631 2020/11/23
Publisher: The Electrochemical SocietyDOI: 10.1149/ma2020-02221631mtgabs
eISSN: 2151-2043
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Porous Microneedle Integrated in Paper based Glucose Sensor for Fluid Channel Interface Peer-reviewed
Hakjae Lee, Kai Takeuchi, Yui Sasaki, Nobuyuki Takama, Tsuyoshi Minami, Beomjoon Kim
2019 IEEE CPMT Symposium Japan (ICSJ) 39-42 2019/11
DOI: 10.1109/icsj47124.2019.8998695
ISSN: 2373-5449
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Capillary driven porous pdms microneedle for naked-eye glucose sensor
Hakjae Lee, Kai Takeuchi, Yui Sasaki, Nobuyuki Takama, Tsuyoshi Minami, Beomjoon Kim
23rd International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2019 654-656 2019
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Room Temperature Bonding of Quartz Glass using Aluminum Oxide Intermediate Layer Peer-reviewed
Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto, Tadatomo Suga
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 85-85 2019
DOI: 10.23919/ltb-3d.2019.8735327
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Correction to: Functionalized microneedles for continuous glucose monitoring (Nano Convergence, (2018), 5, 1, (28), 10.1186/s40580-018-0161-2)
Kai Takeuchi, Beomjoon Kim
Nano Convergence 5 (1) 2018/12/01
Publisher: Korea Nano Technology Research SocietyDOI: 10.1186/s40580-018-0169-7
ISSN: 2196-5404
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Functionalized microneedles for continuous glucose monitoring Peer-reviewed
Kai Takeuchi, Beomjoon Kim
Nano Convergence 5 (1) 2018/12
DOI: 10.1186/s40580-018-0161-2
ISSN: 2196-5404
eISSN: 2196-5404
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Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer Peer-reviewed
Kai Takeuchi, Masahisa Fujino, Yoshiie Matsumoto, Tadatomo Suga
JAPANESE JOURNAL OF APPLIED PHYSICS 57 (4) 2018/04
ISSN: 0021-4922
eISSN: 1347-4065
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Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method Peer-reviewed
Takeuchi Kai, Fujino Masahisa, Matsumoto Yoshiie, Suga Tadatomo
Japanese Journal of Applied Physics 57 (2) 02BB05-02BB05 2018/01/15
ISSN: 0021-4922
eISSN: 1347-4065
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A Porous Microneedle Array Connected to Microfluidic System for ISF Collection Peer-reviewed
Kai Takeuchi, Nobuyuki Takama, Beomjoon Kim, Kirti Sharma, Patrick Ruther, Oliver Paul
2018 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) 85-88 2018
DOI: 10.1109/icsj.2018.8602945
ISSN: 2373-5449
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Room Temperature Temporary Bonding of Glass Substrates Based on SAB Method Using Si Intermediate Layer Peer-reviewed
Kai Takeuchi, Masahisa Fujino, Tadatomo Suga
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 7 (10) 1713-1720 2017/10
DOI: 10.1109/TCPMT.2017.2731621
ISSN: 2156-3950
eISSN: 2156-3985
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Bonding and Debonding of Si/Glass based on SAB Method Combined with Hydrophilic Treatment Peer-reviewed
K. Takeuchi, Y. Matsumoto, T. Suga
Extended Abstracts of the 2017 International Conference on Solid State Devices and Materials 2017/09/21
Publisher: The Japan Society of Applied Physics -
Room temperature bonding and debonding of PI film and glass substrate based on SAB method Peer-reviewed
K. Takeuchi, M. Fujino, Y. Matsumoto, T. Suga
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2017/05
Publisher: IEEEDOI: 10.23919/ltb-3d.2017.7947434
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Modified Surface Activated Bonding Using Si Intermediate Layer for Bonding and Debonding of Glass Substrates Peer-reviewed
K. Takeuchi, M. Fujino, T. Suga
ECS Transactions 75 (9) 185-189 2016/09/23
Publisher: The Electrochemical SocietyISSN: 1938-6737
eISSN: 1938-5862
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Direct Bonding and Debonding of Glass Wafers for Handling of Ultra-thin Glass Sheets Peer-reviewed
Kai Takeuchi, Masahisa Fujino, Tadatomo Suga
2016 International Conference on Electronics Packaging (ICEP) 298-301 2016
-
Room Temperature Bonding and Debonding of Ultra-Thin Glass Substrates for Fabrication of LCD Peer-reviewed
Kai Takeuchi, Masahisa Fujino, Tadatomo Suga
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 1284-1289 2016
ISSN: 0569-5503
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Room temperature direct bonding and debonding of polymer film on glass wafer for fabrication of flexible electronic devices Peer-reviewed
K. Takeuchi, M. Fujino, T. Suga, M. Koizumi, T. Someya
2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015/05
Publisher: IEEEDOI: 10.1109/ectc.2015.7159668
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Room temperature direct bonding and debonding of polyimide film on glass wafer using Si intermediate layer Peer-reviewed
K. Takeuchi, M. Fujino, T. Suga, M. Koizumi, T. Someya
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) 2015/04
Publisher: IEEEDOI: 10.1109/icep-iaac.2015.7111037
Misc. 19
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Fabrication of hollow micro-bump arrays by Au thin film transfer
後藤慎太郎, 竹内魁, 日暮栄治, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 41st 2024
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Room-temperature bonding of wafers with Au thin films using sequential surface treatment by VUV light and Ar plasma
荻野美佳, 竹内魁, 日暮栄治
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 41st 2024
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Adhesion between Si Substrates in Liquid using Polymeric Precursor of SiO2
根本大輝, 竹内魁, 日暮栄治
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 41st 2024
-
Wafer bonding via Perhydropolysilazane at room temperature
竹内魁, 根本大輝, 日暮栄治
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 41st 2024
-
Au flat micro-bump arrays fabricated by transfer and coining of Au thin films
後藤慎太郎, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 日暮栄治
マイクロエレクトロニクスシンポジウム論文集 34th 2024
ISSN: 2434-396X
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Surface smoothing of Au plated films by template stripping using polyimide films
小関奨吾, 荻野美佳, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 清水寿和, 徳久智明, 日暮栄治
エレクトロニクス実装学会講演大会講演論文集(CD-ROM) 38th 2024
ISSN: 1880-4616
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Effect of Water on Wafer Bonding Interface
Kai Takeuchi
Journal of The Japan Institute of Electronics Packaging 26 (5) 434-440 2023/08/01
Publisher: Japan Institute of Electronics PackagingDOI: 10.5104/jiep.26.434
ISSN: 1343-9677
eISSN: 1884-121X
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Passivation of Activated Au Surface for Low Temperature Bonding
竹内魁, 日暮栄治, KIM Beomjoon, WANG Junsha, 須賀唯知
センサ・マイクロマシンと応用システムシンポジウム(CD-ROM) 40th 2023
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2nd quantized state oscillation in a gain switched 925nm-band QW-LD and its suppression
古戸颯真, CUI Yuwen, 竹内魁, 山田博仁, 横山弘之, 日暮栄治
応用物理学会秋季学術講演会講演予稿集(CD-ROM) 84th 2023
ISSN: 2758-4704
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Progress and future perspective of room-temperature bonding technologies for heterogeneous integration
日暮栄治, 竹内魁
電子情報通信学会技術研究報告(Web) 123 (142(CPM2023 10-22)) 2023
ISSN: 2432-6380
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Second-quantized-state laser oscillation dynamics of a 925nm-band QW-LD under strong pulsed excitation
CUI Y., 安食聡一郎, 竹内魁, 竹内魁, 日暮栄治, 日暮栄治, 山田博仁, 山田博仁, 山田博仁, 横山弘之, 横山弘之
応用物理学会春季学術講演会講演予稿集(CD-ROM) 70th 2023
ISSN: 2436-7613
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GaN/カーボン材料の低熱抵抗界面を目的としたAu低温接合
竹内 魁, 須賀 唯知, 田中 敦之, 分島 彰男
精密工学会学術講演会講演論文集 2021S 699-700 2021/03/03
Publisher: 公益社団法人 精密工学会DOI: 10.11522/pscjspe.2021s.0_699
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アルミシリケートガラスの低温接合のためのシーケンシャルプラズマ活性化のAl2O3への影響
竹内 魁, 須賀 唯知
エレクトロニクス実装学術講演大会講演論文集 35 18C4-05 2021
Publisher: 一般社団法人エレクトロニクス実装学会DOI: 10.11486/ejisso.35.0_18c4-05
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表面活性化によるGaN/カーボン材のAu層を介した低温接合
竹内 魁, 須賀 唯知, 田中 敦之, 分島 彰男
エレクトロニクス実装学術講演大会講演論文集 35 17A3-03 2021
Publisher: 一般社団法人エレクトロニクス実装学会DOI: 10.11486/ejisso.35.0_17a3-03
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SiC/Ni中間層を用いたGaN基板の常温接合
竹内 魁, 須賀 唯知, Mu Fengwen, 魚本 幸, 島津 武仁
エレクトロニクス実装学術講演大会講演論文集 35 17A3-04 2021
Publisher: 一般社団法人エレクトロニクス実装学会DOI: 10.11486/ejisso.35.0_17a3-04
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表面活性化による異種材料接合と界面形成—Bonding and Interfaces of Dissimilar Materials by Means of Surface Activation Method—特集 セラミックスコーティングの新潮流 : 界面制御が拓く新しい機能
須賀 唯知, 竹内 魁
Ceramics Japan = セラミックス : bulletin of the Ceramic Society of Japan 55 (10) 716-719 2020/10
Publisher: 日本セラミックス協会ISSN: 0009-031X
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Functionalized microneedles for continuous glucose monitoring
Kai Takeuchi, Beomjoon Kim
NANO CONVERGENCE 5 2018/10
DOI: 10.1186/s40580-018-0161-2
ISSN: 2196-5404
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Fabrication of biodegradable porous microneedle
Morishita Yasuhisa, Takeuchi Kai, Takama Nobuyuki, Kim Beomjoon
Proceedings of JSPE Semestrial Meeting 2018 734-735 2018
Publisher: The Japan Society for Precision EngineeringDOI: 10.11522/pscjspe.2018A.0_734
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Direct Bonding and Debonding of PI film and Glass Wafer using Si intermediate layer for TFT fabrication
Proceedings of JIEP Annual Meeting 29 537-540 2015
Publisher: The Japan Institute of Electronics Packaging
Research Projects 5
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Creation of fundamental technology on room-temperature bonding through nano-interface control
Offer Organization: Japan Society for the Promotion of Science
System: Grants-in-Aid for Scientific Research
Category: Grant-in-Aid for Scientific Research (B)
Institution: Tohoku University
2024/04/01 - 2026/03/31
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ナノ界面制御による常温接合基盤技術の創出
日暮 栄治, 竹内 魁
Offer Organization: 日本学術振興会
System: 科学研究費助成事業
Category: 基盤研究(B)
Institution: 東北大学
2023/04/01 - 2026/03/31
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常温接合技術に基づく耐腐食性接合界面の創出
竹内 魁
Offer Organization: 日本学術振興会
System: 科学研究費助成事業 若手研究
Category: 若手研究
Institution: 東北大学
2023/04 - 2026/03
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高出力用光学素子実装のための直接接合技術の開発
竹内魁
Offer Organization: 公益財団法人 天田財団
System: 奨励研究助成(若手研究者枠)
Institution: 明星大学
2021/10 - 2024/03
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光学素子実装のための酸化アルミニウム中間層を介したガラス材料の常温透明接合
竹内魁
Offer Organization: 公益財団法人 精密測定技術振興財団
System: 研究助成
Category: 助成金
Institution: 明星大学
2021/04 - 2022/03
Teaching Experience 2
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学生実験A 東北大学
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学生実験D 東北大学